CN104465422B - 用于引线接合的超声波换能器与使用超声波换能器形成引线接合的方法 - Google Patents

用于引线接合的超声波换能器与使用超声波换能器形成引线接合的方法 Download PDF

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Publication number
CN104465422B
CN104465422B CN201410548734.3A CN201410548734A CN104465422B CN 104465422 B CN104465422 B CN 104465422B CN 201410548734 A CN201410548734 A CN 201410548734A CN 104465422 B CN104465422 B CN 104465422B
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frequency
transducer
electrical energy
region
driver
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CN201410548734.3A
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Chinese (zh)
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CN104465422A (zh
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D·A·迪安杰利斯
G·W·舒尔策
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Kulicke and Soffa Industries Inc
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Kulicke and Soffa Industries Inc
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
CN201410548734.3A 2009-08-12 2010-08-10 用于引线接合的超声波换能器与使用超声波换能器形成引线接合的方法 Active CN104465422B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23323709P 2009-08-12 2009-08-12
US61/233,237 2009-08-12
CN201080035549.4A CN102473658B (zh) 2009-08-12 2010-08-10 用于引线接合的超声波换能器与使用超声波换能器形成引线接合的方法

Related Parent Applications (1)

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CN201080035549.4A Division CN102473658B (zh) 2009-08-12 2010-08-10 用于引线接合的超声波换能器与使用超声波换能器形成引线接合的方法

Publications (2)

Publication Number Publication Date
CN104465422A CN104465422A (zh) 2015-03-25
CN104465422B true CN104465422B (zh) 2017-06-06

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CN201410548734.3A Active CN104465422B (zh) 2009-08-12 2010-08-10 用于引线接合的超声波换能器与使用超声波换能器形成引线接合的方法
CN201080035549.4A Active CN102473658B (zh) 2009-08-12 2010-08-10 用于引线接合的超声波换能器与使用超声波换能器形成引线接合的方法

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Country Status (6)

Country Link
US (2) US8251275B2 (https=)
JP (1) JP6180736B2 (https=)
CN (2) CN104465422B (https=)
SG (2) SG10201404843RA (https=)
TW (1) TWI531434B (https=)
WO (1) WO2011019692A2 (https=)

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US9504471B2 (en) 2013-09-25 2016-11-29 Cybersonics, Inc. Ultrasonic generator systems and methods
JP5930419B2 (ja) * 2014-03-14 2016-06-08 株式会社カイジョー ボンディング装置
JP5930423B2 (ja) * 2014-05-09 2016-06-08 株式会社カイジョー ボンディング装置
DE102014109630A1 (de) * 2014-07-09 2016-01-14 Hesse Gmbh Vorrichtung zum Herstellen einer Bondverbindung und Transducer hierfür
US9847313B2 (en) * 2015-04-24 2017-12-19 Kulicke And Soffa Industries, Inc. Thermocompression bonders, methods of operating thermocompression bonders, and horizontal scrub motions in thermocompression bonding
EP3179527B1 (en) * 2015-12-07 2020-02-19 Danfoss A/S A tranducer with connectors soldered thereon
EP3408864A4 (en) 2016-01-26 2019-07-31 Kulicke and Soffa Industries, Inc. WEDGEBONDING TOOLS, WEDGEBONDING SYSTEMS AND RELATED METHODS
US10052714B2 (en) * 2016-10-14 2018-08-21 Sonics & Materials, Inc. Ultrasonic welding device with dual converters
KR102229002B1 (ko) 2016-12-14 2021-03-16 주식회사 엘지화학 가공성 및 내환경 응력 균열성이 우수한 에틸렌/알파-올레핀 공중합체
US10381321B2 (en) * 2017-02-18 2019-08-13 Kulicke And Soffa Industries, Inc Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
CN112385026B (zh) * 2018-07-11 2024-06-11 株式会社新川 打线接合装置
EP3603826B1 (en) * 2018-07-31 2023-05-10 Infineon Technologies AG Method for calibrating an ultrasonic bonding machine
CN115427161A (zh) 2021-02-10 2022-12-02 株式会社新川 超声波焊头
US11937979B2 (en) 2021-04-27 2024-03-26 Kulicke And Soffa Industries, Inc. Ultrasonic transducers, wire bonding machines including ultrasonic transducers, and related methods
WO2023042333A1 (ja) 2021-09-16 2023-03-23 株式会社新川 ピンワイヤ形成方法、及びワイヤボンディング装置
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US11798911B1 (en) * 2022-04-25 2023-10-24 Asmpt Singapore Pte. Ltd. Force sensor in an ultrasonic wire bonding device
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US20240116126A1 (en) * 2022-10-11 2024-04-11 Asmpt Singapore Pte. Ltd. Ultrasonic transducer operable at multiple resonant frequencies
CN117861982A (zh) * 2022-10-11 2024-04-12 先进科技新加坡有限公司 可在多个谐振频率下工作的超声波换能器

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Also Published As

Publication number Publication date
WO2011019692A2 (en) 2011-02-17
WO2011019692A3 (en) 2011-05-12
SG10201404843RA (en) 2014-10-30
TWI531434B (zh) 2016-05-01
TW201116354A (en) 2011-05-16
US20120125977A1 (en) 2012-05-24
CN102473658B (zh) 2014-11-26
CN104465422A (zh) 2015-03-25
US8251275B2 (en) 2012-08-28
JP6180736B2 (ja) 2017-08-23
SG177745A1 (en) 2012-02-28
CN102473658A (zh) 2012-05-23
US20120286023A1 (en) 2012-11-15
JP2013506271A (ja) 2013-02-21
US8365977B2 (en) 2013-02-05

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