JPS5149550B2 - - Google Patents

Info

Publication number
JPS5149550B2
JPS5149550B2 JP9269672A JP9269672A JPS5149550B2 JP S5149550 B2 JPS5149550 B2 JP S5149550B2 JP 9269672 A JP9269672 A JP 9269672A JP 9269672 A JP9269672 A JP 9269672A JP S5149550 B2 JPS5149550 B2 JP S5149550B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9269672A
Other languages
Japanese (ja)
Other versions
JPS4949577A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9269672A priority Critical patent/JPS5149550B2/ja
Publication of JPS4949577A publication Critical patent/JPS4949577A/ja
Publication of JPS5149550B2 publication Critical patent/JPS5149550B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP9269672A 1972-09-14 1972-09-14 Expired JPS5149550B2 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9269672A JPS5149550B2 (zh) 1972-09-14 1972-09-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9269672A JPS5149550B2 (zh) 1972-09-14 1972-09-14

Publications (2)

Publication Number Publication Date
JPS4949577A JPS4949577A (zh) 1974-05-14
JPS5149550B2 true JPS5149550B2 (zh) 1976-12-27

Family

ID=14061649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9269672A Expired JPS5149550B2 (zh) 1972-09-14 1972-09-14

Country Status (1)

Country Link
JP (1) JPS5149550B2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2290676A4 (en) * 2008-06-12 2012-01-11 Mitsubishi Materials Corp METHOD FOR CONNECTING A SUBSTRATE AND MOUNTING OBJECT WITH SOLDERING PASTE

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5816617B2 (ja) * 1979-04-27 1983-04-01 株式会社東芝 半導体装置の製造方法
JPS5753948A (ja) * 1980-09-17 1982-03-31 Toshiba Corp Handotaisoshinomauntohoho
JPH0662902A (ja) * 1992-08-25 1994-03-08 Daiwa Seiko Inc スキー靴

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2290676A4 (en) * 2008-06-12 2012-01-11 Mitsubishi Materials Corp METHOD FOR CONNECTING A SUBSTRATE AND MOUNTING OBJECT WITH SOLDERING PASTE

Also Published As

Publication number Publication date
JPS4949577A (zh) 1974-05-14

Similar Documents

Publication Publication Date Title
FR2197529A1 (zh)
FR2198434A5 (zh)
JPS4949577A (zh)
JPS4910875U (zh)
JPS5435451B2 (zh)
JPS49102022U (zh)
JPS4991747U (zh)
JPS529784Y2 (zh)
JPS4877276A (zh)
CH559993A5 (zh)
CH564948A5 (zh)
CH578290A5 (zh)
DD108282A5 (zh)
CH596217A5 (zh)
CH591552A5 (zh)
CH590850A5 (zh)
CH590818A5 (zh)
BE791264A (zh)
BG17676A1 (zh)
BG20645A1 (zh)
CH249173A4 (zh)
CH559489A5 (zh)
CH559550A5 (zh)
CH559783A5 (zh)
CH580559A5 (zh)