TWI554571B - Addition hardening type silicone oxygen composition and optical element - Google Patents

Addition hardening type silicone oxygen composition and optical element Download PDF

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Publication number
TWI554571B
TWI554571B TW101123491A TW101123491A TWI554571B TW I554571 B TWI554571 B TW I554571B TW 101123491 A TW101123491 A TW 101123491A TW 101123491 A TW101123491 A TW 101123491A TW I554571 B TWI554571 B TW I554571B
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TW
Taiwan
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group
integer
addition
composition
component
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TW101123491A
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English (en)
Chinese (zh)
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TW201319168A (zh
Inventor
Mitsuhiro Iwata
Toshiyuki Ozai
Masanari Moteki
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Shinetsu Chemical Co
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Publication of TW201319168A publication Critical patent/TW201319168A/zh
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
TW101123491A 2011-06-30 2012-06-29 Addition hardening type silicone oxygen composition and optical element TWI554571B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011145085A JP5603837B2 (ja) 2011-06-30 2011-06-30 付加硬化型シリコーン組成物及び光学素子

Publications (2)

Publication Number Publication Date
TW201319168A TW201319168A (zh) 2013-05-16
TWI554571B true TWI554571B (zh) 2016-10-21

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TW101123491A TWI554571B (zh) 2011-06-30 2012-06-29 Addition hardening type silicone oxygen composition and optical element

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JP (1) JP5603837B2 (ko)
KR (1) KR20130009621A (ko)
CN (1) CN102850803A (ko)
TW (1) TWI554571B (ko)

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JP6006632B2 (ja) * 2012-12-18 2016-10-12 信越化学工業株式会社 付加硬化型シリコーン組成物及び光学素子
KR101733960B1 (ko) * 2013-03-07 2017-05-10 제이에스알 가부시끼가이샤 경화성 조성물, 경화물 및 광반도체 장치
JP5858027B2 (ja) * 2013-03-07 2016-02-10 Jsr株式会社 硬化性組成物、硬化物および光半導体装置
KR102189563B1 (ko) * 2013-08-19 2020-12-11 스미또모 세이까 가부시키가이샤 부가 경화형 실리콘 수지 조성물, 부가 경화형 실리콘 수지 경화물 및 광 반도체 소자 봉지체
CN105555873B (zh) 2013-08-20 2018-09-14 住友精化株式会社 缩合固化型有机硅树脂组合物、缩合固化型有机硅树脂固化物和光半导体元件密封体
JP2015081316A (ja) * 2013-10-24 2015-04-27 株式会社トクヤマ 無機粒子充填シリコーン樹脂組成物
JP6100717B2 (ja) * 2014-03-05 2017-03-22 信越化学工業株式会社 付加硬化型シリコーン組成物及び光学素子
WO2016052495A1 (ja) * 2014-10-03 2016-04-07 住友化学株式会社 シリコーン樹脂、ｕｖ－ｌｅｄ用封止材組成物、硬化物及びｕｖ－ｌｅｄ用封止材
EP3281984B1 (en) * 2015-04-10 2024-01-31 Dow Toray Co., Ltd. Fluoroalkyl-containing curable organopolysiloxane composition, cured object obtained therefrom, and electronic component or display device including said cured object
CN105238061B (zh) * 2015-11-25 2018-06-15 泸州北方化学工业有限公司 发泡硅橡胶胶料、低密度硅橡胶海绵及其制备方法
WO2018121706A1 (en) * 2016-12-30 2018-07-05 Elkem Silicones Shanghai Co., Ltd. Curable silicone compositions
JP7021046B2 (ja) * 2018-10-22 2022-02-16 信越化学工業株式会社 付加硬化型シリコーン組成物、シリコーン硬化物、及び、光学素子
JP7014745B2 (ja) 2019-01-29 2022-02-01 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物及び光学素子
JP7053514B2 (ja) * 2019-02-07 2022-04-12 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物、該組成物の硬化物、及び光学素子
JP2020132757A (ja) * 2019-02-19 2020-08-31 信越化学工業株式会社 ダイボンディング用シリコーン樹脂組成物、硬化物及び光半導体装置
JP7088880B2 (ja) 2019-05-30 2022-06-21 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物、該組成物の製造方法、及び光半導体装置

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CN1781991A (zh) * 2004-11-18 2006-06-07 瓦克化学有限公司 加工时间长且储存稳定性高的可交联聚硅氧烷组合物

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US5082706A (en) * 1988-11-23 1992-01-21 Dow Corning Corporation Pressure sensitive adhesive/release liner laminate
JPH0662769B2 (ja) * 1991-06-24 1994-08-17 信越化学工業株式会社 フルオロアルキル基含有シリコーンオイル
JPH10158401A (ja) * 1996-12-03 1998-06-16 Toshiba Silicone Co Ltd フルオロアルキル基含有シロキサンの製造方法
JPH115902A (ja) * 1997-06-17 1999-01-12 Shin Etsu Chem Co Ltd 硬化性シリコーンゴム組成物
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JP4409160B2 (ja) * 2002-10-28 2010-02-03 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5027148B2 (ja) * 2006-02-03 2012-09-19 パナソニック株式会社 ケイ酸縮合生成物及びそれを使用してなる光導波路デバイス
JP5060074B2 (ja) * 2006-05-11 2012-10-31 東レ・ダウコーニング株式会社 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置
JP2010123769A (ja) * 2008-11-20 2010-06-03 Shin-Etsu Chemical Co Ltd 発光装置及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1781991A (zh) * 2004-11-18 2006-06-07 瓦克化学有限公司 加工时间长且储存稳定性高的可交联聚硅氧烷组合物

Also Published As

Publication number Publication date
CN102850803A (zh) 2013-01-02
JP2013010881A (ja) 2013-01-17
JP5603837B2 (ja) 2014-10-08
TW201319168A (zh) 2013-05-16
KR20130009621A (ko) 2013-01-23

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