201205899 六、發明說明： 【發明所屬之技術領域】 [醒]本發明涉及一種發光裝置，特別涉及一種半導體發光元 件的封裝結構及其製造方法。 [先前技術] [0002] 作為一種新興的光源，發光二極體憑藉其發光效率高、 體積小、重量輕、環保等優點，已被廣泛地應用到當前 的各個領域當中，大有取代傳統光源的趨勢。 [0003] ❹ 〇 [0004] 傳統的發光二極體通常包括一基底、設置於基底上的發 光二極體晶片，及封裝於發光二極體晶片上的封裝體。 為使發光二極體能發出不同顏色的光，通常在封裝體内 加入螢光粉’發光二極體晶片發出的光可激發螢光粉發 出不同波長的光’從而與發光二極體晶片發出的光混合 成不同顏色例如白色的光。目前業界通常是將粉末狀的 榮光粉:入液態封裝體中，再利用注射成型的方式將封 裝體覆蓋在發光二極體晶片上。但由於在封裝的過程中 去、ό红過填烤固化的製程，由於製程所需時間及螢光 粉自身重力的因去 _ '、’螢光粉會在封裝體中產生不規則的 儿澱，因而得 封聚結構達不到預期的光學效果。 樹脂在C㈣環 氧樹脂的材料，但環氧 件壽命下降令易變質以及產生黃化現象，造成發光元 [0005] 099125482 【發明内容】 有鑒於此 造方法， 表單編號Α0] 有必 要提供一種發光裝置的封裝結構及其製 、製造方法得到的發光裝置具有更好的光 第 3 頁/共 13 頁 0992044741-0 201205899 學性能。 [0006] —種發光裝置封裝結構，包括一發光元件，至少二電極 層及一反射杯，該發光元件置於反射杯的底部並與二電 極層電性連接，該發光裝置封裝結構還包括置於反射杯 上並對發光元件密封的封裝體，該封裝體包括由環氧樹 脂與碎樹脂形成的化合物及螢光粉，且該化合物和該螢 光粉經由混煉滿合而成。 [〇〇〇7]—種發光裝置封裝結構的製造方法，其步驟包括： [〇〇〇8]提供發光元件，將贅光元件設査在一封裝基板上並電性 連結到外部電極； [0009]提供螢光粉及由環氧樹脂與矽樹脂形成的化合物，並將 營光粉與化合物混煉混合形成封袭材料；及 [〇〇1〇] 將所述封裝材料對發光元件進行密封。 [0011] 與習知技術相比’本發明發光:元‘封裝結構利用由環氧 樹脂與梦樹脂形成的化合物及.螢:光粉混煉而成，可有效 避免螢光粉在封裝材料中產生沉澱，使螢光粉在封裝材 料中分佈均勻’從而可使發光裝置獲得預期的光學效果 【實施方式】 [0012]圖1為本發明一實施例的發光裝置封裝結構的剖視示意圖 。该發光裝置封震結構包括一發光元件1 〇及一反射杯4 0 ，該發光元件10置於反射杯40的底部並與二電極101電性 連接，一透明的封裝體50置於反射杯40上並對發光元件 099125482- 10密封。 表單編號A0101 第4頁/共13頁 0992044741-0 201205899 [0013] [0014] Ο ο [0015] [0016] 發光元件10可以是在430nm以上具有發光峰值波長的氣化 鎵系化合物半導體’例如可以是發藍光的發光二極體， 當然還可以在430nm以下具有發光峰值波長的氮化鎵系化 合物半導體，例如紫外光發光二極體。發光元件1()的二匕 電極101分別與二電極層30電連接從而可與外部電 ’了、等通 ，以提供發光元件10工作時所需的電能。電極1〇1及電極 層30並不限於兩個，可視需求增加數量以保證發光元件5 10與外部的電連接。 優選的，發光元件10置於一封裝基板20的頂面上。發光 元件10倒裝在封裝基板20上，可以理解在其他實施例中 發光元件10並不限於倒裝。封裝基板2〇可以為一混合物 ，该混合物包括由環氧樹脂與矽樹脂形成的化合物、二 氧化鈦及硬化劑，且所述環氧樹脂與㈣㈣成的化合 物、二氧化鈦及硬化劑經由混煉混合形成。其中，環氣 樹脂可以為環氧氯丙统（CJ^CHOCHJl)、環氧两醇^ CHJHOCI^OH)等。矽樹脂可以為笨基三甲基矽烷（ (CH3〇)3Si(：6H5)等，硬化劑可以為石夕酸類硬化 基四胺（TETA)。 ——乙 優選的，二電極層30彎折延伸至封裝基板2〇的底面，使 s亥發光裝置形成表面貼裝形態。 反射杯40可以為一混合物，該混合物包括由環氡樹脂與 矽樹脂形成的化合物、二氧化鈦及硬化劑，且所述環氧 樹脂與矽樹脂形成的化合物、二氧化鈦及硬化劑經由混 煉混合形成。其中，環氧樹脂可以為環氧氯丙烷（ 099125482 CH2CH0CH2C1) 表單編號A0101 、環氧丙醇（CH2CHOCH2〇H)等。石夕樹脂 第 5 頁/共 13 頁 0992044741-0 201205899 可以為苯基三曱基矽烷（（CHqO^SiC。!^)等。硬化劑可 3 〇 b 5 以為矽酸類硬化劑或三乙基四胺（TETA)。於本發明一實 施例中，所述封裝基板20與反射杯40為一體成型的結構 〇 [0017] 該封裝體5 0包括由環氧樹脂與矽樹脂形成的化合物及螢 光粉，且該化合物和該螢光粉經由混煉混合而成。由環 氧樹脂與矽樹脂可形成高分子化合物，也即聚合物。將 粉末狀的化合物及螢光粉置於混煉機中捏合、混煉，可 使螢光粉與化合物混合均勻並均質化，從而使螢光粉在 封裝體50中分佈均勻，由於可避免螢光粉在封裝體50中 產生沉澱，採用該封裝體50封裝的發光元件10可得到預 期的光學效果。其中，環氧樹脂可以為環氧氣丙烷（ ch2choch2ci)、環氧丙醇（ch2choch2〇h)等。石夕樹脂 可以為苯基三甲基石夕烧（（CH3〇)3SiC6H5)等。螢光粉可 以是例如石榴石基螢光粉、矽酸鹽基螢光粉、原矽酸鹽 基螢光粉、硫化物基螢光粉、硫代鎵酸鹽基螢光粉和氮 化物基螢光粉。由於封裝體50内具有螢光粉，螢光粉受 到發光元件10發出的光激發後可形成另一波長的光，該 另一波長與發光元件10發出的光的波長不同。 [0018] 優選的，在環氧樹脂中還可以加入硬化劑、催化劑、脫 模劑、阻燃劑及反應抑制劑等中的至少一種添加劑。其 中，硬化劑可以為矽酸類硬化劑或三乙基四胺（TETA)等 。催化劑可以為白金化合物（platinum compound)等。 脫模劑可以為矽氧烷化合物等。阻燃劑可以是各種樹脂 。反應抑制劑可以為乙炔基曱醇（acetylene alcohol 099125482 表單編號A0101 第6頁/共13頁 0992044741-0 201205899201205899 VI. Description of the Invention: [Technical Field of the Invention] [Wake] The present invention relates to a light-emitting device, and more particularly to a package structure of a semiconductor light-emitting element and a method of fabricating the same. [Prior Art] [0002] As an emerging light source, the light-emitting diode has been widely used in various fields due to its high luminous efficiency, small size, light weight, environmental protection, etc., and has largely replaced the conventional light source. the trend of. [0003] A conventional light-emitting diode generally includes a substrate, a light-emitting diode chip disposed on the substrate, and a package packaged on the light-emitting diode wafer. In order to enable the light-emitting diode to emit light of different colors, a fluorescent powder is usually added to the package body. The light emitted by the light-emitting diode chip can excite the fluorescent powder to emit light of different wavelengths, thereby being emitted from the light-emitting diode chip. The light is mixed into light of different colors such as white. At present, the powdered glory powder is usually put into a liquid package, and the package body is covered on the light-emitting diode wafer by injection molding. However, due to the process of going to the process of encapsulation and blushing, the process of the process and the gravity of the phosphor powder itself will cause irregularities in the package. Therefore, the sealed structure does not achieve the desired optical effect. Resin in C (four) epoxy resin material, but the life of epoxy parts is degraded to cause deterioration and yellowing phenomenon, resulting in luminous elements [0005] 099125482 [Invention content] In view of this method, form number Α0] it is necessary to provide a kind of light The package structure of the device and the light-emitting device obtained by the method of manufacturing the same have a better light performance. [0006] A light-emitting device package structure includes a light-emitting element, at least two electrode layers and a reflective cup. The light-emitting element is disposed at a bottom of the reflective cup and electrically connected to the two-electrode layer, and the light-emitting device package structure further includes A package for sealing the light-emitting element on the reflective cup, the package comprising a compound formed of an epoxy resin and a pulverized resin, and a phosphor powder, and the compound and the phosphor powder are formed by kneading. [〇〇〇7] A method for manufacturing a light-emitting device package structure, the steps comprising: [〇〇〇8] providing a light-emitting element, and setting the light-emitting element on a package substrate and electrically connecting to the external electrode; 0009] providing a phosphor powder and a compound formed of an epoxy resin and a ruthenium resin, and kneading and mixing the camping powder with the compound to form a sealant material; and [〇〇1〇] sealing the package material to the light-emitting element . [0011] Compared with the prior art, the 'light-emitting: meta-encapsulation structure of the present invention is compounded by a compound formed of an epoxy resin and a dream resin, and is mixed with a light powder, which can effectively prevent the fluorescent powder from being encapsulated in the packaging material. [0012] FIG. 1 is a cross-sectional view showing a package structure of a light-emitting device according to an embodiment of the present invention. [0012] FIG. 1 is a schematic cross-sectional view showing a package structure of a light-emitting device according to an embodiment of the present invention. The light-emitting device is provided with a light-emitting element 1 and a reflective cup 40. The light-emitting element 10 is placed at the bottom of the reflective cup 40 and electrically connected to the two electrodes 101. A transparent package 50 is placed on the reflective cup 40. And sealed the light-emitting element 099125482- 10. Form No. A0101 Page 4 / Page 13 0992044741-0 201205899 [0014] [0016] The light-emitting element 10 may be a gallium-chloride compound semiconductor having an emission peak wavelength of 430 nm or more 'for example, It is a light-emitting diode that emits blue light, and of course, a gallium nitride-based compound semiconductor having an emission peak wavelength of 430 nm or less, for example, an ultraviolet light-emitting diode. The two electrodes 101 of the light-emitting element 1() are electrically connected to the two-electrode layer 30, respectively, so as to be electrically connected to the outside, to provide electric energy required for the operation of the light-emitting element 10. The electrode 1〇1 and the electrode layer 30 are not limited to two, and may be increased in number as needed to ensure electrical connection of the light-emitting element 510 to the outside. Preferably, the light emitting element 10 is placed on the top surface of a package substrate 20. The light-emitting element 10 is flip-chip mounted on the package substrate 20, it being understood that the light-emitting element 10 is not limited to flip-chip in other embodiments. The package substrate 2A may be a mixture comprising a compound formed of an epoxy resin and a ruthenium resin, titanium oxide, and a hardener, and the epoxy resin is formed by mixing a compound of (4) (tetra), titanium oxide, and a hardener. Among them, the epoxy resin may be an epoxy chloroform (CJ^CHOCHJl), an epoxy diol (CHJHOCI^OH), or the like. The oxime resin may be stupid trimethyl decane ((CH 3 〇) 3Si (: 6H 5), etc., and the hardener may be taluric acid hardening tetraamine (TETA). - B is preferred, the two electrode layer 30 is bent and extended The bottom surface of the package substrate 2 is formed into a surface mount form. The reflective cup 40 may be a mixture comprising a compound formed of a cyclic resin and a ruthenium resin, titanium dioxide and a hardener, and the ring The compound formed of the oxyresin and the oxime resin, the titanium oxide, and the hardener are formed by kneading and mixing. The epoxy resin may be epichlorohydrin (099125482 CH2CH0CH2C1), Form No. A0101, Glycol (CH2CHOCH2〇H), etc.夕树脂第5页/共13页 0992044741-0 201205899 It can be phenyl tridecyl decane ((CHqO^SiC.!^), etc. The hardener can be 3 〇b 5 for tannic acid hardener or triethyltetramine (TETA) In one embodiment of the present invention, the package substrate 20 and the reflective cup 40 are integrally formed. [0017] The package 50 includes a compound formed of an epoxy resin and a resin and a phosphor powder. And this The material and the phosphor powder are mixed by kneading. The epoxy resin and the enamel resin can form a polymer compound, that is, a polymer. The powdered compound and the phosphor powder are kneaded and kneaded in a kneader. The phosphor powder and the compound can be uniformly mixed and homogenized, so that the phosphor powder is uniformly distributed in the package 50. Since the phosphor powder can be prevented from being precipitated in the package 50, the light-emitting element packaged by the package 50 is used. 10, the desired optical effect can be obtained. Among them, the epoxy resin can be epoxide (ch2choch2ci), propylene glycol (ch2choch2〇h), etc. The diarrhea resin can be phenyltrimethyl sulphide ((CH3〇) 3SiC6H5 The phosphor powder may be, for example, garnet-based phosphor powder, citrate-based phosphor powder, orthosilicate-based phosphor powder, sulfide-based phosphor powder, thiogallate-based phosphor powder, and Nitride-based phosphor powder. Since the phosphor 50 is contained in the package 50, the phosphor is excited by light emitted from the light-emitting element 10 to form light of another wavelength, which is different from the wavelength of light emitted from the light-emitting element 10. Different [0018] Preferably, in epoxy At least one of a hardener, a catalyst, a mold release agent, a flame retardant, a reaction inhibitor, and the like may be added to the grease, and the hardener may be a tannic acid hardener or triethyltetramine (TETA) or the like. It may be a platinum compound, etc. The release agent may be a siloxane compound, etc. The flame retardant may be various resins. The reaction inhibitor may be acetylene alcohol 099125482 Form No. A0101 Page 6 / Total 13 pages 0992044741-0 201205899
[0019] 請參考圖2,本發明_實施例中的發光裝m结構的製 造方法包括如下步驟： [0020] 第一步，提供發光元件10。發光元件1〇可為 體。 發光二極 [0021] [0022]Ο [0023] Ο [0024] 099125482 第二步’提供螢光粉及由環氧樹脂與料⑽形成的化合 物，並將化合物與螢光粉混煉形成封裝材料。 第三步，將封震材料對發光元件進行密封以形成封裝體 50。 . 其中，可使發光元件10置於一封裝基板20上，並使發光 το件10的二電極101分別與二電極層3〇電連接。封裝基板 20可以為-混合物，該混合物包括由環氧樹脂與石夕樹脂 形成的化合物、二氧化鈦及硬化劑，且所述 ㈣脂形成的化合物、二氧你鈦及硬化劑經由混練 形成。所述環氧樹脂與矽樹脂形成的化合物二氧化鈦 及硬化劑經由混煉混合後，再利用轉注成型（transfer molding)或埋入成型的技術形成所述封裝基板的形狀。 其中，還可在封裝基板2〇上設置一反射杯4〇，將發光元 件10設於反射杯40的底部，並使封裝體5〇封裝於反射杯 40内。反射杯40可以為—混合物，該混合物包括由環氧 樹脂與矽樹脂形成的化合物、二氧化鈦及硬化劑，且所 述環氧樹脂與矽樹脂形成的化合物、二氧化鈦及硬化劑 、A由遇煉混合形成。所述環氧樹脂與矽樹脂形成的化合 、二氧化欽及硬化劑經由混煉混合後，再利用轉注成 表單編號A0101 第7頁/共13頁 0992044741-0 201205899 型或埋入成型的技術形成所述反射杯的形狀。 [0025] 優選的，可利用轉注成型的方式，即高溫下直接於封裝 模具中將封裝材料液化，接著成型在反射杯40上以形成 封裝體50。由於混煉時，由環氧樹脂與矽樹脂形成的化 合物可將螢光粉包覆，使螢光粉均勻分佈在該化合物中 ，且在液化封裝時可避免沉澱的產生。同時，在轉注成 型的過程中，封裝材料呈現的液態時間較其他的成型過 程（例如注射成型）短且其黏稠度高，可更進一步的保 證螢光粉不會在封裝體50中產生沉澱。另外，由於採用 環氧樹脂與矽樹脂形成的化合物作為封裝原料，不僅同 質性高還可避免單一的環氧樹脂封裝高溫時的黃化現象 〇 [0026] 其中，還可在環氧樹脂中加入硬化劑、催化劑、脫模劑 、阻燃劑及反應抑制劑等添加劑。 [0027] 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0028] 圖1為本發明一實施方式的發光裝置封裝結構的剖視示意 圖。 [0029] 圖2為本發明一實施方式的發光裝置封裝結構製造方法的 流程圖。 099125482 表單編號A0101 第8頁/共13頁 0992044741-0 201205899 【主要元件符號說明】 [0030] 發光元件：10 [0031] 電極.101 [0032] 封裝基板：20 [0033] 電極層：30 [0034] 反射杯：40 [0035] 封裝體：50 ΟReferring to FIG. 2, a method of fabricating a light-emitting device m structure according to an embodiment of the present invention includes the following steps: [0020] In a first step, a light-emitting element 10 is provided. The light-emitting element 1 can be a body. Light-emitting diode [0021] [0023] Ο [0024] 099125482 The second step is to provide a phosphor powder and a compound formed of an epoxy resin and a material (10), and compound the compound with the phosphor powder to form an encapsulating material. . In the third step, the light-emitting element is sealed by the sealing material to form the package 50. Wherein, the light-emitting element 10 can be placed on a package substrate 20, and the two electrodes 101 of the light-emitting element 10 are electrically connected to the two-electrode layer 3, respectively. The package substrate 20 may be a mixture including a compound formed of an epoxy resin and a Lithium resin, titanium oxide, and a hardener, and the compound of the (iv) lipid, the titanium dioxide and the hardener are formed by kneading. The compound titanium dioxide and the hardener which are formed of the epoxy resin and the oxime resin are kneaded and mixed, and then the shape of the package substrate is formed by a technique of transfer molding or embedding molding. Wherein, a reflective cup 4 is disposed on the package substrate 2, the light-emitting element 10 is disposed at the bottom of the reflective cup 40, and the package 5 is packaged in the reflective cup 40. The reflective cup 40 may be a mixture comprising a compound formed of an epoxy resin and an enamel resin, titanium dioxide, and a hardener, and the epoxy resin and the bismuth resin, a titanium oxide and a hardener, and A are mixed. form. The compounding of the epoxy resin and the bismuth resin, the oxidizing agent and the curing agent are mixed and mixed, and then formed into a form number A0101, page 7 / 13 page 0992044741-0 201205899 type or embedded molding technology. The shape of the reflector cup. [0025] Preferably, the encapsulation material can be liquefied by means of transfer molding, that is, directly at a high temperature in a packaging mold, and then formed on the reflective cup 40 to form the package 50. Since the compound formed of the epoxy resin and the oxime resin can be coated with the phosphor powder during the kneading, the phosphor powder is uniformly distributed in the compound, and precipitation can be prevented in the liquefaction package. At the same time, during the transfer molding process, the encapsulating material exhibits a shorter liquid time than other molding processes (e.g., injection molding) and its viscosity is high, which further ensures that the phosphor does not precipitate in the package 50. In addition, since a compound formed of an epoxy resin and a ruthenium resin is used as a packaging material, not only homogeneity but also yellowing of a single epoxy resin package at a high temperature can be avoided. [0026] Among them, an epoxy resin can also be added. Additives such as hardeners, catalysts, mold release agents, flame retardants, and reaction inhibitors. [0027] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0028] FIG. 1 is a cross-sectional view showing a package structure of a light-emitting device according to an embodiment of the present invention. 2 is a flow chart showing a method of manufacturing a light emitting device package structure according to an embodiment of the present invention. 099125482 Form No. A0101 Page 8 / Total 13 Page 0992044741-0 201205899 [Description of Main Component Symbols] [0030] Light-emitting element: 10 [0031] Electrode. 101 [0032] Package substrate: 20 [0033] Electrode layer: 30 [0034 Reflective Cup: 40 [0035] Package: 50 Ο
099125482 表單編號 A0101 第 9 頁/共 13 頁 0992044741-0099125482 Form number A0101 Page 9 of 13 0992044741-0