TWI496871B - 製造螢光體的方法及包含此螢光體的發光裝置 - Google Patents

製造螢光體的方法及包含此螢光體的發光裝置 Download PDF

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Publication number
TWI496871B
TWI496871B TW099142300A TW99142300A TWI496871B TW I496871 B TWI496871 B TW I496871B TW 099142300 A TW099142300 A TW 099142300A TW 99142300 A TW99142300 A TW 99142300A TW I496871 B TWI496871 B TW I496871B
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TW
Taiwan
Prior art keywords
fluorescent material
solution
nano
light
producing
Prior art date
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TW099142300A
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English (en)
Chinese (zh)
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TW201137087A (en
Inventor
宋潤秀
李相爀
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Ｌｇ伊諾特股份有限公司
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Application filed by Ｌｇ伊諾特股份有限公司 filed Critical Ｌｇ伊諾特股份有限公司
Publication of TW201137087A publication Critical patent/TW201137087A/zh
Application granted granted Critical
Publication of TWI496871B publication Critical patent/TWI496871B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77342—Silicates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
TW099142300A 2009-12-04 2010-12-06 製造螢光體的方法及包含此螢光體的發光裝置 TWI496871B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090120181A KR101072162B1 (ko) 2009-12-04 2009-12-04 형광체 제조방법 및 상기 형광체를 포함하는 발광장치

Publications (2)

Publication Number Publication Date
TW201137087A TW201137087A (en) 2011-11-01
TWI496871B true TWI496871B (zh) 2015-08-21

Family

ID=43587510

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099142300A TWI496871B (zh) 2009-12-04 2010-12-06 製造螢光體的方法及包含此螢光體的發光裝置

Country Status (6)

Country Link
US (1) US8465798B2 (enExample)
EP (1) EP2330172B1 (enExample)
JP (1) JP5903212B2 (enExample)
KR (1) KR101072162B1 (enExample)
CN (1) CN102154002B (enExample)
TW (1) TWI496871B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101400343B1 (ko) * 2012-02-10 2014-05-30 한국광기술원 상온 선택적 전극 보호 수용성 수지가 적용된 전극 노출형 침전 및 증발형 용제가 포함된 형광체 제조방법과 형광체 코팅층이 형성된 ｌｅｄ 제조방법
KR101945808B1 (ko) * 2012-08-06 2019-02-08 엘지이노텍 주식회사 발광 소자 및 발광 소자 패키지
TWI484664B (zh) * 2012-09-11 2015-05-11 Brightek Optoelectronic Co Ltd 螢光粉粒子之塗佈方法
TWI484669B (zh) * 2012-09-11 2015-05-11 Brightek Optoelectronic Co Ltd 發光元件之封裝方法
CN108689712B (zh) * 2018-06-26 2020-10-09 镭米光学科技（宁波）有限公司 一体式复合陶瓷荧光体及其制备方法

Citations (3)

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US4208448A (en) * 1978-10-27 1980-06-17 Westinghouse Electric Corp. Method for improving the performance of low pressure fluorescent discharge lamp which utilizes zinc silicate as a phosphor blend constituent
CN1770491A (zh) * 2004-09-02 2006-05-10 株式会社东芝 半导体发光器件
CN1840606A (zh) * 2005-03-31 2006-10-04 通用电气公司 制备磷光体的方法

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JP2514423B2 (ja) * 1989-03-15 1996-07-10 日亜化学工業株式会社 二酸化ケイ素でコ―ティングされた蛍光体の製造方法
JP3189626B2 (ja) 1994-09-09 2001-07-16 双葉電子工業株式会社 表示装置
JPH09255951A (ja) * 1996-03-25 1997-09-30 Kasei Optonix Co Ltd 青色発光蛍光体
JPH11256149A (ja) * 1998-03-16 1999-09-21 Matsushita Electric Ind Co Ltd 赤色蛍光体とこれを用いた蛍光ランプ
US6313578B1 (en) 1998-09-28 2001-11-06 Osram Sylvania Inc. Phosphor coating for gas discharge lamps and lamp containing same
KR100791564B1 (ko) * 1999-12-21 2008-01-03 삼성에스디아이 주식회사 희토류 산화물이 코팅된 형광체 및 그의 제조방법
US6531074B2 (en) * 2000-01-14 2003-03-11 Osram Sylvania Inc. Luminescent nanophase binder systems for UV and VUV applications
JP2002038150A (ja) * 2000-07-26 2002-02-06 Toshiba Corp 真空紫外線励起蛍光体およびそれを用いた発光装置
JP2002038148A (ja) * 2000-07-26 2002-02-06 Toshiba Corp 緑色蛍光体とその製造方法、およびそれを用いた発光装置
KR100768177B1 (ko) 2001-03-13 2007-10-17 삼성에스디아이 주식회사 나노크기의 형광체가 부착된 형광체, 그의 제조방법 및이를 이용하여 제조된 음극선관
KR100717936B1 (ko) 2005-02-01 2007-05-11 주식회사 엘지화학 Ｂｌｕ 용 램프의 상하 색편차 개선을 위한 흐름성이우수한 신규 청색 형광체의 제조방법 및 그로부터 제조된청색 형광체
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4208448A (en) * 1978-10-27 1980-06-17 Westinghouse Electric Corp. Method for improving the performance of low pressure fluorescent discharge lamp which utilizes zinc silicate as a phosphor blend constituent
CN1770491A (zh) * 2004-09-02 2006-05-10 株式会社东芝 半导体发光器件
CN1840606A (zh) * 2005-03-31 2006-10-04 通用电气公司 制备磷光体的方法

Also Published As

Publication number Publication date
US20110133630A1 (en) 2011-06-09
KR101072162B1 (ko) 2011-10-10
KR20110063221A (ko) 2011-06-10
US8465798B2 (en) 2013-06-18
EP2330172A1 (en) 2011-06-08
CN102154002A (zh) 2011-08-17
EP2330172B1 (en) 2017-06-28
TW201137087A (en) 2011-11-01
CN102154002B (zh) 2015-12-16
JP5903212B2 (ja) 2016-04-13
JP2011116985A (ja) 2011-06-16

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