KR20110103876A - 솔더 범프를 가지는 배선기판의 제조방법 및 솔더 볼 탑재용 마스크 - Google Patents

솔더 범프를 가지는 배선기판의 제조방법 및 솔더 볼 탑재용 마스크 Download PDF

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Publication number
KR20110103876A
KR20110103876A KR1020110022374A KR20110022374A KR20110103876A KR 20110103876 A KR20110103876 A KR 20110103876A KR 1020110022374 A KR1020110022374 A KR 1020110022374A KR 20110022374 A KR20110022374 A KR 20110022374A KR 20110103876 A KR20110103876 A KR 20110103876A
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KR
South Korea
Prior art keywords
mask
substrate
solder
solder ball
ball mounting
Prior art date
Application number
KR1020110022374A
Other languages
English (en)
Korean (ko)
Inventor
다쿠야 한도
세이지 모리
모토노부 구라하시
Original Assignee
니혼도꾸슈도교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 니혼도꾸슈도교 가부시키가이샤 filed Critical 니혼도꾸슈도교 가부시키가이샤
Publication of KR20110103876A publication Critical patent/KR20110103876A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020110022374A 2010-03-15 2011-03-14 솔더 범프를 가지는 배선기판의 제조방법 및 솔더 볼 탑재용 마스크 KR20110103876A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010056935A JP5479959B2 (ja) 2010-03-15 2010-03-15 はんだバンプを有する配線基板の製造方法、はんだボール搭載用マスク
JPJP-P-2010-056935 2010-03-15

Publications (1)

Publication Number Publication Date
KR20110103876A true KR20110103876A (ko) 2011-09-21

Family

ID=44797397

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110022374A KR20110103876A (ko) 2010-03-15 2011-03-14 솔더 범프를 가지는 배선기판의 제조방법 및 솔더 볼 탑재용 마스크

Country Status (3)

Country Link
JP (1) JP5479959B2 (ja)
KR (1) KR20110103876A (ja)
TW (1) TWI524442B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102270748B1 (ko) 2013-11-07 2021-06-30 삼성전자주식회사 솔더볼 부착 장치, 솔더볼 부착 방법 및 이를 포함하는 반도체 패키지의 제조 방법
WO2023007543A1 (ja) * 2021-07-26 2023-02-02 株式会社ボンマーク ボール配列マスク及びボール配列マスクの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4822128B2 (ja) * 2007-01-30 2011-11-24 澁谷工業株式会社 ボール配列マスクの支持装置
JP5270192B2 (ja) * 2007-04-16 2013-08-21 アスリートＦａ株式会社 マスクおよびこのマスクを用いた基板の製造方法

Also Published As

Publication number Publication date
JP2011192767A (ja) 2011-09-29
TWI524442B (zh) 2016-03-01
TW201212136A (en) 2012-03-16
JP5479959B2 (ja) 2014-04-23

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