CN103633226B - Phosphor gel preparation and corresponding LED encapsulation method - Google Patents

Phosphor gel preparation and corresponding LED encapsulation method Download PDF

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Publication number
CN103633226B
CN103633226B CN201210297809.6A CN201210297809A CN103633226B CN 103633226 B CN103633226 B CN 103633226B CN 201210297809 A CN201210297809 A CN 201210297809A CN 103633226 B CN103633226 B CN 103633226B
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China
Prior art keywords
silicones
electrode
fluorescent material
phosphor particles
phosphor
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CN201210297809.6A
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Chinese (zh)
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CN103633226A (en
Inventor
毛小荣
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Guangzhou Jingxin Photoelectric Technology Co. Ltd.
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Guangzhou Jingxin Photoelectric Technology Co Ltd
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Priority to CN201210297809.6A priority Critical patent/CN103633226B/en
Priority to TW101130620A priority patent/TWI467814B/en
Publication of CN103633226A publication Critical patent/CN103633226A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Abstract

A kind of phosphor gel preparation, comprises the following steps: provide a silicones, modifies an amido functional group on the silicon atom of silicones；One fluorescent material is provided, phosphor particles is modified a carboxyl functional group；By silicones and the biochemical reaction of fluorescent material hybrid concurrency, make to form amido link between silicon atom and phosphor particles and combine；And add firming agent in the silicones mixture with fluorescent material, so that described mixture solidification.In the preparation method of above-mentioned fluorescent powder colloid, owing to forming amido link by chemical reaction between silicon atom and phosphor particles, phosphor particles is evenly distributed in silicones.Present invention also offers the method for packing of a kind of light emitting diode applying above-mentioned phosphor gel preparation.

Description

Phosphor gel preparation and corresponding LED encapsulation method
Technical field
The present invention relates to the LED encapsulation method of a kind of this phosphor gel preparation of fluorescent powder colloid preparation method and application.
Background technology
Light emitting diode (Light Emitting Diode, LED) is a kind of optoelectronic semiconductor component converting the current to particular range of wavelengths.Light emitting diode is high with its brightness, running voltage is low, power consumption is little, easily mate with integrated circuit, drive the advantages such as simple, life-span length, thus can be widely used in lighting field as light source.
Package structure for LED generally includes fluorescent material.Described fluorescent material is usually mixed in packaging plastic, in order to change the color of the sent light of light emitting diode.But, the phosphor particles being blended in packaging plastic easily precipitates placing after a period of time so that the skewness that fluorescent material is in packaging plastic, thus affect package structure for LED go out optical property.
Summary of the invention
In view of this, it is necessary to a kind of phosphor gel preparation making fluorescent material mix homogeneously in colloid and corresponding package structure for LED are provided.
A kind of phosphor gel preparation, comprises the following steps:
One silicones is provided, the silicon atom of silicones is modified an amido functional group；
One fluorescent material is provided, phosphor particles is modified a carboxyl functional group；
By silicones and the biochemical reaction of fluorescent material hybrid concurrency, make to form amido link between silicon atom and phosphor particles and combine；And
Firming agent is added in the silicones mixture with fluorescent material, so that the solidification of described mixture.
A kind of LED encapsulation method, comprises the following steps:
One substrate is provided；
The first electrode and the second electrode, the first electrode and the second electrode mutually insulated is formed at substrate surface；
Arranging LED crystal particle on substrate, the electrode of LED crystal particle is connected with each other with the first electrode and the second electrode respectively；And
Thering is provided a fluorescent powder colloid, to cover described LED crystal particle, described fluorescent powder colloid is by manufactured by above-described phosphor gel preparation.
In the preparation method of above-mentioned fluorescent powder colloid, owing to forming amido link by chemical reaction between silicon atom and phosphor particles, phosphor particles is evenly distributed in silicones.Further, due to the effect of amido link between silicon atom and phosphor particles, fluorescent material is not easy in silicones precipitation and produces phenomenon pockety.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the fluorescent material preparation method that the embodiment of the present invention provides.
Fig. 2 is the schematic arrangement of the silicones provided in Fig. 1.
Fig. 3 is the structural representation of the phosphor particles provided in Fig. 1.
Fig. 4 is the silicones in Fig. 1 and the structural representation after phosphor particles generation chemical reaction.
Fig. 5 is the package structure for LED prepared by LED encapsulation method that the embodiment of the present invention provides.
Main element symbol description
Substrate 110
First electrode 111
Second electrode 112
LED crystal particle 120
Fluorescent powder colloid 130
Silicones 131
Reflector 140
Reflection cavity 141
Phosphor particles 20
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
Referring to diagram, phosphor gel preparation and LED encapsulation method to the present invention are further detailed.
Refer to Fig. 1-Fig. 2, it is provided that a silicones, on the silicon atom of silicones, then modify an amido functional group.
See also Fig. 3, it is provided that a fluorescent material, phosphor particles 20 is modified a hydroxy functional group.In the present embodiment, the material of described fluorescent material is selected from yttrium-aluminium-garnet, sulfide, silicate, nitride and nitrogen oxides one of them or its mixture.Described carboxyl functional group is formed at the surface of phosphor particles 20 by the method for physical absorption.
See also Fig. 4, by silicones and the biochemical reaction of fluorescent material hybrid concurrency, make to form amido link between silicon atom and phosphor particles 20 and combine.In this embodiment, carbodiimide (EDC) or N-hydroxy-succinamide (NHS) is used to make silicon atom and phosphor particles 20 that chemical reaction to occur as catalyst.In described course of reaction, slough a hydrone between amido functional group and carboxyl functional group and form amido link.
Firming agent is added in the silicones mixture with fluorescent material, so that the mixture solidification of described silicones and fluorescent material.In the present embodiment, described firming agent can be siloxanes or silane.Specifically, the molecular formula of described siloxanes is Me-O-Si, and wherein Me represents methyl；The molecular formula of described silane is CH2=CH-Si.When firming agent is siloxanes, the mixture of silicones and fluorescent material and siloxanes generation condensed type cross-linking reaction, its reaction temperature is 150 degrees Celsius, and the response time is 3 hours to 16 hours.When firming agent is silane, silicones reacts with siloxanes generation addition type cross-linking with the mixture of fluorescent material, and its reaction temperature is 80 degrees Celsius to 150 degrees Celsius, and the response time is 0.5 hour to 5 hours.
In the preparation method of above-mentioned fluorescent powder colloid, by modifying an amido functional group on the silicon atom of silicones, and on phosphor particles 20, modify a hydroxy functional group.When silicones mixes with fluorescent material when, chemical reaction between described silicon atom and phosphor particles 20, is occurred to form amido link, so that silicon atom combines with phosphor particles 20.Therefore, when phosphor particles 20 is dispersed among silicones, even across placing for a long time, described phosphor particles 20 is also not easy in silicones to occur precipitation to produce phenomenon pockety.
The preparation method of above-mentioned fluorescent powder colloid may be used in package structure for LED.
Referring to Fig. 5, the LED encapsulation method that the embodiment of the present invention is provided comprises the following steps.
One substrate 110 is provided.
The first electrode 111 and the second electrode 112, the first electrode 111 and the second electrode 112 mutually insulated is formed on substrate 110 surface.In the present embodiment, the making material of the first electrode 111 and the second electrode 112 includes gold, silver, aluminum, nickel, copper or its alloy.
Arranging LED crystal particle 120 on substrate 110, the electrode of LED crystal particle 120 is connected with each other with the first electrode 111 and the second electrode 112 respectively.
There is provided a fluorescent powder colloid 130, to cover described LED crystal particle 120.Described fluorescent powder colloid 130 includes silicones 131 and is distributed in the phosphor particles 20 among silicones 131.Described fluorescent powder colloid 130 is by manufactured by above-described phosphor gel preparation.
As required, one reflector 140 can be set further on substrate 110 surface.Described reflector 140 has a reflection cavity 141, and it is internal that LED crystal particle 120 is arranged on reflection cavity 141, and described fluorescent powder colloid 130 is filled among reflection cavity 141.
It is understood that for the person of ordinary skill of the art, can conceive according to the technology of the present invention and make other various corresponding changes and deformation, and all these change all should belong to the protection domain of the claims in the present invention with deformation.

Claims (4)

1. a phosphor gel preparation, comprises the following steps:
One silicones is provided, the silicon atom of silicones is modified an amido functional group；
One fluorescent material is provided, phosphor particles is modified a carboxyl functional group；
By silicones and the biochemical reaction of fluorescent material hybrid concurrency, make shape between silicon atom and phosphor particles Amido link is become to combine；And
Firming agent is added in the silicones mixture with fluorescent material, so that the solidification of described mixture.
2. phosphor gel preparation as claimed in claim 1, it is characterised in that silicones with During fluorescent material mixing, carbodiimide or N-hydroxy-succinamide is used to make silicon as catalyst Atom and phosphor particles generation chemical reaction.
3. a LED encapsulation method, comprises the following steps:
One substrate is provided；
The first electrode and the second electrode, the first electrode and the second electrode is formed the most exhausted at substrate surface Edge；
Substrate arranges LED crystal particle, the electrode of LED crystal particle respectively with the first electrode It is connected with each other with the second electrode；And
Thering is provided a fluorescent powder colloid, to cover described LED crystal particle, described fluorescent powder colloid is by weighing Profit requires manufactured by the phosphor gel preparation described in 1-2 any one.
4. LED encapsulation method as claimed in claim 3, it is characterised in that at substrate surface Arranging a reflector, reflector has a reflection cavity, and LED crystal particle is arranged on reflective cavity, Described fluorescent powder colloid is filled among reflection cavity.
CN201210297809.6A 2012-08-21 2012-08-21 Phosphor gel preparation and corresponding LED encapsulation method Active CN103633226B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201210297809.6A CN103633226B (en) 2012-08-21 2012-08-21 Phosphor gel preparation and corresponding LED encapsulation method
TW101130620A TWI467814B (en) 2012-08-21 2012-08-23 Method for making phosphor and a corresponding method for package light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210297809.6A CN103633226B (en) 2012-08-21 2012-08-21 Phosphor gel preparation and corresponding LED encapsulation method

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CN103633226A CN103633226A (en) 2014-03-12
CN103633226B true CN103633226B (en) 2016-12-21

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Citations (4)

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CN101840979A (en) * 2009-03-17 2010-09-22 索尼公司 Luminescent material, luminescent material complex and preparation method thereof, fluorescent labeling reagent and preparation method thereof and light-emitting component
CN101916813A (en) * 2010-07-09 2010-12-15 电子科技大学 Light-emitting diode (LED) and preparation method thereof
CN101916811A (en) * 2010-07-09 2010-12-15 电子科技大学 Light-emitting diode and preparation method thereof
CN102272954A (en) * 2008-11-13 2011-12-07 行家光电有限公司 System and method for forming a thin-film phosphor layer for phosphor-converted light emitting devices

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2078736A1 (en) * 2006-10-31 2009-07-15 Techno Polymer Co., Ltd. Heat-dissipating resin composition, substrate for led mounting, reflector, and substrate for led mounting having reflector portion
JP2011146307A (en) * 2010-01-15 2011-07-28 Sumitomo Chemical Co Ltd Polymer light-emitting element
TWI472564B (en) * 2010-08-19 2015-02-11 Furukawa Electric Co Ltd A thermoplastic resin foam, a thermoplastic resin foam manufacturing method, and a light reflection material
JP5745248B2 (en) * 2010-10-08 2015-07-08 株式会社ダイセル Curing agent composition for epoxy resin, curable resin composition and cured product thereof
KR101171605B1 (en) * 2010-12-28 2012-08-07 주식회사 포스코 Method for repairing stack of solid oxide fuel cell
KR20120078606A (en) * 2010-12-31 2012-07-10 제일모직주식회사 Encapsulation material and electronic device including the same
JP5937521B2 (en) * 2011-01-28 2016-06-22 昭和電工株式会社 Composition including quantum dot phosphor, quantum dot phosphor dispersed resin molded body, structure including quantum dot phosphor, light emitting device, electronic device, mechanical device, and method for producing quantum dot phosphor dispersed resin molded body

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102272954A (en) * 2008-11-13 2011-12-07 行家光电有限公司 System and method for forming a thin-film phosphor layer for phosphor-converted light emitting devices
CN101840979A (en) * 2009-03-17 2010-09-22 索尼公司 Luminescent material, luminescent material complex and preparation method thereof, fluorescent labeling reagent and preparation method thereof and light-emitting component
CN101916813A (en) * 2010-07-09 2010-12-15 电子科技大学 Light-emitting diode (LED) and preparation method thereof
CN101916811A (en) * 2010-07-09 2010-12-15 电子科技大学 Light-emitting diode and preparation method thereof

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Publication number Publication date
CN103633226A (en) 2014-03-12
TW201409772A (en) 2014-03-01
TWI467814B (en) 2015-01-01

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Address after: 518000 Guangdong Province, Shenzhen New District of Longhua City, Dalang street, Hua Sheng Lu Yong Jingxuan commercial building 1608

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Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Street tabulaeformis Industrial Zone tenth east two Ring Road No. two

Applicant before: Zhanjing Technology (Shenzhen) Co., Ltd.

Applicant before: Advanced Optoelectronic Technology Inc.

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Address after: 510000 B/D building, No. 12 North Village Road, Xinhua Street, Huadu District, Guangdong, Guangzhou, China

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Applicant before: Jinyang Shenzhen sea Network Intelligent Technology Co., Ltd.

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