JP6180736B2 - ワイヤーボンディング用の超音波トランスデューサ、ならびに超音波トランスデューサを使ってワイヤーボンドを形成する方法 - Google Patents

ワイヤーボンディング用の超音波トランスデューサ、ならびに超音波トランスデューサを使ってワイヤーボンドを形成する方法 Download PDF

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JP6180736B2
JP6180736B2 JP2012524781A JP2012524781A JP6180736B2 JP 6180736 B2 JP6180736 B2 JP 6180736B2 JP 2012524781 A JP2012524781 A JP 2012524781A JP 2012524781 A JP2012524781 A JP 2012524781A JP 6180736 B2 JP6180736 B2 JP 6180736B2
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frequency
transducer
driver
electrical energy
scrub
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JP2013506271A (ja
JP2013506271A5 (https=
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デアンジェリス、ドミニク、エー．
シュルツェ、ゲリー、ダブリュー．
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クリック アンド ソッファ インダストリーズ、インク．
クリック アンド ソッファ インダストリーズ、インク．
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
JP2012524781A 2009-08-12 2010-08-10 ワイヤーボンディング用の超音波トランスデューサ、ならびに超音波トランスデューサを使ってワイヤーボンドを形成する方法 Active JP6180736B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23323709P 2009-08-12 2009-08-12
US61/233,237 2009-08-12
PCT/US2010/044976 WO2011019692A2 (en) 2009-08-12 2010-08-10 Ultrasonic transducers for wire bonding and methods for forming wire bonds using ultrasonic transducers

Publications (3)

Publication Number Publication Date
JP2013506271A JP2013506271A (ja) 2013-02-21
JP2013506271A5 JP2013506271A5 (https=) 2013-09-26
JP6180736B2 true JP6180736B2 (ja) 2017-08-23

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JP2012524781A Active JP6180736B2 (ja) 2009-08-12 2010-08-10 ワイヤーボンディング用の超音波トランスデューサ、ならびに超音波トランスデューサを使ってワイヤーボンドを形成する方法

Country Status (6)

Country Link
US (2) US8251275B2 (https=)
JP (1) JP6180736B2 (https=)
CN (2) CN104465422B (https=)
SG (2) SG10201404843RA (https=)
TW (1) TWI531434B (https=)
WO (1) WO2011019692A2 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180068715A (ko) 2016-12-14 2018-06-22 주식회사 엘지화학 가공성 및 내환경 응력 균열성이 우수한 에틸렌/알파-올레핀 공중합체
KR20210011979A (ko) 2018-07-11 2021-02-02 가부시키가이샤 신가와 와이어 본딩 장치
KR20230074797A (ko) 2021-09-16 2023-05-31 가부시키가이샤 신가와 핀 와이어 형성방법, 및 와이어 본딩 장치
US12551926B2 (en) 2021-02-10 2026-02-17 Yamaha Robotics Co., Ltd. Ultrasonic horn

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180068715A (ko) 2016-12-14 2018-06-22 주식회사 엘지화학 가공성 및 내환경 응력 균열성이 우수한 에틸렌/알파-올레핀 공중합체
KR20210011979A (ko) 2018-07-11 2021-02-02 가부시키가이샤 신가와 와이어 본딩 장치
US11824038B2 (en) 2018-07-11 2023-11-21 Shinkawa Ltd. Wire bonding apparatus
US12551926B2 (en) 2021-02-10 2026-02-17 Yamaha Robotics Co., Ltd. Ultrasonic horn
KR20230074797A (ko) 2021-09-16 2023-05-31 가부시키가이샤 신가와 핀 와이어 형성방법, 및 와이어 본딩 장치

Also Published As

Publication number Publication date
WO2011019692A2 (en) 2011-02-17
WO2011019692A3 (en) 2011-05-12
SG10201404843RA (en) 2014-10-30
TWI531434B (zh) 2016-05-01
TW201116354A (en) 2011-05-16
US20120125977A1 (en) 2012-05-24
CN102473658B (zh) 2014-11-26
CN104465422A (zh) 2015-03-25
US8251275B2 (en) 2012-08-28
SG177745A1 (en) 2012-02-28
CN102473658A (zh) 2012-05-23
CN104465422B (zh) 2017-06-06
US20120286023A1 (en) 2012-11-15
JP2013506271A (ja) 2013-02-21
US8365977B2 (en) 2013-02-05

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