TWI536466B - 使用焊劑的基板及被裝載物的接合方法 - Google Patents

使用焊劑的基板及被裝載物的接合方法 Download PDF

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Publication number
TWI536466B
TWI536466B TW098119752A TW98119752A TWI536466B TW I536466 B TWI536466 B TW I536466B TW 098119752 A TW098119752 A TW 098119752A TW 98119752 A TW98119752 A TW 98119752A TW I536466 B TWI536466 B TW I536466B
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Taiwan
Prior art keywords
flux
substrate
solder
metallization layer
alloy
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TW098119752A
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English (en)
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TW201019405A (en
Inventor
石川雅之
中川將
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三菱綜合材料股份有限公司
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Priority claimed from JP2008154003A external-priority patent/JP2009302229A/ja
Priority claimed from JP2008221633A external-priority patent/JP2010056399A/ja
Application filed by 三菱綜合材料股份有限公司 filed Critical 三菱綜合材料股份有限公司
Publication of TW201019405A publication Critical patent/TW201019405A/zh
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Publication of TWI536466B publication Critical patent/TWI536466B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
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    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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    • C22C11/06—Alloys based on lead with tin as the next major constituent
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
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Description

使用焊劑的基板及被裝載物的接合方法
本發明是關於一種使用焊劑而對於基板將被裝載物接合相同位置及方向的方法者，尤其是關於一種使用Au-Sn合金焊劑對於基板將元件接合成相同位置及方向的方法。
本發明是依據2008年6月12日向日本國所申請的特願2008-154003及2008年8月29日向日本國所申請的特願2008-221633號主張優先權，而在此援用此些的內容。
一般，在LED(發光二極體)元件、GaAs光元件、GaAs高頻元件、熱傳元件等的半導體元件與基板之接合等，成為使用者Au-Sn合金焊劑等。該Au-Sn合金焊劑是眾知含有Sn：15至25質量%(較佳為Sn：20質量%)，剩餘為Au及混合具有不可避雜質所成的組成的Au-Sn共晶合金氣體噴霧粉末與松香，活性劑、溶劑及增黏劑所成的市場上出售的助熔劑。
當使用該Au-Sn合金焊劑進行接合元件與基板，則有以下的優點。Au-Sn合金焊料接合層為Au-Sn焊料合金之故，因而導熱性良好，且接合信賴性也高。又，Au-Sn合金焊劑是糊狀之故，因而可一併供應於複數接合部，又，可一併進行熱處理。又，在流平時因為助熔劑覆蓋Au-Sn焊料合金表面，所以氧化膜少。所以接合時的熔融Au-Sn焊料合金的流動性變大，潤濕性變良好，而可接合元件全面。又，在接合時不必對元件施加過剩的負荷。
使用該Au-Sn合金焊劑欲接合基板與元件，首先，如第14A圖的縱斷面所示地，在形成於基板1的表面的金屬化層2上裝載或塗佈Au-Sn合金焊劑3，而在該Au-Sn合金焊劑3上，元件4的金屬化層6接觸於Au-Sn合金焊劑3的方式裝載著元件4。在該狀態下經加熱施以流平處理之後進行冷卻，則如第14B圖所示地，經由Au-Sn合金焊料接合層5而接合著基板1與元件4(參照專利文獻1等)。此時，形成於基板1的表面的金屬化層2的面積，一般是與元件4的金屬化層6的面積相同或比元件4的金屬化層6的面積還要大。又，元件4一般具有正方形狀，惟也有長方形狀者。
專利文獻1：日本特開2007-61857號公報
第15圖是從第14A圖的上方向觀看的俯視圖。如第15圖及第14A圖所示地，在基板1的金屬化層2上裝載或塗佈Au-Sn合金焊劑3。在該Au-Sn合金焊劑3上，對基板1的金屬化層2的中心部成為同軸且同一方的方式裝載元件4。但是，在該狀態下經加熱施以流平處理，則在流平處理時經熔融的Au-Sn合金焊料是會擴至基板1的金屬化層2全部而形成Au-Sn合金焊料接合層5。同時地，暫時地元件4成為浮在Au-Sn合金焊料上的狀態，這時候元件4會旋轉或移動。冷卻後，如表示於從第14B的上方向觀看的俯視圖的第16圖，元件4是在金屬化層2上的Au-Sn合金焊料接合層5上，對於基板1的金屬化層2由基板1的金屬化層2中心部偏離又傾斜的狀態下被焊料接合者較多。
尤其是，在工業化地欲將元件4焊料接合於基板，則在廣大基板上形成多數排列的金屬化層。在該多數金屬化層上分別裝載或塗佈Au-Sn合金焊劑，而在該Au-Sn合金焊劑上有規律地裝載元件。在該狀態下裝進加熱爐內，將多數個元件利用1次的流平處理焊料接合於基板。在該流平處理時旋轉元件，對於排列的基板的金屬化層由中心部朝任意方向偏離傾斜而元件被焊料接合，作為交貨所用的產品較不理想。又，今後的封裝尺寸的更微小化之際，當元件彼此間的距離接近，則也有產生元件彼此間的接觸之顧慮。
解決上述課題而為了達成該目的，本發明是採用以下的手段。
(1)一種使用焊劑的基板及被裝載物的接合方法，其特徵為：在形成金屬化層的上述基板的上述金屬化層及形成金屬化層的上述被裝載物的上述金屬化層之間，裝載或塗佈上述焊劑之後，在非氧化性環境中進行流平處理，來接合上述基板與上述被裝載物，形成於上述基板表面的上述金屬化層是具有：面積比上述被裝載物的上述金屬化層的面積還要小的金屬化層本體部分，及從上述金屬化層本體部分的周圍所突出的焊料引誘部所構成的平面形狀。
(2)上述焊劑是含有20至25質量%的Sn，在剩餘部分為Au及不可避雜質的Au-Sn焊料合金粉末，混合助熔劑的Au-Sn合金焊劑也可以。
(3)上述焊劑是含有35至60質量%的Pb，在剩餘部分為Sn及不可避雜質的Pb-Sn焊料合金粉末，混合助熔劑的Pb-Sn合金焊劑也可以。
(4)上述焊劑是含有90至95質量%的Pb，在剩餘部分為Sn及不可避雜質的Pb-Sn焊料合金粉末，混合助熔劑的Pb-Sn合金焊劑也可以。
(5)上述焊劑是含有40至100質量%的Sn，在剩餘部分為由Ag、Au、Cu、Bi、Sb、In及Zn所成的群所選擇的1種或2種以上的金屬及不可避雜質的無鉛焊料合金粉末，混合助熔劑的無鉛焊劑也可以。
(6)上述被裝載物是元件。
(7)形成於上述基板的上述金屬化層是電極膜。
(8)本發明的其他態樣的一種使用焊劑的基板及被裝載物的接合方法，其特徵為：具有：在形成金屬化層的基板的金屬化層，及形成於具有形成金屬化層的矩形狀的被裝載物的金屬化層之間，裝載或塗佈焊劑的工程，及在非氧化性環境中進行流平處理而接合上述基板與上述被裝載物的工程。形成於上述基板表面的上述金屬化層是具有：面積比上述被裝載物的上述金屬化層的面積還要小的金屬化層本體部分，及從上述金屬化層本體部分的周圍所突出的至少兩個焊料引誘部的平面形狀，互相地鄰接的焊料引誘部的長邊方向彼此間所成的角度，是與上述被裝載物的對角線彼此間所成的交叉角的任一相同。
(9)上述矩形狀是正方形狀或是長方形狀都可以。
(10)形成於基板表面的金屬化層，具有：金屬化層本體部分，及從上述金屬化層本體部分的周圍所突出的焊料引誘部所構成的平面形狀。
(11)上述(10)所述的金屬化層，形成於上述基板的上述金屬化層是電極膜。
(12)形成金屬化層的基板，上述金屬化層是包含金屬化層本體部分，及從上述金屬化層本體部分的周圍所突出的焊料引誘部的平面形狀。
(13)上述(12)所述的基板，形成於上述基板上的上述金屬化層是電極膜。
(14)上述焊劑是混合至少含有Sn的焊料合金粉末與助熔劑也可以。
(15)被裝載物與基板的接合體，藉由上述(1)至(9)的任一所述的接合方法，被裝載物與上述基板被接合。
(16)被裝載物與基板的接合體的製造方法，藉由上述(1)至(9)的任一所述的接合方法，接合被裝載物與基板進行製造接合體。
依照本發明的基板與被裝載物的接合方法，對準所期望的位置及方向可焊料接合所有被裝載物。
本發明人等進行了開發對於基板的金屬化層使得元件經常地在相同位置且朝一定向的方式可焊接的基板與元件的接合方法的研究。其結果，依照以下的實施形態，曉得使焊接後的元件的位置與方向一致。
(i)如第1圖的縱斷面圖所示地，經由基板10的金屬化層12及元件14的金屬化層16，使用焊劑13接合基板10與元件14。元件14的大小，是在本發明並未被限定，惟例如一邊長度為50μm以上1cm以下，高度10μm以上5000μm以下。例如，作為產品，一邊長度為950μm以上1100μm以下，高度為90μm以上110μm以下。一般，在LED(發光二極體)元件、GaAs光元件、GaAs高頻元件、熱傳元件等的半導體元件中，金屬化層12是隔著一定間隔形成多數於基板10上。但是，在本發明中，不是一定間隔也可以，或是金屬化層12為一層也可以。在該實施形態中，如第2A圖的俯視圖所示地，形成於基板10表面的金屬化層12是具有：成為矩形狀(長方形狀)的金屬化層本體部分12A，及從金屬化層本體部分12A的周圍突出的焊料引誘部12B。在該實施形態中，尤其是從本體部分12A的一邊中央部，垂直地突出有狹窄的矩形狀焊料引誘部12B。焊料引誘部12B是在該實施形態中為一定寬度，惟作為朝前端變窄小的台形或是三角形狀也可以。金屬化層本體部分12A的面積，是元件14的面積的30～95%左右較佳。
金屬化層12的厚度是並未被限定，惟例如0.02μm以上50μm以下較佳。更佳為例如0.05μm以上10μm以下。金屬化層12的最表面材質也並未被限定，惟從焊料潤濕性的觀點上，以Au、Ag、Cu等較佳。金屬化層是以鍍法或濺鍍法或塗敷法等所形成。焊料引誘部12B的寬度W1是並未被限定，惟例如本體部12A的上述一邊長度是5～50%，更佳為10～40%。即使寬度W1過小或過大，都會降低將元件14予以對位的效果。如第2B圖所示地，焊料引誘部12B的長度L1是將焊料引誘部12B的前端對準元件14之角，而在沿著元件14的對角線配置焊料引誘部12B的狀態下，使得金屬化層12的全領域藉由元件14剛好隱蔽金屬化層12的後端的程度較佳。亦即，金屬化層12的後端的兩個角位於元件14的邊的正下方或是附近較佳。焊料引誘部12B的長度L1是在滿足上述條件的範圍內，例如，金屬化層本體12A的上述一邊的長度的20～70%，更佳為30～50%。
在金屬化層本體部分12A上，裝載Au-Sn合金焊劑13。Au-Sn合金焊劑13的裝載量是與以往同樣就可以，惟具體地來說，經焊接後的焊料接合層的厚度成為1～25μm左右較佳，更佳為1～10μm。在Au-Sn合金焊劑13上朝任意方向裝載具有比上述金屬化層本體部分12A的面積還要大面積的元件14。這時候，即使未做正確的定位，在本發明中藉由焊料引誘部12B可使焊接後的元件14的方向成為一致之故，因而定位精度較低的分量部分，就可降低裝配時的製造成本。
在該狀態下，在惰性氣體環境中進行流平處理，Au-Sn合金焊劑13會熔融，藉由熔融焊料的表面張力，朝著基板10的金屬化層12與元件14的金屬化層16的相對面積成為最大化的相對位置[第2B圖]旋轉及移動。如第2B圖所示地，在流平處理中，元件14的最長對角線(元件為正方形或長方形的情形為一般的對角線，而橢圓形的情形為長徑)與焊料引誘部12B的突出方向成為一致的方式進行旋轉之後被焊接。因此，藉由事先使焊料引誘部12B的方向成為一致，同一形狀的元件都朝一定方向被焊接。這時候，元件14是移動至兩點鏈線部分14也可以。作為元件14朝一定方向被焊接的主要原因，也可考量為從金屬化層本體部分42A朝焊料引誘部42B產生熔融焊料的流動，而會旋轉元件14。
(ii)上述金屬化層本體部分12A與從該金屬化層本體部分12A的周圍所突出的焊料引誘部12B，是可使用作為LED(發光二極體)元件、GaAs光元件、GaAs高頻元件、熱傳元件等的半導體元件等的電極膜。
(iii)表示於上述(i)的現象是並未被限定於基板與元件者，對於一般被裝載物對於基板也會產生。因此，也可適用一般的被裝載物。
(iv)焊劑是Au-Sn合金焊劑較佳，惟替代上述Au-Sn合金焊劑，含有Pb：35～60質量%，剩餘部分：在Sn及不可避雜質的Pb-Sn焊料合金粉末混合助熔劑的Pb-Sn合金焊劑，Pb：含有90～95質量%，剩餘部分：在Sn及不可避雜質的Pb-Sn焊料合金粉末混合助熔劑的Pb-Sn合金焊劑，或是Sn：含有40～100質量%，剩餘部分：在由Ag、Au、Cu、Bi、Sb、In及Zn所成的群所選擇的1種或2種以上的金屬及不可避雜質的無鉛焊料合金粉末混合助熔劑的無鉛焊劑也可得到同樣的效果。
將本發明的其他實施形態表示於第3A圖至第13圖。
形成於基板的金屬化層本體部分的形狀是與元件的形狀相同形狀較佳，惟並未特別地加以限定者。例如，如第3A圖所示地，金屬化層22具有圓形的金屬化層本體部分22A，及從其外周朝半徑方向突出的矩形狀的焊料引誘部22B也可以。金屬化層本體部分是具有其他任意的平面形狀也可以。
又，焊料引誘部是從金屬化層本體部分的周圍的任意位置突出就可以。例如，如第3B圖所示地，從正方形的金屬化層本體部分32A的1個頂點有焊料引誘部32B朝對角線的延長方向突出而形成金屬化層32也可以。
(v)第4A圖是表示另一實施形態的俯視圖。如第4A圖所示地，在該實施形態中，形成於基板10表面的金屬化層42是具有：正方形狀的金屬化層本體部分42A，及從金屬化層本體部分42A的四邊的中央部垂直地突出的4個焊料引誘部42B。鄰接的焊料引誘部42B彼此間所成的角度是90°，而與須接合的元件14的對角線所成的角度一致。在該金屬化層本體部分42A上裝載Au-Sn合金焊劑13，而在該Au-Sn合金焊劑13上以任意方向裝載具有比上述金屬化層本體部分42A的面積還要大的面積的正方形狀元件14。在該狀態下進行流平處理，則藉由熔融焊料的表面張力，如第4B圖的俯視圖所示地，正方形狀的元件14的對角線與焊料引誘部42B的長度方向成為一致的方式，元件14進行旋轉而被焊接，基板10上的所有正方形狀的元件是朝著一定方向被焊接。其他條件都與第1實施形態同樣就可以。
(vi)使用具有長方形狀的元件24的情形，如第5A圖所示地，在基板表面，形成具有：金屬化層本體部分52A及與具有長方形狀的元件24的對角線以相同角度交叉的方式從金屬化層本體部分52A突出所成的4個焊料引誘部52B的金屬化層52。在上述金屬化層本體部分52A上裝載Au-Sn合金焊劑13。在該Au-Sn合金焊劑13上朝任意方向地裝載具有長方形狀的元件24。在其狀態下進行流平處理，則如第5B圖所示地，具有長方形狀的元件24的對角線方向與焊料引誘部52B的方向會一致。結果，可焊接朝著一定方向而具有長方形狀的元件24，其他條件部與第1實施形態同樣就可以。
(vii)表示於上述(v)的現象並不被限定於基板與正方形狀元件者，對於具有對於基板的一般正方形狀的被裝載物也會產生。又，表示於上述(vi)的現象，並不被限定於基板與長方形狀的元件者，對於具有對於基板進行接合的一般長方形狀的被裝載物也會產生。所以，將該現象適用於基板與具有正方形狀的被裝載物或是基板與具有長方形狀的被裝載物之焊料接合而對於基板可焊料接合被裝載物於一定位置及方向。
第6圖至第10圖都表示具有：金屬化層本體部分，及從該金屬化層本體部分的周圍使用與正方形狀的被裝載物(元件)14的對角線相同角度交叉所突出的複數焊料引誘部的金屬化層。為了連接元件與基板，在此些金屬化層本體部分上裝載Au-Sn合金焊劑。在此些Au-Sn合金焊劑上朝任意方向裝載具有比上述金屬化層本體部分的面積還要大的面積的正方形狀的被裝載物(元件)14。第6圖至第10圖是也表示在該狀態下進行流平處理之後的正方形狀的被裝載物(元件)14被焊接的狀態。
如第6圖的實施形態所示地，金屬化層本體部分62A的大小，是與金屬化層62的焊料引誘部62B的寬度相同大小也可以。金屬化層本體部分62A是具有可裝載或塗佈焊劑的面積就可以。
焊料引誘部的形狀，是如第4B圖所示地具一定寬度的帶狀較佳，惟並不被限定於此者。例如焊料引誘部的形狀具有三角形狀也可以。例如，如第7圖所示地具有正方形狀的金屬化層本體部分72A，及從其四邊分別延伸的三角形狀的焊料引誘部72B的金屬化層72也可以。又，如第10圖所示地具有正方形狀的金屬化層本體部分102A，及從其鄰接的兩邊延伸的兩個三角形狀的焊料引誘部102B的金屬化層102也可以。
如第4B圖、第6圖及第7圖所示地，金屬化層的數是4個較佳。但是，如第8圖至第10圖所示地兩個也可以，又，3個或5個以上也可以。例如，如第8圖所示地，具有正方形狀的金屬化層本體部分82A，及從其鄰接的兩邊垂直地延伸的兩個焊料引誘部82B的金屬化層82也可以。又，如第9圖所示地，具有正方形狀的金屬化層本體部分92A，及具有與該金屬化層本體部92A的一邊相同寬度的兩個焊料引誘部92B的金屬化層92也可以。
第11圖是表示具有長方形狀的金屬化層本體部分112A，及從該金屬化層本層部分112A的一個矩邊的兩端所突出的兩支焊料引誘部112B的金屬化層。兩支焊料引誘部112B是形成與長方形狀的被裝載物(元件)的兩條對角線的交叉角相同角度。欲連接元件與基板，在金屬化層本體部分112A上，裝載Au-Sn合金焊劑。在Au-Sn合金焊劑上朝任意方向裝載具有比上述金屬化層本體部分的面積還要大的面積的長方形狀的被裝載物(元件)34。第11圖是表示在該狀態下進行流平處理之後的長方形狀的被裝載物(元件)34被焊接的狀態。
第12圖是表示具有長方形狀的金屬化層本體部122A，及從該金屬化層本體部分122A的三角落突出的三支焊料引誘部122B的金屬化層。3支焊料引誘部122B是形成與互相對應的處所的長方形狀的被裝載物(元件)的兩支對角線的交叉角相同角度。欲連接元件與基板，在金屬化層本體部分122A上，裝載Au-Sn合金焊劑。在Au-Sn合金焊劑上朝任意方向裝載長方形狀的被裝載物(元件)34，藉由流平處理，得到第12圖的焊接狀態。
如第13圖所示地，金屬化層的形狀，是從正方形狀的金屬化層的各邊的中央部除掉半圓狀部分的形狀也可以。該金屬化層132是藉由金屬化層本體部分132A，及從其周邊朝四方延伸的4個焊料引誘部132B所構成。
[實施例1]
作為焊料合金，使用含有Sn：20質量%，剩餘部分具有Au所成的成分組成，具有平均粒徑D50：11.1μm，最大粒徑：20.1μm的Au-Sn合金焊料粉末，以成為RMA助熔劑：8.0質量%，剩餘部分為Au-Sn合金焊料粉末的配合組成的方式將市場上出售的RMA助熔劑予以配合於該Au-Sn合金焊料粉末，經混合來製作具有糊狀黏度：85Pa‧s的Au-Sn合金焊劑。又，將該Au-Sn合金焊劑填充於注射器而裝設於塗佈器裝置(日本武藏技術公司所製，型式號碼：ML-606GX)。
又，準備具有縱：400μm，橫：400μm，高度：100μm尺寸的50個LED元件，對此些LED元件的一面全面施以具有厚度：3μm，縱：400μm，橫：400μm尺寸的鍍金。
又，準備氧化鋁製基板，在該氧化鋁製基板的表面，如第1圖所示地以600μm間隔形成50處1列地形成具有縱200μm，橫200μm的尺寸，具有厚度：10μm的Cu層，具有厚度：5μm的Ni層及具有厚度：0.1μm的Au層所成的複合金屬化層的金屬化層本體部分，以及具有形成與金屬化層本體部分相同構造的複合金屬化層的寬度：100μm，具有長度：90μm的尺寸的焊料引誘部所成的表示於第2A圖的金屬化層。焊料引誘部是突出成為與金屬化層本體部分的列方向同一方向。
在此些的金屬化層本體部分及焊料引誘部所成的50處的金屬化層的金屬化層本體部的中心位置，利用事先所準備的塗佈器裝置塗佈0.03mg量的Au-Sn合金焊劑。在該Au-Sn合金焊劑上使用裝配器裝載事先所準備的50個LED元件。在該狀態下，氮氣環境中，施以溫度：300℃，30秒鐘保持條件的流平處理。之後，經冷卻，使用三維測定機(日本尼康(Nikon)公司所製，NEXIV VMR-3020)，測定一列地排列的50個LED元件位置的元件中心位置。在此，將在x軸方向一列地接合50個的LED元件的中心位置的y軸方向的移動算出作為對於平均y軸位置的標準偏差。其結果，元件中心位置：有y軸移動±4.2μm，可知元件的位置精度極高。
[實施例2]
作為焊料合金，使用含有Pb：37質量%，剩餘部分具有Sn所成的成分組成，具有平均粒徑D50：11.4μm，最大粒徑：14.5μm的Pb-Sn合金焊料粉末。以成為RMA助熔劑：11.0質量%，剩餘部分為Pb-Sn合金焊料粉末的配合組成的方式將市場上出售的RMA助熔劑予以配合於該Pb-Sn合金焊料粉末，經混合來製作具有糊狀黏度：120Pa‧s的Pb-Sn合金焊劑。又，將該Pb-Sn合金焊劑填充於注射器而裝設於塗佈器裝置(日本武藏技術公司所製，型式號碼：ML-606GX)。
藉由該塗佈器裝置，將0.02mg量的Pb-Sn合金焊劑塗佈於在實施例1所製作的金屬化層本體部分及焊料引誘部所成的50處的金屬化層上。在該Pb-Sn合金焊劑上裝載事先準備的50個LED元件。在該狀態下，氮氣環境中，施以溫度：220℃，30秒鐘保持條件的流平處理。之後，經冷卻，使用三維測定機(日本尼康(Nikon)公司所製，NEXIV VMR-3020)，測定50個LED元件位置的元件中心位置。在此，將在x軸方向一列地接合50個的LED元件的中心位置的y軸方向移動算出作為對於平均y軸位置的標準偏差。其結果，元件中心位置：有y軸移動±5.8μm，可知元件的位置精度極高。
[實施例3]
作為焊料合金，使用含有Pb：95質量%，剩餘部分具有Sn所成的成分組成，具有平均粒徑D50：11.7μm，最大粒徑：14.8μm的Pb-Sn合金焊料粉末。以成為RMA助熔劑：10.0質量%，剩餘部分為Pb-Sn合金焊料粉末的配合組成的方式將市場上出售的RMA助熔劑予以配合於該Pb-Sn合金焊料粉末，經混合來製作具有糊狀黏度：80Pa‧s的Pb-Sn合金焊劑。又，將該Pb-Sn合金焊劑填充於注射器而裝設於塗佈器裝置(日本武藏技術公司所製，型式號碼：ML-606GX)。
藉由該塗佈器裝置，將0.03mg量的Pb-Sn合金焊劑塗佈於在實施例1所製作的金屬化層本體部分及焊料引誘部所成的50處的金屬化層上。在該Pb-Sn合金焊劑上裝載事先準備的50個LED元件。氮氣環境中，施以溫度：330℃，30秒鐘保持條件的流平處理。之後，經冷卻，使用三維測定機(日本尼康(Nikon)公司所製，NEXIV VMR-3020)，測定50個LED元件位置的元件中心位置。在此，將在x軸方向一列地接合50個的LED元件的中心位置的y軸方向移動算出作為對於平均y軸位置的標準偏差。其結果，元件中心位置：有y軸移動±6.7μm，可知元件的位置精度極高。
[實施例4]
作為焊料合金，使用含有Sn：96.5質量%，Ag：3.0質量%，剩餘部分具有Cu所成的成分組成，具有平均粒徑D50：10.8μm，最大粒徑：14.1μm的無鉛焊料粉末。以成分RMA助熔劑：12.5質量%，剩餘部分為無鉛焊料粉末的配合組成的方式，將市場上出售的RMA助熔劑予以配合於該無鉛焊料粉末，經混合來製作具有糊狀黏度：72Pa‧s的無鉛焊劑。又，將該無鉛焊劑填充於注射器而裝設於塗佈器裝置(日本武藏技術公司所製，型式號碼：ML-606GX)。
藉由該塗佈器裝置，將0.02mg量的無鉛焊劑塗佈於在實施例1所製作的金屬化層本體部分及焊料引誘部所成的50處的金屬化層上。在該無鉛焊劑上裝載事先準備的50個LED元件。氮氣環境中，施以溫度：240℃，30秒鐘保持條件的流平處理。之後，經冷卻，使用三維測定機(日本尼康(Nikon)公司所製，NEXIV VMR-3020)，測定50個LED元件位置的元件中心位置。在此，將在x軸方向一列地接合50個的LED元件的中心位置的y軸方向移動算出作為對於平均y軸位置的標準偏差。其結果，元件中心位置：有y軸移動±5.1μm，可知元件的位置精度極高。
[習知例1]
作為焊料合金，使用含有Sn：20質量%，剩餘部分具有Au所成的成分組成，具有平均粒徑D50：11.1μm，最大粒徑：20.1μm的Au-Sn合金焊料粉末。以成為RMA助熔劑：8.0質量%，剩餘部分為Au-Sn合金焊料粉末的配合組成的方式將市場上出售的RMA助熔劑予以配合於該Au-Sn合金焊料粉末，經混合來製作具有糊狀黏度：85Pa‧s的Au-Sn合金焊劑。又，將該Au-Sn合金焊劑填充於注射器而裝設於塗佈器裝置(日本武藏技術公司所製，型式號碼：ML-606GX)。
又，準備具有縱：400μm，橫：400μm，高度：100μm尺寸的50個LED元件，對此些LED元件的一面全面施以具有厚度：3μm，縱：400μm，橫：400μm尺寸的鍍金。
又，準備氧化鋁製基板，在該氧化鋁製基板的表面，以600μm間隔形成50處1列地形成具有縱500μm，橫500μm的尺寸，具有厚度：10μm的Cu層，具有厚度：5μm的Ni層及具有厚度：0.1μm的Au層所成的複合金屬化層的表示於第15圖的金屬化層。
在此些的金屬化層所成的50處的金屬化層的中心位置，利用事先所準備的塗佈器裝置塗佈0.03mg量的Au-Sn合金焊劑。在該Au-Sn合金焊劑上使用裝配器裝載事先所準備的50個LED元件。在該狀態下，氮氣環境中，施以溫度：300℃，30秒鐘保持條件的流平處理。之後，經冷卻，使用三維測定機[日本尼康(Nikon)公司所製，NEXIV VMR-3020)，測定一列地排列的50個LED元件位置的元件中心位置。在此，將在x軸方向一列地接合50個的LED元件的中心位置的y軸方向的移動算出作為對於平均y軸位置的標準偏差。其結果，元件中心位置：有y軸移動±38.2μm，可知元件的位置精度差。
[實施例5]
作為焊料合金，使用含有Sn：20質量%，剩餘部分具有Au所成的成分組成，具有平均粒徑D50：11.1μm，最大粒徑：20.1μm的Au-Sn合金焊料粉末。以成為RMA助熔劑：8.0質量%，剩餘部分為Au-Sn合金焊料粉末的配合組成的方式將市場上出售的RMA助熔劑予以配合於該Au-Sn合金焊料粉末，經混合來製作具有糊狀黏度：85Pa‧s的Au-Sn合金焊劑。又，將該Au-Sn合金焊劑填充於注射器而裝設於塗佈器裝置(日本武藏技術公司所製，型式號碼：ML-606GX)。
又，準備具有縱：400μm，橫：400μm，高度：100μm尺寸的50個LED元件，對此些LED元件的一面全面施以具有厚度：3μm，縱：400μm，橫：400μm尺寸的鍍金。
又，準備氧化鋁製基板，在該氧化鋁製基板的表面，以600μm間隔形成50處1列地形成具有縱200μm，橫200μm的尺寸，具有厚度：10μm的Cu層，具有厚度：5μm的Ni層及具有厚度：0.1μm的Au層所成的複合金屬化層的金屬化層本體部分，以及具有從上述金屬化層本體部分十字狀地突出的寬度：50μm，長度：150μm的尺寸且與上述金屬化層本體部分相同構造的複合金屬化層所成的焊料引誘部所成的表示於第4B圖的平面形狀的金屬化層。
在此些的金屬化層本體部分及焊料引誘部所成的50處的金屬化層的金屬化層本體部的中心位置，利用事先所準備的塗佈器裝置塗佈0.03mg量的Au-Sn合金焊劑。在該Au-Sn合金焊劑上使用裝配器裝載事先所準備的50個LED元件。在該狀態下，氮氣環境中，施以溫度：300℃，30秒鐘保持條件的流平處理。之後，經冷卻，使用三維測定機(日本尼康(Nikon)公司所製，NEXIV VMR-3020)，測定一列地排列的50個LED元件位置的元件中心位置。在此，將在x軸方向一列地接合50個的LED元件的中心位置的x軸方向的移動及y軸方向的移動分別算出作為對於平均x軸位置的標準偏差及對於平均y軸位置的標準偏差。其結果，元件中心位置的x軸移動是±4.8μm，y軸移動是±5.2μm，可知元件的位置精度極高。
[實施例6]
作為焊料合金，使用含有Pb：37質量%，剩餘部分具有Sn所成的成分組成，具有平均粒徑D50：11.4μm，最大粒徑：14.5μm的Pb-Sn合金焊料粉末。以成為RMA助熔劑：11.0質量%，剩餘部分為Pb-Sn合金焊料粉末的配合組成的方式將市場上出售的RMA助熔劑予以配合於該Pb-Sn合金焊料粉末。又，經混合來製作具有糊狀黏度：120Pa‧s的Pb-Sn合金焊劑。將該Pb-Sn合金焊劑填充於注射器而裝設於塗佈器裝置(日本武藏技術公司所製，型式號碼：ML-606GX)。
又，準備具有縱：200μm，橫：400μm，高度：100μm尺寸的長方形狀的50個LED元件，對此些LED元件的一面全面施以具有厚度：3μm，縱：200μm，橫：400μm尺寸的鍍金。
又，準備氧化鋁製基板，在該氧化鋁製基板的表面，以600μm間隔形成50處1列地形成具有縱100μm，橫200μm的尺寸，具有厚度：10μm的Cu層，具有厚度：5μm的Ni層及具有厚度：0.1μm的Au層所成的複合金屬化層的金屬化層本體部分，以及具有從上述金屬化層本體部分以與長方形狀的LED元件的對角線相同角度所突出的寬度：50μm，長度：150μm的尺寸且與上述金屬化層本體部分相同構造的複合金屬化層所成的4個焊料引誘部所成的表示於第5B圖的平面形狀的金屬化層。
在此些金屬化層本體部分及焊料引誘部所成的50處的金屬化層的金屬化層本體部的中心位置，利用事先所準備的塗佈器裝置塗佈0.02mg量的Pb-Sn合金焊劑。在該Pb-Sn合金焊劑上使用裝配器裝載事先所準備的50個LED元件。在該狀態下，氮氣環境中，施以溫度：220℃，30秒鐘保持條件的流平處理。之後，經冷卻，使用三維測定機(日本尼康(Nikon)公司所製，NEXIV VMR-3020)，測定一列地排列的50個LED元件位置的元件中心位置。在此，將在x軸方向一列地接合50個的LED元件的中心位置的x軸方向的移動及y軸方向的移動分別算出作為對於平均x軸位置的標準偏差及對於平均y軸位置的標準偏差。其結果，元件中心位置的x軸移動是±7.1μm，y軸移動是±6.8μm，可知元件的位置精度極高。
[實施例7]
作為焊料合金，使用含有Pb：95質量%，剩餘部分具有Sn所成的成分組成，具有平均粒徑D50：11.7μm，最大粒徑：14.8μm的Pb-Sn合金焊料粉末。以成為RMA助熔劑：10.0質量%，剩餘部分為Pb-Sn合金焊料粉末的配合組成的方式將市場上出售的RMA助熔劑予以配合於該Pb-Sn合金焊料粉末，經混合來製作具有糊狀黏度：80Pa‧s的Pb-Sn合金焊劑。又，將該Pb-Sn合金焊劑填充於注射器而裝設於塗佈器裝置(日本武藏技術公司所製，型式號碼：ML-606GX)。
又，準備具有縱：200μm，橫：400μm，高度：100μm尺寸的長方形狀的50個LED元件，對此些LED元件的一面全面施以具有厚度：3μm，縱：200μm，橫：400μm尺寸的鍍金。
又，準備氧化鋁製基板，在該氧化鋁製基板的表面，以600μm間隔形成50處1列地形成具有縱100μm，橫200μm的尺寸，具有厚度：10μm的Cu層，具有厚度：5μm的Ni層及具有厚度：0.1μm的Au層所成的複合金屬化層的金屬化層本體部分，以及具有從上述金屬化層本體部分以與長方形狀的LED元件的對角線相同角度所突出的寬度：100μm，長度：150μm的尺寸且與上述金屬化層本體部分相同構造的複合金屬化層所成的兩個焊料引誘部所成的表示於第11圖的平面形狀的金屬化層。
在此些的金屬化層本體部分及焊料引誘部所成的50處的金屬化層的金屬化層本體部的中心位置，利用事先所準備的塗佈器裝置塗佈0.03mg量的Pb-Sn合金焊劑。在該Pb-Sn合金焊劑上使用裝配器裝載事先所準備的50個LED元件。在該狀態下，氮氣環境中，施以溫度：330℃，30秒鐘保持條件的流平處理。之後，經冷卻，使用三維測定機(日本尼康(Nikon)公司所製，NEXIV VMR-3020)，測定一列地排列的50個LED元件位置的元件中心位置。在此，將接合50個的LED元件的中心位置的x軸方向的移動及y軸方向的移動分別算出作為對於平均x軸位置的標準偏差及對於平均y軸位置的標準偏差。其結果，元件中心位置的x軸移動是±6.6μm，y軸移動是±7.2μm，可知元件的位置精度極高。
[實施例8]
作為焊料合金，使用含有Sn：96.5質量%，Ag：3.0質量%，剩餘部分具有Cu所成的成分組成，具有平均粒徑D50：10.8μm，最大粒徑：14.1μm的無鉛焊料粉末。以成分RMA助熔劑：12.5質量%，剩餘部分為無鉛焊料粉末的配合組成的方式，將市場上出售的RMA助熔劑予以配合於該無鉛焊料粉末，經混合來製作具有糊狀黏度：72Pa‧s的無鉛焊劑。又，將該無鉛焊劑填充於注射器而裝設於塗佈器裝置(日本武藏技術公司所製，型式號碼：ML-606GX)。
又，準備具有縱：400μm，橫：400μm，高度：100μm尺寸的正方形狀的50個LED元件，對此些LED元件的一面全面施以具有厚度：3μm，縱：400μm，橫：400μm尺寸的鍍金。
又，準備氧化鋁製基板，在該氧化鋁製基板的表面，以600μm間隔形成50處1列地形成具有縱200μm，橫200μm的尺寸，具有厚度：10μm的Cu層，具有厚度：5μm的Ni層及具有厚度：0.1μm的Au層所成的複合金屬化層的金屬化層本體部分，以及具有從上述金屬化層本體部分L字狀地突出的寬度：100μm，長度：200μm的尺寸且與上述金屬化層本體部分相同構造的複合金屬化層所成的兩個焊料引誘部所成的表示於第8圖的平面形狀的金屬化層。
在此些的金屬化層本體部分及焊料引誘部所成的50處的金屬化層的金屬化層本體部的中心位置，利用事先所準備的塗佈器裝置塗佈0.02mg量的無鉛焊劑。在該無鉛焊劑上使用裝配器裝載事先所準備的50個LED元件。在該狀態下，氮氣環境中，施以溫度：240℃，30秒鐘保持條件的流平處理。之後，經冷卻，使用三維測定機(日本尼康(Nikon)公司所製，NEXIV VMR-3020)，測定一列地排列的50個LED元件位置的元件中心位置。在此，將接合50個的LED元件的中心位置的x軸方向的移動及y軸方向的移動分別算出作為對於平均x軸位置的標準偏差及對於平均y軸位置的標準偏差。其結果，元件中心位置的x軸移動是±9.3μm，y軸移動是±8.9μm，可知元件的位置精度極高。
[習知例2]
作為焊料合金，使用含有Sn：20質量%，剩餘部分具有Au所成的成分組成，具有平均粒徑D50：11.1μm，最大粒徑：20.1μm的Au-Sn合金焊料粉末。以成為RMA助熔劑：8.0質量%，剩餘部分為Au-Sn合金焊料粉末的配合組成的方式將市場上出售的RMA助熔劑予以配合於該Au-Sn合金焊料粉末，經混合來製作具有糊狀黏度：85Pa‧s的Au-Sn合金焊劑。又，將該Au-Sn合金焊劑填充於注射器而裝設於塗佈器裝置(日本武藏技術公司所製，型式號碼：ML-606GX)。
又，準備具有縱：400μm，橫：400μm，高度：100μm尺寸的50個LED元件，對此些LED元件的一面全面施以具有厚度：3μm，縱：400μm，橫：400μm尺寸的鍍金。
又，準備氧化鋁製基板，在該氧化鋁製基板的表面，以600μm間隔形成50處1列地形成具有縱500μm，橫500μm的尺寸，具有厚度：10μm的Cu層，具有厚度：5μm的Ni層及具有厚度：0.1μm的Au層所成的複合金屬化層的金屬化層。
在此些的金屬化層所成的50處的金屬化層的中心位置，利用事先所準備的塗佈器裝置塗佈0.03mg量的Au-Sn合金焊劑。在該Au-Sn合金焊劑上使用裝配器裝載事先所準備的50個LED元件。在該狀態下，氮氣環境中，施以溫度：300℃，30秒鐘保持條件的流平處理。之後，經冷卻，使用三維測定機(日本尼康(Nikon)公司所製，NEXIV VMR-3020)，測定一列地排列的50個LED元件位置的元件中心位置。在此，將在x軸方向一列地接合50個的LED元件的中心位置的x軸方向的移動及y軸方向的移動分別算出作為對於平均x軸位置的標準偏差及對於平均y軸位置的標準偏差。其結果，元件中心位置：有x軸移動是±42.1μm，y軸移動是±37.5μm，可知元件的位置精度較低。
本發明是提供使用焊劑對於基板將被裝載物接合成相同位置及方向的方法，尤其是提供使用Au-Sn合金焊劑對於基板將元件接合成相同位置及方向的方法之故，因而具有產業上的利用可能性。
1．．．基板
2．．．金屬化層
3．．．Au-Sn合金焊劑
4．．．元件、被裝載物
5．．．Au-Sn合金焊料接合層
6．．．金屬化層
10．．．基板
12．．．金屬化層
12A．．．金屬化層本體部分
12B．．．焊料引誘部
13．．．Au-Sn合金焊劑
14．．．具有正方形狀的元件、被裝載物
16．．．金屬化層
24．．．具有長方形狀的元件、被裝載物
42．．．金屬化層
42A．．．金屬化層本體部分
42B．．．焊料引誘部
52．．．金屬化層
52A．．．金屬化層本體部分
52B．．．焊料引誘部
第1圖是在利用本發明的方法來接合基板與元件的工程中用以說明流平處理前的構成的整體像的縱斷面圖。
第2A圖是在本發明的方法中，用以說明流平處理前的構成的俯視圖。
第2B圖是在本發明的方法中，用以說明流平處理後的構成的俯視圖。
第3A圖是表示在本發明中，形成於基板的金屬化層的形狀的俯視圖。
第3B圖是表示在本發明中，形成於基板的金屬化層的形狀的俯視圖。
第4A圖是在本發明的方法中，用以說明流平處理前的構成的俯視圖。
第4B圖是在本發明的方法中，用以說明流平處理後的構成的俯視圖。
第5A圖是在本發明的方法中，用以說明流平處理前的構成的俯視圖。
第5B圖是在本發明的方法中，用以說明流平處理後的構成的俯視圖。
第6圖是表示在本發明的其他實施形態中，金屬化層及被裝載物的接合狀態的俯視圖。
第7圖是表示在本發明的其他實施形態中，金屬化層及被裝載物的接合狀態的俯視圖。
第8圖是表示在本發明的其他實施形態中，金屬化層及被裝載物的接合狀態的俯視圖。
第9圖是表示在本發明的其他實施形態中，金屬化層及被裝載物的接合狀態的俯視圖。
第10圖是表示在本發明的其他實施形態中，金屬化層及被裝載物的接合狀態的俯視圖。
第11圖是表示在本發明的其他實施形態中，金屬化層及被裝載物的接合狀態的俯視圖。
第12圖是表示在本發明的其他實施形態中，金屬化層及被裝載物的接合狀態的俯視圖。
第13圖是表示在本發明的其他實施形態中，金屬化層及被裝載物的接合狀態的俯視圖。
第14A圖是在習知的方法中，用以說明流平處理前的構成的縱斷面圖。
第14B圖是在習知的方法中，用以說明流平處理後的構成的縱斷面圖。
第15圖是從上面觀看第14A圖的狀態的基板與元件的俯視圖。
第16圖是從上面觀看第14B圖的狀態的基板與元件的俯視圖。
12．．．金屬化層
12A．．．金屬化層本體部分
12B．．．焊料引誘部
13．．．Au-Sn合金焊劑
14．．．具有正方形狀的元件、被裝載物
W1．．．寬度
L1．．．長度

Claims (9)

  1. 一種使用焊劑的基板及被裝載物的接合方法，是屬於使用焊劑的基板及被裝載物的接合方法，其特徵為：具有：在形成於上述基板的金屬化層，及形成於上述被裝載物的具有最長對角線的金屬化層之間，裝載或塗佈上述焊劑的工程，及將此些在非氧化性環境中進行迴焊處理，使焊料熔融，藉由焊料來接合上述基板與上述被裝載物的工程，形成於上述基板的上述金屬化層是具有：面積比上述被裝載物的具有最長對角線的上述金屬化層的面積還要小的金屬化層本體部分，及從上述金屬化層本體部分的周圍所突出的焊料引誘部所構成的平面形狀。
  2. 如申請專利範圍第1項所述的使用焊劑的基板及被裝載物的接合方法，其中，上述焊劑是含有20至25質量%的Sn，在剩餘部分為Au及不可避雜質的Au-Sn焊料合金粉末，混合助熔劑的Au-Sn合金焊劑。
  3. 如申請專利範圍第1項所述的使用焊劑的基板及被裝載物的接合方法，其中，上述焊劑是含有35至60質量%的Pb，在剩餘部分為Sn及不可避雜質的Pb-Sn焊料合金粉末，混合助熔劑的Pb-Sn合金焊劑。
  4. 如申請專利範圍第1項所述的使用焊劑的基板及被 裝載物的接合方法，其中，上述焊劑是含有90至95質量%的Pb，在剩餘部分為Sn及不可避雜質的Pb-Sn焊料合金粉末，混合助熔劑的Pb-Sn合金焊劑。
  5. 如申請專利範圍第1項所述的使用焊劑的基板及被裝載物的接合方法，其中，上述焊劑是含有40至100質量%的Sn，在剩餘部分為由Ag、Au、Cu、Bi、Sb、In及Zn所成的群所選擇的1種或2種以上的金屬及不可避雜質的無鉛焊料合金粉末，混合助熔劑的無鉛焊劑。
  6. 如申請專利範圍第1項所述的使用焊劑的基板及被裝載物的接合方法，其中，上述被裝載物是元件。
  7. 如申請專利範圍第1項所述的使用焊劑的基板及被裝載物的接合方法，其中，形成於上述基板的上述金屬化層是電極膜。
  8. 一種使用焊劑的基板及被裝載物的接合方法，是屬於申請專利範圍第1項所述的使用焊劑的基板及被裝載物的接合方法，其特徵為：形成於上述基板的表面的上述金屬化層，是形成具有從上述金屬化層本體部分的周圍所突出的至少兩個焊料引誘部的平面形狀，互相地鄰接的焊料引誘部的長邊方向彼此間所成的角度，是與上述被裝載物的對角線彼此間所成的交叉角的任一相同。
  9. 一種被裝載物與基板的接合體的製造方法，其特徵為：使用申請專利範圍第1項所述的接合方法。
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CN103208435B (zh) 2016-01-20
WO2009151123A1 (ja) 2009-12-17
TW201019405A (en) 2010-05-16
EP2290676A4 (en) 2012-01-11
EP2290676A1 (en) 2011-03-02
CN102047397A (zh) 2011-05-04
US20110067911A1 (en) 2011-03-24
KR101565184B1 (ko) 2015-11-02

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