SG10201404843RA - Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers - Google Patents

Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers

Info

Publication number
SG10201404843RA
SG10201404843RA SG10201404843RA SG10201404843RA SG10201404843RA SG 10201404843R A SG10201404843R A SG 10201404843RA SG 10201404843R A SG10201404843R A SG 10201404843RA SG 10201404843R A SG10201404843R A SG 10201404843RA SG 10201404843R A SG10201404843R A SG 10201404843RA
Authority
SG
Singapore
Prior art keywords
ultrasonic transducers
methods
wire bonding
wire bonds
forming
Prior art date
Application number
SG10201404843RA
Inventor
Dominick A Deangelis
Gary W Schulze
Original Assignee
Kulicke & Soffa Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke & Soffa Ind Inc filed Critical Kulicke & Soffa Ind Inc
Publication of SG10201404843RA publication Critical patent/SG10201404843RA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05617—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/05624—Aluminium [Al] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/485—Material
    • H01L2224/48505—Material at the bonding interface
    • H01L2224/48799—Principal constituent of the connecting portion of the wire connector being Copper (Cu)
    • H01L2224/488—Principal constituent of the connecting portion of the wire connector being Copper (Cu) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/48817—Principal constituent of the connecting portion of the wire connector being Copper (Cu) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950 °C
    • H01L2224/48824—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85203—Thermocompression bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01028—Nickel [Ni]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/203—Ultrasonic frequency ranges, i.e. KHz
    • H01L2924/20305—Ultrasonic frequency [f] 100 Khz=<f< 125 KHz

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
SG10201404843RA 2009-08-12 2010-08-10 Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers SG10201404843RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US23323709P 2009-08-12 2009-08-12

Publications (1)

Publication Number Publication Date
SG10201404843RA true SG10201404843RA (en) 2014-10-30

Family

ID=43586770

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201404843RA SG10201404843RA (en) 2009-08-12 2010-08-10 Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers
SG2012005203A SG177745A1 (en) 2009-08-12 2010-08-10 Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2012005203A SG177745A1 (en) 2009-08-12 2010-08-10 Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers

Country Status (6)

Country Link
US (2) US8251275B2 (en)
JP (1) JP6180736B2 (en)
CN (2) CN102473658B (en)
SG (2) SG10201404843RA (en)
TW (1) TWI531434B (en)
WO (1) WO2011019692A2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9504471B2 (en) 2013-09-25 2016-11-29 Cybersonics, Inc. Ultrasonic generator systems and methods
JP5930419B2 (en) * 2014-03-14 2016-06-08 株式会社カイジョー Bonding equipment
JP5930423B2 (en) * 2014-05-09 2016-06-08 株式会社カイジョー Bonding equipment
DE102014109630A1 (en) * 2014-07-09 2016-01-14 Hesse Gmbh Apparatus for making a bond and transducer therefor
US9847313B2 (en) * 2015-04-24 2017-12-19 Kulicke And Soffa Industries, Inc. Thermocompression bonders, methods of operating thermocompression bonders, and horizontal scrub motions in thermocompression bonding
EP3179527B1 (en) * 2015-12-07 2020-02-19 Danfoss A/S A tranducer with connectors soldered thereon
WO2017132027A1 (en) 2016-01-26 2017-08-03 Orthodyne Electronics Corporation Wedge bonding tools, wedge bonding systems, and related methods
US10052714B2 (en) * 2016-10-14 2018-08-21 Sonics & Materials, Inc. Ultrasonic welding device with dual converters
KR102229002B1 (en) 2016-12-14 2021-03-16 주식회사 엘지화학 Ethylene/alpha-olefin copolymer having excellent processibility and environmental stress crack resistance
US10381321B2 (en) 2017-02-18 2019-08-13 Kulicke And Soffa Industries, Inc Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
JP7008370B2 (en) * 2018-07-11 2022-02-14 株式会社新川 Wire bonding equipment
EP3603826B1 (en) * 2018-07-31 2023-05-10 Infineon Technologies AG Method for calibrating an ultrasonic bonding machine
US11937979B2 (en) 2021-04-27 2024-03-26 Kulicke And Soffa Industries, Inc. Ultrasonic transducers, wire bonding machines including ultrasonic transducers, and related methods
JP7441558B2 (en) 2021-09-16 2024-03-01 株式会社新川 Pin wire forming method and wire bonding device
US11691214B2 (en) * 2021-10-17 2023-07-04 Shinkawa Ltd. Ultrasound horn
US20240116126A1 (en) * 2022-10-11 2024-04-11 Asmpt Singapore Pte. Ltd. Ultrasonic transducer operable at multiple resonant frequencies

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63118715A (en) * 1986-11-07 1988-05-23 Matsushita Electric Ind Co Ltd Acoustooptic element
JPS63239834A (en) 1987-03-27 1988-10-05 Hitachi Ltd Scrubbing mechanism
JPS63242479A (en) * 1987-03-31 1988-10-07 Jiromaru Tsujino Ultrasonic welding method using coupling oscillation and its equipment
US4938217A (en) * 1988-06-21 1990-07-03 Massachusetts Institute Of Technology Electronically-controlled variable focus ultrasound hyperthermia system
JPH0799945B2 (en) * 1989-05-26 1995-10-25 株式会社トーキン Piezoelectric elliptical motion oscillator
US5237237A (en) * 1990-03-12 1993-08-17 Seiko Epson Corporation Ultrasonic motor and drive method
JP2981951B2 (en) 1992-06-23 1999-11-22 株式会社新川 Wire bonding equipment
JPH0645411A (en) * 1992-07-22 1994-02-18 Rohm Co Ltd Wire bonding method
JP3274731B2 (en) * 1992-12-29 2002-04-15 芝浦メカトロニクス株式会社 Wire bonding equipment
US5469011A (en) 1993-12-06 1995-11-21 Kulicke & Soffa Investments, Inc. Unibody ultrasonic transducer
US5603445A (en) * 1994-02-24 1997-02-18 Hill; William H. Ultrasonic wire bonder and transducer improvements
US5494207A (en) * 1994-05-20 1996-02-27 National Semiconductor Corporation Wire bonder transducer arrangement and method
US5816476A (en) * 1994-08-24 1998-10-06 Verity Instruments Inc. Dual frequency power supply and transducer
KR0129952B1 (en) * 1994-11-09 1998-04-17 김광호 Supersonic vibrator
US5578888A (en) * 1994-12-05 1996-11-26 Kulicke And Soffa Investments, Inc. Multi resonance unibody ultrasonic transducer
US5595328A (en) 1994-12-23 1997-01-21 Kulicke And Soffa Investments, Inc. Self isolating ultrasonic transducer
DE19512820B4 (en) * 1995-04-05 2005-11-03 Branson Ultraschall Niederlassung Der Emerson Technologies Gmbh & Co Method and device for adjusting the operating frequency of an orbital vibration welding system
JP3086158B2 (en) * 1995-07-26 2000-09-11 株式会社日立製作所 Ultrasonic bonding method
US5832412A (en) * 1996-02-09 1998-11-03 Kulicke And Soffa Investments, Inc. Programmable digital frequency ultrasonic generator
US7629726B2 (en) * 2007-07-11 2009-12-08 Puskas William L Ultrasound system
US5884834A (en) * 1996-09-20 1999-03-23 Kulicke And Soffa Investments, Inc. Multi-frequency ultrasonic wire bonder and method
US5890643A (en) * 1996-11-15 1999-04-06 Kulicke And Soffa Investments, Inc. Low mass ultrasonic bonding tool
JP3566039B2 (en) * 1997-07-29 2004-09-15 株式会社新川 Bonding equipment
JP2000253496A (en) * 1999-03-03 2000-09-14 Ge Yokogawa Medical Systems Ltd Array type ultrasonic transducer and its manufacture
JP2000278073A (en) * 1999-03-26 2000-10-06 Asahi Rubber Kk Method for sealing surface mounting type oscillator using ultrasonic composite vibration
US6244498B1 (en) * 1999-04-16 2001-06-12 Micron Semiconductor, Inc. Ultrasonic vibration mode for wire bonding
US6190497B1 (en) * 1999-04-23 2001-02-20 The Hong Kong Polytechnic University Ultrasonic transducer
US6286747B1 (en) * 2000-03-24 2001-09-11 Hong Kong Polytechnic University Ultrasonic transducer
TW521358B (en) * 2000-09-22 2003-02-21 Asm Tech Singapore Pte Ltd A method of bonding wires
KR100896828B1 (en) * 2001-10-26 2009-05-12 외르리콘 어셈블리 이큅먼트 아게, 슈타인하우젠 Method for the calibration of a wire bonder
JP3738420B2 (en) * 2001-11-16 2006-01-25 東京応化工業株式会社 Positive photoresist composition and method for forming thin-film resist pattern for inclined implantation process
DE10160228A1 (en) 2001-12-07 2003-06-18 Hesse & Knipps Gmbh Kreuztransducer
JP3791485B2 (en) * 2002-06-04 2006-06-28 株式会社村田製作所 Tuning fork vibrator, vibration gyro using the same, electronic device using the same, and method for manufacturing tuning fork vibrator
US20040251780A1 (en) * 2003-05-09 2004-12-16 Goodson J. Michael Advanced ceramics in ultrasonic transducerized devices
US7002283B2 (en) 2003-06-03 2006-02-21 Asm Assembly Automation Ltd. Ultrasonic transducer assembly
DE10333783A1 (en) * 2003-07-24 2005-02-17 Multi Orbital Systems Gmbh Orbital friction welding method and apparatus for carrying out the method
BRPI0416131A (en) * 2003-11-05 2007-01-02 Crest Group Inc ultrasonic processing method and apparatus with multiple frequency transducers
JP2005252978A (en) * 2004-03-08 2005-09-15 Nec Tokin Corp Wideband pass type unidirectional transformer
US20070222339A1 (en) * 2004-04-20 2007-09-27 Mark Lukacs Arrayed ultrasonic transducer
JP4264388B2 (en) * 2004-07-01 2009-05-13 富士通株式会社 Semiconductor chip bonding method and bonding apparatus
US7137543B2 (en) * 2004-07-28 2006-11-21 Kulicke And Soffa Industries, Inc. Integrated flexure mount scheme for dynamic isolation of ultrasonic transducers
DE102004045575A1 (en) * 2004-09-17 2006-04-06 Hesse & Knipps Gmbh Ultrasonic transducer with a sensor arranged in the bearing
JP5309626B2 (en) * 2007-03-14 2013-10-09 株式会社ニコン Vibration actuator, vibrator manufacturing method, and vibration actuator manufacturing method
CH700015B1 (en) * 2007-04-04 2010-06-15 Oerlikon Assembly Equipment Ag Ultrasonic Transducer.
KR100891851B1 (en) * 2007-07-27 2009-04-07 삼성전기주식회사 A Stator and Piezo Ultrasonic Motor Having it

Also Published As

Publication number Publication date
SG177745A1 (en) 2012-02-28
TW201116354A (en) 2011-05-16
CN104465422A (en) 2015-03-25
JP6180736B2 (en) 2017-08-23
US8365977B2 (en) 2013-02-05
JP2013506271A (en) 2013-02-21
WO2011019692A3 (en) 2011-05-12
US8251275B2 (en) 2012-08-28
WO2011019692A2 (en) 2011-02-17
CN102473658B (en) 2014-11-26
US20120286023A1 (en) 2012-11-15
TWI531434B (en) 2016-05-01
CN104465422B (en) 2017-06-06
US20120125977A1 (en) 2012-05-24
CN102473658A (en) 2012-05-23

Similar Documents

Publication Publication Date Title
SG10201404843RA (en) Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers
HK1254195A1 (en) Ultrasound transducers
GB201021719D0 (en) Ultrasonic/Acoustic Transducer
IL218187A0 (en) Multilayer acoustic impedance converter for ultrasonic transducers
IL220446A0 (en) Ultrasound transducer assembly and methods of using
EP2421441A4 (en) Improved ultrasound transducer
GB2471425B (en) Operation of patterned ultrasonic transducers
PL2566652T3 (en) Ultrasonic welding device and method of bonding by means of an ultrasonic wave
GB2482968B (en) Ultrasonic transducer device
ZA201009167B (en) Ultrasonic transducer system
EP2425450A4 (en) Novel bonding process and bonded structures
GB0915593D0 (en) Flexi-pcb mounting of ultrasonic transducers for enhanced dermal and transdermal applications
GB201016386D0 (en) Patterned ultrasonic transducers
IL210601A0 (en) High power ultrasound transducer
EP2449553A4 (en) Controllable acoustic transducer
EP2133191A4 (en) Ultrasonic head and transducer for ultrasonic soldering of plastics
EP2541972A4 (en) Piezoelectric acoustic transducer
EP2650694A4 (en) Structure for attaching ultrasound transducer
EP2610432B8 (en) Downhole ultrasonic transducer and method of making same
HK1174138A1 (en) Bonding device and method for manufacturing tabular bonded body
EP2657751A4 (en) Method of manufacturing plate-shaped bonded body, bonding device, and plate-shaped bonded body
EP2717024A4 (en) Ultrasonic transducer and ultrasonic flow-meter
EP2382801A4 (en) Acoustic energy transducer
PL2411095T3 (en) Method of determining functionality of an ultrasound therapy head
EP2549591A4 (en) Ultrasonic welding method and welding section