JPS63242479A - Ultrasonic welding method using coupling oscillation and its equipment - Google Patents
Ultrasonic welding method using coupling oscillation and its equipmentInfo
- Publication number
- JPS63242479A JPS63242479A JP62076139A JP7613987A JPS63242479A JP S63242479 A JPS63242479 A JP S63242479A JP 62076139 A JP62076139 A JP 62076139A JP 7613987 A JP7613987 A JP 7613987A JP S63242479 A JPS63242479 A JP S63242479A
- Authority
- JP
- Japan
- Prior art keywords
- vibration
- oscillation
- welding
- oscillating
- bending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 title claims abstract description 86
- 238000000034 method Methods 0.000 title claims abstract description 7
- 230000010355 oscillation Effects 0.000 title abstract 13
- 230000008878 coupling Effects 0.000 title abstract 3
- 238000010168 coupling process Methods 0.000 title abstract 3
- 238000005859 coupling reaction Methods 0.000 title abstract 3
- 238000005452 bending Methods 0.000 claims abstract description 39
- 230000003068 static effect Effects 0.000 claims abstract description 16
- 150000001875 compounds Chemical class 0.000 claims description 19
- 239000002131 composite material Substances 0.000 abstract description 14
- 238000010586 diagram Methods 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 210000001015 abdomen Anatomy 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
- H01L2224/85206—Direction of oscillation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、複合振動をする溶接チップにより同種および
異種材料の接合を行う超音波溶接方法およびその装置に
関するものである。超音波溶接は、同種または異種の金
属材料、セラミック等または高分子材料等をは家固相の
状態で局部的に接合することが可能で、各種形状の部品
、電子部品、微細な各種の部品、特に集積回路、トラン
ジスタ等の半導体チップ部の微細な電気端子を外部に接
続するために微細なアルミニウムまたは銅等の導線を用
いて外部端子部分への接合を行う、いわゆる超音波ワイ
ヤーボンディング等に広く用いられて居り、電子部品、
光回路部品等の微細化が進み微細部分のより安定な接合
が要求され、また集積度が高くなり一つの半導体チップ
部からの取り出し端子が多くなるに従って極めて高い溶
接の安定度、信頼性が要求される。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an ultrasonic welding method and apparatus for joining similar and dissimilar materials using a welding tip that generates complex vibrations. Ultrasonic welding can locally join similar or dissimilar metal materials, ceramics, polymer materials, etc. in a solid state, and can be used to join parts of various shapes, electronic parts, and various minute parts. In particular, it is used in so-called ultrasonic wire bonding, which uses fine conductive wires such as aluminum or copper to connect the fine electrical terminals of semiconductor chips such as integrated circuits and transistors to the external terminals. Widely used in electronic components,
As the miniaturization of optical circuit components progresses, more stable bonding of minute parts is required, and as the degree of integration increases and the number of terminals extracted from one semiconductor chip increases, extremely high welding stability and reliability are required. be done.
(従来の技術)
従来の超音波溶接装置は単一の撮動系を用いており、溶
接方法としては溶接試料を重ね合わせて溶接チップによ
り静圧力を溶接部に印加した状態で溶接チップを溶接試
料の種類により溶接面に平行または垂直に振動させて接
合を行うもので、場合によっては局部的な加熱と併用さ
れている。また当然溶接チップの振動方向も単一であり
、溶接試料の向きにより溶接に難易が出来、また接合状
態も一様でない欠点があった。例えば、超音波ワイヤー
ボンディングでは溶接チップの振動方向と接合試料の細
線の長さ方向が同じ場合にのみ接合強度が得られており
、また接合の安定性、信頼性も必ずしも充分で無い状態
である。(Prior art) Conventional ultrasonic welding equipment uses a single imaging system, and the welding method involves overlapping welding samples and applying static pressure to the welding part with the welding tip. Depending on the type of specimen, joining is performed by vibrating parallel or perpendicular to the welding surface, and in some cases local heating is also used. Furthermore, the vibration direction of the welding tip is, of course, single, making welding difficult depending on the orientation of the welding sample, and also having the disadvantage that the welding condition is not uniform. For example, in ultrasonic wire bonding, bond strength is obtained only when the vibration direction of the welding tip and the length direction of the thin wire of the bonded sample are the same, and the stability and reliability of the bond are not always sufficient. .
(発明が解決しようとする問題点)
本発明は、従来の単一の超音波振動系を用いてちり、溶
接チップの振動も単一であり、接合の安定性が必ずしも
充分でなかった超音波による各種の溶接方法、マイクロ
接合、超音波ワイヤーボンディング等の接合の安定性を
、振動方向の異なる二次元または三次元の複合振動をす
る溶接チップを構成して各種の制御を行うことにより溶
接部全体に亙って一様な接合状態を実現することにより
向上させ、また溶接チップの振動方向による接合強度の
変化を無くす、または軽減させることを目的としている
。(Problems to be Solved by the Invention) The present invention uses a single ultrasonic vibration system to eliminate dust, welding tip vibration, and ultrasonic vibration, which does not necessarily provide sufficient bonding stability. The stability of various welding methods such as micro bonding, ultrasonic wire bonding, etc. can be improved by configuring a welding tip that generates two-dimensional or three-dimensional complex vibrations with different vibration directions and performing various types of control. The purpose is to improve this by realizing a uniform bonding state over the entire area, and to eliminate or reduce changes in bonding strength due to the direction of vibration of the welding tip.
(問題を解決するための手段)
本発明は、従来の単一の超音波振動系を用いており、溶
接チップの振動も単一であった超音波による各種の溶接
方法、マイクロ接合、超音波ワイヤーボンディングの接
合の安定性を複合振動を用いることにより向上させ、ま
た溶接チップの振動方向による接合強度の変化を無くす
、または軽減させるために、振動方向の異なる複合摂動
をする溶接チップIaを構成して、振動方向の異なる各
振動1d、1cの成分の大きざ(撮動振幅)、振動位相
を制御して溶接チップlaの振動軌跡を二次元または3
次元的に制御し、また振動軌跡、駆動期間を時間的に変
化させて制御・駆動する事により、より一様な接合状態
を実現することにより安定度の高い溶接および方向性の
ない溶接を実現しようとするものである。(Means for Solving the Problems) The present invention uses a conventional single ultrasonic vibration system and uses a single vibration of the welding tip. In order to improve the stability of wire bonding joints by using compound vibrations and to eliminate or reduce changes in bond strength due to vibration directions of the welding tips, welding tip Ia is configured to make compound perturbations in different vibration directions. Then, by controlling the magnitude (imaging amplitude) and vibration phase of the components of vibrations 1d and 1c with different vibration directions, the vibration locus of the welding tip la can be adjusted in two or three dimensions.
By controlling dimensionally and controlling and driving by temporally changing the vibration locus and driving period, a more uniform joining condition is achieved, resulting in highly stable welding and welding without directionality. This is what I am trying to do.
また従来は接合期間中は一定に保持されていた溶接部静
圧力を溶接面に垂直な振動を印加して振動成分の制御を
行うことにより、等価的に溶接部静圧力の最適制御を行
う事により、更に安定な接合を実現しようとするもので
ある。Furthermore, by controlling the vibration component by applying vibration perpendicular to the welding surface to the static pressure of the weld, which was conventionally held constant during the welding period, it is possible to equivalently optimally control the static pressure of the weld. The aim is to achieve even more stable bonding.
(作 用)
異なる振動周波数の複合振動を用いた場合には、溶接チ
ップ部の振動軌跡は、各方向にランダムになり、一方向
の振動のみの場合のように接合部の微小部分の方向性が
無くなり、溶接部分が全体にわたり、より一様に接合さ
れて完全な接合部を得ることが可能となり、また接合強
度も大になる。(Function) When compound vibrations with different vibration frequencies are used, the vibration locus of the welding tip becomes random in each direction, and the directionality of minute parts of the joint becomes different from the case of vibration in only one direction. This eliminates the problem of welding, making it possible to more uniformly join the entire welded part to obtain a complete joint, and also increasing the joint strength.
同一の振動周波数の複合振動を用いた場合には、各振動
1d、leの振動振幅および振動位相を制御することに
より、溶接チップ部1aの振動方向を制御することが可
能になり、また振動軌跡を制御することも可能となる。When compound vibrations with the same vibration frequency are used, by controlling the vibration amplitude and vibration phase of each vibration 1d and le, it is possible to control the vibration direction of the welding tip portion 1a, and also to control the vibration trajectory. It is also possible to control the
また同一周波数の複合振動に更に異なる振動周波数の振
動成分を印加することにより主振動方向を制御した振動
ベクトルにランダムな振動軌跡成分を付加することも可
能になる。Further, by applying vibration components of different vibration frequencies to the complex vibration of the same frequency, it is also possible to add random vibration locus components to the vibration vector whose main vibration direction is controlled.
また複合振動により溶接の初期に溶接チップまたは溶接
試料間の滑りが起こり駆動が困難な場合には、安定な接
合が行い難い場合には、一部の振動を先に印加して一部
分のある程度の接合を行った後、時間を置いて他方の振
動を印加し複合振動により接合面積を増加させることに
より安定な溶接を実現できる。また各振動成分の包路線
の波形を連続的に制御することによっても安定な溶接を
実現できることは明らかである。In addition, if compound vibration causes slippage between the welding tip or the welding sample at the beginning of welding, making it difficult to drive, or if it is difficult to achieve a stable joint, some vibrations may be applied first to reduce the After welding, stable welding can be achieved by applying the other vibration after a period of time and increasing the joint area by compound vibration. It is also clear that stable welding can be achieved by continuously controlling the envelope waveform of each vibration component.
また溶接部に印加する静圧力は溶接状態に大きな影響を
与え、接合の進行段階により最適な静圧力が存在するが
、超音波溶接による接合では溶接時間が極めて短時間に
行われ制御することが極めて困難であるが、溶接面に垂
直な振動を印加することにより効果的に静圧力の等価的
な制御を実現することが可能となる。In addition, the static pressure applied to the weld has a large effect on the welding condition, and there is an optimal static pressure depending on the progress stage of the weld, but when joining by ultrasonic welding, the welding time is extremely short and cannot be controlled. Although it is extremely difficult, it is possible to effectively achieve equivalent control of static pressure by applying vibrations perpendicular to the welding surface.
(実 施 例)
複合振動溶接チップを実現するには、例えば第1図の様
に、振動次数が振動方向によって異なる曲げ振動棒1を
用いて、複数の縦振動系、曲げ振動系またはねじり振動
系2.3により駆動する場合には、縦振動系および曲げ
振動系では他の振動方向の曲げ振動の振動の節部であり
且つ駆動方向では振動の腹部付近となる位置1b、lc
で駆動する事により、また曲げ振動系では他の振動およ
び駆動振動方向の節部で駆動する事により、安定な複合
振動を得ることが出来る。曲げ振動系の振動次数1d、
1eは振動方向の寸法、例えば矩形断面の場合には厚さ
を変化させることにより容易に変化させることが出来る
。(Example of implementation) In order to realize a compound vibration welding tip, for example, as shown in Fig. 1, a bending vibration rod 1 whose vibration order differs depending on the vibration direction is used, and multiple longitudinal vibration systems, bending vibration systems, or torsional vibration systems are used. When driving by system 2.3, positions 1b and lc are vibration nodes of bending vibration in other vibration directions in the longitudinal vibration system and bending vibration system, and are near the abdomen of vibration in the driving direction.
Stable compound vibration can be obtained by driving at a bending vibration system, or by driving at a node in the direction of other vibrations and driving vibrations in a bending vibration system. The vibration order of the bending vibration system is 1d,
1e can be easily changed by changing the dimension in the vibration direction, for example, the thickness in the case of a rectangular cross section.
溶接方法は、例えば金属導線4と板状溶接試料δの場合
には、溶接チップ1aにより重ね合わせた試料に静圧力
0を印加し、溶接チップを複合振動させて振動軌跡を制
御して接合を行う。For example, in the case of a metal conducting wire 4 and a plate-shaped welding sample δ, the welding method is such that zero static pressure is applied to the stacked samples using the welding tip 1a, and the welding tip is subjected to compound vibration to control the vibration locus to perform the welding. conduct.
また駆動用の各振動系の配置2−3は、振動方向の異な
る縦振動、曲げ振動およびねじり振動系を適宜組み合わ
せる事により任意に選択することが可能である。例えば
直交曲げ振動棒を用いた場合には、縦撮動系2個を用い
れば振動系は90度の角度の配置となり、また縦振動系
および曲げ振動系または曲げ振動系を用いれば0度の角
度で平行に配置できる。また曲げ振動棒の長さ方向に振
動する曲げ振動系により駆動することにより溶接面に垂
直な静圧力方向に振動を印加することが可能である。Further, the arrangement 2-3 of each vibration system for driving can be arbitrarily selected by appropriately combining longitudinal vibration, bending vibration, and torsional vibration systems with different vibration directions. For example, when orthogonal bending vibration rods are used, the vibration system will be arranged at a 90 degree angle if two vertical imaging systems are used, and the vibration system will be arranged at a 90 degree angle if a longitudinal vibration system and a bending vibration system or a bending vibration system are used. Can be placed parallel at an angle. Further, by driving a bending vibration system that vibrates in the length direction of the bending vibration rod, it is possible to apply vibration in the direction of static pressure perpendicular to the welding surface.
各振動系が同一周波数の場合には溶接チップ1aの振動
ベクトルの主方向を振動振幅および振動位相を変化させ
ることにより制御することが可能であり、また振動軌跡
のパターンを制御することが可能である。異なる周波数
の振動系を用いた場合には各方向にランダムな振動軌跡
を得ることが出来る。また、同一振動周波数の2個以上
の縦振動系にこれと異なる振動周波数の振動を重畳する
ことにより溶接チップの主振動方向が変化可能で且つラ
ンダムな振動成分を有する複合振動溶接チップを得るこ
とが可能である。When each vibration system has the same frequency, it is possible to control the main direction of the vibration vector of the welding tip 1a by changing the vibration amplitude and vibration phase, and it is also possible to control the pattern of the vibration locus. be. When using vibration systems with different frequencies, random vibration trajectories can be obtained in each direction. Furthermore, by superimposing vibrations with different vibration frequencies on two or more longitudinal vibration systems with the same vibration frequency, a compound vibration welding tip can be obtained in which the main vibration direction of the welding tip can be changed and has random vibration components. is possible.
第2図は、複数の駆動用振動系7.8の配置をより容易
にする為に、他の振動方向に対して4分の1波長長さと
なる曲げ振動棒6C16dを介して駆動することにより
同一位置6bまたは異なる位置で互いの振動に無関係に
駆動可能とした例であるO
また第3図および第4図は、複合曲げ振動棒9.12の
一端に質m9tj、12cを付加して固定−自由振動棒
とした場合で、曲げ振動棒の長さを短くすることが可能
で、また例えば縦振動系または曲げ振動系により曲げ振
動棒上部より駆動することにより静圧力に平行な振動を
印加することも出来る。In order to facilitate the arrangement of a plurality of driving vibration systems 7.8, FIG. This is an example in which the vibration can be driven at the same position 6b or at different positions regardless of each other's vibrations. In addition, Figs. 3 and 4 show a compound bending vibration rod 9. - When using a free vibration rod, it is possible to shorten the length of the bending vibration rod, and for example, by driving from the top of the bending vibration rod with a longitudinal vibration system or a bending vibration system, vibration parallel to the static pressure can be applied. You can also do that.
第5図は、曲げ振動および縦振動変換器、またはねじり
振動および縦振動変換器を一軸構成した例16で、複合
曲げ振動棒15を各種振動次数で駆動することが可カ≦
である。また曲げ摂動変換器を2個組み込み、この振動
方向を変化することにより静圧力に平行な振動を印加す
ることが可能である。FIG. 5 shows an example 16 in which a bending vibration and longitudinal vibration transducer or a torsional vibration and longitudinal vibration transducer is configured on a single axis, and it is possible to drive the composite bending vibration rod 15 at various vibration orders.
It is. Furthermore, by incorporating two bending perturbation transducers and changing the direction of vibration, it is possible to apply vibration parallel to the static pressure.
第6図は、振動系19先端の溶接チップ部18を低次振
動モード棒または小型のチップとした例である。これら
の各種の振動変換器は、例えばPZTの様な電ひずみ変
換器を適宜に分割し、振動モードに応じた方向に分極す
る事により得ることが出来る。FIG. 6 shows an example in which the welding tip portion 18 at the tip of the vibration system 19 is a low-order vibration mode rod or a small tip. These various vibration transducers can be obtained by appropriately dividing an electrostrictive transducer such as PZT and polarizing it in a direction depending on the vibration mode.
(発明の効果)
以上の説明から明らかなように、本発明によれば溶接チ
ップ部を複合振動させ、各振動成分の振動振幅、振動位
相を制御することにより溶接チップの振動軌跡を制御し
、また必要に応じて溶接部静圧力を制御する事を可能に
しているので、一様で安定度の高い接合および振動方向
と無関係に同種または異種材料等の超音波溶接が実現す
る事が可能となる。また複合振動を接合初期から同時に
印加した場合に、溶接試料の駆動が困難な場合には、各
振動の印加時期または駆動波形を制御することにより安
定で方向性のない接合が実現可能となる。(Effects of the Invention) As is clear from the above description, according to the present invention, the vibration locus of the welding tip is controlled by subjecting the welding tip to compound vibration and controlling the vibration amplitude and vibration phase of each vibration component. In addition, since it is possible to control the static pressure at the welding area as necessary, it is possible to realize uniform and highly stable joining and ultrasonic welding of the same or dissimilar materials regardless of the vibration direction. Become. Furthermore, if it is difficult to drive the welding sample when complex vibrations are simultaneously applied from the initial stage of joining, stable and non-directional joining can be achieved by controlling the application timing or drive waveform of each vibration.
第1図は、2個の振動系を用いた駆動位置の異なる両端
自由−自由の複合曲げ振動棒を用いた複合振動溶接チッ
プの概略図、
第2図は、複数の振動系を用いた駆動位置が等しい両端
自由−自由の複合曲げ振動棒を用いた複合振動溶接チッ
プの概略図、
第3図は、駆動位置の異なる固定−自由の複合曲げ振動
棒を用いた複合振動溶接チップの概略図、
第4図は、駆動位置が等しい固定−自由の複合曲げ振動
棒を用いた複合振動溶接チップの概略図、
第5図は、曲げ振動変換器および縦振動変換器、または
ねじり振動変換器および縦振動変換器を一軸構成した振
動系を用いた複合振動溶接チップの概略図、
第6図は、−軸構成した振動系を用いた先端部を溶接チ
ップ部とした複合振動溶接チップの概略図である。
0 ・・・ 溶接部印加静圧力
1 ・・・ 複合曲げ振動棒
1a ・・・ 溶接チップ部
lb、lc ・・・ 駆動部
1d、1e ・・・ 曲げ振動分布
2.3 ・・・ 超音波振動変換器2a、2d
・・・ 振動系節部支持用フランジ4.5 ・・・ 溶
接試料
6 ・・・ 複合曲げ振動棒
6a ・・・ 溶接チップ部
6b ・・・ 駆動部
6c、6d ・・・ 4分の1波長曲げ振動棒7.8
・・・ 超音波振動変換器
7−8 ・・・ 超音波振動変換器設置角度9 ・
・・ 複合曲げ振動棒
9a ・・・ 溶接チップ部
9b、9c ・・・ 駆動部
9d ・・・ 付加質量
10.11 ・・・ 超音波振動変換器12 ・・・
複合曲げ振動棒
12a ・・・ 溶接チップ部
12b ・・・ 駆動部
12c ・・・ 付加質量
13.14 ・・・ 超音波振動変換器15 ・・・
複合曲げ振動棒
15a ・・・ 溶接チップ部
15b ・・・ 駆動部
16 ・・・ −軸構成複合超音波振動変換器16a
、16b、16c −−−振動変換部16ae、16
be、16ce ・−駆動用電極17 ・・・ 静
圧力制御用振動
18 ・・・ 溶接チップ
18a ・・・ 溶接チップ部
19 ・・・ −軸構成複合超音波振動変換器2
0.21 ・・・ 溶接試料Figure 1 is a schematic diagram of a composite vibration welding tip using a composite bending vibrating rod with free-to-free ends at different drive positions using two vibration systems. Figure 2 is a drive using multiple vibration systems. Figure 3 is a schematic diagram of a composite vibration welding tip using a composite bending vibrating rod with both ends free and free at the same position. Figure 3 is a schematic diagram of a composite vibration welding tip using a composite bending vibration rod with fixed and free ends at different drive positions. , Fig. 4 is a schematic diagram of a compound vibration welding tip using fixed-free compound bending vibration rods with equal driving positions; A schematic diagram of a compound vibration welding tip using a vibration system with a uniaxial configuration of a longitudinal vibration transducer. Figure 6 is a schematic diagram of a compound vibration welding tip using a vibration system with a -axis configuration and with the tip as the welding tip. It is. 0... Static pressure applied to welding part 1... Composite bending vibration rod 1a... Welding tip part lb, lc... Drive part 1d, 1e... Bending vibration distribution 2.3... Ultrasonic vibration Converter 2a, 2d
... Vibration system node support flange 4.5 ... Welding sample 6 ... Composite bending vibration rod 6a ... Welding tip part 6b ... Drive parts 6c, 6d ... Quarter wavelength Bending vibration rod 7.8
... Ultrasonic vibration transducer 7-8 ... Ultrasonic vibration transducer installation angle 9 ・
... Composite bending vibration rod 9a ... Welding tip sections 9b, 9c ... Drive section 9d ... Additional mass 10.11 ... Ultrasonic vibration transducer 12 ...
Composite bending vibration rod 12a... Welding tip section 12b... Drive section 12c... Additional mass 13.14... Ultrasonic vibration transducer 15...
Composite bending vibration rod 15a... Welding tip section 15b... Drive section 16... - Shaft configuration compound ultrasonic vibration transducer 16a
, 16b, 16c---vibration converter 16ae, 16
be, 16ce - Drive electrode 17... Static pressure control vibration 18... Welding tip 18a... Welding tip portion 19... - Shaft configuration composite ultrasonic vibration transducer 2
0.21 ... Welding sample
Claims (4)
異なる複合振動を用い各複合振動成分の振動振幅、振動
位相を制御する事により溶接チップの振動軌跡の制御、
駆動期間、振動軌跡のパターンの時間的な制御を行うこ
とを特徴とする超音波溶接方法および装置。(1) Control of the vibration trajectory of the welding tip by controlling the vibration amplitude and vibration phase of each complex vibration component using complex vibrations of the same frequency or different vibration frequencies with different vibration directions;
An ultrasonic welding method and device characterized by temporally controlling a driving period and a vibration locus pattern.
成した、特許請求の範囲第1項記載の超音波溶接装置。(2) The ultrasonic welding device according to claim 1, wherein the compound vibration welding tip is constructed using a compound bending vibration rod.
せて用いて構成した、特許請求の範囲第1項記載の超音
波溶接装置。(3) The ultrasonic welding device according to claim 1, which is configured using a combination of longitudinal vibration, bending vibration, and torsional vibration systems.
静圧力制御をおこなう事を特徴とする、特許請求の範囲
第1項記載の(1)の超音波溶接装置。(4) The ultrasonic welding apparatus according to claim 1, characterized in that the static pressure is controlled equivalently by superimposing ultrasonic vibrations on the static pressure of the welding part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62076139A JPS63242479A (en) | 1987-03-31 | 1987-03-31 | Ultrasonic welding method using coupling oscillation and its equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62076139A JPS63242479A (en) | 1987-03-31 | 1987-03-31 | Ultrasonic welding method using coupling oscillation and its equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63242479A true JPS63242479A (en) | 1988-10-07 |
Family
ID=13596646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62076139A Pending JPS63242479A (en) | 1987-03-31 | 1987-03-31 | Ultrasonic welding method using coupling oscillation and its equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63242479A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5024367A (en) * | 1989-05-15 | 1991-06-18 | Kabushiki Kaisha Shinkawa | Wire bonding method |
EP0711626A1 (en) * | 1994-11-08 | 1996-05-15 | Walter Herrmann Ultraschalltechnik GmbH | Device for the ultrasonic machining of a workpiece |
EP1930148A1 (en) * | 2006-12-07 | 2008-06-11 | Telsonic Holding AG | Use of a device for torsional, ultrasonic welding |
JP2013506271A (en) * | 2009-08-12 | 2013-02-21 | クリック アンド ソッファ インダストリーズ、インク. | Ultrasonic transducer for wire bonding and method of forming wire bond using ultrasonic transducer |
JP2017064779A (en) * | 2015-09-28 | 2017-04-06 | 辻野 次郎丸 | Ultrasonic complex vibration processing device |
JP2018149598A (en) * | 2018-03-27 | 2018-09-27 | 辻野 次郎丸 | Ultrasonic complex vibration processing device |
-
1987
- 1987-03-31 JP JP62076139A patent/JPS63242479A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5024367A (en) * | 1989-05-15 | 1991-06-18 | Kabushiki Kaisha Shinkawa | Wire bonding method |
EP0711626A1 (en) * | 1994-11-08 | 1996-05-15 | Walter Herrmann Ultraschalltechnik GmbH | Device for the ultrasonic machining of a workpiece |
US5730351A (en) * | 1994-11-08 | 1998-03-24 | Walter Hermann Ultra Schalltechnik Gmbh | Device for ultrasound treatment of a workplace |
EP1930148A1 (en) * | 2006-12-07 | 2008-06-11 | Telsonic Holding AG | Use of a device for torsional, ultrasonic welding |
WO2008068281A1 (en) * | 2006-12-07 | 2008-06-12 | Telsonic Holding Ag | Use of a device for torsional ultrasonic welding |
JP2013506271A (en) * | 2009-08-12 | 2013-02-21 | クリック アンド ソッファ インダストリーズ、インク. | Ultrasonic transducer for wire bonding and method of forming wire bond using ultrasonic transducer |
JP2017064779A (en) * | 2015-09-28 | 2017-04-06 | 辻野 次郎丸 | Ultrasonic complex vibration processing device |
JP2018149598A (en) * | 2018-03-27 | 2018-09-27 | 辻野 次郎丸 | Ultrasonic complex vibration processing device |
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