JP2012125806A - Bonding method and bonding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonding method and a bonding device capable of improving the service life of electrodes for performing resistance heating of bonding members comprising a conductive material.SOLUTION: The bonding device includes: first and second electrodes 102, 104 electronically connected to first and second bonding members 160, 170; an electric current supplying means 110 for making an electric current flow from the first electrode to the second electrode via the first bonding member, an intermediate member 180, and the second bonding member; a holding means 120 for holding the first and second bonding members in a relatively static state with respect to first and second contact surfaces 182, 184 of the intermediate member; a sliding means 130 for sliding the first and second contact surfaces against the first and second bonding members; and a control means 150 for controlling the sliding means and the electric current supplying means, and bonding by performing resistance heating by making an electric current flow from the first electrode to the second electrode via the first bonding member, the intermediate member, and the second bonding member, while sliding the first and second contact surfaces against the first and second bonding members.

Description

  The present invention relates to a joining method and joining apparatus for members to be joined made of a conductive material.

  In order to facilitate joining of the parts to be joined by resistance welding, a current is passed while the parts to be joined are in contact, and after the surface oxide film is replaced with a sulfur-enriched layer by resistance heating, sulfur enrichment is performed by sliding. The layers are forcibly separated (see, for example, Patent Document 1).

Japanese Patent Laid-Open No. 7-116868

  However, since the sliding is performed after resistance heating, the sliding causes wear of the softened electrode due to the temperature rise caused by the resistance heating, or the softened portion is welded to the electrode, and the replacement frequency of the electrode is reduced. Has an increasing problem.

  The present invention has been made to solve the problems associated with the above-described prior art, and provides a bonding method and a bonding apparatus capable of improving the life of an electrode for resistance heating of a member to be bonded made of a conductive material. With the goal.

  In order to achieve the above object, a uniform phase of the present invention is a bonding method for simultaneously bonding three or more members to be bonded made of a conductive material, wherein the first electrode is electrically connected to the first member to be bonded. And a second joining member to which the second electrode is electrically connected is joined to an intermediate member constituted by one or more joining members. And the said intermediate member has the 1st contact surface which contacts the said 1st to-be-joined member, and the 2nd contact surface which contacts the said 2nd to-be-joined member, In the above-mentioned joining process, While sliding the first and second contact surfaces with respect to the first and second members to be joined, current is passed from the first electrode to the first member to be joined, the intermediate member, and the second member to be joined. The first and second contact surfaces are joined to the first and second members to be joined by flowing through the member to the second electrode and resistance heating.

  Another aspect of the present invention for achieving the above object is a joining apparatus for simultaneously joining three or more members to be joined made of a conductive material, wherein the first and second members to be joined are: The intermediate member constituted by one or more members to be joined has joining means for joining. The intermediate member has a first contact surface that comes into contact with the first member to be joined, and a second contact surface that comes into contact with the second member to be joined. A first electrode electrically connected to the joining member; a second electrode electrically connected to the second joined member; and a current from the first electrode to the first joined member, the intermediate Current supply means for flowing to the second electrode via the member and the second bonded member, and the first and second bonded members are relatively stationary with respect to the first and second contact surfaces Holding means for holding in a state; sliding means for sliding the first and second contact surfaces with respect to the first and second members to be joined; and controlling the sliding means and the current supply means And sliding the first and second contact surfaces with respect to the first and second members to be joined. In addition, the first and the second electrodes are heated by flowing current from the first electrode to the second electrode via the first member to be bonded, the intermediate member, and the second member to be bonded. Control means for joining the second contact surfaces.

  According to the bonding method and the bonding apparatus according to the present invention, the first and second electrodes for resistance heating are not in contact with the sliding first and second contact surfaces and are relatively stationary. Since the electrodes are electrically connected to the first and second members to be joined, sliding causes wear of the softened electrode due to a temperature rise due to resistance heating, or welding of the softened portion to the electrode. Can be avoided and the frequency of electrode replacement can be reduced. That is, it is possible to provide a bonding method and a bonding apparatus that can improve the life of an electrode for resistance heating of a member to be bonded made of a conductive material.

It is the schematic for demonstrating the joining apparatus which concerns on Embodiment 1. FIG. 3 is a flowchart for explaining a joining method according to the first embodiment. FIG. 6 is a schematic diagram for explaining a first modification according to the first embodiment. FIG. 10 is a schematic diagram for explaining a second modification according to the first embodiment. FIG. 10 is a schematic diagram for explaining a third modification according to the first embodiment. FIG. 10 is a schematic diagram for explaining a modification example 4 according to the first embodiment. FIG. 6 is a schematic diagram for explaining a joining device according to a second embodiment. FIG. 9 is a schematic diagram for explaining a first modification according to the second embodiment. FIG. 10 is a schematic diagram for explaining a second modification according to the second embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic diagram for explaining a bonding apparatus according to the first embodiment.

  The joining apparatus 100 according to the first embodiment is used for simultaneously joining workpieces W made of three or more members to be joined made of a conductive material using resistance heating and frictional heat, and the first electrode 102, A second electrode 104, a current supply device 110, a holding device 120, a sliding device (sliding means) 130, a pressurizing device 140, and a control device 150 are included.

  The workpiece W is disposed between the first member to be bonded 160 positioned above, the second member to be bonded 170 positioned below, and the first member to be bonded 160 and the second member to be bonded 170. It is possible to easily form a structure including the intermediate member 180 which is a member to be joined and in which the members to be joined are joined in series. The intermediate member 180 has a first contact surface 182 that contacts the first member to be bonded 160 and a second contact surface 184 that contacts the second member to be bonded.

  The areas of the first and second contact surfaces 182 and 184 are set to be substantially the same. The intermediate member 180 has a uniform shape with respect to the direction of vibration described later, and the extending direction of the first and second contact surfaces 182 and 184 is the horizontal direction H, and the intermediate member has. The first and second contact surfaces can be easily joined by vibration.

  In the present embodiment, aluminum (Al) is applied to the members to be joined. As the aluminum, a rolled material (for example, A5052) or a cast material (for example, ADC12) can be used. The member to be joined is not particularly limited as long as it is a conductive material, and iron (Fe) or magnesium (Mg) can be applied. Moreover, it is also possible to apply to joining of the same material of Al—Al, and joining of different materials of Al—Fe or Al—Mg.

  In order to join the first and second members to be joined 160 and 170 to the intermediate member 180 at a relatively low temperature, the intermediate member 180 is a conductive material that constitutes the first and second members to be joined 160 and 170. It is also preferable that the conductive material is made of a lower melting point.

  The first and second electrodes 102 and 104 are heating means for raising the temperature of the workpiece W by resistance heating, and the first electrode 102 is electrically connected to a first member to be bonded 160 located above, The second electrode 104 is electrically connected to the second bonded member 170 located below. Each of the first and second electrodes 102 and 104 can be composed of a plurality of electrodes.

  The current supply device 110 is a current supply means for causing a current to flow from the first electrode 102 to the second electrode 104 via the first bonded member 160, the intermediate member 180, and the second bonded member 170, For example, the current value and the voltage value are configured to be adjustable.

  The holding device 120 includes a first holding unit 122 and a second holding unit 124. The first holding part 122 holds the first member to be bonded 160 and restricts the movement in the horizontal direction, whereby the first member to be bonded 160 (and the first member 160 with respect to the first contact surface 182 of the intermediate member 180). It is used to keep the electrode 102) relatively stationary. The second holding part 124 is located on the opposite side of the first holding part 122 with respect to the intermediate member 180, holds the second joined member 170, and restricts the movement in the horizontal direction, whereby the second of the intermediate member 180. The second bonded member 170 (and the second electrode 104) is used to maintain a relatively stationary state with respect to the contact surface 184.

  The sliding device 130 is used to generate frictional heat by sliding the first and second contact surfaces 182 and 184 of the intermediate member 180 with respect to the first and second joined members 160 and 170. A shaft 132 that vibrates (vibrates) the intermediate member 180 in a horizontal direction H parallel to the extending direction of the first and second contact surfaces 182 and 184, and a motor 134 that is a drive source of the shaft 132; It comprises a vibration means having For example, the excitation amplitude is adjustable in the range of 100 to 1000 μm, and the excitation frequency is adjustable in the range of 10 to 100 Hz. The vibration mechanism is not particularly limited, and for example, ultrasonic vibration, electromagnetic vibration, hydraulic vibration, and cam vibration can be applied.

  In addition, since the exciting direction is a reciprocating motion in one direction along the extending direction of the first and second contact surfaces 182 and 184, the degree of freedom of the shape of the first and second contact surfaces 182 and 184 is improved. It will be. In other words, since vibration can be applied as long as it can be displaced in one direction, the first and second contact surfaces 182 and 184 do not have to be flat, and for example, a convex portion fits into a groove extending in one direction. It is also possible to adopt a form.

  Further, the sliding device 130 is not limited to a form using vibration (excitation mechanism), and it is also possible to appropriately apply a rotational motion or a revolving motion that swings around in a circular orbit without rotating. . In the case of the revolving motion, unlike the vibration, the relative motion between the contact surfaces does not stop, so only the dynamic friction coefficient acts to stabilize the friction coefficient, and it is possible to wear the contact surface uniformly. .

  The pressurizing apparatus 140 includes a first pressurizing unit 142 positioned above and a second pressurizing unit 144 positioned below. The first pressurizing unit 142 is a surface pressure adjusting means for adjusting the pressing surface pressure of the first bonded member 160 against the first contact surface 182, and is connected to the first electrode 102 and in the vertical direction (first Further, it can be moved forward and backward in a pressing direction L that is orthogonal to the second contact surfaces 182 and 184. The second pressurizing unit 144 is a surface pressure adjusting means for adjusting the pressing surface pressure of the second bonded member 170 against the second contact surface 184, is connected to the second electrode 104, and advances and retreats in the vertical direction L. It is possible to move. For example, the first and second pressure units 142 and 144 incorporate hydraulic cylinders, and are configured to be capable of adjusting the pressing force. The pressing force is, for example, 2 to 10 MPa.

  The control device 150 is a control means including a computer having a calculation unit, a storage unit, an input unit, and an output unit, and is used to comprehensively control the current supply device 110, the sliding device 130, and the pressurizing device 140. The Each function of the control device 150 is exhibited when the arithmetic unit executes a program stored in the storage device.

  The program adjusts, for example, the pressing surface pressure of the first member to be bonded 160 against the first contact surface 182 and the pressing surface pressure of the second member to be bonded 170 against the second contact surface 184 by the pressing device 140. Then, the first and second contact surfaces 182 and 184 of the intermediate member 180 are caused to vibrate with respect to the first and second members to be joined 160 and 170 by vibrating the intermediate member 180 in the horizontal direction H by the sliding device 130. Current supplied from the current supply device 110 to the second electrode 104 from the first electrode 102 via the first member 160, the intermediate member 180, and the second member 170. This is to cause the controller 150 to execute a procedure for joining the first and second contact surfaces 182 and 184 by flowing and resistance heating.

  In the bonding apparatus 100, as described above, the first and second electrodes 102 and 104 for resistance heating are not in contact with the sliding first and second contact surfaces 182 and 184, and are relatively The first and second electrodes 102 and 104 softened due to temperature rise due to resistance heating are worn by sliding because they are electrically connected to the first and second joined members 160 and 170 that are stationary. In other words, it is possible to prevent the softened portion from being welded to the first and second electrodes 102 and 104, and to reduce the replacement frequency of the first and second electrodes 102 and 104. That is, the joining apparatus which can improve the lifetime of the electrode for resistance-heating the to-be-joined member which consists of an electrically-conductive material can be provided.

Next, the joining method according to the first embodiment will be described. FIG. 2 is a flowchart for explaining the joining method according to the first embodiment. The algorithm shown by the flowchart shown in FIG. 2 is stored as a program in the storage unit of the control device 150, and is executed by the arithmetic unit of the control device 150.

  In this bonding method, the first and second contact surfaces 182 and 184 of the intermediate member 180 are slid with respect to the first and second members to be bonded 160 and 170, and current is supplied from the first electrode 102. The first and second contact surfaces 182 and 184 are made to flow through the first electrode 160, the intermediate member 180, and the second member 170 through the second electrode 104 and heated by resistance, so that the first and second contact surfaces 182 and 184 It has a joining process for joining to the 2nd joined members 160 and 170.

  The joining process generally uses a preliminary sliding step (S11) for reducing variation in contact resistance, resistance heating and frictional heat (plastic flow), and joins the first joined member 160 and the intermediate member 180. A first joining step (S12) for starting the formation of the interface and the joining interface between the second member to be joined 170 and the intermediate member 180, a second joining step (S13) for promoting the integration of the joining interface, 170 and a cooling step (S14) for cooling the intermediate member 180.

  More specifically, in the preliminary sliding step (S11), the workpiece W in which the intermediate member 180 is disposed between the first member to be joined 160 and the second member to be joined 170 is introduced, and The first and second pressure units 142 and 144 are operated, and a pressing force is applied to the first and second bonded members 160 and 170 via the first and second electrodes 102 and 104.

  Thereafter, the sliding device 130 is driven, and this causes sliding (vibration) of the intermediate member 180 in the horizontal direction H. At this time, the first and second joined members 160 and 170 that are in contact with the intermediate member 180 are under pressure, and movement in the horizontal direction is restricted by the first holding portion 122 and the second holding portion 124 of the holding device 120. Therefore, friction occurs in the first and second contact surfaces 182 and 184 of the intermediate member 180 (and corresponding contact surfaces in the first member 160 and the second member 170), and aluminum oxidation occurs on the contact surface surface. The film is removed.

  In the first joining step (S12), the current supply device 110 is operated, and the current supplied from the current supply device 110 is supplied from the first electrode 102 to the first joined member 160, the intermediate member 180, and the second joined member. It flows to the 2nd electrode 104 via the member 170, and resistance heating arises. As a result, the first and second contact surfaces 182 and 184 are subjected to wear, plastic flow, and material diffusion due to the combined use of both frictional heat and resistance heating, and the formation of a joint interface is started.

  In the second joining step (S13), the amount of heat generated by resistance heating is reduced by decreasing the supply of current by the current supply device 110, while the frictional heat is increased by increasing the pressure applied by the pressurizing device 140. Be made. As a result, the amount of heat generated by resistance heating is reduced, and the process proceeds to a process of promoting integration by stirring the softened material by sliding. Increase in frictional heat can also be achieved by controlling the sliding device 130.

  The supply of current by the current supply device 110 is finally stopped. Immediately before entering the cooling step (S14), the operation of the sliding device 130 is stopped, and the intermediate member 180 is positioned at a predetermined stationary position (final joining position). At this time, in order to improve positioning accuracy and facilitate positioning, it is also possible to reduce the pressure applied by the pressurizing device 140.

  As a result of the first joining step (S12) and the second joining step (S13), the joining interface has a diffusion joining region in which conductive materials are mutually diffused, and a plastic flow joining having a pressure welding by plastic flow and a recrystallized structure. A region will be formed. That is, since the bonding interface is physically bonded by the plastic flow bonding region in addition to the diffusion bonding region, it has strength close to the base material characteristics of the first and second members to be bonded 160 and 170 and the intermediate member 180. Therefore, it is possible to ensure good bonding strength and water tightness over the entire bonding surface.

  In the cooling step (S14), the pressurizing force by the pressurizing device 140 is increased, and when a predetermined time has elapsed, it is determined that the cooling has ended, and pressurization is stopped. Then, the first and second pressure units 142 and 144 (first and second electrodes 102 and 104) of the pressure device 140 are separated from the first and second members to be joined 160 and 170, respectively. The end of cooling can also be determined directly by detecting the temperature.

  Thereafter, the workpiece W in which the intermediate member 180 is disposed and bonded between the first bonded member 160 and the second bonded member 170 is removed. That is, it is possible to easily form a structure in which the members to be joined are joined in series.

  In the preliminary sliding step (S11), the aluminum oxide film on the surface of the contact surface is removed, and the variation in contact resistance due to the difference in film thickness is reduced. Therefore, heat generation in the subsequent first joining step (S12). Variation in quantity is suppressed. In addition, before the preliminary sliding step (S11), pre-treatment such as degreasing and removing the aluminum oxide film by brushing with a wire brush is not required, so that workability is improved. In addition, it is also possible to implement pre-processing as needed.

  The first and second contact surfaces are operated by operating the current supply device 110 with the sliding device 130 stopped before the preliminary sliding step (S11) or as an alternative to the preliminary sliding step (S11). It is also possible to provide a preheating step in which 182 and 184 are softened by resistance heating. Further, the preliminary sliding step (S11) can be omitted as appropriate.

  It is also possible to integrate the second joining step (S13) with the first joining step (S12) by not reducing the supply of current and increasing the applied pressure. In addition, the cooling step (S14) can be omitted as appropriate.

  In the present bonding method, as described above, the first and second electrodes 102 and 104 for resistance heating are not in contact with the sliding first and second contact surfaces 182 and 184 and are relatively The first and second electrodes 102 and 104 softened due to temperature rise due to resistance heating are worn by sliding because they are electrically connected to the first and second joined members 160 and 170 that are stationary. In other words, it is possible to prevent the softened portion from being welded to the first and second electrodes 102 and 104, and to reduce the replacement frequency of the first and second electrodes 102 and 104. That is, it is possible to provide a bonding method that can improve the life of the electrode for resistance heating of the member to be bonded made of a conductive material.

  Further, since both frictional heat and resistance heating are used in combination, it is not necessary to apply a high surface pressure as compared with the case of using only one, so the areas of the first and second contact surfaces 182 and 184 are large. Even in this case, it can be easily joined. In other words, even if a high pressing force (surface pressure) is not applied to the contact surface, the current-concentrated portion changes and is heated uniformly, so that even when the contact surface has a large area or a complicated shape, it is joined. And surface bonding with low distortion is possible.

  Since only the surface layer of the contact surface is plastically flowed (melted) and joined, the heating time can be shortened, and even in a cast product containing gas in the material, the gas in the material expands due to heating, It is difficult to eject and it is possible to achieve good bonding.

  In addition, since the areas of the first and second contact surfaces 182 and 184 are set to be substantially the same, it is possible to suppress current from being concentrated on one of the first and second contact surfaces 182 and 184 and to heat uniformly. Easy to do. In addition, even when there is a high surface pressure region where current concentrates on the first and second contact surfaces 182 and 184, resistance heating is greatly applied in the region and the oxide film is forcibly heated. Since the pressure concentration (surface pressure) and vibration act to cause plastic flow and wear, the current concentration changes every moment, and the current flow is dispersed, and the first and second The contact surfaces 182 and 184 are heated uniformly.

  FIG. 3 is a schematic diagram for explaining a first modification according to the first embodiment.

  In the joining apparatus 100A according to the first modification, the area of the first contact surface 182 and the area of the second contact surface 184 are different, and the area of the first contact surface 182 is larger than the area of the second contact surface 184. It has become. In this case, since it is difficult to uniformly join the first and second contact surfaces 182 and 184, the interposition member 190 is disposed between the first member to be joined 160 and the intermediate member 180.

  The interposition member 190 is made of a conductive material having a melting point lower than that of the conductive material constituting the first bonded member 160 and / or the intermediate member 180. Therefore, even if the area of the first contact surface 182 and the area of the second contact surface 184 are different, the low melting point interposition member is disposed on the larger area 162, so that uniform bonding is possible. is there.

  When the interposed member 190 is made of a eutectic reaction material capable of forming a liquid phase (eutectic reaction) with the conductive material constituting the first bonded member 160 and / or the intermediate member 180 at a low temperature, Since it is possible to join 1 to-be-joined member 160 and the intermediate member 180 to an intermediate member at lower temperature, it is preferable. In this case, in addition to the diffusion bonding region and the plastic flow bonding region, the intermediate material intermediate bonding region (the intermediate member 190 and the conductive material constituting the intermediate member 190 include the first bonded member 160 and the intermediate member 180 at the bonding interface. And a diffusion bonding region diffused in the conductive material that constitutes the conductive material, and the discharged or diffused interposition member 190 exists in the diffusion bonding region. In addition, the thickness of the eutectic reaction material is, for example, 10 to 100 μm, but is not particularly limited thereto, and the thickness can be appropriately changed according to the site.

  Since the eutectic reaction material forms a liquid phase and promotes interdiffusion between the members to be joined and between the eutectic reaction material and the member to be joined, it is possible to ensure good joint strength, and Since the gap is filled with the liquid phase to be formed, it is easy to achieve good water-tightness even when joining large areas or curved surfaces. In addition, it becomes a liquid phase with a low melting point by eutectic reaction, and plays a role of blocking oxygen and suppressing reoxidation. This is also preferable in that joining with low heat input is possible and mass production is easy. In addition, eutectic reaction materials that undergo eutectic reaction with aluminum are, for example, zinc (Zn), copper (Cu), tin (Sn), and silver (Ag).

  When the area of the second contact surface 184 is larger than the area of the first contact surface 182, the interposition member 190 is disposed between the second member to be bonded 170 and the intermediate member 180 in order to bond uniformly. It is preferable. In addition, the interposition member 190 can apply a brazing material or solder that forms a liquid phase. In addition, the interposition member 190 is not limited to a separate form, and may be formed of a covering layer integrated with the first member to be bonded 160 or the intermediate member 180. In this case, it is possible to arrange the interposed member 190 locally. The coating can be formed by plating, cladding material, coating, or the like.

  FIG. 4 is a schematic diagram for explaining a second modification according to the first embodiment.

  In the joining apparatus 100 </ b> B according to the second modification, the first interposed member 192 disposed between the first joined member 160 and the intermediate member 180 and the second interposed member 170 disposed between the intermediate member 180. And a second interposed member 194. The first interposed member 192 is made of a conductive material having a melting point lower than that of the conductive material constituting the first bonded member 160 and / or the intermediate member 180, and the second interposed member 194 is formed of the second bonded member 170 and / or the intermediate member. It is made of a conductive material having a melting point lower than that of the conductive material constituting the member 180.

  Therefore, the first and second members to be joined 160 and 170 can be joined to the intermediate member 180 at a low temperature, and the degree of freedom of selection of the conductive material constituting the intermediate member 180 is great. The first and second interposed members 192 and 194 are preferably made of a eutectic reaction material in order to perform bonding at a lower temperature.

  The first and second interposed members 192 and 194 are not limited to forms formed separately from each other, and may be formed of a coating layer integrated with the intermediate member 180 or integrated with the first and second members to be bonded 160 and 170. It is also possible to make it from a structured coating layer.

  FIG. 5 is a schematic diagram for explaining a third modification according to the first embodiment.

  In the joining apparatus 100C according to the modification 3, the intermediate member 180 is composed of three intermediate members (joined members) 180A to 180C made of a conductive material, and the third holding portion 126 and the second sliding device 130A are added. Has been. The intermediate member (first intermediate member) 180 </ b> A is opposed to the first member to be bonded 160 and has a first contact surface 182. The intermediate member (second intermediate member) 180 </ b> C is opposed to the second bonded member 170 and has a second contact surface 184. The intermediate member (third intermediate member) 180B is disposed between the intermediate member 180A and the intermediate member 180C. The third holding unit 126 is a second holding unit that holds the intermediate member 180B relatively stationary with respect to the intermediate members 180A and 180C. The second sliding device 130A is used to generate frictional heat by sliding the first contact surface 182 of the intermediate member 180A with respect to the first member 160 to be bonded. The second contact surface 184 of the member 180C is slid with respect to the second joined member 170 to generate frictional heat.

  In this case, the third holding portion 126 restricts the movement of the intermediate member 180B located in the center in the horizontal direction (holding the intermediate member 180B relatively stationary with respect to the intermediate members 180A and 180C) The first and second members to be joined 160 are vibrated (excited) in the horizontal direction H by the intermediate member 180A positioned above and the intermediate member 180C positioned below by the first and second sliding devices 130 and 130A. , 170 can be joined to the intermediate member 180A and the intermediate member 180C, and the intermediate member 180B can be joined to the intermediate member 180A and the intermediate member 180C. That is, in the modification 3, the workpiece | work consisting of five to-be-joined members can be joined. In addition, it is possible to apply even when it has more than three intermediate members by further adding a holding part and a sliding device.

  FIG. 6 is a schematic diagram for explaining a fourth modification according to the first embodiment.

  The workpiece W is not limited to a simple shape, and can be applied even to a large part having a complicated shape to which a high pressure die casting method (HPDC) is applied.

  For example, in the joining device 100D according to the modified example 4, the first joined member 160A having the flange portion 166 and the hemispherical portion 168, and the second joined member 170A having the flange portion 176 and the hemispherical portion 178, It is also possible to join the intermediate member 180A.

  In this case, the first holding part 122A and the second holding part 124B of the holding device 120 are the first holding part 120B in order to restrict the horizontal movement of the first and second joined members 160A and 170A, which are large molded parts. It is preferable that the second members to be joined 160A and 170A be fixed at a plurality of locations.

  Further, the first and second pressurizing portions 142A and 144B of the pressurizing device 140 are in contact with the first and second joined members 160A and 170A so as to directly apply the pressing force, and the first and second electrodes 102A and 104A are elastically connected to the first and second pressurizing units 142A and 144B, and are configured so that a large pressing force from the first and second pressurizing units 142A and 144B is not directly applied. preferable.

  As described above, in the first embodiment, the first and second electrodes for resistance heating are not in contact with the sliding first and second contact surfaces and are relatively stationary. Since the electrodes are electrically connected to the first and second members to be joined, sliding causes wear of the softened electrode due to a temperature rise due to resistance heating, or welding of the softened portion to the electrode. Can be avoided and the frequency of electrode replacement can be reduced. That is, it is possible to provide a bonding method and a bonding apparatus that can improve the life of an electrode for resistance heating a member to be bonded made of a conductive material.

  When the intermediate member is disposed between the first member to be joined and the second member to be joined, it is possible to easily form a structure in which the members to be joined are joined in series.

  When the areas of the first and second contact surfaces to be joined are substantially the same, current is prevented from concentrating on one of the first contact surface and the second contact surface, so uniform heating is easy. It is.

  When the area of the first contact surface is larger than the area of the second contact surface, an intermediate member made of a conductive material having a melting point lower than that of the conductive material constituting the first member to be joined and / or the intermediate member is used as the first member to be joined. When the area of the second contact surface is larger than the area of the first contact surface, a conductive material having a melting point lower than that of the conductive material constituting the second bonded member and / or the intermediate member is used. When the intermediate member to be arranged is arranged between the second and third members to be joined, the low melting point interposing member is arranged on the larger area, so that it can be uniformly joined.

  When the sliding consists of vibration and the first and second contact surfaces of the intermediate member have a uniform shape with respect to the direction of vibration, the first and second contact surfaces can be easily joined by vibration. .

  When the intermediate member is made of a conductive material having a melting point lower than that of the conductive material constituting the first and second bonded members, the first bonded member and / or the second bonded member are bonded to the intermediate member at a low temperature. Is possible.

  A first interposed member that is disposed between the first member to be joined and the intermediate member and is made of a conductive material having a melting point lower than that of the conductive material constituting the first member to be joined and / or the intermediate member; and a second member to be joined And a second interposed member made of a conductive material having a melting point lower than that of the conductive material constituting the second member to be joined and / or the intermediate member, the first and second members to be joined Can be bonded to the intermediate member at a low temperature, and the degree of freedom in selecting the conductive material constituting the intermediate member is great.

  In the case where the first and second interposed members are formed of a covering layer integrated with the intermediate member, the first and second interposed members can be locally disposed only on the first and second contact surfaces.

  Next, a second embodiment will be described.

  FIG. 7 is a schematic diagram for explaining the joining apparatus according to the second embodiment.

  In the second embodiment, the members to be joined are joined in series in that it is possible to easily form a structure in which a plurality of members to be joined are juxtaposed and joined to one surface of the members to be joined. In general, the structure is different from the first embodiment in which the structure can be easily formed.

  Specifically, the joining device 200 according to the second embodiment is used to join the workpieces W, and includes a first electrode 202, a second electrode 204, a current supply device 210, a holding device 220, a sliding device (sliding). Means) 230, pressurizing device 240 and control device 250.

  The workpiece W includes first and second members to be joined 260 and 270 located above and an intermediate member 280 that is a third member to be joined located below, and the first and second members 260 and 260 are joined. A member 270 is juxtaposed on one surface of the intermediate member 280. Therefore, the intermediate member 280 has the first contact surface 282 that contacts the first member to be bonded 260 and the second contact surface 284 that contacts the second member to be bonded 270 on the same surface.

  The first electrode 202 and the second electrode 204 are electrically connected to the first and second members to be joined 260 and 270 located above, and the current supply device 210 receives current from the first electrode 202. The first member to be joined 260, the intermediate member 280, and the second member to be joined 270 are configured to flow to the second electrode 204.

  The holding device 220 includes a first holding unit 222 and a second holding unit 224 juxtaposed with the first holding unit 224. The first holding unit 222 holds the first member to be bonded 260 and restricts the movement in the horizontal direction, whereby the first member to be bonded 260 (and the first member 260 with respect to the first contact surface 282 of the intermediate member 280). Used to maintain the electrode 202) in a relatively stationary state. The second holding part 224 is used to maintain the second member to be bonded 270 (and the second electrode 204) relatively stationary with respect to the second contact surface 284 of the intermediate member 280. The first holding unit 222 and the second holding unit 224 can be appropriately integrated.

  The sliding device 230 is used to slide the first and second contact surfaces 282 and 284 of the intermediate member 280 relative to the first and second members to be joined 260 and 270, and the intermediate member 280 is moved horizontally. A shaft 232 that vibrates (vibrates) in the direction H and a motor 234 that is a drive source of the shaft 232 are included.

  The pressure device 240 includes a first pressure unit 242 and a second pressure unit 244 located above. The first pressurizing unit 242 is a surface pressure adjusting means for adjusting the pressing surface pressure of the first bonded member 260 against the first contact surface 282, is connected to the first electrode 202, and moves forward and backward in the vertical direction L. It is possible. The second pressurizing unit 244 is a surface pressure adjusting means for adjusting the pressing surface pressure of the second member to be bonded 270 against the second contact surface 284, is connected to the second electrode 204, and advances and retreats in the vertical direction L. It is possible to move.

  Therefore, the control device 250 adjusts the pressing surface pressure of the first member to be bonded 260 against the first contact surface 282 and the pressing surface pressure of the second member to be bonded 270 against the second contact surface 284 by the pressure device 240. The first and second contact surfaces 282 and 284 of the intermediate member 280 are made to move relative to the first and second members to be joined 260 and 270 by vibrating the intermediate member 280 in the horizontal direction H by the sliding device 230. While sliding, the current supplied from the current supply device 210 flows from the first electrode 202 to the second electrode 204 via the first member to be joined 260, the intermediate member 280, and the second member to be joined 270. The first and second contact surfaces 282 and 284 can be joined to one surface of the intermediate member 280 by resistance heating.

  At this time, the first and second electrodes 202 and 204 for resistance heating are not in contact with the sliding first and second contact surfaces 282 and 284 and are relatively stationary. In addition, since the electrodes 202 and 204 are softened due to the temperature rise due to resistance heating due to sliding, the softened portions are welded to the electrodes 202 and 204 because they are electrically connected to the second bonded members 260 and 270. Is avoided, and the frequency of replacement of the electrodes 202 and 204 can be reduced.

  In the second embodiment, the area of the first contact surface 282 with respect to the first member to be bonded 260 is larger than the area of the second contact surface 284 with respect to the second member to be bonded 270. Therefore, it is preferable to control the pressing surface pressure of the first member to be bonded 260 to be smaller than the pressing surface pressure of the second member to be bonded 270. That is, even if the area of the first contact surface 282 and the second contact surface 284 are different, it is possible to heat uniformly by changing the surface pressure according to the difference and adjusting the contact resistance. In addition, when the area of the first contact surface 282 with respect to the first member to be bonded 260 is smaller than the area of the second contact surface 284 with respect to the second member to be bonded 270, the first member to be bonded 260 is pressed from the same viewpoint. It is preferable to control the surface pressure so as to be larger than the pressing surface pressure of the second member to be bonded 270.

  FIG. 8 is a schematic diagram for explaining the first modification according to the second embodiment.

  The joining apparatus 200A according to the first modification includes an interposition member 290 disposed on one surface of the intermediate member 280 facing the first and second joined members 260 and 270. The interposition member 290 is made of a conductive material having a melting point lower than that of the conductive materials constituting the first and second members to be joined 260 and 270, as in the second modification according to the first embodiment. Therefore, the first and second members to be joined 260 and 270 can be joined to the intermediate member 280 at a low temperature, and the degree of freedom in selecting a conductive material constituting the intermediate member 280 is great. The interposed member 290 is not limited to a separate form, and is configured from a coating layer that is integrated with the intermediate member 280, or is configured from a coating layer that is integrated with the first and second bonded members 260 and 270. Is possible.

  FIG. 9 is a schematic diagram for explaining a second modification according to the second embodiment.

  In the joining device 200B according to Modification 2, the intermediate member 280 is composed of three intermediate members (joined members) 280A to 280C made of a conductive material, and a third holding unit 226 and a second sliding device 230A are added. Has been. The intermediate member (first intermediate member) 280 </ b> A is opposed to the first and second members to be joined 260 and 270 and has first and second contact surfaces 282 and 284. The intermediate member (second intermediate member) 280B and the intermediate member 280C are disposed so as to be opposed to the surfaces of the intermediate member 280A that are opposite to the first and second contact surfaces 282, 284, and the intermediate member 280C is disposed outside. Facing (located at the bottom). The third holding unit 226 is a second holding unit that holds the intermediate member 280B relatively stationary with respect to the intermediate members 280A and 280C. The second sliding device 230A is used for generating frictional heat by sliding the intermediate member 280C with respect to the intermediate member 280B. The sliding device 230 also has a function of generating frictional heat by sliding the intermediate member 280A with respect to the intermediate member 280B.

  In this case, as in the third modification according to the first embodiment, the third holding portion 226 restricts the movement of the intermediate member 280B located in the center in the horizontal direction, while the second sliding device 230A positions the lower position. By oscillating (vibrating) the intermediate member 280C in the horizontal direction H, the first and second members to be joined 260 and 270 are joined to the intermediate member 280A located above and the middle member 280B located in the center. Can be joined to the intermediate member 280A and the intermediate member 280C. That is, in the modification 3, it is possible to join the workpieces W composed of five members to be joined. In addition, by omitting the intermediate member 280C and the second sliding device 230A, the present invention can be applied to the case where there are two intermediate members, or by adding a holding portion and a sliding device, more than three intermediate members can be provided. It is possible to apply even if it has.

  As described above, in the second embodiment, the first member to be joined and the second member to be joined are juxtaposed on one surface of the intermediate member. It is possible to easily form a structure in which the members to be joined are juxtaposed and joined.

  Further, when the area of the first contact surface is larger than the area of the second contact surface, the pressing surface pressure of the first bonded member against the first contact surface is greater than the pressing surface pressure of the second bonded member against the second contact surface. When the area of the first contact surface is smaller and smaller than the area of the second contact surface, the pressing surface pressure of the first bonded member against the first contact surface is greater than the pressing surface pressure of the second bonded member against the second contact surface. Enlarge. In this case, since the contact resistance is adjusted by changing the surface pressure according to the difference in area between the first and second contact surfaces, it is possible to heat uniformly.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims.

  For example, the first and second electrodes are not limited to the form that directly contacts the first and second members to be joined. Moreover, it is also possible to comprise the 1st and 2nd pressurization part of a pressurization apparatus, and the 1st and 2nd electrode so that advancing / retreating independently is possible.

100,100A-100D joining apparatus,
102, 102A first electrode,
104, 104A second electrode,
110 Current supply device (current supply means),
120 holding device (holding means),
122, 122A first holding part,
124, 124B second holding part,
126 third holding part (second holding means),
130 sliding device (sliding means),
130A second sliding device (sliding means),
132 shaft,
134 motor,
140 pressure device,
142, 142A first pressurizing part (surface pressure adjusting means),
144, 144B second pressurizing part (surface pressure adjusting means),
150 control device (control means),
160, 160A first member to be joined,
166 flange,
168 hemispherical part,
170, 170A second member to be joined,
176 flange,
178 hemispherical part,
180 intermediate member (third member to be joined),
180A intermediate member (first intermediate member),
180B intermediate member (third intermediate member),
180C intermediate member (second intermediate member),
182 first contact surface,
184 second contact surface,
190 interposition member,
192 first interposed member,
194 second interposed member,
200, 200A, 200B joining device,
202 first electrode,
204 second electrode,
210 current supply device (current supply means),
220 holding device (holding means),
222 first holding part,
224 second holding portion,
226 third holding portion (second holding means),
230 sliding device (sliding means),
230A second sliding device (sliding means),
232 shaft,
234 motor,
240 pressure device,
242 1st pressurizing part (surface pressure adjusting means),
244 2nd pressurizing part (surface pressure adjusting means),
250 control device (control means),
260 first member to be joined,
270 Second member to be joined,
280 Intermediate member (third member to be joined),
280A intermediate member (first intermediate member),
280B intermediate member (second intermediate member),
280C intermediate member,
282 first contact surface,
284 second contact surface,
290 interposition member,
H horizontal direction,
L vertical direction,
W Work.

Claims (19)

A bonding method for simultaneously bonding three or more members to be bonded made of a conductive material,
The first member to be joined to which the first electrode is electrically connected and the second member to be joined to which the second electrode is electrically connected to an intermediate member constituted by one or more members to be joined, Having a joining process for joining,
The intermediate member has a first contact surface that contacts the first member to be bonded, and a second contact surface that contacts the second member to be bonded,
In the joining step, while sliding the first and second contact surfaces with respect to the first and second members to be joined,
By applying a current from the first electrode to the second electrode via the first member to be joined, the intermediate member and the second member to be resistance-heated, the first and second A contact surface is joined to the first and second members to be joined.   The joining method according to claim 1, wherein the intermediate member is disposed between the first member to be joined and the second member to be joined.   The joining method according to claim 2, wherein areas of the first and second contact surfaces to be joined are substantially the same. When the area of the first contact surface is larger than the area of the second contact surface, an interposed member made of a conductive material having a melting point lower than that of the conductive material constituting the first member to be joined and / or the intermediate member, It arrange | positions between a 1st to-be-joined member and the said intermediate member,
When the area of the second contact surface is larger than the area of the first contact surface, an intermediate member made of a conductive material having a melting point lower than that of the conductive material constituting the second member to be joined and / or the intermediate member, It arrange | positions between a 2nd to-be-joined member and the said 3 to-be-joined member. The joining method of Claim 2 characterized by the above-mentioned. The intermediate member includes a first intermediate member that is opposed to the first member to be joined and has the first contact surface, and a second intermediate member that is opposed to the second member to be joined and has the second contact surface; And a third intermediate member disposed between the first intermediate member and the second intermediate member,
In the joining step, the first and second intermediate members and the third intermediate member are held by holding the third intermediate member relatively stationary with respect to the first and second intermediate members. It joins. The joining method of any one of Claims 2-4 characterized by the above-mentioned.   The joining method according to claim 1, wherein the first joined member and the second joined member are juxtaposed on one surface of the intermediate member. When the area of the first contact surface is larger than the area of the second contact surface, the pressing surface pressure of the first member to be bonded to the first contact surface is the pressure of the second member to be bonded to the second contact surface. Smaller than the pressing surface pressure,
When the area of the first contact surface is smaller than the area of the second contact surface, the pressing surface pressure of the first member to be bonded to the first contact surface is the pressure of the second member to be bonded to the second contact surface. The bonding method according to claim 6, wherein the bonding surface pressure is greater than the pressing surface pressure. The intermediate member includes a first intermediate member facing the first and second members to be joined and having the first and second contact surfaces, and a reverse of the first and second contact surfaces of the first intermediate member. A second intermediate member disposed relative to the surface located on the side,
In the joining step, the first intermediate member and the second intermediate member are joined by holding the second intermediate member relatively stationary with respect to the first intermediate member. The joining method according to claim 6 or 7. The sliding consists of vibrations,
The joining method according to claim 1, wherein the first and second contact surfaces have a uniform shape with respect to the vibration direction.   The joining method according to claim 1, wherein the intermediate member is made of a conductive material having a melting point lower than that of the conductive material constituting the first joined member and / or the second joined member. A first interposition member that is disposed between the first member to be joined and the intermediate member, and is made of a conductive material having a melting point lower than that of the first material to be joined and / or the intermediate member;
A second interposed member that is disposed between the second member to be joined and the intermediate member and is made of a conductive material having a melting point lower than that of the conductive material constituting the second member to be joined and / or the intermediate member;
The bonding method according to claim 1, further comprising:   The joining method according to claim 11, wherein the first interposed member and the second interposed member are formed of a coating layer integrated with the intermediate member. A joining apparatus for joining three or more members to be joined made of a conductive material at the same time,
Having a joining means for joining the first member to be joined and the second member to be joined to an intermediate member constituted by one or more members to be joined;
The intermediate member has a first contact surface that contacts the first member to be bonded, and a second contact surface that contacts the second member to be bonded,
The joining means includes
A first electrode electrically connected to the first member to be joined;
A second electrode electrically connected to the second member to be joined;
Current supply means for causing a current to flow from the first electrode to the second electrode via the first bonded member, the intermediate member, and the second bonded member;
Holding means for holding the first and second members to be joined relatively stationary with respect to the first and second contact surfaces;
Sliding means for sliding the first and second contact surfaces with respect to the first and second members to be joined;
The sliding means and the current supply means are controlled so that the current is supplied from the first electrode to the first electrode while sliding the first and second contact surfaces with respect to the first and second members to be joined. A control means for joining the first and second contact surfaces by flowing through the second electrode and resistance heating via the 1 to-be-joined member, the intermediate member and the second to-be-joined member;
A joining apparatus comprising: The intermediate member is disposed between the first member to be joined and the second member to be joined,
The holding means is
A first holding part for holding the first joined member;
A second holding portion that is located on the opposite side of the first holding means with respect to the intermediate member and holds the second joined member;
14. The joining apparatus for members to be joined according to claim 13, characterized in that The intermediate member includes a first intermediate member that is opposed to the first member to be joined and has the first contact surface, and a second intermediate member that is opposed to the second member to be joined and has the second contact surface; And a third intermediate member disposed between the first intermediate member and the second intermediate member,
The joining apparatus further includes second holding means for holding the third intermediate member in a stationary state relative to the first and second intermediate members,
When the first and second contact surfaces are joined, the first and second intermediate members are held in a relatively stationary state with respect to the first and second intermediate members. The intermediate member and the third intermediate member are bonded to each other. The apparatus for bonding a member to be bonded according to claim 14. The first member to be joined and the second member to be joined are juxtaposed on one surface of the intermediate member,
The holding means is
A first holding part for holding the first joined member;
A second holding part that is juxtaposed with the first holding part and holds the second joined member;
14. The joining apparatus for members to be joined according to claim 13, characterized in that A surface pressure adjusting means for adjusting the pressing surface pressure of the first bonded member against the first contact surface and the pressing surface pressure of the second bonded member against the second contact surface;
The surface pressure adjusting means is
When the area of the first contact surface is larger than the area of the second contact surface, the pressing surface pressure of the first member to be bonded is adjusted to be smaller than the pressing surface pressure of the second member to be bonded,
When the area of the first contact surface is smaller than the area of the second contact surface, the pressing surface pressure of the first member to be bonded is controlled to be larger than the pressing surface pressure of the second member to be bonded. The joining apparatus of the to-be-joined member of Claim 16 characterized by the above-mentioned. The intermediate member includes a first intermediate member facing the first and second members to be joined and having the first and second contact surfaces, and a reverse of the first and second contact surfaces of the first intermediate member. A second intermediate member disposed relative to the surface located on the side,
The joining apparatus further includes second holding means for holding the second intermediate member in a stationary state relative to the first intermediate member,
When the first and second contact surfaces are joined, the second intermediate member is held in a relatively stationary state with respect to the first intermediate member, whereby the first intermediate member and the second intermediate member are held. The joining device according to claim 16 or 17, wherein the intermediate member is joined. The sliding means comprises vibration means for vibrating the first and second contact surfaces with respect to the first and second members to be joined,
The joining device according to any one of claims 13 to 18, wherein the first and second contact surfaces have a uniform shape with respect to the direction of the vibration.

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