JP5853364B2 - Joining method and joining device - Google Patents

Description

The present invention is a bonding method using resistance heating and vibrating friction on Bonding equipment.

  Conventionally, resistance welding has been used as a method for joining conductive metal materials to each other. Resistance welding is performed by resistance heating caused by contact resistance of the joint surface by sandwiching the conductive metal materials in contact with each other and applying current from the electrodes with pressure applied between the electrodes. This is a method of melting and joining metal materials together. For example, Patent Document 1 describes a method in which a pair of conductive metal materials to be bonded are vibrated in contact with each other, the vibration is stopped after the surface insulating coating is peeled off, and fusion bonding is performed by resistance heating. Yes.

JP 11-138275 A

  However, in the method described in Patent Document 1, a pressure is applied to the conductive material and vibration is performed under a high surface pressure. Therefore, the shape of the conductive material is the transmission of the pressure from the pressurization site to the joint surface. And, the shape is limited to a shape that can satisfactorily transmit the excitation force via the joint surface. For example, when the conductive material has a shape such as a space portion or a cantilever portion, it is difficult to uniformly transmit the applied pressure and excitation force to the entire bonding surface, and a stable bonding strength is obtained. I can't. Accordingly, there is a problem that the shape of the conductive material to be joined is limited, and the room for selecting the product shape to which the conductive material is applied is narrowed.

The present invention has been made to solve the above-described problems, and relates to a joining technique for a joining member having conductivity, and can uniformly join the entire joining surface and obtain a stable joining strength. joining method of, and an object thereof is to provide a bonding equipment.

The joining method according to the present invention is a joining method for joining a pair of members to be joined having conductivity. In the joining method, the joining surfaces of the joined members to be joined are opposed to each other, and a current is passed from one of the pair of joined members to the other while relatively sliding the pair of joined members. It has the joining process which joins the said joint surfaces by resistance heating. And in the said joining process, it joins, supporting the inner wall surface of a space part with a reinforcement member by the reinforcement member inserted in the case of joining to the space part provided in at least one of a pair of said to-be-joined members .

  The joining method according to the present invention is a joining method for joining a pair of members to be joined having conductivity. In the joining method, the joining surfaces of the joined members to be joined are opposed to each other, and a current is passed from one of the pair of joined members to the other while relatively sliding the pair of joined members. It has the joining process which joins the said joint surfaces by resistance heating. And in the said joining process, it joins, supporting the cantilever part provided in at least one of a pair of said to-be-joined members with a reinforcement member.

  ADVANTAGE OF THE INVENTION According to this invention, it can join in the state which raised the rigidity of the to-be-joined member by supporting a part of to-be-joined member by a reinforcement member. For this reason, even when a space part and a cantilever part are provided in a member to be joined, a pressurizing force can be uniformly transmitted to the whole joining surface. And since it slides in the state which raised the rigidity of the to-be-joined member, it can prevent that a to-be-joined member generate | occur | produces, and can spread an excitation force to the whole to-be-joined member. As a result, the entire bonding surface can be uniformly bonded, and a stable bonding strength can be obtained.

It is the schematic for demonstrating an example of the joining apparatus which concerns on Embodiment 1. FIG. 3 is a flowchart for explaining a joining method according to the first embodiment. It is a figure for demonstrating the joining method which concerns on Embodiment 1, Comprising: FIG. 3 (A) is a top view which shows a pair of to-be-joined member arrange | positioned in the up-down direction from the upper side, FIG.3 (B) These are sectional views which follow the 3B-3B line of Drawing 3 (A). FIG. 4A is a diagram for explaining a joining method according to the first modification of the first embodiment, and FIG. 4A is a plan view showing a pair of members to be joined arranged in the vertical direction from above, and FIG. 4 (B) is a cross-sectional view taken along line 4B-4B in FIG. 4 (A). It is a figure for demonstrating the joining method which concerns on the modification 2 of Embodiment 1, Comprising: FIG. 5 (A) is a top view which shows a pair of to-be-joined member arrange | positioned in the up-down direction from the upper side, FIG. FIG. 5B is a cross-sectional view taken along line 5B-5B in FIG. FIG. 6A is a diagram for explaining a joining method according to a third modification of the first embodiment, and FIG. 6A is a plan view showing a pair of members to be joined arranged in the vertical direction from above, and FIG. 6 (B) is a cross-sectional view taken along line 6B-6B of FIG. 6 (A). FIG. 7A is a diagram for explaining a joining method according to the second embodiment, and FIG. 7A is a plan view showing a pair of members to be joined arranged in the vertical direction from above, and FIG. These are sectional views which follow the 7B-7B line of Drawing 7 (A). FIG. 8A is a diagram for explaining a joining method according to a first modification of the second embodiment, and FIG. 8A is a plan view showing a pair of members to be joined arranged in the vertical direction from above, and FIG. 8 (B) is a cross-sectional view taken along line 8B-8B in FIG. 8 (A). FIG. 9A is a diagram for explaining a joining method according to Embodiment 3, and FIG. 9A is a plan view showing a pair of members to be joined arranged in the vertical direction from above, FIG. 9B. These are sectional drawings which follow the 9B-9B line | wire of FIG. 9 (A). FIG. 10A is a diagram for explaining a joining method according to Embodiment 4, and FIG. 10A is a plan view showing a pair of members to be joined arranged in the vertical direction from the upper side, and FIG. FIG. 11 is a perspective view schematically showing a pair of members to be joined shown in FIG. It is a figure for demonstrating the joining method which concerns on Embodiment 5, Comprising: FIG. 11 (A) is a top view which shows a pair of to-be-joined member arrange | positioned in the up-down direction from the upper side, FIG.11 (B) These are sectional views which follow the 11B-11B line of Drawing 11 (A).

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. The dimensional ratios in the drawings are exaggerated for convenience of explanation, and may differ from actual ratios.

(Embodiment 1)
FIG. 1 is a schematic diagram for explaining an example of a joining apparatus applied to the joining method according to the first embodiment.

  The joining device 40 according to the first embodiment is a joining device for joining a pair of members to be joined 10 and 20 having conductivity. In summary, the joining device 40 includes a current supply device (current supply means) 50 that supplies a current to the pair of members to be joined 10 and 20, a holding device 60 that holds the pair of members to be joined 10 and 20, and a pair. A sliding device (sliding means) 70 that slides the bonded members 10 and 20 of the bonded members 10 and 20 so that the bonded surfaces 10a and 20a of the bonded members 10 and 20 are bonded to each other, and a pair of bonded members. A reinforcing member 100 that supports the inner wall surface 13 of the space 11 provided in one of the joining members 10 and 20, and a pressurizing device 80 that relatively presses the joining members 10 and 20 together. And a control device (control means) 90. The control device 90 controls the operations of the current supply device 50, the sliding device 70, and the pressurizing device 80, so that the members to be joined 10 and 20 using resistance heating and frictional heat (plastic flow) are controlled. Realize bonding. Details will be described below.

  As shown in FIG. 1, a workpiece to be joined is a member to be joined that is disposed between a member to be joined 10 located above, a member 20 to be joined located below, and the members 10 and 20 to be joined. An intermediate member 30 is included. The extending direction of the joint surfaces 10a and 20a is a horizontal direction H.

As shown in FIG. 3, the member to be bonded 10 has a space portion 11 formed in advance according to the product shape to which the members to be bonded 10 and 20 are applied. The space 11 is defined by the inner wall surface 13 and is provided between the joint surface 10 a and the pressure surface 10 b that is pressurized by the pressure device 80. In addition, illustration of the intermediate member 30 is abbreviate | omitted in FIG.
In the present embodiment, aluminum (Al) is applied to the members to be joined 10 and 20. As the aluminum, a rolled material (for example, A5052) or a cast material (for example, ADC12) can be used. The members to be joined 10 and 20 are not particularly limited as long as they are conductive materials, and iron (Fe) or magnesium (Mg) can also be applied. Moreover, it is also possible to apply to joining of the same material of Al—Al, and joining of different materials of Al—Fe or Al—Mg. Since an Al—Fe or Al—Mg dissimilar material joined body can be obtained, it can be easily applied as automotive parts such as a cylinder head.

  The reinforcing member 100 is configured by ribs 110 that are integrally formed with the member to be bonded 10 in advance. The reinforcing member 100 is provided in order to suppress a decrease in rigidity of the bonded member 10 due to the formation of the space portion 11. Both ends of the rib 110 in the thickness direction of the member to be joined 10 are arranged in contact with the inner wall surface 13 of the space 11. By disposing the ribs 110 in this way, a supporting force is applied to the inner wall surface 13 of the space portion 11 along the pressurizing direction (indicated by an arrow P in FIG. 3) in which the pressurizing device 80 pressurizes the member 10 to be joined. It is possible to act.

  The rib 110 has a shape extending in a sliding direction (indicated by an arrow H in the figure) in which the sliding device 70 slides on the members 10 and 20 to be joined. For this reason, in the plan view, the longitudinal direction of the rib 110 is arranged extending in a direction substantially parallel to the sliding direction. When the member to be bonded 10 is slid, the vibration force generated along the sliding direction can be satisfactorily transmitted to the entire member to be bonded 10 via the rib 110.

  The intermediate member 30 is made of a eutectic reaction material that undergoes a eutectic reaction with the bonded members 10 and 20. When the bonded members 10 and 20 are aluminum, eutectic reaction materials that form a low temperature eutectic with aluminum are zinc (Zn), silicon (Si), copper (Cu), tin (Sn), silver (Ag), Nickel (Ni) or the like can be applied.

  The eutectic reaction material forms a liquid phase and promotes interdiffusion between the members to be bonded 10 and 20 and between the eutectic reaction material and the members to be bonded 10 and 20, thereby ensuring good bonding strength. In addition, since the gap is filled with the liquid phase to be formed, it is easy to achieve good water-tightness even when joining large areas or curved surfaces. Therefore, it is particularly effective for a portion requiring high water tightness, a two-dimensional curved surface, or a large area portion. The thickness of the eutectic reaction material is, for example, 10 to 100 μm, but is not particularly limited thereto, and the thickness can be appropriately changed according to the site.

  The intermediate member 30 forms a liquid layer with a low melting point by a eutectic reaction, and plays a role of blocking oxygen and suppressing reoxidation. For this reason, it is possible to perform bonding in the atmosphere in a short time and with low heat input as compared to vacuum brazing and vacuum brazing which requires long-time work. The use of the intermediate member 30 is also preferable in terms of facilitating mass production.

  The intermediate member 30 can also be composed of a conductive material that forms a liquid phase other than the eutectic reaction material. In this case, the degree of freedom of selection of the intermediate member is large (the material selection range is wide), and a liquid phase is formed by the intermediate member 30, so that the members to be bonded 10, 20 and the intermediate member 30 and the member to be bonded 10 are formed. , 20 is promoted, and good bonding strength is ensured. And since a gap | interval is filled up with the liquid phase formed, it is easy to achieve favorable watertightness also in joining of a large area and a curved surface. Examples of the conductive material that forms a liquid phase other than the eutectic reaction material include inexpensive and general brazing materials and low-temperature solder as compared with the eutectic reaction material.

  The intermediate member 30 is not limited to the form which consists of another body, but can also be comprised from the coating layer integrated with one of the to-be-joined members 10 and 20. FIG. In this case, it is possible to arrange the intermediate member 30 locally. The coating can be formed by plating, cladding material, coating, or the like. Moreover, the intermediate member 30 does not necessarily need to be provided.

  The first and second electrodes 42 and 44 raise the temperature of the members to be bonded 10 and 20 and the intermediate member 30 (bonding surfaces 10a and 20a of the members 10 and 20 to which the intermediate member 30 is interposed) by resistance heating. It is a heating means for softening, and the first electrode 42 is electrically connected to the member to be bonded 10 positioned above, and the second electrode 44 is electrically connected to the member to be bonded 20 positioned below. The The 1st and 2nd electrodes 42 and 44 are not limited to the form which contacts the to-be-joined members 10 and 20 directly, For example, it is also possible to contact indirectly through the other member which has electroconductivity. Each of the first and second electrodes 42 and 44 may be composed of a plurality of electrodes.

  The current supply device 50 is current supply means for causing a direct current or an alternating current to flow from the first electrode 42 to the second electrode 44 via the bonded member 10, the intermediate member 30, and the bonded member 20. For example, the current value and the voltage value are configured to be adjustable.

  The holding device 60 has a movable holding part 62 positioned above and a fixed holding part 64 positioned below. The movable holding part 62 is used to hold the member 10 to be reciprocated in the horizontal direction H. The fixed holding portion 64 is used to restrict the movement of the member to be bonded 20 in the horizontal direction H and maintain the member to be bonded 20 in a stationary state relative to the member to be bonded 10.

  The sliding device 70 slides the member to be bonded 10 relative to the member to be bonded 20, and generates frictional heat (plasticity) on the bonding surfaces 10a and 20a of the members to be bonded 10 and 20 on which the intermediate member 30 is interposed. (Vibrating) used to generate a flow). The vibration means vibrates (vibrates) the member to be bonded 10 held by the movable holding portion 62 in a horizontal direction H parallel to the extending direction of the bonding surfaces 10a and 20a. And a motor 74 as a driving source. The vibration means can arbitrarily control the vibration frequency, the vibration amplitude, the vibration force, and the like. For example, the excitation amplitude is adjustable in the range of 100 to 1000 μm, and the excitation frequency is adjustable in the range of 10 to 100 Hz. The vibration mechanism is not particularly limited, and for example, ultrasonic vibration, electromagnetic vibration, hydraulic vibration, and cam vibration can be applied.

  Since the excitation direction is a reciprocating motion in one direction along the extending direction of the joint surfaces 10a and 20a, the degree of freedom of the shape of the joint surfaces 10a and 20a is improved. That is, since vibration can be applied as long as it can be displaced in only one direction, the shape of the joint surfaces 10a and 20a does not need to be a flat surface. For example, the convex portion may be fitted in a groove extending in one direction. Is possible.

  Further, the sliding device 70 is not limited to a form using vibration (vibration mechanism), and it is also possible to appropriately apply a rotational motion or a revolving motion that swings around in a circular orbit without rotating. . In the revolving motion, unlike the vibration, the relative motion between the joint surfaces 10a and 20a does not stop. Therefore, only the dynamic friction coefficient acts to stabilize the friction coefficient, and the joint surfaces 10a and 20a are evenly worn. It is possible to make it.

  The pressurizing device 80 includes a pressurizing unit 82 positioned above and a support structure 84 positioned below. The pressurizing part 82 is connected to the first electrode 42 and can be moved back and forth in the vertical direction (direction orthogonal to the joint surfaces 10a and 20a) L. The pressurizing unit 82 can apply pressure to the member to be bonded 10 via the first electrode 42, and is a surface pressure adjusting means for adjusting the pressing surface pressure of the member to be bonded 10 against the member to be bonded 20. The pressurizing unit 82 includes, for example, a hydraulic cylinder, and is configured to be able to adjust the applied pressure. The applied pressure is, for example, 2 to 10 MPa. The support structure 84 is used to support the second electrode 44 to which the pressurizing force of the pressurizing device 80 is transmitted via the member to be bonded 10, the intermediate member 30, and the member to be bonded 20.

  It is also possible to apply a form in which the pressure applied by the pressurizing unit 82 is directly applied to the bonded member 10 without using the first electrode 42. It is also possible to dispose the pressurizing unit 82 and the support structure 84 in reverse. In this case, the second electrode 44 is pressed by the pressurizing portion 82 disposed below, and the first electrode 42 is supported by the support structure 84 disposed above. In addition, the degree of freedom in adjusting the surface pressure can be improved by providing the second pressure unit instead of the support structure 84.

  The control device 90 is a control means including a computer having a calculation unit, a storage unit, an input unit, and an output unit, and is used for comprehensively controlling the pressurizing device 80, the sliding device 70, and the current supply device 50. Is done. Each function of the control device 90 is exhibited when the arithmetic unit executes a program stored in the storage device.

  The program, for example, in a state where the pressurizing force of the pressurizing device 80 is adjusted, causes the member to be joined 10 to vibrate in the horizontal direction H by the sliding device 70, whereby the member to be joined 10 in which the intermediate member 30 is interposed, The current supplied from the current supply device 50 is slid from the first electrode 42 through the joined member 10, the intermediate member 30, and the joined member 20 while sliding the 20 joining surfaces 10 a and 20 a. This is to cause the controller 90 to execute a procedure for joining the members to be joined 10 and 20 with the intermediate member 30 interposed by flowing to the electrode 44 and resistance heating.

  Next, the joining method according to the first embodiment will be described based on the flowchart shown in FIG. 2 and FIG.

  In summary, the joining method is such that the joining surfaces 10a and 20a of the members to be joined 10 and 20 are opposed to each other and the first and second electrodes 42 and 44 are moved while the members to be joined 10 and 20 are relatively slid. There is a joining step S12 for joining the joining surfaces 10a and 20a by causing a current to flow from the joined member 10 to the joined member 20 through resistance heating. And in joining process S12, it joins, making the inner wall surface 13 of the space part 11 provided in the to-be-joined member 10 supported by the rib 110. FIG. Further, after the joining step S12, a step S14 for removing the rib 110 from the joined member 10 is performed.

  First, the intermediate member 30 is sandwiched between the members 10 and 20 to be bonded together, and the members 10 and 20 are held between the first and second electrodes 42 and 44. The member to be bonded 20 is fixed to the fixed holding portion 64, and the member to be bonded 10 is held by the movable holding portion 62 so as to vibrate.

  Subsequently, the members to be joined 10 and 20 are pressurized with a pressurizing force set in advance by the pressurizing device 80. The pressure applied by the pressurizing device 80 is adjusted by the control device 90 and is preferably about 2 to 10 MPa, for example, but is not limited thereto.

  Next, the sliding device 70 is driven by the control device 90, and the member to be joined 10 is slid in the direction along the joining surfaces 10a and 20a (preliminary sliding step (preliminary vibration step) S11). Although the excitation frequency and the excitation amplitude are not particularly limited, as an example, the excitation amplitude is preferably about 100 to 1000 μm, and the excitation frequency is preferably about 10 to 100 Hz.

  When the pre-sliding step S11 that slides while applying pressure as described above is performed, the joint surfaces 10a and 20a slide, frictional heat is generated, the material is softened, and the joint surfaces 10a and 20a are worn. It plastically flows and the surface pressure between the joint surfaces 10a and 20a is made uniform to some extent. Further, the preliminary sliding step S11 has the effect of reducing the variation in contact resistance due to the difference in the film thickness by removing the oxide film on the surface of the aluminum, and suppressing the variation in the amount of heat generated when resistance heating is performed in the subsequent step. Demonstrate. Therefore, before bonding, the surface of the members to be bonded 10 and 20 made of aluminum is degreased, and further, a treatment such as brushing with a wire brush to remove the oxide film on the surface becomes unnecessary, and workability is improved.

  After the preliminary sliding step S11, a joining step S12 is performed. In the joining step S <b> 12, current is supplied to the first and second electrodes 42 and 44 by the current supply device 50 while maintaining sliding by the sliding device 70. Since the contact resistance values at the joint surfaces 10a and 20a are relatively low at the high surface pressure portion, the current concentrates on the high surface pressure portions of the joint surfaces 10a and 20a. Therefore, resistance heating is greatly applied and heated in the high surface pressure portions of the bonding surfaces 10a and 20a, and the oxide film on the bonding surfaces 10a and 20a is forcibly separated and the high surface pressure portion heated by the resistance heating. Further, pressurization and vibration are also applied to cause wear, plastic flow and material diffusion, thereby causing a reduction in the surface pressure of the high surface pressure portion. As a result, the current concentration changes from moment to moment, the current flow is dispersed, the joining surfaces 10a and 20a are heated uniformly, and the entire joining surfaces 10a and 20a can be joined uniformly. Further, since the bonding is performed by using both the vibration and the resistance heating by the current, the current concentrated portion can be changed and uniform heating can be performed without applying a high pressure to the bonding surfaces 10a and 20a. Even when 20a has a large area or a complicated shape, it can be bonded and uniform surface bonding is possible. In addition, since only the surface layers of the joining surfaces 10a and 20a are melted and joined, the heating time can be shortened, and even in a cast product containing gas in the material, the gas in the material expands due to heating. Therefore, it is difficult to eject and good bonding can be realized.

  In addition, in joining process S12, the intermediate member 30 is made into a liquid phase with a low melting point by eutectic reaction, and promotes the mutual diffusion to the to-be-joined members 10 and 20 or the to-be-joined members 10 and 20 of the intermediate member 30. Further, since the intermediate member 30 plays a role of blocking oxygen and suppressing re-oxidation of the joint surfaces 10a and 20a, it can be joined in the atmosphere for a short time with low heat input, and mass production is facilitated. .

  In the bonding step S <b> 12, the rib 110 arranged in the space portion 11 of the member to be bonded 10 supports the inner wall surface 13 of the space portion 11, thereby reducing the rigidity of the member to be bonded 10 due to the formation of the space portion 11. compensate. For this reason, it becomes possible to transmit the applied pressure given to the pressurization surface 10b of the to-be-joined member 10 to the joining surface 10a satisfactorily. Further, it is possible to prevent the member to be bonded 10 from being bent, and to distribute the excitation force to the entire member to be bonded 10.

  When the joining step S12 is finished, the sliding device 70 is stopped, but in order to join the members 10 and 20 to be joined at a desired relative position, the members to be joined 10 and 20 are finally joined by the sliding device 70. Is positioned at a desired position. At this time, if the pressure applied by the pressurizing device 80 is large, the positioning accuracy is lowered. Therefore, the pressure applied by the pressurizing device 80 may be decreased before the sliding device 70 is stopped. Thereby, it becomes possible to stop the sliding device 70 in a state where the members to be joined 10 and 20 are in a desirable relative position. In addition, you may provide the other structure for positioning the to-be-joined member 10 and 20 separately.

  A cooling step S13 is performed after the joining step S12. In the cooling step S <b> 13, the control device 90 stops the sliding device 70 and the current supply device 50 and increases the pressure applied by the pressurizing device 80. Then, when the preset time has elapsed, it is determined that the cooling has ended, and the pressurization by the pressurizing device 80 is ended. Alternatively, after a signal input to the control device 90 from a thermometer (not shown) that measures the temperatures of the members to be joined 10 and 20 is equal to or less than a predetermined value, it is determined that the cooling is finished, and the pressurizing device 80 Pressurization can also be terminated. Thereafter, the first and second electrodes 42 and 44 are retracted, and the joined members 10 and 20 joined are removed from the apparatus. Thereby, joining of the to-be-joined members 10 and 20 is completed.

  After removing the members to be joined 10 and 20 from the joining apparatus 10, the step S14 of removing the rib 110 from the members to be joined 10 is performed. As a method for removing the rib 110, for example, a conventionally known metal processing method such as polishing or cutting is used. By removing the ribs 110, it is possible to obtain a conductive member having a predetermined shape corresponding to the design shape of the product.

  Note that the preliminary sliding step S11 is not necessarily provided. Further, instead of sliding by the sliding device 70 instead of the preliminary sliding step S11 or before the preliminary sliding step S11, current is supplied to the first and second electrodes 42, 44 by the current supply device 50. Thus, the joint surfaces 10a and 20a may be softened by resistance heating.

  Further, in the joining step S12, after the temperature of the members to be joined 10 and 20 is increased by resistance heating for a predetermined time, the amount of heat generated by resistance heating may be decreased, and the amount of heat generated by sliding may be further increased. A method for reducing the amount of heat generated by resistance heating and further increasing the amount of heat generated by sliding can be realized by simply increasing the pressure applied by the pressurizing device 80. When the pressurizing force by the pressurizing device 80 is increased, the contact pressure at the joining surfaces 10a and 20a is increased, so that the contact resistance is reduced and the amount of heat generated by the resistance heating is reduced. Furthermore, when the surface pressure at the joint surfaces 10a and 20a increases, the frictional force at the joint surfaces 10a and 20a increases, and the amount of heat generated by sliding increases. Thus, by reducing the amount of heat generated by resistance heating and increasing the amount of heat generated by sliding, the softened material is agitated by sliding from the process of increasing the temperature by contact resistance and promoting softening. Thus, the process moves to the process of promoting integration. Note that the method of reducing the amount of heat generated by resistance heating and increasing the amount of heat generated by sliding is not necessarily limited to the method of increasing the pressurizing force of the pressurizing device 80. For example, the current supply device 50 or the sliding device. 70 can be realized, or the pressurizing device 80 can be combined with another device.

  In addition, before the preliminary sliding step S11, pretreatment such as degreasing or removing the aluminum oxide film by brushing with a wire brush can be performed. Further, the cooling step S13 is not necessarily provided.

  At the bonding interface of the members to be bonded 10 and 20 bonded by the above-described bonding method, the diffusion bonding surface bonded by the diffusion of the material of the members to be bonded 10 and 20 and the material of the members to be bonded 10 and 20 are plastic. A plastic fluid joining surface joined by flowing and an intermediate layer interposing joint surface joined via the intermediate member 30 are mixedly formed.

  Further, in the joining step S <b> 12, the inner wall surface 13 of the space portion 11 of the member to be joined 10 is supported by the rib 110, so that the joining of the member to be joined 10 can be performed with increased rigidity. For this reason, even when the space part 11 is provided in the member to be bonded 10, the applied pressure applied to the pressure surface 10b of the member to be bonded 10 can be satisfactorily transmitted to the bonding surface 10a. The surface pressure can be made uniform. And since it slides in the state which raised the rigidity of the to-be-joined member 10, it can prevent that the to-be-joined member 10 produces a deflection | deviation, and can distribute the exciting force to the to-be-joined member 10 whole. As a result, the entire joining surfaces 10a and 20a can be joined uniformly, and a stable joining strength can be obtained.

  In addition, since the reinforcing member is configured by the rib 110 formed integrally with the member to be bonded 10 in advance, there is no need to perform the work of installing the reinforcing member in the space portion 11 before performing the bonding process. An increase in work man-hours associated with the installation of members can be suppressed. By performing the step of removing the ribs 110, it is possible to prevent an increase in the weight of the member to be joined 10 and an increase in size due to the installation of the ribs 110.

  Further, since the rib 110 is formed in a shape extending in the sliding direction in which the members to be bonded 10 and 20 are slid, the vibration generated along the sliding direction when the member 10 is slid. The force can be satisfactorily transmitted to the entire bonded member 10 through the rib 110.

  Next, modified examples 1 to 3 according to the first embodiment will be sequentially described.

  FIG. 4 shows a plan view and a cross-sectional view of a member to be joined for explaining a first modification according to the first embodiment.

  In the first modification, the space portion 11 of the member to be bonded 10 has an opening 14 that is continuous with the inside of the space portion 11 and the outside of the member to be bonded 10. The reinforcing member 100 is disposed such that both end portions in the thickness direction of the bonded member 10 are in contact with the inner wall surface 13 of the space portion 11.

  In the present modification, the electric resistance value of the current path formed by the reinforcing member 100 is smaller than the electric resistance value of the current path formed around the space portion 11 by the bonded member 10. . In the illustrated example, the cross-sectional area of the reinforcing member 100 made of the same material as the main body of the member to be bonded 10 is the part having the smallest cross-sectional area among the parts where the current path is formed in the member to be bonded 10. By making it larger than the cross-sectional area of 15, the electric resistance value of the reinforcing member 100 is made relatively small. When the amount of heat generated from the member to be bonded 10 increases, it becomes difficult to adjust the heating amount by resistance heating and the heating amount by frictional heat, and it becomes difficult to uniformly bond the entire bonding surfaces 10a and 20a. Moreover, there is a possibility that softening of the bonded member 10 due to resistance heating becomes excessive. Therefore, the electric resistance value of the current path formed by the reinforcing member 100 is reduced, and the current flowing through the member to be bonded 10 is mainly passed through the reinforcing member 100 and flows to the member to be bonded 20 side. Thereby, it is prevented that an electric current flows excessively in the to-be-joined member 10, and the heat_generation | fever from the to-be-joined member 10 is suppressed.

  Even in the joining of the member to be joined 10 having the cross-sectional space portion 11 as shown in the present modification, the joining is performed in a state where the rigidity of the member to be joined 10 is increased by the reinforcing member 100 installed in the space portion 11. It becomes possible. For this reason, even when the space portion 11 is provided in the member to be bonded 10, the surface pressure of the bonding surface 10a can be made uniform, and a stable bonding strength can be obtained.

  Further, since the electrical resistance value of the current path formed by the reinforcing member 100 is smaller than the electrical resistance value of the current path formed by the member to be bonded 10 around the space portion 11, It is possible to prevent the current from flowing excessively, and to suppress the heat generation from the bonded member 10.

  FIG. 5 shows a plan view and a cross-sectional view of a member to be joined for explaining a second modification according to the first embodiment.

  In the second modification, the space portion 11 of the member to be joined 10 has one closed internal space that is defined by the inner wall surface 13 of the space portion 11. The reinforcing member 100 is disposed so as to fill the internal space of the space portion 11. Each part of the outer surface of the reinforcing member 100 is in contact with the inner wall surface 13 of the space 11. Since the contact area between the inner wall surface 13 of the space portion 11 and the reinforcing member 100 is increased, it is possible to perform the bonding with the rigidity of the member to be bonded 10 further increased. Therefore, it is possible to improve the uniformity of the surface pressure of the bonding surface 10a and to obtain more stable bonding strength.

  FIG. 6 shows a plan view and a cross-sectional view of a member to be joined for explaining the third modification according to the first embodiment.

  In Modification 3, the member to be bonded 10 employs the member to be bonded having the structure shown in Modification 1 described above. On the other hand, the reinforcing member 100 is disposed in contact with the vertical wall 16 of the inner wall surface 13 so that the contact area with the inner wall surface 13 of the space portion 11 is larger than that of the reinforcing member 100 shown in Modification 1. ing. Similar to the modified example 2, in such a case, the contact area between the inner wall surface 13 of the space portion 11 and the reinforcing member 100 can be increased, so that the rigidity of the member to be bonded 10 is further increased. It becomes possible to do.

(Embodiment 2)
FIG. 7 shows a plan view and a cross-sectional view of a member to be joined for explaining the joining method according to the second embodiment. In addition, about the member which has the same function as Embodiment 1, the same code | symbol is attached | subjected and the description is partially abbreviate | omitted.

  In the second embodiment, the reinforcing member 100 is formed of a conductive member that is provided separately from the member to be joined 10 and is separable from the space portion 11. In this respect, the second embodiment is different from the first embodiment in which the rib 110 formed integrally with the member to be bonded 10 in advance is used as the reinforcing member.

  The reinforcing member 100 can be made of a known metal material such as iron, copper, or stainless steel, for example. However, in order to prevent the bonded member 10 and the reinforcing member 100 from being fused when a current is passed through the bonded member 10, it is desirable to select a material having a higher melting point than the bonded member 10. . Therefore, when aluminum is used for the member 10 to be joined, it is desirable that the reinforcing member 100 be made of, for example, iron or copper.

  An arm 120 is attached to the reinforcing member 100 so that the reinforcing member 100 can be installed on the bonded member 10 and the reinforcing member 100 can be easily detached from the bonded member 10. The material of the arm 120 is not particularly limited. For example, the arm 120 can be made of the same material as that of the reinforcing member 100.

  The reinforcing member 100 is electrically connected to a current supply device 50 that supplies a current to the bonded member 10. Thereby, the reinforcing member 100 is caused to function as the first electrode 42 for flowing current to the members 10 and 20 to be joined. In addition, the application of the pressing force to the member to be bonded 10 is directly performed using the pressurizing unit 82 without using the first electrode 42.

  In Embodiment 2, since the reinforcing member 100 is provided separately from the member to be joined 10 and can be separated, the reinforcing member 100 can be set while positioning relatively freely in the joining process. Accordingly, the reinforcing member 100 can be installed for each member to be joined 10 to be joined corresponding to a portion where the rigidity needs to be increased, and the surface pressure of the joining surface 10a is more effectively equalized. be able to. Furthermore, even when different members to be joined are joined, the reinforcing member 100 can be shared, so that an increase in cost associated with the use of the reinforcing member 100 can be suppressed. In addition, since a conductive member is used for the reinforcing member 100, a current path can be formed in the space portion 11. Since the current flowing through the member to be bonded 10 can be branched and flowed, it is possible to prevent the current from concentrating on the member 10 to be bonded and to prevent heat generation of the member 10 to be bonded.

  In addition, since the reinforcing member 100 is electrically connected to the current supply device 50 to function as the first electrode 42, the joining device is compared with the case where the reinforcing member 100 and the first electrode 42 are provided separately. 40 can be reduced in size and configured.

  Next, a modification according to the second embodiment will be described.

  FIG. 8 shows a plan view and a cross-sectional view of a member to be joined for explaining a modification according to the second embodiment.

  As shown in the present modification, the member 10 to be bonded may not be used as the first electrode, and a dedicated first electrode 42 for supplying a current to the member to be bonded 10 may be separately provided.

(Embodiment 3)
FIG. 9 shows a plan view and a cross-sectional view of a member to be joined for explaining the joining method according to the third embodiment. Note that members having the same functions as those in the first and second embodiments are denoted by the same reference numerals, and description thereof is partially omitted.

  In the third embodiment, the reinforcing member 100 is configured by an insulating member that is provided separately from the bonded member 10 and is separable from the space portion 11. The reinforcing member 100 can be made of, for example, a hard resin material.

  According to this embodiment, since the reinforcing member 100 does not form a current path, the current flows through the bonded member 10 main body. In the case where the member to be bonded 10 and the reinforcing member 100 are provided separately, it is possible to prevent current from flowing through the contact portion between the member to be bonded 10 and the reinforcing member 100, thereby preventing the contact portion from excessively generating heat. It becomes possible to do.

(Embodiment 4)
FIG. 10 shows a plan view and a schematic perspective view of members to be joined for explaining the joining method according to the fourth embodiment. Members having the same functions as those of the first to third embodiments are denoted by the same reference numerals, and the description thereof is partially omitted.

  In the fourth embodiment, the space portion 11 of the member to be bonded 10 has an opening 14 that faces the bonding surface 20 a of the member to be bonded 20. The reinforcing member 100 is disposed such that one end in the thickness direction of the member to be bonded 10 is brought into contact with the inner wall surface 13 of the space 11 and the other end is brought into contact with the bonding surface 20 a of the member to be bonded 20. As shown in the drawing, when the thickness of the vertical wall 16 of the member to be bonded 10 is formed to be relatively thin, it is difficult to spread the excitation force over the entire member 10 to be bonded. By arranging the reinforcing member 100 adjacent to the vertical wall 16, it is possible to transmit the excitation force satisfactorily. Therefore, even in the joining of the member to be joined 10 having the space portion 11 as shown in the figure, the surface pressure of the joining surface 10a can be made uniform, and a stable joining strength can be obtained.

  In the present embodiment, the reinforcing member 100 can be configured by a rib formed integrally with the member to be bonded 10, or a conductive member or an insulating member provided separately from the member to be bonded 10. It is also possible to configure by. When the reinforcing member 100 is configured by a rib or a conductive member, the electrical resistance value of the member to be bonded 10 can be adjusted by the rib or the conductive member that is in contact with the vertical wall 16 of the member to be bonded 10. It becomes possible. For example, by increasing the total cross-sectional area of the cross-sectional area of the conductive member or rib as the reinforcing member 100 and the cross-sectional area of the vertical wall 16 of the member 10 to be joined, the electric current of the current path formed in the vicinity of the vertical wall 16 is increased. The resistance value can be set smaller.

(Embodiment 5)
FIG. 11 shows a plan view and a schematic perspective view of members to be joined for explaining the joining method according to the fifth embodiment. Members having the same functions as those in the first to fourth embodiments are denoted by the same reference numerals, and a part of the description is omitted.

  As shown in FIG. 11, the member to be joined 10 has a substantially L-shaped cross section. The member 10 to be joined is disposed in a cantilever state by bringing one end of the L shape into contact with the member 20 to be joined. The part which forms the pressurization surface 10b among the to-be-joined members 10 comprises the cantilever part 17. FIG.

  The reinforcing member 100 is configured by ribs 110 that are integrally formed with the member to be bonded 10 in advance. By supporting the cantilever 17 of the member to be bonded 10 by the rib 110, the rigidity of the member to be bonded 10 is improved. One end of the rib 110 in the thickness direction of the member to be joined 10 is disposed in contact with the cantilever 17, and the other end is disposed in contact with the vertical wall 16. By disposing the ribs 110 in this way, it is possible to apply a supporting force to the cantilever portion 17 in the pressing direction in which the pressing device 80 presses the member to be bonded 10. The rib 110 is removed from the member to be bonded 10 after performing the bonding process.

  In the present embodiment, in the joining step, the cantilever portion 17 of the member to be joined 10 is supported by the rib 110, so that the joining of the member to be joined 10 can be performed with increased rigidity. For this reason, even when the to-be-joined member 10 is provided with the cantilever part 17, the applied pressure applied to the pressing surface 10b of the to-be-joined member 10 can be transmitted favorably to the joining surface 10a. The surface pressure of 10a can be made uniform. And since it slides in the state which raised the rigidity of the to-be-joined member 10, it can prevent that the to-be-joined member 10 produces a deflection | deviation, and can distribute the exciting force to the to-be-joined member 10 whole. As a result, the entire joining surfaces 10a and 20a can be joined uniformly, and a stable joining strength can be obtained.

  In the present embodiment, the reinforcing member may be constituted by a conductive member or an insulating member provided separately from the member to be joined, instead of the rib 110 formed integrally with the member to be joined. . Further, it is possible to function as the first electrode by electrically connecting the reinforcing member to the current supply device. Furthermore, it is possible to suppress heat generation from the member to be joined by forming the electric resistance value of the current path formed by the reinforcing member to be smaller than the electric resistance value of the current path formed by the member to be joined. . In addition, the reinforcing member is formed in a shape extending in the sliding direction for sliding the member to be joined, thereby reinforcing the excitation force generated along the sliding direction when sliding the member to be joined. It is also possible to exert the effect of favorably transmitting to the entire bonded member through the member.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims.

  For example, in each embodiment, the intermediate member can be omitted as appropriate.

  The shape, the number, and the like of the reinforcing member 100 are not particularly limited to those shown in the embodiment, and the function of increasing the rigidity of the bonded member 10 by supporting the inner wall surface 13 or the cantilever portion 17 of the space portion 11. As long as it can be exhibited, it can be changed as appropriate. Moreover, the shape of the space part 11 or the cantilever part 17 is not particularly limited, and can be appropriately changed according to the shape of the product in which the member to be bonded 10 is used. For example, it is possible to employ a space portion 11 having a slit shape or a rectangular cross section. Moreover, in each embodiment, although it demonstrated in the form by which the space part 11 or the cantilever part 17 was provided only in the one to-be-joined member 10 used as joining object, for example, both of them used as joining object The joining method of the present invention can also be applied to joining in which a member to be joined is provided with a space or a cantilever. Moreover, it is also possible to join the members to be joined by using a reinforcing member made of ribs together with a reinforcing member made of a conductive material and a reinforcing member made of an insulating member.

10, 20 member to be joined,
10a, 20a joint surface,
10b pressure surface,
11 Space,
13 Inner wall surface,
14 opening,
17 Cantilever,
30 intermediate member,
40 joining device,
42 first electrode,
44 second electrode,
50 Current supply device (current supply means),
60 holding device,
70 Sliding device (sliding means),
80 pressure device,
82 pressurizing part,
84 support structure,
90 control device (control means),
100 reinforcing members,
110 Ribs (reinforcing members).

Claims (16)

A joining method for joining a pair of members to be joined having conductivity,
By facing the bonding surfaces of the members to be bonded to each other and sliding the pair of the members to be bonded relatively, current is passed from one of the pair of the members to be bonded to the other to perform resistance heating. , Having a bonding step of bonding the bonding surfaces,
A joining method in which, in the joining step, joining is performed while supporting an inner wall surface of the space portion by a reinforcing member inserted in joining to a space portion provided in at least one of the pair of members to be joined. The reinforcing member has a rib formed integrally with the member to be joined in advance,
The joining method according to claim 1, further comprising a step of removing the rib from the member to be joined after the joining step.   The joining method according to claim 1, wherein the reinforcing member includes a conductive member that is provided separately from the member to be joined and is separable from the space portion.   The electrical resistance value of the electric current path which the said reinforcement member forms is smaller than the electric resistance value of the electric current path which the said to-be-joined member forms around the said space part, The joining of any one of Claims 1-3 Method.   5. The method according to claim 1, wherein the reinforcing member constitutes an electrode by electrically connecting the current supplying means for supplying current to the member to be joined and the reinforcing member. 6. Joining method.   The joining method according to claim 1, wherein the reinforcing member includes an insulating member that is provided separately from the member to be joined and is separable from the space portion.   The joining method according to claim 1, wherein the reinforcing member is formed to extend in a sliding direction in which the member to be joined is slid. A joining method for joining a pair of members to be joined having conductivity,
By facing the bonding surfaces of the members to be bonded to each other and sliding the pair of the members to be bonded relatively, current is passed from one of the pair of the members to be bonded to the other to perform resistance heating. , Having a bonding step of bonding the bonding surfaces,
The joining method, wherein in the joining step, joining is performed while a cantilever provided in at least one of the pair of members to be joined is supported by a reinforcing member. A joining device for joining a pair of members to be joined having conductivity,
Current supply means for supplying current to the pair of members to be joined;
Sliding means for relatively sliding the pair of members to be joined with the joining surfaces of the members to be joined facing each other;
A reinforcing member that is inserted into the space portion provided in at least one of the pair of members to be joined at the time of joining and supports the inner wall surface of the space portion;
Control for controlling the current supply means and the sliding means so as to perform resistance heating between the opposing joining surfaces by supplying current to the electrodes while relatively sliding the pair of members to be joined. Means for joining.   The joining apparatus according to claim 9, wherein the reinforcing member has a rib formed integrally with the joined member in advance.   The joining device according to claim 9 or 10, wherein the reinforcing member includes a conductive member that is provided separately from the member to be joined and is separable from the space portion.   The electrical resistance value of the current path formed by the reinforcing member is smaller than the electrical resistance value of the current path formed by the bonded member around the space. The joining apparatus as described in.   The joining apparatus according to claim 9, wherein the current supply unit and the reinforcing member are electrically connected, and the reinforcing member constitutes an electrode.   The joining device according to claim 9, wherein the reinforcing member includes an insulating member that is provided separately from the member to be joined and is separable from the space portion.   The joining device according to claim 9, wherein the reinforcing member has a shape extending in a sliding direction in which the member to be joined is slid. A joining device for joining a pair of members to be joined having conductivity,
Current supply means for supplying current to the pair of members to be joined;
Sliding means for relatively sliding the pair of members to be joined with the joining surfaces of the members to be joined facing each other;
A reinforcing member that supports a cantilever provided in at least one of the pair of members to be joined;
Control for controlling the current supply means and the sliding means so as to perform resistance heating between the opposing joining surfaces by supplying current to the electrodes while relatively sliding the pair of members to be joined. Means for joining.

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