TWI531434B - 用於引線接合之超音波換能器與使用超音波換能器形成引線接合之方法 - Google Patents

用於引線接合之超音波換能器與使用超音波換能器形成引線接合之方法 Download PDF

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Publication number
TWI531434B
TWI531434B TW099126904A TW99126904A TWI531434B TW I531434 B TWI531434 B TW I531434B TW 099126904 A TW099126904 A TW 099126904A TW 99126904 A TW99126904 A TW 99126904A TW I531434 B TWI531434 B TW I531434B
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TW
Taiwan
Prior art keywords
frequency
electrical energy
transducer
driver
applying
Prior art date
Application number
TW099126904A
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English (en)
Chinese (zh)
Other versions
TW201116354A (en
Inventor
多明尼克Ａ 丹安吉里斯
蓋瑞Ｗ 舒爾西
Original Assignee
庫力克及索發工業股份有限公司
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Application filed by 庫力克及索發工業股份有限公司 filed Critical 庫力克及索發工業股份有限公司
Publication of TW201116354A publication Critical patent/TW201116354A/zh
Application granted granted Critical
Publication of TWI531434B publication Critical patent/TWI531434B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
TW099126904A 2009-08-12 2010-08-12 用於引線接合之超音波換能器與使用超音波換能器形成引線接合之方法 TWI531434B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US23323709P 2009-08-12 2009-08-12

Publications (2)

Publication Number Publication Date
TW201116354A TW201116354A (en) 2011-05-16
TWI531434B true TWI531434B (zh) 2016-05-01

Family

ID=43586770

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099126904A TWI531434B (zh) 2009-08-12 2010-08-12 用於引線接合之超音波換能器與使用超音波換能器形成引線接合之方法

Country Status (6)

Country Link
US (2) US8251275B2 (https=)
JP (1) JP6180736B2 (https=)
CN (2) CN104465422B (https=)
SG (2) SG10201404843RA (https=)
TW (1) TWI531434B (https=)
WO (1) WO2011019692A2 (https=)

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Also Published As

Publication number Publication date
WO2011019692A2 (en) 2011-02-17
WO2011019692A3 (en) 2011-05-12
SG10201404843RA (en) 2014-10-30
TW201116354A (en) 2011-05-16
US20120125977A1 (en) 2012-05-24
CN102473658B (zh) 2014-11-26
CN104465422A (zh) 2015-03-25
US8251275B2 (en) 2012-08-28
JP6180736B2 (ja) 2017-08-23
SG177745A1 (en) 2012-02-28
CN102473658A (zh) 2012-05-23
CN104465422B (zh) 2017-06-06
US20120286023A1 (en) 2012-11-15
JP2013506271A (ja) 2013-02-21
US8365977B2 (en) 2013-02-05

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