USD816135S1 - Spoked solder pad - Google Patents
Spoked solder pad Download PDFInfo
- Publication number
- USD816135S1 USD816135S1 US29/512,592 US201429512592F USD816135S US D816135 S1 USD816135 S1 US D816135S1 US 201429512592 F US201429512592 F US 201429512592F US D816135 S USD816135 S US D816135S
- Authority
- US
- United States
- Prior art keywords
- solder pad
- spoked
- spoked solder
- top plan
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Images
Description
Broken line illustrations of environmental structure in the drawings, including dashed line radial axes and integrated circuit package and/or circuit board outlines in FIGS. 1-3 , and integrated circuit elements in FIG. 4 , are provided for illustrative purposes only and form no part of the claimed design.
Claims (1)
- The ornamental design for a spoked solder pad, as shown and described.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/512,592 USD816135S1 (en) | 2014-12-19 | 2014-12-19 | Spoked solder pad |
US29/636,910 USD845369S1 (en) | 2014-12-19 | 2018-02-12 | Spoked solder pad |
US29/636,907 USD845368S1 (en) | 2014-12-19 | 2018-02-12 | Spoked solder pad |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/512,592 USD816135S1 (en) | 2014-12-19 | 2014-12-19 | Spoked solder pad |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/636,910 Division USD845369S1 (en) | 2014-12-19 | 2018-02-12 | Spoked solder pad |
US29/636,907 Division USD845368S1 (en) | 2014-12-19 | 2018-02-12 | Spoked solder pad |
Publications (1)
Publication Number | Publication Date |
---|---|
USD816135S1 true USD816135S1 (en) | 2018-04-24 |
Family
ID=61951999
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/512,592 Active USD816135S1 (en) | 2014-12-19 | 2014-12-19 | Spoked solder pad |
US29/636,907 Active USD845368S1 (en) | 2014-12-19 | 2018-02-12 | Spoked solder pad |
US29/636,910 Active USD845369S1 (en) | 2014-12-19 | 2018-02-12 | Spoked solder pad |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/636,907 Active USD845368S1 (en) | 2014-12-19 | 2018-02-12 | Spoked solder pad |
US29/636,910 Active USD845369S1 (en) | 2014-12-19 | 2018-02-12 | Spoked solder pad |
Country Status (1)
Country | Link |
---|---|
US (3) | USD816135S1 (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD571810S1 (en) * | 2006-06-20 | 2008-06-24 | Kabushiki Kaisha Toshiba | Module with built-in integrated circuits for use with IC cards |
US20090211087A1 (en) | 2004-07-08 | 2009-08-27 | International Business Machines Corporation | Method and system for improving alignment precision of parts in mems |
US7902666B1 (en) | 2009-10-05 | 2011-03-08 | Powertech Technology Inc. | Flip chip device having soldered metal posts by surface mounting |
US20110067911A1 (en) | 2008-06-12 | 2011-03-24 | Mitsubishi Materials Corporation | Method of bonding parts to substrate using solder paste |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
USD702240S1 (en) * | 2012-04-13 | 2014-04-08 | Blackberry Limited | UICC apparatus |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61102089A (en) | 1984-10-25 | 1986-05-20 | 松下電工株式会社 | Mount structure of flat package ic |
JPH09107173A (en) | 1995-10-11 | 1997-04-22 | Tokai Rika Co Ltd | Pad structure and wiring board device |
US5900674A (en) | 1996-12-23 | 1999-05-04 | General Electric Company | Interface structures for electronic devices |
US6054563A (en) | 1997-03-05 | 2000-04-25 | Rhodia Chimie | Preparation of solid, powdery rare earth carboxylates by evaporation method |
WO2001020660A1 (en) | 1999-09-09 | 2001-03-22 | Fujitsu Limited | Method of mounting optical and electrical devices, and mounting structure |
US6507113B1 (en) | 1999-11-19 | 2003-01-14 | General Electric Company | Electronic interface structures and methods of fabrication |
US20020092672A1 (en) | 2001-01-16 | 2002-07-18 | Primavera Anthony A. | Contact pads and circuit boards incorporating same |
JP3610496B2 (en) | 2002-07-30 | 2005-01-12 | オリオン電機株式会社 | Soldering structure for printed circuit boards and electronic components |
JP4428337B2 (en) | 2005-12-02 | 2010-03-10 | ソニー株式会社 | Manufacturing method of semiconductor device |
US20090091025A1 (en) | 2007-10-04 | 2009-04-09 | Agency For Science, Technology And Research | Method for forming and releasing interconnects |
WO2013179288A1 (en) | 2012-05-29 | 2013-12-05 | Essence Solar Solutions Ltd. | Self aligning soldering |
-
2014
- 2014-12-19 US US29/512,592 patent/USD816135S1/en active Active
-
2018
- 2018-02-12 US US29/636,907 patent/USD845368S1/en active Active
- 2018-02-12 US US29/636,910 patent/USD845369S1/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090211087A1 (en) | 2004-07-08 | 2009-08-27 | International Business Machines Corporation | Method and system for improving alignment precision of parts in mems |
USD571810S1 (en) * | 2006-06-20 | 2008-06-24 | Kabushiki Kaisha Toshiba | Module with built-in integrated circuits for use with IC cards |
US20110067911A1 (en) | 2008-06-12 | 2011-03-24 | Mitsubishi Materials Corporation | Method of bonding parts to substrate using solder paste |
US7902666B1 (en) | 2009-10-05 | 2011-03-08 | Powertech Technology Inc. | Flip chip device having soldered metal posts by surface mounting |
USD702240S1 (en) * | 2012-04-13 | 2014-04-08 | Blackberry Limited | UICC apparatus |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
USD702241S1 (en) * | 2012-04-23 | 2014-04-08 | Blackberry Limited | UICC apparatus |
Also Published As
Publication number | Publication date |
---|---|
USD845369S1 (en) | 2019-04-09 |
USD845368S1 (en) | 2019-04-09 |
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