TWI597869B - Light emitting device package and method of manufacturing the same - Google Patents

Description

Light emitting device package structure and manufacturing method thereof

The present invention relates to a light emitting device, and more particularly to a package structure of a semiconductor light emitting device and a method of fabricating the same.

As an emerging light source, the light-emitting diode has been widely used in various fields due to its high luminous efficiency, small size, light weight, environmental protection, etc., and has a tendency to replace the traditional light source.

A conventional light-emitting diode generally includes a substrate, a light-emitting diode chip disposed on the substrate, and a package packaged on the light-emitting diode wafer. In order to enable the light emitting diode to emit light of different colors, the phosphor is usually added into the package, and the light emitted by the LED chip can excite the phosphor to emit light of different wavelengths, thereby emitting light with the LED of the LED. Mix into different colors such as white light. At present, the powdery phosphor powder is usually mixed into a liquid package, and the package is covered on the LED substrate by injection molding. However, due to the process of baking and curing in the process of packaging, due to the time required for the process and the self-gravity of the phosphor powder, the phosphor powder will generate irregular precipitation in the package, and the resulting package structure is up to Less than expected optical effects.

In addition, most of the general packaging processes use epoxy resin materials, but the epoxy resin is prone to deterioration and yellowing at high temperatures, resulting in a decrease in the lifetime of the light-emitting device.

In view of the above, it is necessary to provide a package structure of a light-emitting device and a method of manufacturing the same, and the light-emitting device obtained by the method has better optical performance.

A light emitting device package structure includes a light emitting element, at least two electrode layers and a reflective cup. The light emitting element is disposed at a bottom of the reflective cup and electrically connected to the two electrode layers. The light emitting device package structure further includes being disposed on the reflective cup. And a package in which the light-emitting element is sealed, the package includes a compound formed of an epoxy resin and a enamel resin, and a phosphor powder, and the compound and the phosphor powder are mixed by kneading.

A method for manufacturing a light emitting device package structure, comprising the steps of: providing a light emitting element, disposing the light emitting element on a package substrate and electrically connecting to the external electrode; providing a phosphor powder and a compound formed of the epoxy resin and the germanium resin, And mixing the phosphor powder with the compound to form an encapsulating material; and sealing the encapsulating material to the light emitting element.

Compared with the prior art, the light-emitting device package structure of the present invention is compounded by a compound formed of an epoxy resin and a ruthenium resin and a fluorescent powder, which can effectively prevent the phosphor powder from being precipitated in the packaging material, and the phosphor powder is used. Uniform distribution in the encapsulating material allows the illuminating device to achieve the desired optical effect.

10‧‧‧Lighting elements

101‧‧‧ electrodes

20‧‧‧Package substrate

30‧‧‧electrode layer

40‧‧‧Reflection Cup

50‧‧‧Package

1 is a cross-sectional view showing a package structure of a light-emitting device according to an embodiment of the present invention.

2 is a flow chart of a method of fabricating a package structure of a light emitting device according to an embodiment of the present invention.

1 is a cross-sectional view showing a package structure of a light emitting device according to an embodiment of the present invention. The light emitting device package structure includes a light emitting element 10 and a reflective cup 40. The light emitting element 10 is placed at the bottom of the reflective cup 40 and electrically connected to the two electrodes 101. A transparent package 50 is placed on the reflective cup 40 and The light emitting element 10 is sealed.

The light-emitting element 10 may be a gallium nitride-based compound semiconductor having an emission peak wavelength of 430 nm or more, and may be, for example, a blue-emitting light-emitting diode, and of course, a gallium nitride-based compound semiconductor having an emission peak wavelength of 430 nm or less, for example, Ultraviolet light emitting diode. The two electrodes 101 of the light-emitting element 10 are electrically connected to the two-electrode layer 30, respectively, so as to be electrically connected to an external power source to provide electrical energy required for the operation of the light-emitting element 10. The electrode 101 and the electrode layer 30 are not limited to two, and may be increased in number as needed to ensure electrical connection of the light-emitting element 10 to the outside.

Preferably, the light emitting element 10 is placed on the top surface of a package substrate 20. The light-emitting element 10 is flip-chip mounted on the package substrate 20, it being understood that the light-emitting element 10 is not limited to flip-chip in other embodiments. The package substrate 20 may be a mixture including a compound formed of an epoxy resin and an enamel resin, titanium oxide, and a hardener, and the epoxy resin and the bismuth resin compound, titanium oxide, and hardener are formed by kneading and mixing. The epoxy resin may be epichlorohydrin (CH2CHOCH2Cl) or propylene glycol (CH2CHOCH2OH). The oxime resin may be phenyltrimethylnonane ((CH3O)3SiC6H5) or the like. The hardener may be a tannic acid hardener or triethyltetramine (TETA).

Preferably, the two-electrode layer 30 is bent and extended to the bottom surface of the package substrate 20 to form the light-emitting device in a surface mount configuration.

The reflective cup 40 may be a mixture including a compound formed of an epoxy resin and an enamel resin, titanium oxide, and a hardener, and the epoxy resin and the bismuth resin compound, titanium oxide, and hardener are formed by kneading and mixing. Among them, the epoxy resin can be epichlorohydrin (CH2CHOCH2Cl), glycidyl alcohol (CH2CHOCH2OH), and the like. The oxime resin may be phenyltrimethylnonane ((CH3O)3SiC6H5) or the like. The hardener may be a tannic acid hardener or triethyltetramine (TETA). In an embodiment of the invention, the package substrate 20 and the reflective cup 40 are integrally formed.

The package 50 includes a compound formed of an epoxy resin and a enamel resin, and a phosphor powder, and the compound and the phosphor powder are kneaded and mixed. A polymer compound, that is, a polymer, can be formed from an epoxy resin and an oxime resin. The powdered compound and the phosphor powder are kneaded and kneaded in a kneader, and the phosphor powder and the compound are uniformly mixed and homogenized, so that the phosphor powder is uniformly distributed in the package 50, since the firefly can be avoided. The toner generates a precipitate in the package 50, and the light-emitting element 10 packaged by the package 50 can achieve a desired optical effect. The epoxy resin may be epichlorohydrin (CH2CHOCH2Cl) or propylene glycol (CH2CHOCH2OH). The oxime resin may be phenyltrimethylnonane ((CH3O)3SiC6H5) or the like. The phosphor powder may be, for example, garnet-based phosphor powder, citrate-based phosphor powder, orthosilicate-based phosphor powder, sulfide-based phosphor powder, thiogallate-based phosphor powder, and nitride-based powder. Fluorescent powder. Since the phosphor 50 is contained in the package 50, the phosphor is excited by the light emitted from the light-emitting element 10 to form light of another wavelength, which is different from the wavelength of the light emitted from the light-emitting element 10.

Preferably, at least one of a hardener, a catalyst, a mold release agent, a flame retardant, a reaction inhibitor, and the like may be added to the epoxy resin. Among them, the hardener may be a tannic acid hardener or triethyltetramine (TETA) or the like. The catalyst may be a platinum compound or the like. The release agent may be a siloxane compound or the like. The flame retardant may be various resins. The reaction inhibitor may be acetylene alcohol or the like.

Referring to FIG. 2, a method for fabricating a light emitting device package structure according to an embodiment of the present invention includes the following steps:

In the first step, a light-emitting element 10 is provided. The light emitting element 10 can be a light emitting diode.

In the second step, a phosphor powder and a compound formed of an epoxy resin and a enamel resin are provided, and the compound is mixed with the phosphor powder to form an encapsulating material.

In the third step, the encapsulating material is sealed to the light emitting element to form the package 50.

The light-emitting element 10 can be placed on a package substrate 20, and the two electrodes 101 of the light-emitting element 10 are electrically connected to the two-electrode layer 30, respectively. The package substrate 20 may be a mixture including a compound formed of an epoxy resin and an enamel resin, titanium oxide, and a hardener, and the epoxy resin and the bismuth resin compound, titanium oxide, and hardener are formed by kneading and mixing. The compound formed of the epoxy resin and the oxime resin, the titanium oxide, and the hardener are kneaded and mixed, and then the shape of the package substrate is formed by a technique of transfer molding or embedding molding.

A reflective cup 40 may be disposed on the package substrate 20 to provide the light-emitting element 10 at the bottom of the reflective cup 40 and to encapsulate the package 50 in the reflective cup 40. The reflective cup 40 may be a mixture including a compound formed of an epoxy resin and an enamel resin, titanium oxide, and a hardener, and the epoxy resin and the bismuth resin compound, titanium oxide, and hardener are formed by kneading and mixing. The compound formed of the epoxy resin and the enamel resin, the titanium dioxide, and the hardener are kneaded and mixed, and then the shape of the reflecting cup is formed by a technique of transfer molding or embedding molding.

Preferably, the encapsulating material can be liquefied by means of transfer molding, that is, directly at a high temperature in a packaging mold, and then formed on the reflective cup 40 to form the package 50. Due to the compounding of the epoxy resin and the enamel resin during the kneading, the phosphor powder can be coated to uniformly distribute the phosphor powder in the compound, and precipitation can be prevented during liquefaction packaging. At the same time, in the process of transfer molding, the encapsulating material exhibits a shorter liquid time than other molding processes (for example, injection molding) and has a high viscosity, which further ensures that the fluorescent powder does not precipitate in the package 50. In addition, since a compound formed of an epoxy resin and a ruthenium resin is used as a packaging material, not only the homogeneity is high, but also the yellowing phenomenon at the time of high temperature of a single epoxy resin package can be avoided.

Among them, an additive such as a hardener, a catalyst, a mold release agent, a flame retardant, and a reaction inhibitor may be added to the epoxy resin.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

Claims (10)

A light emitting device package structure includes a light emitting element, at least two electrode layers and a reflective cup. The light emitting element is placed at the bottom of the reflective cup and electrically connected to the two electrode layers. The improvement is that the light emitting element is further disposed on the reflective cup and a package for sealing a light-emitting element, the package comprising a compound formed of an epoxy resin and a ruthenium resin, and a phosphor powder, wherein the compound and the phosphor powder are mixed by kneading, and the epoxy resin contains a hardener And a catalyst, a mold release agent, a flame retardant, and a reaction inhibitor. The oxime resin is phenyltrimethylnonane, and the hardener is at least one of a phthalic acid hardener and triethyltetramine. The light-emitting device package structure according to claim 1, wherein the reflective cup is a mixture formed by kneading and mixing, the mixture comprising titanium dioxide, a compound formed of an epoxy resin and an anthracene resin, and a hardener. The light emitting device package structure according to claim 1, wherein the light emitting element is disposed on a top surface of a package substrate, the package substrate is a mixture formed by kneading mixing, and the mixture includes titanium dioxide, A compound formed of an epoxy resin and a enamel resin, and a hardener. The light emitting device package structure of claim 3, wherein the reflective cup and the package substrate are integrally formed. A manufacturing method of a light emitting device package structure, comprising the steps of: providing a light emitting element, disposing the light emitting element on a package substrate and electrically connecting to the external electrode; providing a phosphor powder and a compound formed of the epoxy resin and the resin, and Mixing the phosphor powder with the compound to form an encapsulating material; and sealing the encapsulating material to the light emitting element; wherein the epoxy resin is added with a hardener, a catalyst, a mold release agent, a flame retardant, and a reaction inhibitor The oxime resin is phenyltrimethylnonane, and the curing agent is at least one of a phthalic acid-based curing agent and triethyltetramine. The method of manufacturing a light-emitting device package structure according to claim 5, wherein the package material is sealed to the light-emitting element by a technique of transfer molding. The method of manufacturing a light emitting device package structure according to claim 5, wherein the light emitting element is placed at a bottom of a reflective cup, and the packaging material is filled on the reflective cup and the light emitting element is sealed. The method of manufacturing a light-emitting device package structure according to claim 7, wherein the reflective cup is a mixture comprising a compound formed of an epoxy resin and an enamel resin, titanium dioxide, and a hardener, and the ring A compound formed of an oxy resin and an oxime resin, titanium dioxide, and a curing agent are formed by kneading and mixing. The method for manufacturing a light-emitting device package structure according to claim 8, wherein the epoxy resin and the bismuth resin compound, the titanium dioxide and the hardener are mixed and mixed, and then molded by injection molding or embedding. The technique forms the shape of the reflector cup. The method of manufacturing a light-emitting device package structure according to claim 5, wherein the package substrate is a mixture formed by kneading and mixing, the mixture comprising a compound formed of an epoxy resin and an anthracene resin, titanium dioxide, and a hardener. After the mixture is mixed by kneading, the shape of the package substrate is formed by a technique of transfer molding or embedding molding.