USD816135S1 - Spoked solder pad - Google Patents

Spoked solder pad Download PDF

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Publication number
USD816135S1
USD816135S1 US29/512,592 US201429512592F USD816135S US D816135 S1 USD816135 S1 US D816135S1 US 201429512592 F US201429512592 F US 201429512592F US D816135 S USD816135 S US D816135S
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US
United States
Prior art keywords
solder pad
spoked
spoked solder
top plan
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/512,592
Inventor
Myron Walker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US29/512,592 priority Critical patent/USD816135S1/en
Priority to US29/636,910 priority patent/USD845369S1/en
Priority to US29/636,907 priority patent/USD845368S1/en
Application granted granted Critical
Publication of USD816135S1 publication Critical patent/USD816135S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top plan view of a solder pad with three or more solderable lobes, each solderable lobe symmetrically extending along a radial axis.
FIG. 2 is a top plan view of a solder pad with illustrative solder prefill on the solder pad as shown in FIG. 1.
FIG. 3 is a top plan view of a solder pad with illustrative solder prefill wetting along each radial axis when soldered; and,
FIG. 4 is a top plan view of a solder pad with illustrative integrated circuit elements in unused adjacent space.
Broken line illustrations of environmental structure in the drawings, including dashed line radial axes and integrated circuit package and/or circuit board outlines in FIGS. 1-3, and integrated circuit elements in FIG. 4, are provided for illustrative purposes only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a spoked solder pad, as shown and described.
US29/512,592 2014-12-19 2014-12-19 Spoked solder pad Active USD816135S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/512,592 USD816135S1 (en) 2014-12-19 2014-12-19 Spoked solder pad
US29/636,910 USD845369S1 (en) 2014-12-19 2018-02-12 Spoked solder pad
US29/636,907 USD845368S1 (en) 2014-12-19 2018-02-12 Spoked solder pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/512,592 USD816135S1 (en) 2014-12-19 2014-12-19 Spoked solder pad

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US29/636,910 Division USD845369S1 (en) 2014-12-19 2018-02-12 Spoked solder pad
US29/636,907 Division USD845368S1 (en) 2014-12-19 2018-02-12 Spoked solder pad

Publications (1)

Publication Number Publication Date
USD816135S1 true USD816135S1 (en) 2018-04-24

Family

ID=61951999

Family Applications (3)

Application Number Title Priority Date Filing Date
US29/512,592 Active USD816135S1 (en) 2014-12-19 2014-12-19 Spoked solder pad
US29/636,907 Active USD845368S1 (en) 2014-12-19 2018-02-12 Spoked solder pad
US29/636,910 Active USD845369S1 (en) 2014-12-19 2018-02-12 Spoked solder pad

Family Applications After (2)

Application Number Title Priority Date Filing Date
US29/636,907 Active USD845368S1 (en) 2014-12-19 2018-02-12 Spoked solder pad
US29/636,910 Active USD845369S1 (en) 2014-12-19 2018-02-12 Spoked solder pad

Country Status (1)

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US (3) USD816135S1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD571810S1 (en) * 2006-06-20 2008-06-24 Kabushiki Kaisha Toshiba Module with built-in integrated circuits for use with IC cards
US20090211087A1 (en) 2004-07-08 2009-08-27 International Business Machines Corporation Method and system for improving alignment precision of parts in mems
US7902666B1 (en) 2009-10-05 2011-03-08 Powertech Technology Inc. Flip chip device having soldered metal posts by surface mounting
US20110067911A1 (en) 2008-06-12 2011-03-24 Mitsubishi Materials Corporation Method of bonding parts to substrate using solder paste
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD702240S1 (en) * 2012-04-13 2014-04-08 Blackberry Limited UICC apparatus

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61102089A (en) 1984-10-25 1986-05-20 松下電工株式会社 Mount structure of flat package ic
JPH09107173A (en) 1995-10-11 1997-04-22 Tokai Rika Co Ltd Pad structure and wiring board device
US5900674A (en) 1996-12-23 1999-05-04 General Electric Company Interface structures for electronic devices
US6054563A (en) 1997-03-05 2000-04-25 Rhodia Chimie Preparation of solid, powdery rare earth carboxylates by evaporation method
WO2001020660A1 (en) 1999-09-09 2001-03-22 Fujitsu Limited Method of mounting optical and electrical devices, and mounting structure
US6507113B1 (en) 1999-11-19 2003-01-14 General Electric Company Electronic interface structures and methods of fabrication
US20020092672A1 (en) 2001-01-16 2002-07-18 Primavera Anthony A. Contact pads and circuit boards incorporating same
JP3610496B2 (en) 2002-07-30 2005-01-12 オリオン電機株式会社 Soldering structure for printed circuit boards and electronic components
JP4428337B2 (en) 2005-12-02 2010-03-10 ソニー株式会社 Manufacturing method of semiconductor device
US20090091025A1 (en) 2007-10-04 2009-04-09 Agency For Science, Technology And Research Method for forming and releasing interconnects
WO2013179288A1 (en) 2012-05-29 2013-12-05 Essence Solar Solutions Ltd. Self aligning soldering

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090211087A1 (en) 2004-07-08 2009-08-27 International Business Machines Corporation Method and system for improving alignment precision of parts in mems
USD571810S1 (en) * 2006-06-20 2008-06-24 Kabushiki Kaisha Toshiba Module with built-in integrated circuits for use with IC cards
US20110067911A1 (en) 2008-06-12 2011-03-24 Mitsubishi Materials Corporation Method of bonding parts to substrate using solder paste
US7902666B1 (en) 2009-10-05 2011-03-08 Powertech Technology Inc. Flip chip device having soldered metal posts by surface mounting
USD702240S1 (en) * 2012-04-13 2014-04-08 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD702241S1 (en) * 2012-04-23 2014-04-08 Blackberry Limited UICC apparatus

Also Published As

Publication number Publication date
USD845369S1 (en) 2019-04-09
USD845368S1 (en) 2019-04-09

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