TWI530515B - 藉由電磁波的直接輻射而形成導電圖案的方法和在其上具有導電圖案之樹脂結構 - Google Patents

藉由電磁波的直接輻射而形成導電圖案的方法和在其上具有導電圖案之樹脂結構 Download PDF

Info

Publication number
TWI530515B
TWI530515B TW103127553A TW103127553A TWI530515B TW I530515 B TWI530515 B TW I530515B TW 103127553 A TW103127553 A TW 103127553A TW 103127553 A TW103127553 A TW 103127553A TW I530515 B TWI530515 B TW I530515B
Authority
TW
Taiwan
Prior art keywords
region
polymer resin
resin substrate
metal layer
electromagnetic wave
Prior art date
Application number
TW103127553A
Other languages
English (en)
Other versions
TW201525033A (zh
Inventor
金宰賢
金在鎭
朴哲□
朴致成
田信姬
鄭相允
鄭漢娜
Original Assignee
Lg化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg化學股份有限公司 filed Critical Lg化學股份有限公司
Publication of TW201525033A publication Critical patent/TW201525033A/zh
Application granted granted Critical
Publication of TWI530515B publication Critical patent/TWI530515B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24Electrically-conducting paints
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1603Process or apparatus coating on selected surface areas
    • C23C18/1607Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1603Process or apparatus coating on selected surface areas
    • C23C18/1607Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • C23C18/1639Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641Organic substrates, e.g. resin, plastic
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1689After-treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2026Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
    • C23C18/204Radiation, e.g. UV, laser
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073Multistep pretreatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22Roughening, e.g. by etching
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • C25D5/56Electroplating of non-metallic surfaces of plastics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/012Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing wire harnesses
    • H01B13/01236Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing wire harnesses the wires being disposed by machine
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/32Filling or coating with impervious material
    • H01B13/322Filling or coating with impervious material the material being a liquid, jelly-like or viscous substance
    • H01B13/327Filling or coating with impervious material the material being a liquid, jelly-like or viscous substance using a filling or coating cone or die
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Nanotechnology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Laminated Bodies (AREA)

Description

藉由電磁波的直接輻射而形成導電圖案的方法和在其上具有導電圖案之樹脂結構
本發明關於一種藉由電磁波的直接輻射而形成導電圖案的方法,該電磁波能藉由簡單製程將精細導電圖案形成於不同種類的聚合物樹脂產物或樹脂層上,即使是該聚合物樹脂本身中沒有特定無機添加物;以及其上形成具有該導電圖案之樹脂結構。
近幾年,因為發展精細電子技術,所以對於精細導電圖案形成於不同樹脂產物或樹脂層等的聚合物樹脂基材(或產物)表面上之結構的需求提高。在該聚合物樹脂基材表面和該結構上的導電圖案可用以將不同標的如天線整併於手機外殼、不同種類的感測器、MEMS結構和RFID標籤等中。
特別是,最近的可攜式裝置如智慧式手機等不像現有 的手機等,必須同時安裝局部網路功能如通訊、藍芽、Wi-Fi和電子付款等,且由於此原因,其必需同時安裝不同天線於一個智慧式手機中。然而,除了那個之外,因為得強調該可攜式裝置如智慧式手機等的審美設計態樣,所以持續提議且研究能擔任該聚合物樹脂基材表面上的不同天線如該可攜式裝置的外殼等之導電圖案的形成方法以便同時符合這些要求。
因為對於將導電圖案形成於該聚合物樹脂基材表面上的技術的興趣提昇,所以有人提議關此的數種技術。例如,有人提議一種將導電圖案形成於聚合物樹脂基材上的方法,其係藉由將含有過渡金屬如銅和鉻等特定無機添加物(例如,具有尖晶石結構的CuCr2O4等)摻混且在聚合物樹脂晶片中成形而形成聚合物樹脂基材,將電磁波如雷射等直接輻射於預定區域上,且鍍敷該雷射輻射區以形成金屬層。在此方法中,使該雷射輻射區中的無機添加物衍生組分曝光且產生一種鍍敷晶種的功能以致於可以形成該金屬層和導電圖案。
然而,因為該導電圖案的形成方法中得使用實質量的高價特定無機添加物,所以會有總製造成本提高的缺點。除此之外,因為該無機添加物必須混入該聚合物樹脂晶片本身中,所以該無機添加物可能損及該聚合物樹脂基材或其所形成的樹脂產物之物性如機械性質等。另外,該特定無機添加物如具有尖晶石結構的CuCr2O4等本身具有相當深的顏色,使該特定無機添加物可能在提供客戶期望的顏 色之含有該特定無機添加物的聚合物樹脂基材或樹脂產物時損及多重因子。例如,為了提供具有期望顏色的含有該無機添加物之聚合物樹脂基材,得使用大量的顏料,且不容易提供白色。
由於該缺點,所以需要一種能藉由簡單製程將精細導電圖案形成於不同種類的聚合物樹脂產物或樹脂層上的技術,即使是該聚合物樹脂本身中沒有特定無機添加物。
本發明提供一種藉由電磁波的直接輻射而形成導電圖案的方法,該電磁波能藉由簡單製程將精細導電圖案形成於不同種類的聚合物樹脂產物或樹脂層上。
除此之外,本發明提供一種樹脂結構,其具有藉由該導電圖案的形成方法製得的導電圖案。
本發明之一代表性具體實例提供一種藉由電磁波的直接輻射而形成導電圖案的方法,該方法包括藉由將該電磁波選擇性地輻射於聚合物樹脂基材上而形成具有預定表面粗糙度的第一區;將導電晶種形成於該聚合物樹脂基材上;藉由鍍敷其上形成具有導電晶種的該聚合物樹脂基材而形成金屬層;及從該聚合物樹脂基材的第二區移除該導電晶種和該金屬層,其中該第二區具有比該第一區小的表 面粗糙度。
除此之外,該第一和第二區的表面粗糙度可藉由其他方法界定。例如,當藉由使用黏著力為4.0至6.0N/10mm寬的膠帶進行根據ISO 2409標準方法之間距為2mm或更小的橫割試驗時,該聚合物樹脂基材的第一區之表面粗糙度可藉由試驗中的標的金屬層脫層面積相當於該金屬層面積的5%或更小時之黏著力界定,且當在剩下的第二區上進行相同試驗時,該聚合物樹脂基材剩下的第二區之表面粗糙度可藉由試驗中的標的金屬層脫層面積相當於該金屬層面積的65%或更大時之黏著力界定。
本發明之另一代表性具體實例提供一種具有導電圖案之樹脂結構,其包括:包括被形成為具有預定表面粗糙度的第一區和表面粗糙度比該第一區小的第二區之聚合物樹脂基材;及選擇地形成於該聚合物樹脂基材的第一區上之導電晶種和金屬層。
根據本發明,即使聚合物樹脂基材本身不含高價的特定無機添加物如具有尖晶石結構的CuCr2O4等,藉由輻射電磁波如雷射等形成導電圖案的區域之表面粗糙度及對金屬層的黏著力也可予以調整,以致於該導電圖案可藉由簡單製程形成於該聚合物樹脂基材上。
因此,形成該導電圖案的製程之製造成本可以被減降,且該聚合物樹脂基材或該特定無機添加物引致的產物 之物性如機械性質和介電常數等或高功率電磁波輻射等可以最小化。除此之外,因為期望的精細導電圖案可被形成於該聚合物樹脂基材上而不使用該特定無機添加物,所以該樹脂本身的顏色可以清楚顯示出來,且易於提供預期顏色的該聚合物樹脂基材或產物顏色。
因此,藉由使用該導電圖案的形成方法,天線、RFID標籤、不同種類的感測器和MEMS結構等的導電圖案均可相當有效地形成於不同種類的樹脂產物如智慧式手機外殼等上。
第1圖係顯示根據本發明的代表性具體實例依照製程順序直接輻射電磁波而形成導電圖案的方法之一實例的示意圖。
第2a圖顯示在實施例1的導電圖案形成方法中,預定區域藉由將雷射輻射於該聚合物樹脂基材而具有表面粗糙度的情況之照片(第一張照片)、顯示在輻射雷射之後藉由無電鍍敷形成銅金屬層的情況之照片(第二張照片)及顯示從沒被雷射輻射的剩下區域移除鍍敷層的情況之照片(第三張照片)。
第2b圖係根據實施例1具有表面粗糙度的雷射輻射區域之光學顯微鏡照片。
第2c圖係顯示在實施例1中形成該金屬層(導電圖案)的掃描式電子顯微鏡(SEM)照片,其中有導電晶種 長成,且該金屬層藉由鍍敷而形成於該導電晶種上。
第3圖係顯示在實施例9的導電圖案形成方法中從沒被雷射輻射的區域選擇性地移除該金屬層等而將該導電圖案形成於該聚合物樹脂基材上的情況之照片。
第4a圖係顯示在實施例6的雷射輻射區中使用光學剖面儀之依高度而定的顏色變化之照片(左側),及顯示三維結構中的顏色變化之照片(右側)。
第4b圖係顯示在實施例8的雷射輻射區中使用光學剖面儀之依高度而定的顏色變化之照片(左側),及顯示三維結構中的顏色變化之照片(右側)。
後文中,要來描述根據本發明的特定代表性具體實例藉由電磁波的直接輻射而形成導電圖案的方法及具有其所形成的導電圖案樹脂結構。
根據本發明的代表性具體實例,藉由電磁波的直接輻射而形成導電圖案的方法包括:藉由將該電磁波選擇性地輻射於聚合物樹脂基材上而形成具有預定表面粗糙度的第一區;將導電晶種形成於該聚合物樹脂基材上;藉由鍍敷其上形成具有導電晶種的該聚合物樹脂基材而形成金屬層;及從該聚合物樹脂基材的第二區移除該導電晶種和該金屬層,其中該第二區具有比該第一區小的表面粗糙度。
根據本發明的該代表性具體實例,首先,形成具有某個外形如凹凸、預定圖案或不定形外形的表面結構以便藉 由將電磁波如雷射等輻射於形成導電圖案的第一區上而使該第一區的聚合物樹脂基材具有預定表面粗糙度。在該第一區中,該聚合物樹脂基材表面與藉由鍍敷於該一區所形成的金屬層之間的黏著力由於該預定表面粗糙度而可獲得改善。
另一方面,在沒被電磁波如雷射等輻射的第二區中,可能由於該聚合物樹脂基材本身的原始表面性質而顯示該聚合物樹脂基材表面與該第二區中的金屬層之間的黏著力不足。
相應地,當該第一區的聚合物樹脂基材上形成用於促成鍍敷製程的導電晶種時,與該聚合物樹脂基材具有優良黏著力的金屬層可有利地形成於該第一區上;另一方面,由於黏著力不足而易於移除的金屬層可形成於該第二區上。因此,當弱物理力應用於該聚合物樹脂基材以選擇性地移除該第二區的金屬層及導電晶種時,期望的導電圖案便可輕易地形成於該聚合物樹脂基材上。
如上所述,根據本發明的代表性具體實例,例如,即使聚合物樹脂基材本身不含高價的特定無機添加物如具有尖晶石結構的CuCr2O4等,藉由輻射電磁波如雷射等形成導電圖案的區域之表面粗糙度及黏著力等也可予以調整,以致於該導電圖案可藉由簡單製程形成於該聚合物樹脂基材上。
因此,形成該導電圖案的製程之製造成本可以被減降,且該聚合物樹脂基材或該特定無機添加物引致的產物 之物性如機械性質等可以最小化。除此之外,因為期望的精細導電圖案可被形成於該聚合物樹脂基材上而不使用該特定無機添加物,所以該樹脂本身的顏色可以清楚顯示出來,且易於提供預期顏色的該聚合物樹脂基材或產物顏色。
另一方面,在後文中,針對各製程步驟參照圖式更明確地描述根據本發明的代表性具體實例藉由直接輻射電磁波而形成該導電圖案之方法。第1圖係顯示根據本發明的代表性具體實例依照製程順序直接輻射電磁波而形成導電圖案的方法之一實例的示意圖。
如第1圖的①和②所示,在根據代表性具體實例形成該導電圖案之方法中,先藉由將電磁波選擇性地輻射於該聚合物樹脂基材上而形成具有預定表面粗糙度的第一區。
該聚合物樹脂基材可藉由使用任何熱固性樹脂或任何熱塑性樹脂形成。能形成該聚合物樹脂基材如熱固性樹脂或熱塑性樹脂的聚合物樹脂指定實例可包括ABS樹脂、聚對苯二甲酸烷二酯樹脂(如聚對苯二甲酸丁二酯樹脂或對苯二甲酸乙二酯樹脂等)、聚碳酸酯樹脂、聚丙烯樹脂及聚鄰苯二甲醯胺樹脂等,且除此之外,該聚合物樹脂基材可藉由使用不同聚合物樹脂形成。
除此之外,該聚合物樹脂基材可由可由上述聚合物樹脂形成;但是,需要時,可另含有一般用以形成該聚合物樹脂產物的添加物,例如,UV安定劑、熱安定劑或耐衝擊性補強劑(impact reinforcing agent)。該添加物可依 以該聚合物樹脂基材的總重量為基準,約2重量%或約0.01至2重量的適當量內含。另一方面,該聚合物樹脂基材並不一定包括此技藝中已知且藉由輻射該電磁波而用以形成該導電圖案的具有尖晶石結構的特定無機添加物如CuCr2O4
另一方面,該第一區藉由將電磁波如雷射等輻射於上述聚合物樹脂基材上而具有預定表面粗糙度,其中在具有該表面粗糙度的第一區中,可形成相對標準化的圖案如孔或網眼花紋等或凹凸形,或可形成其中複合成形的多數不規則孔、圖案或凹凸形的不定形表面結構,且該第一區的聚合物樹脂基材由於不同表面形狀或結構而具有預定表面粗糙度。
至於實例,為了確保形成於該第一區中的金屬層(導電圖案)與該聚合物樹脂基材表面之間的優良黏著力,該聚合物樹脂基材的第一區以中線算術平均粗糙度絕對值(Ra)所界定的表面粗糙度可為500nm或更大,或約1μm或更大,或約1至3μm,且沒被該電磁波輻射到的該第二區以中線算術平均粗糙度絕對值(Ra)所界定的表面粗糙度可能比該第一區小,例如,約400nm或更小,或約100nm或更小,或約0至90nm。
除此之外,上述表面粗糙度也可藉由其他方法來界定。例如,該第一區和第二區的表面粗糙度可依照根據ISO 2409標準方法的橫割試驗藉由對該金屬層的黏著程度。例如,當根據ISO 2409標準方法之間距為2mm或更 小的橫割試驗係藉由使用黏著力為4.0至6.0N/10mm寬的膠帶進行時,該聚合物樹脂基材的第一區可能具有藉由黏著力界定的表面粗糙度(例如ISO 0級或1級),其中試驗中的該標的金屬層脫層面積相當於該金屬層面積的約5%或更小,且當根據ISO 2409標準方法之間距為2mm或更小的橫割試驗係藉由使用黏著力為4.0至6.0N/10mm寬的膠帶進行時,該聚合物樹脂基材的第二區可具有藉由黏著力界定的表面粗糙度(例如ISO 5級或更高級),其中試驗中的該標的金屬層脫層面積相當於該金屬層面積的65%或更大。
因為該第一區的聚合物樹脂基材藉由輻射該電磁波如雷射等而具有上述表面粗糙度,所以當依照下述鍍敷製程將該金屬層形成於該第一區上時,該金屬層便可利用優良的黏著力形成且保持於該聚合物樹脂基材上,以形成優良的導電圖案。比起該第一區,因為沒藉由電磁波如雷射等輻射的第二區之聚合物樹脂基材由於其表面性質而具有上述表面粗糙度,所以當該金屬層係依照下述鍍敷製程形成時,該第二區可能具有相當低的黏著力而易於移除。結果,該第二區的金屬層可以輕易且選擇性地移除而將該導電圖案形成於該第一區的聚合物樹脂基材上。
另一方面,電磁波如雷射等可在下述的預定條件下輻射使該第一區的聚合物樹脂基材具有上述表面粗糙度。
首先,在該電磁波的輻射中,可以輻射雷射電磁波,例如,可以輻射波長為248nm、約308nm、約355nm、約 532nm、約585nm、約755nm、約1064nm、約1070nm、約1550nm、約2940nm或約10600nm的雷射電磁波。在另一實例中,可以輻射波長在紅外線(IR)區的雷射電磁波。
除此之外,輻射該雷射電磁波時的特定條件可依據該聚合物樹脂基材的樹脂種類、物性、厚度、該待形成的金屬層的種類或厚度或考慮上述因子的適當黏著力水準做控制或變更。另一方面,該雷射電磁波可以在平均功率為約0.1至50W,或約1至30W,或約5至25W,之輻射條件下輻射,使該第一區的聚合物樹脂基材具有上述預定表面粗糙度。
除此之外,該雷射電磁波的輻射可藉由較高功率輻射一次,但是該雷射電磁波可藉由較低功率輻射二或更多次。當該雷射電磁波的輻射次數增加時,該表面粗糙度提高,形成於該表面上的結構如凹凸形等可能從孔形圖案變成網眼圖案化或不定形表面結構。因此,藉由控制該雷射電磁波的輻射條件及次數,可在該第一區的聚合物樹脂基材上形成適當表面結構,且可提供與該金屬層具有適當程度和優良的黏著力之表面粗糙度。
除此之外,在輻射該雷射電磁波時,電磁波輻射痕跡可能依據輻射該雷射電磁波時的輻射間距而形成於該聚合物樹脂基材的孔形中。然而,為了使該第一區的聚合物樹脂基材具有上述適當表面粗糙度,較佳為可以輻射該雷射電磁波使電磁波輻射痕跡之中間部分的間距或該電磁波的 輻射間距為約20μm或更大或約20至70μm,但是並不特別限於此。結果,該第一區的聚合物樹脂基材可具有適當表面粗糙度及該聚合物樹脂基材與該金屬層之間的適當黏著力。
另一方面,如上所述,等到將該電磁波如雷射等輻射於該第一區之後,可按照第1圖的③所示將導電晶種形成於該該聚合物樹脂基材上。該導電晶種係於鍍敷時長在該聚合物樹脂基材上,且藉由該鍍敷促進該金屬層的形成。因此,更優良的金屬層和該導電圖案可適當地形成於該第一區的聚合物樹脂基材上。
該導電晶種可能含有金屬奈米粒子、金屬離子或金屬錯合物離子。除此之外,該金屬離子或該金屬錯合物離子可以當離子本身、或當該金屬離子所結合的含金屬化合物或當含金屬錯合物的金屬錯合物離子、或甚至當該含金屬化合物或該金屬錯合物的粒子使用。
該導電晶種中包括的金屬原子種類沒有特別限制,只要該金屬原子具有導電性。例如,該導電晶種可包括選自由以下所組成的群組中的至少一種金屬:銅(Cu)、鉑(Pt)、鈀(Pd)、銀(Ag)、金(Au)、鎳(Ni)、鎢(W)、鈦(Ti)、鉻(Cr)、鋁(Al)、鋅(Zn)、錫(Sn)、鉛(Pb)、鎂(Mg)、錳(Mn)和鐵(Fe)、其離子或錯合物離子。
除此之外,為了將該導電晶種形成於該聚合物樹脂基材上,含有上述導電晶種如金屬奈米粒子、該金屬離子或 該金屬錯合物離子的導電晶種、分散液或溶液可應用於該聚合物樹脂基材上,緊接著多種方法如沉澱法、乾燥法及/或還原法,以形成呈粒子形式的導電晶種。更明確地說,當該分散液等含有該金屬奈米粒子時,該金屬奈米粒子係藉由溶解度的差異而沉澱並乾燥而形成呈粒子形式的導電晶種,且當該分散液等含有該金屬離子或該金屬錯合物離子(或含有這些離子的金屬化合物或錯合物;例如,該金屬化合物或該錯合物如AgNO3、Ag2SO4、KAg(CN)2)時,該金屬離子或該金屬錯合物離子係還原且乾燥以適當地形成呈粒子形式的導電晶種。
在此,該金屬離子或該金屬錯合物離子的還原可藉由使用一般還原劑進行,例如,至少一種選自由以下所組成的群組之還原劑:以醇為底質的還原劑、以醛為底質的還原劑、以次磷酸為底質的還原劑如次磷酸鈉或其水合物等、以肼為底質的還原劑如胼或其水合物等、硼氫化鈉及氫化鋰鋁。
除此之外,該分散液或該溶液可適當地包括能改善該聚合物樹脂基材與該導電晶種之間的緊密黏著力之以水為底質的溶液(例如,含有以聚乙烯基吡咯烷酮為底質的聚合物之溶液等)或能將該金屬離子或該金屬錯合物離子安定化之以水為底質的錯合劑(例如,NH3、EDTA或羅謝爾鹽(Rochelle salt)等)當成液相介質。
另外,該導電晶種的分散液或溶液可藉由將液相組合物應用於該該聚合物樹脂基材的一般製程應用,例如,如 浸漬、旋塗及噴佈的多種方法。
按上述形成的導電晶種可形成於包括形成於該第一區上的表面凹凸形、圖案或表面結構之間的空間在內之整個聚合物樹脂基材表面上,且可負責依照該鍍敷製程促進該金屬層的有利形成且控制該金屬層的鍍敷速率或物性。
另一方面,就在上述電磁波輻射之後,立即進行形成該導電晶種的製程;然而,等到以表面張力比該分散液或溶液低的表面活化劑選擇性地表面處理該聚合物樹脂基材之後,可進行形成該導電晶種的製程。除此之外,該聚合物樹脂基材可依照將該表面活化劑加於該分散液或該溶液本身以便形成該導電晶種的情況做表面處理。在此,在添加該表面活化劑之前該表面活化劑可具有比該分散液或溶液低的表面張力。
該表面活化劑可使該導電晶種能更均勻地形成且保持於該聚合物樹脂基材表面上,特別是,介於該凹凸形、圖案或表面結構之間。理由是因為該表面活化劑移除該表面結構之間的空氣以幫助該導電晶種輕易地滲入該表面結構之間。因此,當增加以該表面活化劑做處理時,該導電晶種係有利地完全吸到該第一區上,且該金屬層可藉由該鍍敷製程更均勻地或有利地形成。除此之外,由於利用該表面活化劑做處理及該導電晶種形成,使該金屬層與該第一區上的聚合物樹脂基材之間的黏著力可獲得更進一步改善以有利地形成具有優良導電性的導電圖案。
該表面活化劑的種類可能依據上述導電晶種的分散液 或該溶液種類而有所不同,且可包括表面張力比該分散液或溶液低的任何液相介質。例如,具有較低表面張力的有機溶劑如乙醇等均可用作該表面活化劑。
除此之外,該表面活化劑可藉由將該聚合物樹脂基材沉浸數秒至數分鐘的方法等做處理。
另一方面,參照第1圖的④,等到該導電晶種形成於該聚合物樹脂基材上之後,該金屬層可藉由鍍敷其上形成具有該導電晶種的該聚合物樹脂基材而形成。形成該金屬層的製程可藉由將該導電金屬無電鍍敷於該聚合物樹脂基材上而進行,且進行該無電鍍敷製程的方法及條件可藉由一般方法及條件進行。
例如,該鍍敷製程係藉由使用含有構成該金屬層的導電金屬(例如,金屬源如銅等)、錯合劑、pH調節劑及還原劑等之鍍敷溶液進行以將該金屬層形成於包括該一區和該第二區的聚合物樹脂基材上。在此,該金屬層可形成於上述長出的導電晶種上。
該金屬層可藉由優良的黏著力有利地形成於該第一區上;另一方面,該金屬層由於對該聚合物樹脂基材的黏著力不足而可輕易地從該第二區移除(例如,如第2a圖的第二圖所示,該金屬層可以從該聚合物樹脂基材分層)。
等到形成該金屬層之後,該導電晶種和該金屬層可從該聚合物樹脂基材的第二區選擇性地移除以將該導電圖案形成於剩下的第一區上,如第1圖的⑤和⑥所示。
如上所述,因為該金屬層係依照相當易於移除該金屬 層的狀態形成於該第二區上,所以該金屬層及該導電晶種可藉由簡單方法如將弱物理力施於該聚合物樹脂基材等而從該第二區選擇性地移除。在此,由於介於該金屬層與該第一區上的聚合物樹脂基材之間的優良黏著力,使該金屬層可留下而形成該導電圖案。
如上所述,從該第二區移除該導電晶種和該金屬層的製程,可藉由將弱物理力施於該聚合物樹脂基材的任何方法進行,如超音波輻射(音波處理)、液相清洗、液相沖洗、空氣噴吹、繞絕緣帶(taping)、塗刷(brushing)及利用人力的方法如用手直接除塵或擦拭,或藉由從其中選出的二或更多種方法之組合進行。
例如,清洗或沖洗係於水中在超音波輻射預定時間下進行,且空氣噴吹等係依照使該第二區的導電晶種和金屬層可選擇性地移除之方式進行。
藉由上述方法形成的具有該導電圖案的樹脂結構可包括被分成該第一區及該第二區的該聚合物樹脂基材,該第一區以中線算術平均粗糙度絕對值(Ra)所界定的表面粗糙度為500nm或更大,且該第二區的表面粗糙度比該第一區小;及選擇性地形成於該聚合物樹脂基材的第一區上的該導電晶種和該金屬層。
在此,因為根據代表性具體實例的方法中已經充分描述該第一和第二區的表面粗糙度,所以能省略其附加的描述。除此之外,如上所述,該第一區可表示該電磁波如雷射等輻射的區域。
上述樹脂結構可能是具有供天線用的導電圖案之不同樹脂產物或樹脂層如智慧式手機外殼等,或可能是具有導電圖案如其他RFID標籤、不同種類的感測器或MEMS結構等之不同樹脂產物或樹脂層。
如上所述,根據本發明,即使是該聚合物樹脂本身中沒有高價的特定無機添加物如具有尖晶石結構的CuCr2O4等,也能調整藉由輻射電磁波如雷射等而形成導電圖案的區域之表面粗糙度及對金屬層的黏著力,以致於該導電圖案可藉由簡單方法形成於該聚合物樹脂基材上。
因此,形成該導電圖案的製程之製造成本及原料成本可以減降,且該聚合物樹脂基材或該特定無機添加物引致的產物之物性如機械性質等的衰退可以最小化。除此之外,因為期望的精細導電圖案可被形成於該聚合物樹脂基材上而不使用該特定無機添加物,所以該樹脂本身的顏色可以清楚顯示出來,且易於提供預期顏色的該聚合物樹脂基材或產物顏色。因此,根據本發明的代表性具體實例,精細導電圖案可於較低製造成本且藉由簡單方法形成於不同樹脂產物或樹脂層上,以致於可提供具有不同顏色和外形的樹脂產物,包括以前沒被提過的新樹脂產物。
後文中,本發明的作用及效果係藉由本發明的特定實施例詳細地描述。另一方面,這些實例係藉由實施例提供,且因此,不得視為限制本發明的範疇。
實施例1:藉由雷射直接輻射形成導電圖案
製備含有UV安定劑、熱安定劑及總量小於2重量%的耐衝擊性補強劑而沒有其他不同無機添加物之聚碳酸樹脂基材。波長為1064nm的雷射係於具有21.4W的平均功率之輻射條件下輻射於聚碳酸樹脂基材的預定區上一次。在此,該聚碳酸樹脂的雷射輻射痕跡之中間部分的間距係藉由控制該雷射的輻射間距而控制為約35μm。
相應地,被該雷射輻射的聚碳酸樹脂基材之預定區上具有預定表面粗糙度。第2a圖的第一張照片中顯示如以上製好的聚碳酸樹脂基材之照片,且第2b圖中顯示被雷射輻射形成以便具有該表面粗糙度的區域之光學顯微照片。
接著,將該聚碳酸樹脂基材浸於包括Pd離子的水溶液中約5分鐘,以將包括Pd的導電晶種形成於該基材上。接下來,以去離子水清洗該基材,且藉由使用銅當導電金屬進行無電鍍敷。在無電鍍敷時,使用含有銅源(硫酸銅)、錯合劑(羅謝爾鹽)、pH調節劑(氫氧化鈉水溶液)和還原劑(甲醛)的鍍敷溶液。該無電鍍敷係於室溫進行約1小時以形成該金屬層。
第2a圖的第二張照片中顯示的是顯示上述形成的金屬層之照片。參照第2a圖,可以確定的是該金屬層係有利地形成於該雷射輻射的區域;然而,剩下區域中的金屬層由於黏著力不足變得相當容易移除而以脫層狀態形成。
接著,將該基材浸於該去離子水中,緊接著超音波輻射(音波處理)經過20分鐘,及空氣噴吹,以選擇性地 移除沒被雷射輻射的區域之金屬層。第2a圖的第三張照片係顯示從沒被輻射的區域選擇性地移除該金屬層等以將導電圖案形成於該基材上的情況之照片,且第2c圖係顯示形成該導電圖案的部位之掃描式電子顯微鏡(SEM)照片。參照第2c圖,可確認該導電晶種係長於對應部位,且該金屬層係藉由鍍敷形成於導電薄層(導電金屬粒子)上。
實施例2至8:藉由雷射直接輻射形成導電圖案
除了實施例1中之該雷射的平均功率輻射條件及該雷射輻射痕跡之中間部分的間距係於一次輻射中更換成約15.7W和約25μm(實施例2)、約15.7W和約35μm(實施例3)、約18.6W和約45μm(實施例4)、約21.4W和約45μm(實施例5)、約21.4W和約55μm(實施例6)、約24.2W和約55μm(實施例7)、約28.5W和約55μm(實施例8)以外,各自具有導電圖案的實施例2至8的樹脂結構係藉由與實施例1的相同方法製造。
實施例9:藉由雷射直接輻射形成導電圖案
除了乙醇和含有Ag錯合物離子而非Pd的水性錯合物離子溶液(含有AgNO3和錯合劑NH3的溶液)係用作形成該導電晶種的溶液以外,具有導電圖案的實施例9的樹脂結構係藉由與實施例1的相同方法製造。第3圖係顯示從沒被雷射輻射的區域選擇性地移除該金屬層等而將該 導電圖案形成於該基材上的情況之照片。
試驗實施例1:導電圖案的表面粗糙度評估
表面粗糙度係於該聚碳酸樹脂基材的預定區域上藉由根據實施例1至9的雷射輻射。面積0.2mm X 0.3mm的中線算術平均粗糙度絕對值(Ra)係藉由使用光學剖面儀(Nano view E1000,Nanosystem,Korea)測量。在第4a圖中,在實施例6的雷射輻射區中使用光學剖面儀顯示依高度而定的顏色變化之照片(左側),且顯示提供三維結構的顏色變化之照片(右側)。除此之外,第4a圖也顯示測得的表面粗糙度。第4b圖係顯示實施例8的照片且分別顯示依雷射條件變化而定的表面狀態變化及表面粗糙度的變化值。藉由於被實施例1至9的雷射輻射的區域之不同6個點處使用上述方法測量表面粗糙度且平均測量值所獲得之Ra值係彙總且顯示於以下表1中。為了對照,第4a和4b圖顯示於6個點當中的任一點處測到的表面粗糙度,且表1顯示於6個點處測到的值之平均值。
試驗實施例2:導電圖案的黏著力評估
藉由使用根據ISO 2409標準方法之黏著力為4.0至6.0N/10mm寬的膠帶(3M思高膠帶(scotch tape)#371)在其上形成根據實施例1至9的該金屬層及該導電圖案之區域中橫割試驗。在此,介於該基材與該金屬層之間的黏著力或緊密黏著力(close adhesion)係藉由將該金 屬層切割成10X10圖形(約2mm或更小的間距),且測量由於貼上和撕下該膠帶而脫層的金屬層面積而測試。
該導電圖案的脫層面積之黏著力評估係依據以下ISO等級標準的規定進行。
1. 0級:當該導電圖案的脫層面積相當於評估中的標的導電圖案面積的0%的時候。
2. 1級:當該導電圖案的脫層面積相當於評估中的標的導電圖案面積的0%至5%或更小的時候。
3. 2級:當該導電圖案的脫層面積相當於評估中的標的導電圖案面積的5%至15%或更小的時候。
4. 3級:當該導電圖案的脫層面積相當於評估中的標的導電圖案面積的15%至35%或更小的時候。
5. 4級:當該導電圖案的脫層面積相當於評估中的標的導電圖案面積的35%至65%或更小的時候。
6. 5級:當該導電圖案的脫層面積相當於評估中的標的導電圖案面積的65%以上的時候。
除此之外,依照實施例1至9形成該導電圖案之後的金屬層(導電圖案)的均勻度係依據以下標準的規定評估。
1. O:用肉眼,具有由雷射輻射形成的表面粗糙度之所有區域中形成上色均勻的金屬層(鍍敷薄膜),且當藉由光學顯微鏡觀察該金屬層表面時,沒顯示細孔。
2. △:用肉眼,具有由雷射輻射形成的表面粗糙度之所有區域中形成上色均勻的金屬層(鍍敷薄膜);然 而,當藉由光學顯微鏡觀察該金屬層表面時,部分顯示細孔。
3. X:用肉眼,並非具有由雷射輻射形成的表面粗糙度之所有區域中均形成上色均勻的金屬層(鍍敷薄膜);且當藉由光學顯微鏡觀察該金屬層表面時,至少部分顯示細孔。
將評估結果顯示於以下表1。
參照表1,可確認在實施例1至9中,透過包括在被雷射輻射的區域中形成約500nm或更大的表面粗糙度(Ra)以改善該聚合物樹脂基材與該金屬層之間的黏著力之製程及形成該導電晶種等之製程的方法,可在被雷射輻射的區域選擇性地形成相當優良的金屬層(導電圖案)。特別是,可確認該導電圖案具有優良均勻性及對該聚合物 樹脂基材的優良黏著力,而能有利地形成。
總之,根據以上實施例,即使是該聚合物樹脂基材本身不含高價特定無機添加物如CuCr2O4等,也可調整藉由雷射電磁波如雷射等而形成導電圖案的區域之表面粗糙度及對金屬層的黏著力,以致於該導電圖案可藉由簡單方法形成於該聚合物樹脂基材上。

Claims (19)

  1. 一種藉由電磁波的直接輻射而形成導電圖案之方法,該方法包含:藉由將該電磁波選擇性地輻射於含有熱固性樹脂或熱塑性樹脂之聚合物樹脂基材上而形成具有預定表面粗糙度的第一區;將導電晶種形成於該聚合物樹脂基材上;藉由鍍敷其上形成具有導電晶種的該聚合物樹脂基材而形成金屬層;及從該聚合物樹脂基材的第二區移除該導電晶種和該金屬層,其中該第二區具有比該第一區小的表面粗糙度,其中該聚合物樹脂基材的第一區以中線算術平均粗糙度絕對值(Ra)所界定的表面粗糙度為500nm至3μm,且該第二區的中線算術平均粗糙度絕對值(Ra)比該第一區小。
  2. 如申請專利範圍第1項之方法,其中當藉由使用黏著力為4.0至6.0N/10mm寬的膠帶進行根據ISO 2409標準方法之間距為2mm或更小的橫割試驗時,該聚合物樹脂基材的第一區之表面粗糙度係藉由試驗中的標的金屬層脫層面積相當於該金屬層面積的5%或更小時之黏著力界定。
  3. 如申請專利範圍第1項之方法,其中當藉由使用黏著力為4.0至6.0N/10mm寬的膠帶進行根據ISO 2409標準方法之間距為2mm或更小的橫割試驗時,該聚合物樹脂基材的第二區之表面粗糙度係藉由試驗中的標的金屬 層脫層面積相當於該金屬層面積的65%或更大時之黏著力界定。
  4. 如申請專利範圍第1項之方法,其中該聚合物樹脂基材含有選自由ABS樹脂、聚對苯二甲酸烷二酯樹脂、聚碳酸酯樹脂、聚丙烯樹脂及聚鄰苯二甲醯胺樹脂所組成的群組中之至少一種。
  5. 如申請專利範圍第1項之方法,其中該電磁波的輻射係藉由輻射出波長為248nm、308nm、355nm、532nm、585nm、755nm、1064nm、1070nm、1550nm、2940nm或10600nm的雷射電磁波而進行。
  6. 如申請專利範圍第1項之方法,其中該電磁波的輻射係藉由在具有0.1至50W的平均功率之輻射條件下輻射出雷射電磁波而進行。
  7. 如申請專利範圍第1項之方法,其中該電磁波的輻射係藉由輻射出雷射電磁波使該聚合物樹脂基材上所示的電磁波輻射痕跡之中間部分的間距為20至70μm而進行。
  8. 如申請專利範圍第1項之方法,其中該電磁波的輻射係藉由輻射出雷射電磁波一次或藉由輻射出該雷射電磁波兩次或更多次而進行。
  9. 如申請專利範圍第1項之方法,其中該導電晶種含有金屬奈米粒子、金屬離子或金屬錯合物離子。
  10. 如申請專利範圍第9項之方法,其中該導電晶種含有選自由以下所組成的群組中的至少一種金屬:銅 (Cu)、鉑(Pt)、鈀(Pd)、銀(Ag)、金(Au)、鎳(Ni)、鎢(W)、鈦(Ti)、鉻(Cr)、鋁(Al)、鋅(Zn)、錫(Sn)、鉛(Pb)、鎂(Mg)、錳(Mn)和鐵(Fe)、其離子或錯合物離子。
  11. 如申請專利範圍第9項之方法,其中該導電晶種的形成包括:將含有該金屬奈米粒子、金屬離子或金屬合錯合物離子的分散液或溶液施塗於該聚合物樹脂基材上;及使該金屬奈米粒子沉澱並乾燥或將該金屬離子或金屬錯合物離子還原並乾燥而形成呈粒子形式的導電晶種。
  12. 如申請專利範圍第11項之方法,其中該金屬離子或金屬錯合物離子的還原係在至少一種選自由以下所組成的群組之還原劑存在下進行:以醇為底質的還原劑、以醛為底質的還原劑、以次磷酸鹽為底質的還原劑、以肼為底質的還原劑、硼氫化鈉及氫化鋰鋁。
  13. 如申請專利範圍第11項之方法,其另外包含:在形成該導電晶種時添加表面張力比該分散液或溶液低的表面活化劑,或在該電磁波輻射和該導電晶種形成之間以表面張力比該分散液或溶液低的表面活化劑進行該聚合物樹脂基材的表面處理。
  14. 如申請專利範圍第1項之方法,其中該金屬層的形成包括將導電金屬電鍍於該聚合物樹脂基材上。
  15. 如申請專利範圍第1項之方法,其中從該第二區 移除該導電晶種和該金屬層包括藉由組合選自由以下所組成的群組中之一或二或更多種方法將物理力(physical power)應用於該聚合物樹脂基材上:超音波輻射(音波處理)、液相清洗、液相沖洗、空氣噴吹、繞絕緣帶(taping)、塗刷(brushing)及利用人力的方法。
  16. 一種具有導電圖案之樹脂結構,其包含:包括被形成為具有預定表面粗糙度的第一區和表面粗糙度比該第一區小的第二區之聚合物樹脂基材;及選擇地形成於該聚合物樹脂基材的第一區上之導電晶種和金屬層,其中該聚合物樹脂基材的第一區以中線算術平均粗糙度絕對值(Ra)所界定的表面粗糙度為500nm至3μm,且該第二區的中線算術平均粗糙度絕對值(Ra)比該第一區小,及其中該聚合物樹脂基材含有熱固性樹脂或熱塑性樹脂。
  17. 如申請專利範圍第16項之樹脂結構,其中該第一區相當於該電磁波所輻射的區域。
  18. 如申請專利範圍第16項之樹脂結構,其中當藉由使用黏著力為4.0至6.0N/10mm寬的膠帶進行根據ISO 2409標準方法之間距為2mm或更小的橫割試驗時,該聚合物樹脂基材的第一區之表面粗糙度係藉由試驗中的標的金屬層脫層面積相當於該金屬層面積的5%或更小時之黏著力界定。
  19. 如申請專利範圍第16項之樹脂結構,其中當藉 由使用黏著力為4.0至6.0N/10mm寬的膠帶進行根據ISO 2409標準方法之間距為2mm或更小的橫割試驗時,該聚合物樹脂基材的第二區之表面粗糙度係藉由試驗中的標的金屬層脫層面積相當於該金屬層面積的65%或更大時之黏著力界定。
TW103127553A 2013-08-09 2014-08-11 藉由電磁波的直接輻射而形成導電圖案的方法和在其上具有導電圖案之樹脂結構 TWI530515B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20130094867 2013-08-09
KR1020140093782A KR20150018382A (ko) 2013-08-09 2014-07-24 전자기파의 직접 조사에 의한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체

Publications (2)

Publication Number Publication Date
TW201525033A TW201525033A (zh) 2015-07-01
TWI530515B true TWI530515B (zh) 2016-04-21

Family

ID=53046827

Family Applications (3)

Application Number Title Priority Date Filing Date
TW103127268A TWI565740B (zh) 2013-08-09 2014-08-08 藉由電磁波之直接輻射以形成導電圖案之方法,及具有導電圖案於其上之樹脂結構
TW103127269A TWI563889B (en) 2013-08-09 2014-08-08 Method for forming conductive pattern by direct radiation of electromagnetic wave, and resin structure having conductive pattern there
TW103127553A TWI530515B (zh) 2013-08-09 2014-08-11 藉由電磁波的直接輻射而形成導電圖案的方法和在其上具有導電圖案之樹脂結構

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW103127268A TWI565740B (zh) 2013-08-09 2014-08-08 藉由電磁波之直接輻射以形成導電圖案之方法,及具有導電圖案於其上之樹脂結構
TW103127269A TWI563889B (en) 2013-08-09 2014-08-08 Method for forming conductive pattern by direct radiation of electromagnetic wave, and resin structure having conductive pattern there

Country Status (7)

Country Link
US (3) US20160212860A1 (zh)
EP (3) EP3032548A4 (zh)
JP (3) JP6316961B2 (zh)
KR (4) KR20150018368A (zh)
CN (3) CN105474330B (zh)
TW (3) TWI565740B (zh)
WO (3) WO2015020332A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150018368A (ko) * 2013-08-09 2015-02-23 주식회사 엘지화학 전자기파의 직접 조사에 의한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
KR102374414B1 (ko) * 2015-04-24 2022-03-15 엘지이노텍 주식회사 전자파 차폐 구조물
KR102010472B1 (ko) * 2015-07-20 2019-08-13 주식회사 엘지화학 전자기파의 직접 조사에 의한 도전성 패턴 형성 방법
US10103056B2 (en) * 2017-03-08 2018-10-16 Lam Research Corporation Methods for wet metal seed deposition for bottom up gapfill of features
US10892671B2 (en) * 2017-07-25 2021-01-12 GM Global Technology Operations LLC Electrically conductive copper components and joining processes therefor
CN110545635B (zh) * 2018-05-29 2021-09-14 鹏鼎控股(深圳)股份有限公司 多层电路板的制作方法
US11465397B1 (en) * 2018-08-21 2022-10-11 Iowa State University Research Foundation, Inc. Fabrication of high-resolution graphene-based flexible electronics via polymer casting
KR102543186B1 (ko) * 2018-11-23 2023-06-14 삼성전자주식회사 반도체 패키지
EP4286456A1 (en) * 2021-08-13 2023-12-06 LG Chem, Ltd. Polymer composite and molded product comprising same
JP2024511502A (ja) * 2021-08-13 2024-03-13 エルジー・ケム・リミテッド 高分子複合体およびそれを含む成形品
EP4286457A1 (en) * 2021-08-13 2023-12-06 LG Chem, Ltd. Polymer composite and molded product comprising same
CN115066088A (zh) * 2022-06-30 2022-09-16 浙江华正新材料股份有限公司 印制电路板及其制备方法

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8105633A (nl) 1981-12-15 1983-07-01 Philips Nv Werkwijze voor de vervaardiging van metaalbeelden of patronen op en/of onder het oppervlak van een substraat met een halfgeleidende lichtgevoelige verbinding.
US4666735A (en) * 1983-04-15 1987-05-19 Polyonics Corporation Process for producing product having patterned metal layer
JPH0480374A (ja) * 1990-07-23 1992-03-13 Nippondenso Co Ltd プリント配線板の製造方法
US5112434A (en) 1991-03-20 1992-05-12 Shipley Company Inc. Method for patterning electroless metal on a substrate followed by reactive ion etching
JP3222660B2 (ja) * 1993-10-26 2001-10-29 松下電工株式会社 基材表面の処理方法
JPH09186432A (ja) * 1995-12-28 1997-07-15 Hitachi Aic Inc プリント配線板の製造方法
AU6402900A (en) 1999-06-08 2000-12-28 Biomicro Systems, Inc. Laser ablation of doped fluorocarbon materials and applications thereof
JP4483017B2 (ja) 2000-04-19 2010-06-16 パナソニック電工株式会社 配線器具スイッチ部材
SG102588A1 (en) * 2000-08-03 2004-03-26 Inst Materials Research & Eng A process for modifying chip assembly substrates
IL138530A0 (en) 2000-09-18 2003-02-12 T L M Advanced Laser Technolog Method for the formation of a pattern on an insulating substrate
DE10143520A1 (de) 2001-09-05 2003-04-03 Siemens Dematic Ag Lösung und Verfahren zum Bearbeiten der Oberfläche von Kunststoffen, insbesondere von LCP-Substraten zur Verbesserung der Haftung von Metallisierungen und Verwendung einer derartigen Lösung
JP2003243807A (ja) * 2002-02-14 2003-08-29 Nec Kansai Ltd 配線基板及びその製造方法
JP4427262B2 (ja) * 2003-03-07 2010-03-03 財団法人近畿高エネルギー加工技術研究所 薄膜回路の形成方法
KR100543139B1 (ko) 2003-07-04 2006-01-20 한국기계연구원 전도성 패턴 형성 방법
DE10344511A1 (de) * 2003-09-24 2005-04-28 Mitsubishi Polyester Film Gmbh Orientierte, mittels elektromagnetischer Strahlung strukturierbare und mit Aminosilan beschichtete Folie aus thermoplastischem Polyester zur Herstellung selektiv metallisierter Folien
GB0402960D0 (en) 2004-02-10 2004-03-17 Plastic Logic Ltd Thermal imaging of catalyst in electroless deposition of metal films
JP2005240151A (ja) 2004-02-27 2005-09-08 Jsr Corp 金属膜形成方法
US7291380B2 (en) 2004-07-09 2007-11-06 Hewlett-Packard Development Company, L.P. Laser enhanced plating for forming wiring patterns
US20060083939A1 (en) 2004-10-20 2006-04-20 Dunbar Meredith L Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto
KR100653853B1 (ko) * 2005-05-24 2006-12-05 네오폴리((주)) 비금속 씨드 에피 성장을 이용한 비정질 반도체 박막의결정화 방법 및 이를 이용한 다결정 박막 트랜지스터의제조방법
KR101045149B1 (ko) * 2005-08-04 2011-06-30 가부시키가이샤 가네카 금속 피복 폴리이미드 필름
JP2007131875A (ja) 2005-11-08 2007-05-31 Fujifilm Corp 金属膜形成方法及び金属パターン形成方法
JP2007180089A (ja) * 2005-12-27 2007-07-12 Auto Network Gijutsu Kenkyusho:Kk 回路導体パターンを有する樹脂成形部品の製造方法
JP4478115B2 (ja) * 2006-01-27 2010-06-09 三共化成株式会社 導電性回路の形成方法
KR101309332B1 (ko) 2006-08-17 2013-09-16 주식회사 이엠따블유 플라스틱 사출물에 안테나 패턴을 형성하는 방법 및 그에의해 제조된 안테나 패턴을 포함하는 사출물
JP2008106345A (ja) * 2006-09-28 2008-05-08 Fujifilm Corp 導電性膜の形成方法、それを用いて形成された導電性膜、並びにプリント配線基板、薄層トランジスタ、及び装置
US20090202938A1 (en) 2008-02-08 2009-08-13 Celin Savariar-Hauck Method of improving surface abrasion resistance of imageable elements
JP4215816B1 (ja) 2008-05-26 2009-01-28 日本カラリング株式会社 レーザーマーキング多層シート
KR20090060209A (ko) * 2008-12-22 2009-06-11 현봉수 부분도금제품의 제조방법
JP5658435B2 (ja) 2009-03-31 2015-01-28 リンテック株式会社 マスクフィルム用部材、それを用いたマスクフィルムの製造方法及び感光性樹脂印刷版の製造方法
KR20100134356A (ko) 2009-06-15 2010-12-23 이봉구 미세 도전성 패턴의 제조방법
JP4996653B2 (ja) * 2009-07-10 2012-08-08 三共化成株式会社 成形回路部品の製造方法
KR100991105B1 (ko) 2009-10-23 2010-11-01 한국기계연구원 자기패턴된 전도성 패턴과 도금을 이용한 고전도도 미세패턴 형성방법
CN102409319B (zh) * 2009-12-30 2013-01-09 比亚迪股份有限公司 塑料制品的制备方法及塑料制品
CN102071424B (zh) 2010-02-26 2012-05-09 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
KR101124619B1 (ko) 2010-03-03 2012-03-20 한국원자력연구원 방사선을 이용한 고분자 재료 표면 위에 나노 재료 고정화 및 패턴 형성 방법
US8581104B2 (en) * 2010-03-31 2013-11-12 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
KR101049219B1 (ko) 2010-05-25 2011-07-13 한국기계연구원 레이저를 이용한 회로 형성 방법 및 그에 의하여 형성된 회로 기판
CN102071411B (zh) * 2010-08-19 2012-05-30 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
JP5022501B2 (ja) * 2010-11-04 2012-09-12 株式会社日本表面処理研究所 成形回路部品の製造方法
JP5731215B2 (ja) 2010-12-10 2015-06-10 三共化成株式会社 成形回路部品の製造方法
WO2012090980A1 (ja) 2010-12-27 2012-07-05 日本ゼオン株式会社 硬化性樹脂組成物、硬化物、表面処理硬化物、及び積層体
CN103547347A (zh) * 2011-02-16 2014-01-29 道康宁公司 涂覆多孔基材的方法
KR101297630B1 (ko) 2011-05-03 2013-08-19 주식회사 디지아이 레이저 직접 구조화용 조성물 및 이를 이용한 레이저 직접 구조화 방법
KR101263879B1 (ko) 2011-05-06 2013-05-13 주식회사 디지아이 레이저 직접 구조화를 위한 코팅 조성물 및 이를 이용한 레이저 직접 구조화 방법
WO2012157135A1 (ja) * 2011-05-17 2012-11-22 三共化成株式会社 成形回路基板の製造方法
JP5835947B2 (ja) 2011-05-30 2015-12-24 セーレン株式会社 金属膜パターンが形成された樹脂基材
KR20130023519A (ko) 2011-08-29 2013-03-08 도레이첨단소재 주식회사 도금입자 크기 및 에칭성을 이용한 세미 에디티브 연성동박적층 필름 및 그 제조방법
KR101377273B1 (ko) 2011-11-17 2014-03-26 한국기계연구원 레이저를 이용한 연성 회로 기판의 제조 시스템 및 그 제조 방법
JP2014058604A (ja) 2012-09-14 2014-04-03 Mitsubishi Engineering Plastics Corp 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
KR101250932B1 (ko) * 2013-02-01 2013-04-03 이도연 모바일기기의 안테나 및 그 제조방법
KR101339640B1 (ko) 2013-04-02 2013-12-09 김한주 레이저 직접 구조화 방법
KR20150018368A (ko) * 2013-08-09 2015-02-23 주식회사 엘지화학 전자기파의 직접 조사에 의한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
US9668342B2 (en) * 2013-09-27 2017-05-30 Lg Chem, Ltd. Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
KR101722744B1 (ko) 2014-10-23 2017-04-03 주식회사 엘지화학 전자기파 조사에 의한 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체

Also Published As

Publication number Publication date
KR101831885B1 (ko) 2018-02-23
EP3007183B1 (en) 2020-02-26
JP2016529714A (ja) 2016-09-23
CN105453190A (zh) 2016-03-30
EP3007182A1 (en) 2016-04-13
EP3007182B1 (en) 2020-06-24
KR20150018368A (ko) 2015-02-23
JP2016529713A (ja) 2016-09-23
CN105453190B (zh) 2018-01-02
JP6316961B2 (ja) 2018-04-25
EP3032548A4 (en) 2017-02-08
JP6162898B2 (ja) 2017-07-12
WO2015020332A1 (ko) 2015-02-12
KR20150018369A (ko) 2015-02-23
TWI565740B (zh) 2017-01-11
TW201524291A (zh) 2015-06-16
CN105474331A (zh) 2016-04-06
WO2015020456A1 (ko) 2015-02-12
CN105474330B (zh) 2017-12-05
JP2016533032A (ja) 2016-10-20
TW201525033A (zh) 2015-07-01
CN105474330A (zh) 2016-04-06
KR20150018382A (ko) 2015-02-23
CN105474331B (zh) 2017-12-05
JP6316962B2 (ja) 2018-04-25
EP3007182A4 (en) 2017-02-08
US20160194759A1 (en) 2016-07-07
EP3007183A4 (en) 2017-02-08
US10344385B2 (en) 2019-07-09
TWI563889B (en) 2016-12-21
KR101823660B1 (ko) 2018-01-30
WO2015020455A1 (ko) 2015-02-12
US20160201198A1 (en) 2016-07-14
US20160212860A1 (en) 2016-07-21
KR20160130371A (ko) 2016-11-11
EP3007183A1 (en) 2016-04-13
TW201527369A (zh) 2015-07-16
EP3032548A1 (en) 2016-06-15

Similar Documents

Publication Publication Date Title
TWI530515B (zh) 藉由電磁波的直接輻射而形成導電圖案的方法和在其上具有導電圖案之樹脂結構
TWI507467B (zh) 用於形成導電圖案之組成物和方法、及其上具有導電圖案的樹脂結構體
US10837114B2 (en) Composition for forming conductive pattern by irradiation of electromagnetic waves, method for forming conductive pattern using same, and resin structure having conductive pattern
JP2006210891A (ja) ポリイミド樹脂の無機薄膜パターン形成方法
JP5001550B2 (ja) ポリイミド樹脂の無機薄膜形成方法及び表面改質した無機薄膜形成用ポリイミド樹脂の製造方法
KR101752887B1 (ko) 전자기파의 직접 조사에 의한 도전성 패턴 형성 방법
KR20170048011A (ko) 수지 구조체 및 이의 제조 방법
JP2023054019A (ja) メッキ部品の製造方法及び基材の成形に用いられる金型
KR102010472B1 (ko) 전자기파의 직접 조사에 의한 도전성 패턴 형성 방법
KR20140128539A (ko) 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체