JPH07116868A - Method and device for joining metallic material - Google Patents

Method and device for joining metallic material

Info

Publication number
JPH07116868A
JPH07116868A JP26483593A JP26483593A JPH07116868A JP H07116868 A JPH07116868 A JP H07116868A JP 26483593 A JP26483593 A JP 26483593A JP 26483593 A JP26483593 A JP 26483593A JP H07116868 A JPH07116868 A JP H07116868A
Authority
JP
Japan
Prior art keywords
joined
vibration
joining
static pressure
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26483593A
Other languages
Japanese (ja)
Inventor
Masafumi Sakuranaka
雅文 櫻中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP26483593A priority Critical patent/JPH07116868A/en
Publication of JPH07116868A publication Critical patent/JPH07116868A/en
Pending legal-status Critical Current

Links

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

PURPOSE:To easily perform a joining operation by anyone without drawing on his skill and experience by causing a current to flow through the joined surface of metallic materials to be joined, opposing each other, making a sulfur concentrated layer formed by resistance heating, and vibrating the metallic materials while applying a static pressure force. CONSTITUTION:Metallic materials 13 and 14 to be joined, are held between an electrode plate 9 and the tip 5a of a horn 5, and resistance heating is performed by causing a current to flow through the metallic materials 13 and 14 to be joined while applying a perliminary static pressure force by a pressurizing means 16. After that, the metallic materials 13 and 14 are joined by confirming the formation of a sulfur concentrated layer after decreasing a temperature, and applying an ultrasonic vibration with a desired amplitude through the horn 5 while applying a prescribed static pressure force by the pressurizing means 16. In addition, even large metallic material to be joined, which are impossible to be joined by the conventional ultrasonic joining, can be joined by increasing the static pressure force by 30 to 50%.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は導電性の金属材料の接
合方法及び装置に係り、とくに固相接合方法及びその接
合装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for joining conductive metallic materials, and more particularly to a solid phase joining method and apparatus for joining the same.

【0002】[0002]

【従来の技術】従来、比較的に薄い金属材料の接合方法
として、被接合金属材料の接合面方向に静圧力を加えつ
つ超音波振動エネルギーを接合面に与えて接合する超音
波接合方法及びそのための種々の装置が公知である。
2. Description of the Related Art Conventionally, as a joining method of relatively thin metal materials, an ultrasonic joining method of applying ultrasonic vibration energy to the joining surfaces while applying static pressure in the joining surface direction of the metal materials to be joined and therefor Various devices are known.

【0003】[0003]

【発明が解決しようとする課題】この従来公知の超音波
接合は、接合面を清浄化してから該接合面を制御するこ
となく過大な静圧力を加えて振動振幅を印加して拡散接
合を行うので、母材や被接合材料の劣化が激しく、とく
に材料が線状のものの場合には、つぶれ変形を起した
り、切れたり、剥離したり或はその他の検出不能な潜在
的欠陥が生じたりするという問題があった。
According to the conventionally known ultrasonic bonding, diffusion bonding is performed by cleaning the bonding surface and then applying an excessive static pressure without controlling the bonding surface to apply a vibration amplitude. Therefore, deterioration of the base material and the material to be joined is severe, especially when the material is linear, it may cause crush deformation, breakage, peeling or other undetectable potential defects. There was a problem of doing.

【0004】また、従来の超音波接合は、接合加圧力、
振動時間、ホーン、アンビルのナール加工等の再現性が
難しく、経験と勘に頼るところが多かった。
In addition, the conventional ultrasonic joining is performed by applying a joining pressure,
Reproducibility of vibration time, horn, knurling of anvil, etc. was difficult, and I often relied on experience and intuition.

【0005】超音波接合は基本的には拡散接合と考えら
れ、接合部を破断させて顕微鏡でみると、酸化物層が消
失している。このことから接合部での酸化物層の消失が
即ち接合であると考えられる。金属材料表面の酸化物層
の消失は該金属材料を弱真空中で加熱することによって
得られるが、同時に金属材料に不純物として包合されて
いた硫黄が加熱によって表面に偏折して硫黄濃化層を形
成する。したがってこの状態で接合を行えば、大きなエ
ネルギーを要せずとも接合が可能となるが、製品の量産
時において弱真空状態の中で被接合金属材料の接合を行
うことはかなりの無理をともなうものである。
Ultrasonic bonding is basically considered to be diffusion bonding, and the oxide layer disappears when the bonded portion is broken and viewed under a microscope. From this, it is considered that the disappearance of the oxide layer at the bonded portion is the bonding. The disappearance of the oxide layer on the surface of the metal material is obtained by heating the metal material in a weak vacuum, but at the same time, the sulfur that was included as an impurity in the metal material is biased to the surface by heating and the sulfur is concentrated. Form the layers. Therefore, if bonding is performed in this state, it is possible to bond without requiring a large amount of energy, but it is quite difficult to bond metal materials to be bonded in a weak vacuum during mass production of products. Is.

【0006】この発明の目的は、従来のものよりも高い
静圧力や高い周波数を用いたり、或は長年の経験と勘に
頼らなくとも、さらには弱真空の状態を作り出さなくと
も、容易に導電性の金属材料同志を接合できる接合方法
及び装置を提供せんとするにある。
The object of the present invention is to easily conduct electricity without using a higher static pressure and a higher frequency than the conventional one, or without relying on many years of experience and intuition, and without creating a weak vacuum state. It is an object of the present invention to provide a joining method and apparatus capable of joining metallic metallic materials.

【0007】[0007]

【課題を解決するための手段】上述した目的を達成する
ためにこの発明は、金属材料の接合方法として、互いに
接合される被接合金属材料の接合面を対向させ、被接合
金属材料に電流を流して抵抗加熱により接合面に硫黄濃
化層を形成させ、次いで前記被接合金属材料の接合面方
向に静圧力を加えながら振動を与えるものである。
In order to achieve the above-mentioned object, the present invention provides a method for joining metallic materials, in which the joining surfaces of the joined metallic materials to be joined are opposed to each other and a current is applied to the joined metallic materials. It is flowed to form a sulfur-enriched layer on the joint surface by resistance heating, and then vibration is given while applying static pressure in the joint surface direction of the metal material to be joined.

【0008】この発明はまた、装置としては、一方の電
極を兼ねる振動子を有する振動発振手段と、前記振動子
に対向して設置されたもう一方の電極と、前記振動子と
もう一方の電極との間に挟んだところの互いに接合され
る被接合金属材料の接合面に静圧力を加える加圧手段と
を含ましめて構成するものである。
The present invention also provides, as a device, a vibrating and oscillating means having a vibrator that also serves as one electrode, another electrode installed so as to face the vibrator, and the vibrator and the other electrode. And a pressing means for applying a static pressure to the joint surfaces of the metal materials to be joined, which are sandwiched between and.

【0009】尚、上記いずれの場合にも振動を起こす手
段は、超音波振動によるもの、電磁式振動によるもの、
さらにカム式振動によるもの等が考えられる。
In any of the above cases, the means for vibrating is by ultrasonic vibration, electromagnetic vibration,
Further, cam type vibration may be considered.

【0010】[0010]

【作用】請求項1のように構成すると、被接合金属材料
がジュール熱によって加熱され、その接合面での酸化物
層が消失して硫黄濃化層が形成される結果、低い接合温
度と加圧力及び振動周波数を用いても被接合金属材料は
容易に接合される。
According to the present invention, the metal material to be bonded is heated by Joule heat, and the oxide layer on the bonding surface disappears to form a sulfur-enriched layer. The metal materials to be joined are easily joined even by using pressure and vibration frequency.

【0011】請求項2のように構成すると、一方の電極
を兼ねる振動子と、もう一方の電極板の間に挟まれた被
接合金属材料は、通電にともなうジュール熱によって加
熱され、加圧手段による接合方向からの圧力を受けつつ
超音波発生装置の振動子によって振動を印加される。
According to the second aspect of the invention, the metal material to be welded sandwiched between the vibrator also serving as one of the electrodes and the other electrode plate is heated by Joule heat accompanying energization, and joined by the pressurizing means. Vibration is applied by the vibrator of the ultrasonic generator while receiving pressure from the direction.

【0012】[0012]

【実施例】図面はこの発明の一実施例を説明するための
説明図であり、1は超音波発生装置2、ブースター3、
例えば耐熱衝撃性に優れた窒化ケイ素(Si34)製の
ダイヤフラム4、一方の電極を兼ねるホーン5で構成さ
れた振動発振手段であり、ホーン5はダイヤフラム4と
同じく窒化ケイ素製のスタッドボルト6を介してブース
ター3へ接続されている。尚、ホーンに代えて振動子の
みを用いる場合もあることからこのこの明細書において
振動子とした場合にはホーンを含めた意味で用いてい
る。7は反射極台であり、この反射極台7上には同じく
窒化ケイ素製の絶縁板8を介して、もう一方の電極プレ
ート9が載置されている。10は電源トランスであり、
この電源トランス10からはケーブル11、12がホー
ン5と電極プレート9に接続されている。ホーン5の先
端に設けたチップ5aと電極プレート9との間には一対
の被接合金属材料13、14が互いに接合面を対向接触
させて設置されている。ホーン5の先端の上部に設けた
受圧プレート5bの上方には押圧体15が載置当接して
おり、この押圧体15と反射極台7には接合面方向より
加圧手段16により静圧力が加えられるようになってい
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The drawings are explanatory views for explaining one embodiment of the present invention, in which reference numeral 1 denotes an ultrasonic wave generator 2, a booster 3,
For example, the vibration oscillating means is composed of a diaphragm 4 made of silicon nitride (Si 3 N 4 ) excellent in thermal shock resistance, and a horn 5 also serving as one electrode. The horn 5 is a stud bolt made of silicon nitride, which is the same as the diaphragm 4. It is connected to the booster 3 via 6. Since only the vibrator may be used instead of the horn, when the vibrator is used in this specification, the term includes the horn. Reference numeral 7 denotes a reflection pole base, and another electrode plate 9 is placed on the reflection pole base 7 with an insulating plate 8 also made of silicon nitride interposed therebetween. 10 is a power transformer,
Cables 11 and 12 are connected to the horn 5 and the electrode plate 9 from the power transformer 10. Between the tip 5a provided at the tip of the horn 5 and the electrode plate 9, a pair of metal materials 13 and 14 to be bonded are installed with their bonding surfaces facing each other. A pressing body 15 is placed and abutted above the pressure receiving plate 5b provided above the tip of the horn 5, and a static pressure is applied to the pressing body 15 and the reflection pole base 7 from the joint surface direction by the pressing means 16. It is supposed to be added.

【0013】次に、上述した装置を用いて実際に金属材
料を接合した場合について説明する。
Next, a case where metal materials are actually joined using the above-mentioned apparatus will be described.

【0014】[0014]

【実施例1】チタニウム同志を被接合金属材料に選び、
これを電極プレート9とホーン5のチップ5aとの間に
挟み、加圧手段16による予備静圧力を加えつつ電極プ
レート9とホーン5を介して被接合金属材料13、14
に電流を流し、約750℃まで抵抗発熱させた。その
後、600℃まで温度を下げて硫黄濃化層が形成された
のを確認して加圧手段16により20KgFの静圧力を
加えつつ0.4secの間ホーン5を介して20KHz
50μの振動振幅を加えたところ接合し、その接合強度
は母材強度と同程度となった。
[Example 1] Titanium is selected as a metal material to be bonded,
This is sandwiched between the electrode plate 9 and the tip 5a of the horn 5, and the pre-static pressure by the pressurizing means 16 is applied to the metal materials 13 and 14 to be joined via the electrode plate 9 and horn 5.
An electric current was passed through to cause resistance heating up to about 750 ° C. Then, the temperature was lowered to 600 ° C., and it was confirmed that the sulfur-enriched layer was formed, and while the static pressure of 20 KgF was applied by the pressurizing means 16, 20 KHz was applied via the horn 5 for 0.4 sec.
When a vibration amplitude of 50 μ was applied, they were joined, and the joining strength was about the same as the base metal strength.

【0015】これはチタニウムの表面の硫黄温度が40
0℃から上昇して約700℃で飽和し、接合面に硫黄濃
化層が析出されると、当然にその拡散接合温度は酸化層
の場合の拡散接合温度よりも低くなることを利用したも
ので、抵抗加熱をともなわない従来の超音波接合では、
同一の接合材料で750℃の拡散接合温度を必要とし、
50KgFの静圧力と20KHz60μの振動振幅を
0.8sec加えることを必要とした。
This is because the titanium surface has a sulfur temperature of 40.
Utilizing the fact that when the temperature rises from 0 ° C and becomes saturated at about 700 ° C and a sulfur-enriched layer is deposited on the joint surface, its diffusion bonding temperature becomes lower than that of the oxide layer. With conventional ultrasonic bonding that does not involve resistance heating,
The same bonding material requires a diffusion bonding temperature of 750 ° C,
It was necessary to apply a static pressure of 50 KgF and a vibration amplitude of 20 KHz 60 μ for 0.8 sec.

【0016】両者を対比してみれば明らかなように、本
願発明を実施した場合には、従来の単なる超音波接合の
ものに比して拡散接合温度、被接合金属材料へ加える静
圧力、振動周波数、及び振動振幅等は共に低く、また、
振動を加える時間も短くて済むことから接合に要するエ
ネルギーが少なくて済むことが解った。
As is clear from a comparison between the two, when the present invention is carried out, the diffusion bonding temperature, the static pressure applied to the metal material to be bonded, and the vibration are higher than those of the conventional simple ultrasonic bonding. Both frequency and vibration amplitude are low, and
It was found that the time required to apply vibration was short and the energy required for joining was small.

【0017】[0017]

【実施例2】アルミニウムと銅の異種の被接合金属材料
13、14を電極プレート9とホーン5のチップ5aと
の間に挟み、加圧手段16による予備静圧力を加えつ
つ、電流を流して約500℃まで抵抗発熱させた。しか
る後、接合面の温度を400℃まで下げ、硫黄濃化層が
形成されたのを確認して加圧手段を用いて10KgFの
静圧力を加えつつ20KHz60μの振動振幅を0.3
sec与えたところ、接合して母材強度と同程度になっ
た。
[Embodiment 2] Dissimilar metal materials 13 and 14 made of aluminum and copper are sandwiched between the electrode plate 9 and the chip 5a of the horn 5, and a current is applied while applying a preliminary static pressure by the pressurizing means 16. Resistance heat was generated up to about 500 ° C. After that, the temperature of the joint surface is lowered to 400 ° C., it is confirmed that the sulfur-enriched layer is formed, and a static pressure of 10 KgF is applied by using a pressurizing means while the vibration amplitude of 20 KHz 60 μ is 0.3.
When sec was applied, the strength of the base metal was almost the same as that of the base metal after joining.

【0018】同一の接合材料を従来の超音波接合によっ
て接合しようとすると、拡散接合温度は500℃であ
り、静圧力は20KgFを要し、20KHz70μの振
動振幅を0.8sec必要としたので、この場合にも、
本願発明のものが接合に要するエネルギーを必要とせず
優れていることが解った。
If the same joining material is to be joined by conventional ultrasonic joining, the diffusion joining temperature is 500 ° C., the static pressure is 20 KgF, and the vibration amplitude of 20 KHz 70 μ is 0.8 sec. Even if
It was found that the invention of the present application is excellent without requiring the energy required for bonding.

【0019】そして、上述した実施例1と2の両者にお
いて、接合された被接合金属材料のつぶれ変形はなく、
いずれも原型を保っていた。
In both the first and second embodiments described above, there is no crushing deformation of the joined metal materials to be joined,
Both kept their original shape.

【0020】この発明者はさらに、上述した本願発明を
さまざまな材料、及び態様で実施した結果、本願発明を
実施すれば従来の超音波接合では不可能とされていた大
型の被接合材料でも静圧力を30%〜50%高めれば接
合が可能であること、周波数の高い共振振動(定常振
動)を用いなくとも、電磁式又はカム式等を用いた振動
発振手段による振動の低い周波数振動でも同じように接
合できることが解った。
Further, as a result of carrying out the above-described present invention with various materials and modes, the inventor of the present invention can still perform the operation of the present invention even with a large material to be joined, which has been impossible with conventional ultrasonic joining. Even if the pressure is increased by 30% to 50%, joining is possible, and the same applies to low frequency vibration of vibration by a vibration oscillating means using an electromagnetic type or a cam type without using high frequency resonant vibration (steady vibration). It was found that they can be joined like.

【0021】[0021]

【発明の効果】請求項1のように構成すると、従来の超
音波接合の場合よりも弱い静圧力と振動振幅及び振動時
間で被接合金属材料を接合できるので、従来のもののよ
うなつぶれ変形、切れ、剥離等が発生するのを防止で
き、その他の検出不能な潜在欠陥を排除できる上により
接合し易くなるので、従来のように熟練工の勘や長年の
経験に頼らなくとも誰でもが容易に接合作業を行うこと
ができるという効果を奏し得る。
According to the first aspect of the present invention, since the metal materials to be joined can be joined with a weaker static pressure, vibration amplitude and vibration time than in the case of the conventional ultrasonic joining, the crushing deformation like the conventional one can be achieved. It is possible to prevent breakage, peeling, etc., and to eliminate other latent defects that cannot be detected, making it easier to join, so anyone can easily do it without relying on the intuition of skilled workers and many years of experience as in the past. It is possible to obtain an effect that the joining work can be performed.

【0022】請求項2のように構成すると、従来の装置
を大幅に改良することなく、より性能のアップした金属
材料の接合装置を提供することができるものである。
According to the second aspect of the present invention, it is possible to provide a metal material joining apparatus having improved performance without significantly improving the conventional apparatus.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明を説明するための説明図である。FIG. 1 is an explanatory diagram for explaining the present invention.

【符号の説明】[Explanation of symbols]

1 振動発振手段 2 超音波発生装置 3 ブースター 4 ダイヤフラム 5 ホーン(振動子) 7 反射極台 9 電極プレート 10 電源トランス 13 被接合金属材料 14 被接合金属材料 15 押圧体 16 加圧手段 DESCRIPTION OF SYMBOLS 1 Vibration oscillating means 2 Ultrasonic wave generator 3 Booster 4 Diaphragm 5 Horn (vibrator) 7 Reflective pole base 9 Electrode plate 10 Power transformer 13 Metal material to be bonded 14 Metal material to be bonded 15 Pressing body 16 Pressurizing means

Claims (8)

【特許請求の範囲】[Claims] 【請求項1】 互いに接合される被接合金属材料の接合
面を対向させ、前記被接合金属材料に電流を流して抵抗
加熱をすることにより接合面に硫黄濃化層を形成させ、
次いで前記被接合金属材料の接合面方向に静圧力を加え
ながら振動を与えることを特徴とする、金属材料の接合
方法。
1. A sulfur-enriched layer is formed on the joint surface by causing the joint surfaces of the joint metal materials to be jointed to face each other and applying an electric current to the joint metal material for resistance heating.
Next, a method for joining metal materials, characterized in that vibration is applied while applying static pressure in the joining surface direction of the metal materials to be joined.
【請求項2】 振動が超音波振動である、請求項1記載
の金属材料の接合装置。
2. The apparatus for joining metal materials according to claim 1, wherein the vibration is ultrasonic vibration.
【請求項3】 振動が電磁式振動である、請求項1記載
の金属材料の接合装置。
3. The apparatus for joining metal materials according to claim 1, wherein the vibration is electromagnetic vibration.
【請求項4】 振動がカム式振動である、請求項1記載
の金属材料の接合装置。
4. The joining apparatus for metal materials according to claim 1, wherein the vibration is cam vibration.
【請求項5】 一方の電極を兼ねる振動子を有する振動
発振手段と、前記振動子に対向して設置されたもう一方
の電極と、前記振動子ともう一方の電極との間に挟んだ
ところの互いに接合される被接合金属材料の接合面に静
圧力を加える加圧手段とを含むことを特徴とする、金属
材料の接合装置。
5. A vibrating and oscillating means having a vibrator that also serves as one electrode, another electrode placed so as to face the vibrator, and a portion sandwiched between the vibrator and the other electrode. And a pressing means for applying a static pressure to the joint surfaces of the metal materials to be joined, which are joined to each other.
【請求項6】 振動発振手段が超音波発振手段である、
請求項5記載の金属材料の接合装置。
6. The vibration oscillating means is an ultrasonic oscillating means,
The metal material joining apparatus according to claim 5.
【請求項7】 振動発振手段が電子式の振動発振手段で
ある、請求項5記載の金属材料の接合装置。
7. The apparatus for joining metal materials according to claim 5, wherein the vibration oscillating means is an electronic vibration oscillating means.
【請求項8】 振動発振手段がカム式発振手段である、
請求項5記載の金属材料の接合装置。
8. The vibration oscillating means is a cam type oscillating means.
The metal material joining apparatus according to claim 5.
JP26483593A 1993-10-22 1993-10-22 Method and device for joining metallic material Pending JPH07116868A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26483593A JPH07116868A (en) 1993-10-22 1993-10-22 Method and device for joining metallic material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26483593A JPH07116868A (en) 1993-10-22 1993-10-22 Method and device for joining metallic material

Publications (1)

Publication Number Publication Date
JPH07116868A true JPH07116868A (en) 1995-05-09

Family

ID=17408874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26483593A Pending JPH07116868A (en) 1993-10-22 1993-10-22 Method and device for joining metallic material

Country Status (1)

Country Link
JP (1) JPH07116868A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011162345A1 (en) * 2010-06-24 2011-12-29 日産自動車株式会社 Joining method and joining apparatus
JP2012086268A (en) * 2010-09-22 2012-05-10 Nissan Motor Co Ltd Method of joining and device therefor
WO2012081440A1 (en) * 2010-12-14 2012-06-21 日産自動車株式会社 Bonded object of electroconductive materials
WO2012081521A1 (en) * 2010-12-15 2012-06-21 日産自動車株式会社 Bonding method and members to be bonded
JP2012125804A (en) * 2010-12-15 2012-07-05 Nissan Motor Co Ltd Bonding method, and member to be bonded
JP2012125809A (en) * 2010-12-15 2012-07-05 Nissan Motor Co Ltd Bonding method and bonding device
JP2012125806A (en) * 2010-12-15 2012-07-05 Nissan Motor Co Ltd Bonding method and bonding device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011162345A1 (en) * 2010-06-24 2011-12-29 日産自動車株式会社 Joining method and joining apparatus
JP2012024840A (en) * 2010-06-24 2012-02-09 Nissan Motor Co Ltd Method and apparatus for joining
JP2012086268A (en) * 2010-09-22 2012-05-10 Nissan Motor Co Ltd Method of joining and device therefor
WO2012081440A1 (en) * 2010-12-14 2012-06-21 日産自動車株式会社 Bonded object of electroconductive materials
JP5786866B2 (en) * 2010-12-14 2015-09-30 日産自動車株式会社 Conductive material assembly
WO2012081521A1 (en) * 2010-12-15 2012-06-21 日産自動車株式会社 Bonding method and members to be bonded
JP2012125804A (en) * 2010-12-15 2012-07-05 Nissan Motor Co Ltd Bonding method, and member to be bonded
JP2012125809A (en) * 2010-12-15 2012-07-05 Nissan Motor Co Ltd Bonding method and bonding device
JP2012125806A (en) * 2010-12-15 2012-07-05 Nissan Motor Co Ltd Bonding method and bonding device

Similar Documents

Publication Publication Date Title
Neppiras Ultrasonic welding of metals
KR100456381B1 (en) Ultrasonic Bonding Method and Ultrasonic Bonding Device
US2946119A (en) Method and apparatus employing vibratory energy for bonding metals
JP2004174546A (en) Method of joining metallic member
JP2002280140A (en) Ultrasonic jointing method to wire, and ultrasonic jointing device using the same method
JPH07116868A (en) Method and device for joining metallic material
US5921460A (en) Method of soldering materials supported on low-melting substrates
JPH02101754A (en) Bonding process and bonding apparatus
JPH06114565A (en) Spot welding method for different kinds of metal members
JP2000174059A (en) Method of mounting electronic component
JP2000278073A (en) Method for sealing surface mounting type oscillator using ultrasonic composite vibration
JP2004243402A (en) Metal foil joining method, and metal foil connecting device
JPH01317687A (en) Spot welding method for laminated steel plate
JP2002231838A (en) Assembling method of package
US3461542A (en) Bonding leads to quartz crystals
JPH09108854A (en) Method for joining between conductors and joining structure between conductors
JP3446458B2 (en) Ultrasonic bonding method
JP3397136B2 (en) Bonding tools and bonding equipment
JPS58388A (en) Structure of weld zone in ultrasonic welding
JPS63242479A (en) Ultrasonic welding method using coupling oscillation and its equipment
RU2271909C2 (en) Pressure welding method
JP2826633B2 (en) In-plane composite method of metal plate
JP2000216198A (en) Semiconductor device and its manufacture
JPH08340176A (en) Connecting method of lead wire
JPH0232078B2 (en)