TWI524442B - 具有焊料凸塊的配線基板之製造方法、焊球搭載用遮罩 - Google Patents

具有焊料凸塊的配線基板之製造方法、焊球搭載用遮罩 Download PDF

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Publication number
TWI524442B
TWI524442B TW100108462A TW100108462A TWI524442B TW I524442 B TWI524442 B TW I524442B TW 100108462 A TW100108462 A TW 100108462A TW 100108462 A TW100108462 A TW 100108462A TW I524442 B TWI524442 B TW I524442B
Authority
TW
Taiwan
Prior art keywords
mask
substrate
solder
solder ball
wiring board
Prior art date
Application number
TW100108462A
Other languages
English (en)
Chinese (zh)
Other versions
TW201212136A (en
Inventor
Takuya Hando
Seiji Mori
Motonobu Kurahashi
Original Assignee
Ngk Spark Plug Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ngk Spark Plug Co filed Critical Ngk Spark Plug Co
Publication of TW201212136A publication Critical patent/TW201212136A/zh
Application granted granted Critical
Publication of TWI524442B publication Critical patent/TWI524442B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW100108462A 2010-03-15 2011-03-14 具有焊料凸塊的配線基板之製造方法、焊球搭載用遮罩 TWI524442B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010056935A JP5479959B2 (ja) 2010-03-15 2010-03-15 はんだバンプを有する配線基板の製造方法、はんだボール搭載用マスク

Publications (2)

Publication Number Publication Date
TW201212136A TW201212136A (en) 2012-03-16
TWI524442B true TWI524442B (zh) 2016-03-01

Family

ID=44797397

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100108462A TWI524442B (zh) 2010-03-15 2011-03-14 具有焊料凸塊的配線基板之製造方法、焊球搭載用遮罩

Country Status (3)

Country Link
JP (1) JP5479959B2 (ja)
KR (1) KR20110103876A (ja)
TW (1) TWI524442B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102270748B1 (ko) 2013-11-07 2021-06-30 삼성전자주식회사 솔더볼 부착 장치, 솔더볼 부착 방법 및 이를 포함하는 반도체 패키지의 제조 방법
WO2023007543A1 (ja) * 2021-07-26 2023-02-02 株式会社ボンマーク ボール配列マスク及びボール配列マスクの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4822128B2 (ja) * 2007-01-30 2011-11-24 澁谷工業株式会社 ボール配列マスクの支持装置
JP5270192B2 (ja) * 2007-04-16 2013-08-21 アスリートＦａ株式会社 マスクおよびこのマスクを用いた基板の製造方法

Also Published As

Publication number Publication date
TW201212136A (en) 2012-03-16
KR20110103876A (ko) 2011-09-21
JP2011192767A (ja) 2011-09-29
JP5479959B2 (ja) 2014-04-23

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MM4A Annulment or lapse of patent due to non-payment of fees