TWI535775B - 鹼性顯影型樹脂，使用該樹脂的感光性樹脂組成物 - Google Patents

鹼性顯影型樹脂，使用該樹脂的感光性樹脂組成物 Download PDF

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Publication number
TWI535775B
TWI535775B TW102123948A TW102123948A TWI535775B TW I535775 B TWI535775 B TW I535775B TW 102123948 A TW102123948 A TW 102123948A TW 102123948 A TW102123948 A TW 102123948A TW I535775 B TWI535775 B TW I535775B
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TW
Taiwan
Prior art keywords
resin
alkali
hydroxyl group
phenol
phenol resin
Prior art date
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TW102123948A
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English (en)
Chinese (zh)
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TW201420668A (zh
Inventor
山本和義
關根健二
堀口尙文
Original Assignee
日本化藥股份有限公司
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Publication of TW201420668A publication Critical patent/TW201420668A/zh
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Publication of TWI535775B publication Critical patent/TWI535775B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28—Chemically modified polycondensates
    • C08G8/32—Chemically modified polycondensates by organic acids or derivatives thereof, e.g. fatty oils
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/12—Chemically modified polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C08G8/20—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with polyhydric phenols
    • C08G8/22—Resorcinol
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C09D161/04, C09D161/18 and C09D161/20
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials For Photolithography (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW102123948A 2012-07-13 2013-07-04 鹼性顯影型樹脂，使用該樹脂的感光性樹脂組成物 TWI535775B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012157142 2012-07-13
JP2012223382 2012-10-05

Publications (2)

Publication Number Publication Date
TW201420668A TW201420668A (zh) 2014-06-01
TWI535775B true TWI535775B (zh) 2016-06-01

Family

ID=49915688

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102123948A TWI535775B (zh) 2012-07-13 2013-07-04 鹼性顯影型樹脂，使用該樹脂的感光性樹脂組成物

Country Status (5)

Country Link
JP (1) JP6111248B2 (fr)
KR (1) KR102031014B1 (fr)
CN (1) CN104470962B (fr)
TW (1) TWI535775B (fr)
WO (1) WO2014010204A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6761224B2 (ja) * 2014-02-19 2020-09-23 味の素株式会社 プリント配線板、半導体装置及び樹脂シートセット
JP6343669B2 (ja) * 2014-07-10 2018-06-13 太陽インキ製造株式会社 樹脂絶縁層の形成方法、樹脂絶縁層およびプリント配線板
TWI687769B (zh) * 2015-05-12 2020-03-11 日商三菱製紙股份有限公司 噴砂用感光性樹脂組成物及噴砂處理方法
JP6907531B2 (ja) * 2015-12-28 2021-07-21 荒川化学工業株式会社 印刷インキ用変性フェノール樹脂、活性エネルギー線硬化型樹脂組成物、ゲルワニス、硬化物、活性エネルギー線硬化型印刷インキ及び印刷物
TWI609382B (zh) * 2016-07-26 2017-12-21 台灣太陽油墨股份有限公司 介電材料組成物及含其之絕緣膜及電路板
WO2020045311A1 (fr) 2018-08-28 2020-03-05 住友ベークライト株式会社 Composition de résine photosensible négative et dispositif à semi-conducteur l'utilisant
CN110753455A (zh) * 2019-10-23 2020-02-04 深南电路股份有限公司 一种抗镀干膜加工方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6454390A (en) 1987-08-26 1989-03-01 Matsushita Electric Ind Co Ltd Driver using shape memory alloy
JP3190251B2 (ja) 1995-06-06 2001-07-23 太陽インキ製造株式会社 アルカリ現像型のフレキシブルプリント配線板用光硬化性・熱硬化性樹脂組成物
JP3659825B2 (ja) 1997-12-19 2005-06-15 太陽インキ製造株式会社 アルカリ現像可能な光硬化性・熱硬化性組成物及びそれから得られる硬化皮膜
JP3468291B2 (ja) * 2000-04-10 2003-11-17 荒川化学工業株式会社 アルコキシ基含有シラン変性フェノール樹脂、樹脂組成物、エポキシ樹脂硬化剤及び有機・無機ハイブリッド体。
EP1327642A4 (fr) * 2000-09-20 2006-07-19 Taiyo Ink Mfg Co Ltd Resine photosensible carboxylee, composition photodurcissable/thermodurcissable pouvant etre developpee par une solution alcaline et contenant cette resine, et article durci produit a partir de ces elements
JP2002128866A (ja) 2000-10-20 2002-05-09 Toshiba Chem Corp 導電性ペースト
JP2002128865A (ja) * 2000-10-31 2002-05-09 Showa Highpolymer Co Ltd 感光性樹脂組成物
JP4889850B2 (ja) * 2000-10-31 2012-03-07 昭和電工株式会社 硬化性樹脂、感光性樹脂組成物及び硬化塗膜の形成方法
JP2002138126A (ja) 2000-10-31 2002-05-14 Inoac Corp 弾性部材
JP4167599B2 (ja) * 2002-02-19 2008-10-15 太陽インキ製造株式会社 硬化性樹脂及びそれを含有する硬化性樹脂組成物
WO2011122027A1 (fr) * 2010-03-31 2011-10-06 太陽ホールディングス株式会社 Composition de résine thermodurcissable photodurcissable

Also Published As

Publication number Publication date
JPWO2014010204A1 (ja) 2016-06-20
KR102031014B1 (ko) 2019-10-11
CN104470962A (zh) 2015-03-25
WO2014010204A1 (fr) 2014-01-16
TW201420668A (zh) 2014-06-01
JP6111248B2 (ja) 2017-04-05
CN104470962B (zh) 2017-09-12
KR20150036042A (ko) 2015-04-07

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