EP2330172A1 - Method for manufacturing phosphor and light emitting device comprising the phosphor - Google Patents
Method for manufacturing phosphor and light emitting device comprising the phosphor Download PDFInfo
- Publication number
- EP2330172A1 EP2330172A1 EP20100193699 EP10193699A EP2330172A1 EP 2330172 A1 EP2330172 A1 EP 2330172A1 EP 20100193699 EP20100193699 EP 20100193699 EP 10193699 A EP10193699 A EP 10193699A EP 2330172 A1 EP2330172 A1 EP 2330172A1
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- EP
- European Patent Office
- Prior art keywords
- fluorescent material
- solution
- nano
- light emitting
- putting
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title 2
- 239000000463 material Substances 0.000 claims abstract description 133
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- 239000006228 supernatant Substances 0.000 claims abstract description 9
- 238000001035 drying Methods 0.000 claims abstract description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000000354 decomposition reaction Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 claims description 3
- 229910000368 zinc sulfate Inorganic materials 0.000 claims description 3
- 239000011686 zinc sulphate Substances 0.000 claims description 3
- 239000002105 nanoparticle Substances 0.000 description 6
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 4
- 238000013019 agitation Methods 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 229920010524 Syndiotactic polystyrene Polymers 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920006375 polyphtalamide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000004954 Polyphthalamide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- -1 i.e. Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- ACWBQPMHZXGDFX-QFIPXVFZSA-N valsartan Chemical class C1=CC(CN(C(=O)CCCC)[C@@H](C(C)C)C(O)=O)=CC=C1C1=CC=CC=C1C1=NN=NN1 ACWBQPMHZXGDFX-QFIPXVFZSA-N 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Definitions
- the present invention relates to a method for manufacturing fluorescent body and a light emitting device including the fluorescent body manufactured by the manufacturing method.
- a light emitting diode (hereinafter, referred to as LED) can be used to configure a light emitting source by using a compound semiconductor material such as GaAs-based, AlGaAs-based, GaN-based, InGaN-based and InGaAIP-based material.
- Said LED is packaged and used as a light emitting device emitting various colors.
- the light emitting device is now used as a light source for many fields, for example, a lighting indicator, a character indicator and an image viewer which display colors.
- One aspect of this invention is a method for manufacturing a fluorescent material.
- the method includes:
- the first solution is at least one selected from the group consisting of DI water, ethanol, acetone, methanol and isopropyl alcohol.
- the method Prior to putting the fluorescent material into the first solution and agitating the fluorescent material and the first solution, the method further includes heating and agitating the first solution until the temperature of the first solution reaches a predetermined temperature.
- the putting the fluorescent material into the first solution and agitating the fluorescent material and the first solution includes heating and agitating such that the temperature of the solution does not fall below a predetermined temperature.
- the light emitting device includes:
- Fig. 1 is a view showing a light emitting device of the present invention.
- a light emitting device 100 includes a package body 110, a light emitting element 120, a resin 125 and lead frames 132 and 134.
- the package body (110) is injected-molded in a predetermined shape by using at least one selected from the group consisting of PPA(Polyphthalamide), LCP(Liquid Crystal Polymer) and SPS(Syndiotactic polystyrene).
- a cavity 115 is formed having a constant depth in the upper part 112 of the package body 110.
- the circumference of the cavity 115 may be formed inclined at a predetermined angle with respect to an axis perpendicular to the bottom surface of the cavity 115.
- a plurality of the lead frames 132 and 134 are horizontally formed in the package body 110.
- the cavity having a shape of a reflective cup is formed on the upper part of the package body 110.
- the plurality of the lead frames 132 and 134 are exposed inside the cavity 115 and are electrically disconnected. Both ends of the plurality of the lead frames 132 and 134 are exposed to the outside of the package body 110 and are used as an electrode.
- a reflective material may be coated on the surfaces of the lead frames 132 and 134.
- the light emitting element 120 is die-bonded to a first lead frame 132 among the plurality of the lead frames 132 and 134.
- the light emitting element 120 is connected to the first lead frame 132 and a second lead frame 134 by means of a wire 122.
- the light emitting element 120 may correspond to at least one of colored light emitting diodes, for example, at least one selected from the group consisting of a red light emitting diode, a green light emitting diode, a blue light emitting diode and ultraviolet (UV) light emitting diode.
- a red light emitting diode for example, at least one selected from the group consisting of a red light emitting diode, a green light emitting diode, a blue light emitting diode and ultraviolet (UV) light emitting diode.
- UV ultraviolet
- the resin 125 is formed in the area of the cavity 115.
- the resin 125 includes a transparent silicon material or epoxy material.
- Fluorescent material 140 is added to the resin 125.
- the fluorescent material 140 may correspond to a silicate based fluorescent material. Particularly, nano-sized fluorescent materials are formed on a part of the surface of the fluorescent material 140.
- a convex lens may be formed on the resin 125.
- a protective device such as a zener diode for protecting the light emitting element 120 may be mounted on the plurality of the lead frames 132 and 134.
- the fluorescent material 140 added to the resin 125 may include many cracks 200 formed on the surface of the fluorescent material 140 (see Fig. 2 ).
- a plurality of the cracks having a shape depressed by a predetermined depth may be formed on the surface of the fluorescent material.
- the nano-sized fluorescent material is added to the fluorescent material in which the crack is formed such that the crack is filled with the nano-sized fluorescent material, i.e., nano-sized fluorescent powder (hereinafter, briefly referred to as a nano fluorescent material). That is, as shown in Fig. 3 , the cracks formed on the surface of the fluorescent material 140 are coated with or filled with sphere-shaped nano fluorescent material 300, so that it is possible to reduce the optical scattering caused by the cracks.
- the nano fluorescent material 300 may be formed by using a thermo spray decomposition method.
- the nano fluorescent material 300 having the same color and quality may be used as nano particles for smoothly filling the irregular structure of the fluorescent material 140.
- the nano fluorescent material 300 may include silicon based fluorescent material which is the same as fluorescer, for example, SrBaSiO:Eu.
- SrBaSiO:Eu silicon based fluorescent material which is the same as fluorescer
- the nano fluorescent material 300 and the fluorescent material 140 are attached to each other by van der vals force. As a result, luminous efficiency may be improved by as much as 20% to 30%.
- the sphere-shaped nano fluorescent material and a method of coating the nano fluorescent material on the surface (in particular, the crack) of the fluorescent material 140 will be described in detail.
- Figs. 4 to 8 are views describing a method for manufacturing the fluorescent material in accordance with the embodiment of the present invention.
- agitator 410 and a beaker 430 being placed on the agitator and receiving solution. DI water solution 401 is put into the beaker 430 and a magnetic bar 420 is put into the beaker 430. Then, the agitator 410 is turned on.
- the magnetic bar 420 may not be fixed by a constituent such as an axis of rotation.
- the agitator 410 rotating the magnetic bar 420 does not contact with the magnetic bar 420 and is able to function as a magnetic agitator which rotates the magnetic bar 420 by applying a magnetic force from the outside.
- the magnetic agitator generates a rotating magnetic force by using a rotating electromagnet.
- a magnetic body (magnetic bar) external from the agitator is able to rotate by receiving the applied magnetic force.
- the agitator 410 is operated.
- the DI water 401 and the magnetic bar 420 are heated and agitated until the temperature of the DI water 401 reaches a predetermined temperature.
- the predetermined temperature is required to be about 50 degrees Celsius.
- ethanol, acetone, methanol and isopropyl alcohol and the like can be used instead of the DI water 401.
- more various solutions can be used according to embodiments.
- a fluorescent material 510 is put into the DI water 401 and is additionally agitated for about 30 minutes.
- the fluorescent material 510 may be composed of a silicate based material and have a mean particle diameter of 15 ⁇ m. However, since the size and kind of the fluorescent material can be variously changed according to a fluorescent material to be manufactured, more detailed description thereof will be omitted.
- the DI water 401 and the fluorescent material 510 are mixed in the beaker 430.
- a nano fluorescent material 610 is put into the beaker 430 and agitated.
- the nano fluorescent material 610 is composed of a fluorescent material having a size of from 100 nm to 400 nm. Through a thermo spray decomposition process, the nano fluorescent material having a nano size may be formed. If the size of the nano fluorescent material 610 is less than 100 nm, luminance may be deteriorated.
- the nano fluorescent material 610 is composed of a fluorescent material having the same color as that of the foregoing fluorescent material 510.
- the fluorescent material 510 is a yellow silicate fluorescent material
- the nano fluorescent material 610 is also formed of the yellow silicate fluorescent material. This intends that light having the same color is emitted through the resin to which the fluorescent material 510 is added, because the nano fluorescent material 610 is coated on the surface of the fluorescent material 510.
- 10gram of the nano fluorescent material 610 is put into the beaker 430.
- a predetermined amount of acetic acid is put into the beaker 430.
- 1Ml of the acetic acid together with the nano fluorescent material 610 are put into the beaker 430.
- the temperature of the solution in the beaker 430 should not be equal to or less than a predetermined temperature, preferably, about 50 degrees Celsius.
- the agitation is performed for about one hour.
- a person performing the embodiment checks the fluorescent material distribution, while checking the beaker 430.
- the reason why the acetic acid is put is that the nano fluorescent material 610 is well adsorbed into the cracks by etching the rough surface of the fluorescent material 510.
- Any solution capable of etching the surface of the fluorescent material 510, as well as the acetic acid can be variously used according to embodiments.
- a heater of the agitator 410 is turned off and the temperature of the solution of the beaker 430 is reduced.
- ZnSO 4 solution of 10% is put into the beaker 430 and more agitation is performed for about one hour.
- the reason why ZnSO 4 solution is put is that electrostatic force between particles of the solution is increased by ionizing the solution in the beaker 430, so that the nano fluorescent material 610 is better adsorbed on the surface of the fluorescent material 510.
- the agitator 410 is stopped and distribution state of the solution is checked. In other words, supernatant on the fluorescent material is checked whether it becomes transparent or not.
- the supernatant 810 is checked whether it becomes transparent or not and the agitation time may be increased or decreased according to the transparency of the supernatant 810. If the supernatant 810 becomes transparent (the transparency at this time can be variously determined according to embodiments or a person performing the embodiment), this means that the nano fluorescent material 610 is well adsorbed on the surface of the fluorescent material 510. Accordingly, the supernatant 810 is separated from a solution 820 including the fluorescent material. Here, it is possible to separate the supernatant 810 from the solution 820 including the fluorescent material by using a rotary pump. After the separation, the solution 820 including the fluorescent material is dried.
- the manufactured fluorescent material 510 corresponds to the fluorescent material 140 shown in Fig. 1 .
- Light emitted from the light emitting element 120 passes through a fluorescent material having a much reduced roughness of its surface, thereby reducing luminous efficiency degradation caused by light scatter.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Abstract
putting the fluorescent material into a first solution, and agitating the fluorescent material and the first solution;
putting a nano fluorescent material having a nano size into the first solution, and agitating the nano fluorescent material having a nano size and the first solution; and
separating supernatant from the first solution including the fluorescent material, and drying the fluorescent material.
Disclosed is a light emitting device. The light emitting device includes:
a body;
a light emitting element mounted on a cavity formed in the body;
a resin formed in the cavity; and
a fluorescent material added to the resin,
wherein a nano fluorescent material having a nano size is adsorbed in the fluorescent material.
Description
- The present invention relates to a method for manufacturing fluorescent body and a light emitting device including the fluorescent body manufactured by the manufacturing method.
- A light emitting diode (hereinafter, referred to as LED) can be used to configure a light emitting source by using a compound semiconductor material such as GaAs-based, AlGaAs-based, GaN-based, InGaN-based and InGaAIP-based material.
- Said LED is packaged and used as a light emitting device emitting various colors. The light emitting device is now used as a light source for many fields, for example, a lighting indicator, a character indicator and an image viewer which display colors.
- One aspect of this invention is a method for manufacturing a fluorescent material. The method includes:
- putting the fluorescent material into a first solution, and agitating the fluorescent material and the first solution;
- putting a nano fluorescent material having a nano size into the first solution, and agitating the nano fluorescent material having a nano size and the first solution; and
- separating supernatant from the first solution including the fluorescent material, and drying the fluorescent material.
- The first solution is at least one selected from the group consisting of DI water, ethanol, acetone, methanol and isopropyl alcohol.
- Prior to putting the fluorescent material into the first solution and agitating the fluorescent material and the first solution, the method further includes heating and agitating the first solution until the temperature of the first solution reaches a predetermined temperature.
- The putting the fluorescent material into the first solution and agitating the fluorescent material and the first solution includes heating and agitating such that the temperature of the solution does not fall below a predetermined temperature.
- Another aspect of this invention is a light emitting device. The light emitting device includes:
- a body;
- a light emitting element mounted on a cavity formed in the body;
- a resin formed in the cavity; and
- a fluorescent material added to the resin,
-
-
Fig. 1 is a view showing a light emitting device of the present invention. -
Fig. 2 is a view showing that a crack is created on the surface of a fluorescent material. -
Fig. 3 is a view showing that nano-fluorescent material is adsorbed in the crack on the surface of the fluorescent material in accordance with an embodiment of the present invention. -
Figs. 4 to 8 are views describing a method for manufacturing the fluorescent material in accordance with the embodiment of the present invention. - Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. Items disclosed in the embodiment determine the sprit and scope of the present invention. The spirit of the embodiment includes changes and modification of the embodiment by means of addition, elimination and change of the components of the present invention.
-
Fig. 1 is a view showing a light emitting device of the present invention. - Referring to
Fig. 1 , alight emitting device 100 includes apackage body 110, a light emitting element 120, aresin 125 andlead frames - The package body (110) is injected-molded in a predetermined shape by using at least one selected from the group consisting of PPA(Polyphthalamide), LCP(Liquid Crystal Polymer) and SPS(Syndiotactic polystyrene). A
cavity 115 is formed having a constant depth in theupper part 112 of thepackage body 110. The circumference of thecavity 115 may be formed inclined at a predetermined angle with respect to an axis perpendicular to the bottom surface of thecavity 115. - A plurality of the
lead frames package body 110. The cavity having a shape of a reflective cup is formed on the upper part of thepackage body 110. - The plurality of the
lead frames cavity 115 and are electrically disconnected. Both ends of the plurality of thelead frames package body 110 and are used as an electrode. A reflective material may be coated on the surfaces of thelead frames - The light emitting element 120 is die-bonded to a
first lead frame 132 among the plurality of thelead frames first lead frame 132 and asecond lead frame 134 by means of awire 122. - The light emitting element 120 may correspond to at least one of colored light emitting diodes, for example, at least one selected from the group consisting of a red light emitting diode, a green light emitting diode, a blue light emitting diode and ultraviolet (UV) light emitting diode.
- The
resin 125 is formed in the area of thecavity 115. Theresin 125 includes a transparent silicon material or epoxy material.Fluorescent material 140 is added to theresin 125. Thefluorescent material 140 may correspond to a silicate based fluorescent material. Particularly, nano-sized fluorescent materials are formed on a part of the surface of thefluorescent material 140. - A convex lens may be formed on the
resin 125. A protective device such as a zener diode for protecting the light emitting element 120 may be mounted on the plurality of thelead frames - The
fluorescent material 140 added to theresin 125 may includemany cracks 200 formed on the surface of the fluorescent material 140 (seeFig. 2 ). In a conventional method for manufacturing the fluorescent material, a plurality of the cracks having a shape depressed by a predetermined depth may be formed on the surface of the fluorescent material. When the fluorescent material having such cracks formed therein is added as it is to theresin 125, light emitted from the light emitting element 120 is irregularly scattered through the cracks, which deteriorates optical characteristics. - The nano-sized fluorescent material is added to the fluorescent material in which the crack is formed such that the crack is filled with the nano-sized fluorescent material, i.e., nano-sized fluorescent powder (hereinafter, briefly referred to as a nano fluorescent material). That is, as shown in
Fig. 3 , the cracks formed on the surface of thefluorescent material 140 are coated with or filled with sphere-shaped nanofluorescent material 300, so that it is possible to reduce the optical scattering caused by the cracks. The nanofluorescent material 300 may be formed by using a thermo spray decomposition method. - The nano
fluorescent material 300 having the same color and quality may be used as nano particles for smoothly filling the irregular structure of thefluorescent material 140. The nanofluorescent material 300 may include silicon based fluorescent material which is the same as fluorescer, for example, SrBaSiO:Eu. When nanofluorescent material 300 which are formed of the same material and in the same manner are used, the nanofluorescent material 300 and thefluorescent material 140 are attached to each other by van der vals force. As a result, luminous efficiency may be improved by as much as 20% to 30%. - Hereinafter, in accordance with the embodiment of the present invention, the sphere-shaped nano fluorescent material and a method of coating the nano fluorescent material on the surface (in particular, the crack) of the
fluorescent material 140 will be described in detail. -
Figs. 4 to 8 are views describing a method for manufacturing the fluorescent material in accordance with the embodiment of the present invention. - Referring to
Fig. 4 , provided are anagitator 410 and abeaker 430 being placed on the agitator and receiving solution.DI water solution 401 is put into thebeaker 430 and amagnetic bar 420 is put into thebeaker 430. Then, theagitator 410 is turned on. - The
magnetic bar 420 may not be fixed by a constituent such as an axis of rotation. Theagitator 410 rotating themagnetic bar 420 does not contact with themagnetic bar 420 and is able to function as a magnetic agitator which rotates themagnetic bar 420 by applying a magnetic force from the outside. Here, the magnetic agitator generates a rotating magnetic force by using a rotating electromagnet. When the generated magnetic force is applied outwardly, a magnetic body (magnetic bar) external from the agitator is able to rotate by receiving the applied magnetic force. - After the
DI water 401 and themagnetic bar 420 are put into thebeaker 430, theagitator 410 is operated. Here, theDI water 401 and themagnetic bar 420 are heated and agitated until the temperature of theDI water 401 reaches a predetermined temperature. The predetermined temperature is required to be about 50 degrees Celsius. In this case, ethanol, acetone, methanol and isopropyl alcohol and the like can be used instead of theDI water 401. Moreover, more various solutions can be used according to embodiments. - Next, as shown in
Fig. 5 , 100gram of afluorescent material 510 is put into theDI water 401 and is additionally agitated for about 30 minutes. Here, it is necessary to heat and agitate theDI water 401 and thefluorescent material 510 in such a manner that the temperature of theDI water 401 does not fall below the predetermined temperature (about 50 degrees Celsius). - The
fluorescent material 510 may be composed of a silicate based material and have a mean particle diameter of 15µm. However, since the size and kind of the fluorescent material can be variously changed according to a fluorescent material to be manufactured, more detailed description thereof will be omitted. TheDI water 401 and thefluorescent material 510 are mixed in thebeaker 430. - As shown in
Fig. 6 , anano fluorescent material 610 is put into thebeaker 430 and agitated. Thenano fluorescent material 610 is composed of a fluorescent material having a size of from 100 nm to 400 nm. Through a thermo spray decomposition process, the nano fluorescent material having a nano size may be formed. If the size of thenano fluorescent material 610 is less than 100 nm, luminance may be deteriorated. In particular, thenano fluorescent material 610 is composed of a fluorescent material having the same color as that of the foregoingfluorescent material 510. For example, when thefluorescent material 510 is a yellow silicate fluorescent material, thenano fluorescent material 610 is also formed of the yellow silicate fluorescent material. This intends that light having the same color is emitted through the resin to which thefluorescent material 510 is added, because thenano fluorescent material 610 is coated on the surface of thefluorescent material 510. - According to the embodiment, 10gram of the
nano fluorescent material 610 is put into thebeaker 430. Here, not only the nano-sized powder thenano fluorescent material 610 is slowly put so as not to be blown off, but also a predetermined amount of acetic acid is put into thebeaker 430. For example, 1Mℓ of the acetic acid together with thenano fluorescent material 610 are put into thebeaker 430. The temperature of the solution in thebeaker 430 should not be equal to or less than a predetermined temperature, preferably, about 50 degrees Celsius. The agitation is performed for about one hour. A person performing the embodiment checks the fluorescent material distribution, while checking thebeaker 430. - Here, the reason why the acetic acid is put is that the
nano fluorescent material 610 is well adsorbed into the cracks by etching the rough surface of thefluorescent material 510. - Any solution capable of etching the surface of the
fluorescent material 510, as well as the acetic acid can be variously used according to embodiments. - As shown in
Fig. 7 , a heater of theagitator 410 is turned off and the temperature of the solution of thebeaker 430 is reduced. When the temperature of the solution of thebeaker 430 reaches about 20 degrees Celsius, ZnSO4 solution of 10% is put into thebeaker 430 and more agitation is performed for about one hour. Here, the reason why ZnSO4 solution is put is that electrostatic force between particles of the solution is increased by ionizing the solution in thebeaker 430, so that thenano fluorescent material 610 is better adsorbed on the surface of thefluorescent material 510. - After a predetermined time (about one hour) elapses, the
agitator 410 is stopped and distribution state of the solution is checked. In other words, supernatant on the fluorescent material is checked whether it becomes transparent or not. - As shown in
Fig. 8 , the supernatant 810 is checked whether it becomes transparent or not and the agitation time may be increased or decreased according to the transparency of the supernatant 810. If the supernatant 810 becomes transparent (the transparency at this time can be variously determined according to embodiments or a person performing the embodiment), this means that thenano fluorescent material 610 is well adsorbed on the surface of thefluorescent material 510. Accordingly, the supernatant 810 is separated from asolution 820 including the fluorescent material. Here, it is possible to separate the supernatant 810 from thesolution 820 including the fluorescent material by using a rotary pump. After the separation, thesolution 820 including the fluorescent material is dried. - As a result, the manufacture of the
fluorescent material 510 in which thenano fluorescent material 610 is adsorbed is completed. The manufacturedfluorescent material 510 corresponds to thefluorescent material 140 shown inFig. 1 . Light emitted from the light emitting element 120 passes through a fluorescent material having a much reduced roughness of its surface, thereby reducing luminous efficiency degradation caused by light scatter.
Claims (15)
- A method for manufacturing a fluorescent material,
putting the fluorescent material into a first solution, and agitating the fluorescent material and the first solution;
putting a nano fluorescent material having a nano size into the first solution, and agitating the nano fluorescent material having a nano size and the first solution; and
separating supernatant from the first solution including the fluorescent material, and drying the fluorescent material. - The method of claim 1, wherein the first solution is at least one selected from the group consisting of DI water, ethanol, acetone, methanol and isopropyl alcohol.
- The method of claim 1, further, prior to putting the fluorescent material into the first solution and agitating the fluorescent material and the first solution, comprising heating and agitating the first solution until the temperature of the first solution reaches a predetermined temperature.
- The method of claim 1, wherein the putting the fluorescent material into the first solution and agitating the fluorescent material and the first solution comprises heating and agitating such that the temperature of the solution does not fall below a predetermined temperature.
- The method of claim 4, wherein the predetermined temperature is 50 degrees Celsius.
- The method of claim 1, wherein the nano fluorescent material is manufactured through thermo spray decomposition method.
- The method of claim 1, wherein the putting the nano fluorescent material comprises putting acetic acid as well as the nano fluorescent material.
- The method of claim 7, wherein, after the putting the nano fluorescent material and the acetic acid, the solution is heated and agitated such that the temperature of the solution does not fall below a predetermined temperature.
- The method of claim 1, wherein, after the putting the nano fluorescent material having a nano size into the first solution, and agitating the nano fluorescent material having a nano size and the first solution, additional ZnSO4 solution is put into the first solution and agitated.
- The method of claim 1, wherein the nano fluorescent material comprises the same material as that of the fluorescent material.
- The method of claim 1, wherein a size of the nano fluorescent material is from 100 nm to 400 nm.
- A light emitting device comprising:a body;a light emitting element mounted on a cavity formed in the body;a resin formed in the cavity; anda fluorescent material added to the resin,
wherein a nano fluorescent material having a nano size is adsorbed in the fluorescent material. - The light emitting device of claim 12, wherein the nano fluorescent material is composed of a fluorescent material having the same color as that of the fluorescent material.
- The light emitting device of claim 12, wherein the nano fluorescent material is attached to a crack of the fluorescent material.
- The light emitting device of claim 12, wherein a size of the nano fluorescent material is from 100 nm to 400 nm.
Applications Claiming Priority (1)
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KR1020090120181A KR101072162B1 (en) | 2009-12-04 | 2009-12-04 | Method for manufacturing phosphor and light emitting device comprising the phosphor |
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EP2330172A1 true EP2330172A1 (en) | 2011-06-08 |
EP2330172B1 EP2330172B1 (en) | 2017-06-28 |
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EP10193699.5A Not-in-force EP2330172B1 (en) | 2009-12-04 | 2010-12-03 | Method for manufacturing phosphor and light emitting device comprising the phosphor |
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US (1) | US8465798B2 (en) |
EP (1) | EP2330172B1 (en) |
JP (1) | JP5903212B2 (en) |
KR (1) | KR101072162B1 (en) |
CN (1) | CN102154002B (en) |
TW (1) | TWI496871B (en) |
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KR101400343B1 (en) * | 2012-02-10 | 2014-05-30 | 한국광기술원 | Phosphor production method and manufacturing method of LED with phosphor coating |
KR101945808B1 (en) * | 2012-08-06 | 2019-02-08 | 엘지이노텍 주식회사 | Light emitting device and light emitting device package |
TWI484664B (en) * | 2012-09-11 | 2015-05-11 | Brightek Optoelectronic Co Ltd | Method for spreading fluorescent particles |
TWI484669B (en) * | 2012-09-11 | 2015-05-11 | Brightek Optoelectronic Co Ltd | Method of package illuminant elecment |
CN108689712B (en) * | 2018-06-26 | 2020-10-09 | 镭米光学科技(宁波)有限公司 | Integrated composite ceramic phosphor and preparation method thereof |
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EP0993020A1 (en) * | 1998-09-28 | 2000-04-12 | Osram Sylvania Inc. | Phosphor coating for gas discharge lamps |
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JP2514423B2 (en) * | 1989-03-15 | 1996-07-10 | 日亜化学工業株式会社 | Method for producing phosphor coated with silicon dioxide |
JP3189626B2 (en) | 1994-09-09 | 2001-07-16 | 双葉電子工業株式会社 | Display device |
JPH09255951A (en) * | 1996-03-25 | 1997-09-30 | Kasei Optonix Co Ltd | Blue-light-emitting phosphor |
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2009
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-
2010
- 2010-11-19 US US12/949,879 patent/US8465798B2/en active Active
- 2010-11-29 JP JP2010264854A patent/JP5903212B2/en active Active
- 2010-12-03 EP EP10193699.5A patent/EP2330172B1/en not_active Not-in-force
- 2010-12-06 TW TW099142300A patent/TWI496871B/en active
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EP0993020A1 (en) * | 1998-09-28 | 2000-04-12 | Osram Sylvania Inc. | Phosphor coating for gas discharge lamps |
US20010048966A1 (en) * | 2000-01-14 | 2001-12-06 | Trumble Cathy Shaw | Luminescent nanophase binder systems for UV and VUV applications |
EP1710289A1 (en) * | 2005-03-31 | 2006-10-11 | General Electric Company | Method for making phosphors |
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Also Published As
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US20110133630A1 (en) | 2011-06-09 |
CN102154002B (en) | 2015-12-16 |
JP5903212B2 (en) | 2016-04-13 |
TWI496871B (en) | 2015-08-21 |
KR101072162B1 (en) | 2011-10-10 |
CN102154002A (en) | 2011-08-17 |
US8465798B2 (en) | 2013-06-18 |
KR20110063221A (en) | 2011-06-10 |
JP2011116985A (en) | 2011-06-16 |
EP2330172B1 (en) | 2017-06-28 |
TW201137087A (en) | 2011-11-01 |
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