TWI467814B - Method for making phosphor and a corresponding method for package light emitting diode - Google Patents

Description

Fluorescent powder colloid preparation method and corresponding light emitting diode packaging method

The invention relates to a method for preparing a phosphor powder colloid and a method for packaging the same according to the method for preparing the phosphor powder colloid.

A Light Emitting Diode (LED) is an optoelectronic semiconductor component that converts current into a specific wavelength range. The light-emitting diode is widely used in the field of illumination because of its high brightness, low operating voltage, low power consumption, easy matching with integrated circuits, simple driving, and long life.

Fluorescent powder is typically included in the light emitting diode package structure. The phosphor powder is usually mixed in the encapsulant to change the color of the light emitted by the LED. However, the phosphor particles mixed in the encapsulant are easily precipitated after being left for a period of time, so that the distribution of the phosphor in the encapsulant is not uniform, thereby affecting the light-emitting performance of the LED package structure.

In view of the above, it is necessary to provide a method for preparing a phosphor powder colloid which uniformly mixes the phosphor powder in the colloid and a corresponding LED package structure.

A method for preparing a phosphor powder colloid comprises the following steps:

Providing a resin to modify an amino functional group on the ruthenium atom of the ruthenium resin;

Providing a phosphor powder to modify a carboxyl functional group on the phosphor powder particles;

Mixing the ruthenium resin with the phosphor powder and chemically reacting to form a guanamine bond between the ruthenium atom and the phosphor powder particles;

A curing agent is added to the mixture of the enamel resin and the fluorescent powder to cure the mixture.

A light emitting diode packaging method includes the following steps:

Providing a substrate;

Forming a first electrode and a second electrode on the surface of the substrate, wherein the first electrode and the second electrode are insulated from each other;

A light emitting diode die is disposed on the substrate, and electrodes of the light emitting diode die are respectively connected to the first electrode and the second electrode; and

A phosphor powder colloid is provided to cover the light emitting diode colloid, and the phosphor powder colloid is manufactured by the above method for preparing a phosphor powder colloid.

In the above method for preparing a phosphor powder colloid, the phosphor powder particles are uniformly distributed in the tantalum resin due to a chemical reaction between the ruthenium atom and the phosphor powder particles to form a guanamine bond. Further, due to the action of the guanamine bond between the ruthenium atom and the phosphor powder particles, the phosphor powder is less likely to precipitate in the ruthenium resin to cause uneven distribution.

Hereinafter, the method for preparing a phosphor powder colloid and the method for encapsulating a light emitting diode of the present invention will be further described with reference to the drawings.

Referring to Figures 1-2, a resin is provided and then an amino functional group is modified on the ruthenium atom of the ruthenium resin.

Referring to FIG. 3 together, a phosphor is provided to modify a hydroxyl functional group on the phosphor particle 20. In this embodiment, the material of the phosphor powder is selected from one of yttrium aluminum garnet, sulfide, silicate, nitride and nitrogen oxide or a mixture thereof. The carboxyl functional group is formed on the surface of the phosphor particle 20 by a physical adsorption method.

Referring to FIG. 4 together, the ruthenium resin is mixed with the phosphor powder and chemically reacted to form a guanamine bond between the ruthenium atom and the phosphor powder particle 20 to be combined. In the present embodiment, ruthenium atoms are chemically reacted with the phosphor particles 20 by using carbodiimide (EDC) or N-hydroxysuccinimide (NHS) as a catalyst. During the reaction, a water molecule is removed between the amino functional group and the carboxyl functional group to form a guanamine bond.

A curing agent is added to the mixture of the oxime resin and the phosphor powder to cure the mixture of the oxime resin and the phosphor powder. In this embodiment, the curing agent may be a decane or a decane. Specifically, the molecular formula of the oxane is Me-O-Si, wherein Me represents a methyl group; and the decane has a molecular formula of CH2=CH-Si. When the curing agent is a decane, the mixture of the cerium resin and the fluorescent powder undergoes a condensation type crosslinking reaction with a decane, and the reaction temperature is 150 degrees Celsius, and the reaction time is 3 hours to 16 hours. When the curing agent is decane, the mixture of the cerium resin and the fluorescent powder undergoes an addition crosslinking reaction with the decane, and the reaction temperature is from 80 degrees Celsius to 150 degrees Celsius, and the reaction time is from 0.5 hours to 5 hours.

In the above method for preparing a phosphor powder colloid, an amino functional group is modified on a ruthenium atom of a ruthenium resin, and a hydroxy functional group is modified on the phosphor powder particle 20. When the oxime resin is mixed with the phosphor powder, a chemical reaction occurs between the ruthenium atom and the phosphor powder particle 20 to form a guanamine bond, thereby binding the ruthenium atom and the phosphor powder particle 20. Therefore, when the phosphor particles 20 are uniformly dispersed in the resin, even if it is left for a long period of time, the phosphor particles 20 are less likely to precipitate in the resin and cause uneven distribution.

The above method for preparing a phosphor powder colloid can be applied to a light emitting diode package structure.

Referring to FIG. 5, a method for packaging a light emitting diode according to an embodiment of the present invention includes the following steps.

A substrate 110 is provided.

The first electrode 111 and the second electrode 112 are formed on the surface of the substrate 110, and the first electrode 111 and the second electrode 112 are insulated from each other. In this embodiment, the material of the first electrode 111 and the second electrode 112 includes gold, silver, aluminum, nickel, copper or an alloy thereof.

The light emitting diode die 120 is disposed on the substrate 110, and the electrodes of the light emitting diode die 120 are connected to the first electrode 111 and the second electrode 112, respectively.

A phosphor colloid 130 is provided to cover the light emitting diode die 120. The phosphor powder colloid 130 includes a tantalum resin 131 and phosphor powder particles 20 distributed in the tantalum resin 131. The phosphor powder colloid 130 is produced by the above method for preparing a phosphor powder colloid.

A reflective cup 140 may be further disposed on the surface of the substrate 110 as needed. The reflector cup 140 has a reflective cavity 141. The LED die 120 is disposed inside the reflective cavity 141. The phosphor paste 130 is filled in the reflective cavity 141.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

110. . . Substrate

111. . . First electrode

112. . . Second electrode

120. . . Light-emitting diode grain

130. . . Fluorescent powder colloid

131. . . Tantalum resin

140. . . Reflective cup

141. . . Reflecting cavity

20. . . Fluorescent powder particles

FIG. 1 is a schematic flow chart of a method for preparing a phosphor powder provided by an embodiment of the present invention.

2 is a schematic view showing the molecular structure of the oxime resin provided in FIG.

FIG. 3 is a schematic structural view of the phosphor powder particles provided in FIG. 1. FIG.

4 is a schematic view showing the structure of the resin of FIG. 1 after chemical reaction with the phosphor particles.

FIG. 5 is a light emitting diode package structure prepared by the LED package method according to an embodiment of the invention.

Claims (10)

A method for preparing a phosphor powder colloid comprises the following steps:
Providing a resin to modify an amino functional group on the ruthenium atom of the ruthenium resin;
Providing a phosphor powder to modify a carboxyl functional group on the phosphor powder particles;
Mixing the ruthenium resin with the phosphor powder and chemically reacting to form a guanamine bond between the ruthenium atom and the phosphor powder particles; and adding a curing agent to the mixture of the ruthenium resin and the phosphor powder, thereby The mixture is cured. The method for preparing a phosphor powder colloid according to claim 1, wherein in the process of mixing the oxime resin and the phosphor powder, the ruthenium atom is used as a catalyst by using carbodiimide or N-hydroxysuccinimide as a catalyst. The phosphor particles react chemically. The method for preparing a phosphor powder colloid according to claim 1, wherein the curing agent is a decane. The method for preparing a phosphor powder colloid according to claim 3, wherein the mixture of the anthracene resin and the phosphor powder undergoes a condensation type crosslinking reaction with the deuterium oxide. The method for preparing a phosphor powder colloid according to claim 4, wherein the condensation type crosslinking reaction has a reaction temperature of 150 ° C and a reaction time of 3 hours to 16 hours. The method for preparing a phosphor powder colloid according to claim 1, wherein the curing agent is decane. The method for preparing a phosphor powder colloid according to claim 6, wherein the mixture of the enamel resin and the phosphor powder is subjected to an addition crosslinking reaction with the decane. The method for preparing a phosphor powder colloid according to claim 7, wherein the reaction temperature of the addition crosslinking reaction is from 80 degrees Celsius to 150 degrees Celsius, and the reaction time is from 0.5 hours to 5 hours. A light emitting diode packaging method includes the following steps:
Providing a substrate;
Forming a first electrode and a second electrode on the surface of the substrate, wherein the first electrode and the second electrode are insulated from each other;
A light emitting diode die is disposed on the substrate, and electrodes of the light emitting diode die are respectively connected to the first electrode and the second electrode; and a phosphor powder colloid is provided to cover the light emitting diode die. The phosphor powder colloid is produced by the method for preparing a phosphor powder colloid according to any one of claims 1 to 8. The method of claim 2, wherein a reflective cup is disposed on the surface of the substrate, the reflective cup has a reflective cavity, and the light emitting diode die is disposed inside the reflective cavity, the fluorescent The powder colloid is filled in the reflective cavity.