JPS6454390A - Driver using shape memory alloy - Google Patents

Driver using shape memory alloy

Info

Publication number
JPS6454390A
JPS6454390A JP21206787A JP21206787A JPS6454390A JP S6454390 A JPS6454390 A JP S6454390A JP 21206787 A JP21206787 A JP 21206787A JP 21206787 A JP21206787 A JP 21206787A JP S6454390 A JPS6454390 A JP S6454390A
Authority
JP
Japan
Prior art keywords
spring
shape memory
memory alloy
gears
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21206787A
Other languages
Japanese (ja)
Inventor
Tomoaki Ieda
Noboru Kurata
Masaaki Tojo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP21206787A priority Critical patent/JPS6454390A/en
Publication of JPS6454390A publication Critical patent/JPS6454390A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H61/00—Electrothermal relays
    • H01H61/01—Details
    • H01H61/0107—Details making use of shape memory materials
    • H01H2061/0115—Shape memory alloy [SMA] actuator formed by coil spring

Landscapes

  • Details Of Measuring And Other Instruments (AREA)
  • Thermally Actuated Switches (AREA)

Abstract

PURPOSE: To abruptly change the length of a tension spring made of a shape memory alloy by respectively attaching the tension spring and a tension spring to two pins fitted to the side face of each of two partial gears meshed with each other. CONSTITUTION: A driving device is composed of tension springs 11 and 12 made of a shape memory alloy, partial gears 13a and 13b, and pins 14a and 14b. The gears 13a and 13b are meshed with each other and rotatably supported by shafts 15a and 15b so that the rotations of the gears can be transmitted. The springs 11 and 12 are supported by pins 14a and 14b which are fitted to the side face of each gear 12a and 13b. When the constant of the spring 12, etc., is changed, various characteristics of bias forces can be applied to the spring 11 and, contrary to the conventional example, the bias forces can be made stronger as the spring 11 becomes longer. By applying the bias forces, the spring 11 can be made longer abruptly, because the tensile bias load applied to the spring 11 becomes larger as the temperature becomes lower.
JP21206787A 1987-08-26 1987-08-26 Driver using shape memory alloy Pending JPS6454390A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21206787A JPS6454390A (en) 1987-08-26 1987-08-26 Driver using shape memory alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21206787A JPS6454390A (en) 1987-08-26 1987-08-26 Driver using shape memory alloy

Publications (1)

Publication Number Publication Date
JPS6454390A true JPS6454390A (en) 1989-03-01

Family

ID=16616318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21206787A Pending JPS6454390A (en) 1987-08-26 1987-08-26 Driver using shape memory alloy

Country Status (1)

Country Link
JP (1) JPS6454390A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63205650A (en) * 1987-02-20 1988-08-25 Unitika Ltd Alkaline development type photosensitive resin composition
US5281678A (en) * 1990-11-20 1994-01-25 W. R. Grace & Co. Preparation of unsaturated epoxy ester resin and carboxylated unsaturated epoxy ester resin and photosensitive composition comprising the same
US5849460A (en) * 1994-07-27 1998-12-15 Hitachi, Ltd. Photosensitive resin composition and method for using the same in manufacture of circuit boards
US5853957A (en) * 1995-05-08 1998-12-29 Tamura Kaken Co., Ltd Photosensitive resin compositions, cured films thereof, and circuit boards
US6333834B1 (en) 1992-11-13 2001-12-25 Syquest Technology, Inc. Rattle reduction mechanism in a removable cartridge for a disk drive
JP2003009457A (en) * 2001-06-18 2003-01-10 Nidec Copal Corp Axial flow fan motor
US6756166B2 (en) 2001-09-25 2004-06-29 Tamurakaken Corporation Photosensitive resin composition and printed wiring board
US7195857B2 (en) 2001-07-04 2007-03-27 Showa Denko K.K. Resist curable resin composition and cured article thereof
KR20110095096A (en) 2010-02-17 2011-08-24 다이요 홀딩스 가부시키가이샤 Solder resist composition and printed wiring board
KR20140129329A (en) 2010-03-31 2014-11-06 다이요 홀딩스 가부시키가이샤 Solder resist composition and printed circuit board
KR20150036042A (en) 2012-07-13 2015-04-07 닛뽄 가야쿠 가부시키가이샤 Alkali development type resin, and photosensitive resin composition using same
KR20170132815A (en) 2015-03-31 2017-12-04 다이요 잉키 세이조 가부시키가이샤 Curable resin composition, dry film, cured product and printed wiring board
KR20190114806A (en) 2018-03-30 2019-10-10 다이요 잉키 세이조 가부시키가이샤 Curable resin composition, dry film, cured product and printed wiring board

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63205650A (en) * 1987-02-20 1988-08-25 Unitika Ltd Alkaline development type photosensitive resin composition
US5281678A (en) * 1990-11-20 1994-01-25 W. R. Grace & Co. Preparation of unsaturated epoxy ester resin and carboxylated unsaturated epoxy ester resin and photosensitive composition comprising the same
US5319060A (en) * 1990-11-20 1994-06-07 W. R. Grace & Co.-Conn. Preparation of unsaturated epoxy ester resin and carboxylated unsaturated epoxy ester resin and photosensitive composition comprising the same
US6333834B1 (en) 1992-11-13 2001-12-25 Syquest Technology, Inc. Rattle reduction mechanism in a removable cartridge for a disk drive
US5849460A (en) * 1994-07-27 1998-12-15 Hitachi, Ltd. Photosensitive resin composition and method for using the same in manufacture of circuit boards
US6156462A (en) * 1995-05-08 2000-12-05 Tamura Kaken Co., Ltd. Photosensitive resin compositions, cured films thereof, and circuit substrates
US5853957A (en) * 1995-05-08 1998-12-29 Tamura Kaken Co., Ltd Photosensitive resin compositions, cured films thereof, and circuit boards
JP2003009457A (en) * 2001-06-18 2003-01-10 Nidec Copal Corp Axial flow fan motor
US7195857B2 (en) 2001-07-04 2007-03-27 Showa Denko K.K. Resist curable resin composition and cured article thereof
US6756166B2 (en) 2001-09-25 2004-06-29 Tamurakaken Corporation Photosensitive resin composition and printed wiring board
KR20110095096A (en) 2010-02-17 2011-08-24 다이요 홀딩스 가부시키가이샤 Solder resist composition and printed wiring board
KR20140129329A (en) 2010-03-31 2014-11-06 다이요 홀딩스 가부시키가이샤 Solder resist composition and printed circuit board
KR20150036042A (en) 2012-07-13 2015-04-07 닛뽄 가야쿠 가부시키가이샤 Alkali development type resin, and photosensitive resin composition using same
KR20170132815A (en) 2015-03-31 2017-12-04 다이요 잉키 세이조 가부시키가이샤 Curable resin composition, dry film, cured product and printed wiring board
KR20190114806A (en) 2018-03-30 2019-10-10 다이요 잉키 세이조 가부시키가이샤 Curable resin composition, dry film, cured product and printed wiring board

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