KR100869694B1 - 발광 장치 - Google Patents
발광 장치 Download PDFInfo
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- KR100869694B1 KR100869694B1 KR1020060074063A KR20060074063A KR100869694B1 KR 100869694 B1 KR100869694 B1 KR 100869694B1 KR 1020060074063 A KR1020060074063 A KR 1020060074063A KR 20060074063 A KR20060074063 A KR 20060074063A KR 100869694 B1 KR100869694 B1 KR 100869694B1
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- light emitting
- powder layer
- fluorescent
- fluorescent powder
- liquid
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
LED 번호 | 구동 조건 1 | 구동 조건 2 | ||
제조 방법 | 종래 방법 | 본 발명 | 종래 방법 | 본 발명 |
1 | X=0.28 Y=0.28 | X=0.28 Y=0.28 | X=0.36 Y=0.32 | X=0.28 Y=0.28 |
2 | X=0.30 Y=0.26 | X=0.28 Y=0.28 | X=0.38 Y=0.34 | X=0.28 Y=0.28 |
3 | X=0.29 Y=0.27 | X=0.28 Y=0.28 | X=0.42 Y=0.36 | X=0.28 Y=0.28 |
4 | X=0.24 Y=0.24 | X=0.28 Y=0.28 | X=0.36 Y=0.38 | X=0.28 Y=0.28 |
5 | X=0.27 Y=0.25 | X=0.28 Y=0.28 | X=0.38 Y=0.33 | X=0.28 Y=0.28 |
LED 번호 | 구동 조건 1 | 구동 조건 2 | ||
제조 방법 | 종래 방법 | 본 발명 | 종래 방법 | 본 발명 |
1 | 8800 mcd | 9500 mcd | 3500 mcd | 8500 mcd |
2 | 9400 mcd | 10500 mcd | 3200 mcd | 8000 mcd |
3 | 9200 mcd | 10200 mcd | 2700 mcd | 7500 mcd |
4 | 9800 mcd | 12100 mcd | 4000 mcd | 9500 mcd |
5 | 9500 mcd | 11200 mcd | 3700 mcd | 9000 mcd |
Claims (11)
- 발광 장치에 있어서,발광 반도체 장치; 및접착 재료를 사용하거나 포함하지 않고 분자 상호작용 인력에 의해 응고되는 복수의 형광 입자들을 포함하며, 상기 발광 반도체 장치의 광로 상에 배치되는 형광 분말층;을 포함하는, 발광 장치.
- 삭제
- 제 1 항에 있어서,상기 접착 재료는 수지, 유기 폴리머 및 글라스 아교(glass glue)로 이루어진 그룹으로부터 선택된 하나를 포함하는, 발광 장치.
- 제 1 항에 있어서,적어도 상기 형광 분말층의 상면을 덮는 제 1 패시베이션을 더 포함하는, 발광 장치.
- 제 4 항에 있어서,적어도 상기 제 1 패시베이션 및 상기 형광 분말층을 덮는 제 2 패시베이션을 더 포함하는, 발광 장치.
- 제 5 항에 있어서,상기 제 2 패시베이션은 상기 제 1 패시베이션보다 더 두꺼운, 발광 장치.
- 제 1 항에 있어서,상기 형광 입자들은 분말 형광체들인, 발광 장치.
- 제 1 항에 있어서,상기 형광 분말층은,상기 발광 반도체 장치에 부착되며,상기 형광 분말층은,어떠한 접착 재료의 사용 없이 복수의 형광 입자들을 액체에 분산시켜 혼합물을 형성하고, 상기 혼합물이 일정 시간 동안 기판 표면을 덮도록 하며, 상기 형광 입자들이 상기 기판 표면에 달라붙어 형광 분말층이 되도록 상기 액체를 제거하여 상기 형광 입자들을 분자 상호작용 인력에 의해 응고시킴으로써 형성되는, 발광 장치.
- 제 1 항에 있어서,상기 발광 반도체 장치는 기판, 상기 기판 상의 복수의 반도체층들, 및 상기 복수의 반도체층들 상의 도전층을 포함하고,상기 형광 분말층은 상기 기판, 상기 복수의 반도체층들 또는 상기 도전층 중 하나에 부착되는, 발광 장치.
- 제 9 항에 있어서,상기 도전층은 투명 도전성 재료로 만들어지는, 발광 장치.
- 발광 장치 패키지 구조에 있어서,한쌍의 전극;상기 한쌍의 전극을 전기 접속하는 리드 프레임;상기 리드 프레임에 고정되며 발광 반도체 장치 및 형광 분말층을 포함하는 발광 장치; 및상기 리드 프레임 및 상기 발광 반도체 장치를 캡슐화하는 패키지 재료;를 포함하며,상기 형광 분말층은,어떠한 접착 재료의 사용 없이 복수의 형광 입자들을 액체에 분산시켜 혼합물을 형성하고, 상기 혼합물이 일정 시간 동안 기판 표면을 덮도록 하며, 상기 형광 입자들이 상기 기판 표면에 달라붙어 형광 분말층이 되도록 상기 액체를 제거하여 상기 형광 입자들을 분자 상호작용 인력에 의해 응고시킴으로써 형성되는 발광 장치 패키지 구조.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93104058 | 2004-02-19 | ||
TW93104058 | 2004-02-19 |
Related Parent Applications (1)
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KR20050004484U Division KR200392877Y1 (ko) | 2004-02-19 | 2005-02-19 | 발광 장치 |
Publications (2)
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KR20060097680A KR20060097680A (ko) | 2006-09-14 |
KR100869694B1 true KR100869694B1 (ko) | 2008-11-21 |
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KR1020060074063A KR100869694B1 (ko) | 2004-02-19 | 2006-08-07 | 발광 장치 |
KR1020060099461A KR100990337B1 (ko) | 2004-02-19 | 2006-10-12 | 발광 장치 제조 장비 |
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KR1020060099461A KR100990337B1 (ko) | 2004-02-19 | 2006-10-12 | 발광 장치 제조 장비 |
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US (2) | US7749038B2 (ko) |
JP (2) | JP4329938B2 (ko) |
KR (2) | KR100869694B1 (ko) |
DE (1) | DE202005002110U1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2011105858A2 (ko) | 2010-02-25 | 2011-09-01 | (주)라이타이저코리아 | 발광 다이오드 및 그 제조방법 |
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KR100658970B1 (ko) | 2006-01-09 | 2006-12-19 | 주식회사 메디아나전자 | 복합 파장의 광을 발생시키는 발광 다이오드 소자 |
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US7846391B2 (en) * | 2006-05-22 | 2010-12-07 | Lumencor, Inc. | Bioanalytical instrumentation using a light source subsystem |
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KR100818518B1 (ko) * | 2007-03-14 | 2008-03-31 | 삼성전기주식회사 | Led 패키지 |
US7709811B2 (en) * | 2007-07-03 | 2010-05-04 | Conner Arlie R | Light emitting diode illumination system |
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US8389957B2 (en) | 2011-01-14 | 2013-03-05 | Lumencor, Inc. | System and method for metered dosage illumination in a bioanalysis or other system |
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US8967846B2 (en) | 2012-01-20 | 2015-03-03 | Lumencor, Inc. | Solid state continuous white light source |
US9217561B2 (en) | 2012-06-15 | 2015-12-22 | Lumencor, Inc. | Solid state light source for photocuring |
CN103151434B (zh) * | 2013-02-25 | 2016-04-27 | 上舜电子科技(中国)有限公司 | 一种改善led封装荧光粉分布均匀性的方法 |
EP3188260B1 (en) * | 2015-12-31 | 2020-02-12 | Dow Global Technologies Llc | Nanostructure material structures and methods |
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CN113287207A (zh) * | 2018-09-28 | 2021-08-20 | 江苏新云汉光电科技有限公司 | 一种led灯及其增加流明的方法 |
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Also Published As
Publication number | Publication date |
---|---|
KR100990337B1 (ko) | 2010-10-29 |
US20050184651A1 (en) | 2005-08-25 |
JP4329938B2 (ja) | 2009-09-09 |
DE202005002110U1 (de) | 2005-05-04 |
KR20060097680A (ko) | 2006-09-14 |
JP2005236302A (ja) | 2005-09-02 |
US20100270910A1 (en) | 2010-10-28 |
JP2008258659A (ja) | 2008-10-23 |
KR20070009947A (ko) | 2007-01-19 |
US7749038B2 (en) | 2010-07-06 |
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