TWI535775B - 鹼性顯影型樹脂，使用該樹脂的感光性樹脂組成物 - Google Patents

鹼性顯影型樹脂，使用該樹脂的感光性樹脂組成物 Download PDF

Info

Publication number
TWI535775B
TWI535775B TW102123948A TW102123948A TWI535775B TW I535775 B TWI535775 B TW I535775B TW 102123948 A TW102123948 A TW 102123948A TW 102123948 A TW102123948 A TW 102123948A TW I535775 B TWI535775 B TW I535775B
Authority
TW
Taiwan
Prior art keywords
resin
alkali
hydroxyl group
phenol
phenol resin
Prior art date
Application number
TW102123948A
Other languages
English (en)
Chinese (zh)
Other versions
TW201420668A (zh
Inventor
山本和義
關根健二
堀口尙文
Original Assignee
日本化藥股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本化藥股份有限公司 filed Critical 日本化藥股份有限公司
Publication of TW201420668A publication Critical patent/TW201420668A/zh
Application granted granted Critical
Publication of TWI535775B publication Critical patent/TWI535775B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28—Chemically modified polycondensates
    • C08G8/32—Chemically modified polycondensates by organic acids or derivatives thereof, e.g. fatty oils
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/12—Chemically modified polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C08G8/20—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with polyhydric phenols
    • C08G8/22—Resorcinol
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C09D161/04, C09D161/18 and C09D161/20
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials For Photolithography (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW102123948A 2012-07-13 2013-07-04 鹼性顯影型樹脂，使用該樹脂的感光性樹脂組成物 TWI535775B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012157142 2012-07-13
JP2012223382 2012-10-05

Publications (2)

Publication Number Publication Date
TW201420668A TW201420668A (zh) 2014-06-01
TWI535775B true TWI535775B (zh) 2016-06-01

Family

ID=49915688

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102123948A TWI535775B (zh) 2012-07-13 2013-07-04 鹼性顯影型樹脂，使用該樹脂的感光性樹脂組成物

Country Status (5)

Country Link
JP (1) JP6111248B2 (ja)
KR (1) KR102031014B1 (ja)
CN (1) CN104470962B (ja)
TW (1) TWI535775B (ja)
WO (1) WO2014010204A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6761224B2 (ja) * 2014-02-19 2020-09-23 味の素株式会社 プリント配線板、半導体装置及び樹脂シートセット
WO2016006264A1 (ja) * 2014-07-10 2016-01-14 太陽インキ製造株式会社 樹脂絶縁層の形成方法、樹脂絶縁層およびプリント配線板
TWI687769B (zh) * 2015-05-12 2020-03-11 日商三菱製紙股份有限公司 噴砂用感光性樹脂組成物及噴砂處理方法
JP6907531B2 (ja) * 2015-12-28 2021-07-21 荒川化学工業株式会社 印刷インキ用変性フェノール樹脂、活性エネルギー線硬化型樹脂組成物、ゲルワニス、硬化物、活性エネルギー線硬化型印刷インキ及び印刷物
TWI609382B (zh) * 2016-07-26 2017-12-21 台灣太陽油墨股份有限公司 介電材料組成物及含其之絕緣膜及電路板
KR20210049870A (ko) 2018-08-28 2021-05-06 스미또모 베이크라이트 가부시키가이샤 네거티브형 감광성 수지 조성물, 및 그것을 이용한 반도체 장치
CN110753455A (zh) * 2019-10-23 2020-02-04 深南电路股份有限公司 一种抗镀干膜加工方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6454390A (en) 1987-08-26 1989-03-01 Matsushita Electric Ind Co Ltd Driver using shape memory alloy
JP3190251B2 (ja) 1995-06-06 2001-07-23 太陽インキ製造株式会社 アルカリ現像型のフレキシブルプリント配線板用光硬化性・熱硬化性樹脂組成物
JP3659825B2 (ja) 1997-12-19 2005-06-15 太陽インキ製造株式会社 アルカリ現像可能な光硬化性・熱硬化性組成物及びそれから得られる硬化皮膜
JP3468291B2 (ja) * 2000-04-10 2003-11-17 荒川化学工業株式会社 アルコキシ基含有シラン変性フェノール樹脂、樹脂組成物、エポキシ樹脂硬化剤及び有機・無機ハイブリッド体。
KR100796405B1 (ko) * 2000-09-20 2008-01-21 다이요 잉키 세이조 가부시키가이샤 카르복실기 함유 감광성 수지, 이것을 함유하는 알칼리현상 가능 광경화성ㆍ열경화성 조성물 및 그 경화물
JP2002128866A (ja) 2000-10-20 2002-05-09 Toshiba Chem Corp 導電性ペースト
JP2002128865A (ja) * 2000-10-31 2002-05-09 Showa Highpolymer Co Ltd 感光性樹脂組成物
JP4889850B2 (ja) * 2000-10-31 2012-03-07 昭和電工株式会社 硬化性樹脂、感光性樹脂組成物及び硬化塗膜の形成方法
JP2002138126A (ja) 2000-10-31 2002-05-14 Inoac Corp 弾性部材
JP4167599B2 (ja) * 2002-02-19 2008-10-15 太陽インキ製造株式会社 硬化性樹脂及びそれを含有する硬化性樹脂組成物
WO2011122027A1 (ja) 2010-03-31 2011-10-06 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物

Also Published As

Publication number Publication date
JPWO2014010204A1 (ja) 2016-06-20
CN104470962B (zh) 2017-09-12
TW201420668A (zh) 2014-06-01
CN104470962A (zh) 2015-03-25
KR102031014B1 (ko) 2019-10-11
JP6111248B2 (ja) 2017-04-05
KR20150036042A (ko) 2015-04-07
WO2014010204A1 (ja) 2014-01-16

Similar Documents

Publication Publication Date Title
TWI535775B (zh) 鹼性顯影型樹脂，使用該樹脂的感光性樹脂組成物
TWI432900B (zh) 感光性樹脂組成物
TWI793795B (zh) 硬化性樹脂組成物、乾膜、硬化物及印刷配線板
JP4376290B2 (ja) ソルダーレジスト、そのドライフィルム及び硬化物ならびにプリント配線板
KR101481071B1 (ko) 내열성 및 기계적 성질이 우수한 감광성 수지 조성물 및 인쇄회로기판용 보호필름
JP2013522687A (ja) 光硬化性及び熱硬化性を有する樹脂組成物、並びにドライフィルムソルダレジスト
JP2007249148A (ja) 感光性熱硬化性樹脂組成物、並びにレジスト膜被覆平滑化プリント配線基板及びその製造法。
WO2012036477A2 (ko) 감광성 수지 조성물, 드라이 필름 솔더 레지스트 및 회로 기판
TWI731956B (zh) 硬化性樹脂組成物、乾膜、硬化物及印刷配線板
TWI727175B (zh) 感光性樹脂組成物、乾膜、及印刷線路板
TWI793289B (zh) 含有聚合性不飽和基的鹼可溶性樹脂的製造方法、含有聚合性不飽和基的鹼可溶性樹脂、以其作為必須成分的感光性樹脂組成物以及其硬化膜
JP4894257B2 (ja) 分岐ポリエーテル樹脂組成物の製造方法および酸ペンダント型分岐ポリエーテル樹脂組成物の製造方法
JP2003280190A (ja) 光硬化性・熱硬化性樹脂組成物
WO2014021590A1 (ko) 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트
JP4882271B2 (ja) レジストインキ用樹脂組成物
JP3953853B2 (ja) 光硬化性・熱硬化性樹脂組成物
KR20140115988A (ko) 에폭시아크릴레이트 수지, 에폭시아크릴레이트 산무수물 부가체, 경화성 수지 조성물, 알칼리 현상형 감광성 수지 조성물 및 이들의 경화물
TW201945844A (zh) 硬化性樹脂組成物、乾膜、硬化物，及電子零件
JP4408401B2 (ja) アルカリ水溶液可溶性樹脂、それを含む組成物及びその硬化物
JP6073720B2 (ja) アルカリ現像型感光性樹脂組成物及びその硬化物
JP4293483B2 (ja) 変性共重合体及び樹脂組成物
JP5924185B2 (ja) ビニルエステル化合物、ビニルエステル樹脂、その製造方法、感光性樹脂組成物、その硬化物、及びレジストインキ
JP2021144097A (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
WO2001051991A1 (en) Resin composition, cured object obtained therefrom, and article thereof
JP5268233B2 (ja) エポキシ樹脂、エポキシ樹脂組成物、並びにその硬化物

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees