KR100693462B1 - Wavelength - converted light emitting diode package using phosphor and manufacturing method - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wavelength conversion light emitting device and a method of manufacturing the same, and more particularly, to a light emitting device that generates light of a specific color such as white by wavelength converting a part of light emitted using a phosphor and a method of manufacturing the same. A wavelength conversion type light emitting diode package using the phosphor of the present invention includes a light emitting diode for emitting light; A phosphor layer converting and emitting wavelengths of light emitted from the light emitting diodes; A coating part for preventing the spread of the phosphor layer; And an electrode unit for providing a power source of the light emitting diode. According to the present invention, the light emitting diode is bonded to the bottom surface of the cup, coated with a material having a different polarity from the material coated with the phosphor around the light emitting diode, and the phosphor is coated on the inside to uniformly coat the entire light emitting diode. It provides a light emitting device coated with a phosphor layer on the entire light emitting surface to improve the light wavelength conversion efficiency.

Phosphor, white color light emitting diode, dispensing

Description

Wavelength Converting Light Emitting Diode Package and Manufacturing Method Using Phosphors {WAVELENGTH-CONVERTED LIGHT EMITTING DIODE PACKAGE USING PHOSPHOR AND MANUFACTURING METHOD}

1 is a view for explaining the manufacturing process of the wavelength conversion light emitting device having a phosphor coating structure by a stencil method.

Figure 2 is a side cross-sectional view showing a wavelength conversion type light emitting diode package using a phosphor according to the prior art.

Figure 3 is a schematic diagram showing an example of spin coating that can be used in the process of forming the phosphor layer according to the prior art.

4A and 4B are bottom and side cross-sectional views illustrating a wavelength conversion light emitting device having a phosphor coating structure according to an embodiment of the present invention.

5 is a schematic view showing a problem to be solved in the present invention.

{Description of Signs of Major Parts of Drawings}

100: light emitting diode 101: coating

102 fluorescent layer 103 sealing material

104: electrode wire 105: electrode portion

106: cup

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wavelength conversion light emitting device and a method of manufacturing the same, and more particularly, to a light emitting device that generates light of a specific color such as white by wavelength converting a part of light emitted using a phosphor and a method of manufacturing the same.

Recently, light-emitting diodes (LEDs) are expected to be the next generation energy-saving illumination light sources by changing from light sources for display to LED light sources, and are expected to replace incandescent lamps and fluorescent lamps. Therefore, technological innovations in the fields of white LED technology, semiconductor lighting or solid state lighting are being actively implemented in various countries around the world.

The light emission of a white LED basically depends on the inherent property of a semiconductor and a phosphor, and is not heat or discharge light. Therefore, unlike ordinary incandescent bulbs, LED lighting fixtures are not hot to touch and are safe and have a long lifespan and thus generate little waste. In addition, since it does not contain harmful substances such as broken glass, mercury, and organic matter, it is an illumination light source that is friendly to the global environment. Therefore, it can be applied not only to general lighting but also in various fields, and a huge market is expected to be formed in the next 10 years.

In general, semiconductor light emitting diodes have a monochromatic characteristic of emitting only light of a predetermined wavelength. Accordingly, in order to obtain white light emission, in general, a combination of R, G, and B is used to implement white light, or a method of converting a part of light of a blue or ultraviolet light emitting device using a phosphor to combine the light into white light. In general, the latter method is actively used in view of cost reduction and miniaturization of products.

Since the conventional white light emitting diode illustrated in FIG. 1 is manufactured by forming a phosphor layer on an upper surface of a wafer on which a plurality of LEDs are formed and then cutting them into individual chip sizes, the phosphor layer is evenly disposed on the top and side surfaces of the white light emitting diode. Coated. However, this process is difficult to realize in general SMEs because it can be manufactured with a semiconductor fab manufacturing line, and it has a disadvantage that it can be applied only to the patent flip structure. (U.S. Patent # 6642652)

On the contrary, as shown in FIG. 2, there is a method of coating a phosphor in a final encapsulation process of a light emitting diode. This method is a white light emitting diode package structure using the most widely used phosphor.

Referring to FIG. 2, the white light emitting diode package includes a cup-shaped package structure in which the light emitting diode is mounted. An ultraviolet or blue light emitting diode is mounted on an electrode formed on a substrate inside the cup-shaped package structure. In addition, the light emitting diode is connected to the electrode of the light emitting diode through the wire 104 to the electrode pattern provided in the cup-shaped package structure.

In the package structure 106 in which the light emitting diodes 100 are mounted, a fluorescent material phosphor molding part 102 is formed using a suitable phosphor. The phosphor constituting the molding part 102 may be, for example, a fluorescent material such as YAG (yttrium-aluminum-garnet type). Such a fluorescent material is prepared by mixing a curing agent with a main material such as an epoxy resin that is not cured in a powder state, and preparing an epoxy slurry, and providing the epoxy slurry to the inside of the package structure by using a dispensing method. Configure. Phosphor particles are interspersed in the molding part, and part of the light emitted from the LED collides with the phosphor particles to convert wavelengths, and the other part is passed through the molding part as it is. These different wavelengths of light can be combined to obtain white light.

However, there is a problem that it is very difficult to obtain a uniform color light in the entire light emission surface because the phosphor powder scattered in the phosphor molding portion 102 or the phosphor layer has a non-uniform spatial distribution. It is acting as a barrier to penetrating the LCD BLU or projector market that requires high-performance specifications of light emitting diodes. In addition, this method can also affect the reliability of the LED device by providing a space for reacting with the material mixed with the phosphor instead of being directly excited with the phosphor when ultraviolet rays are emitted from the active layer.

3 illustrates a technique of coating a phosphor on a top surface of a wafer in which a plurality of light emitting diodes exist by spin coating. This method has a disadvantage in that the coating of the phosphor may not be uniform when there is a step on the top surface of the wafer. It is difficult to commercialize it because it requires post-processing such as etching again to remove the part to be cleaned.

Therefore, there is a need in the art for a wavelength conversion type light emitting diode structure that can be easily manufactured by coating a phosphor to overcome this problem.

The present invention has been made to solve the above problems, and an object thereof is to provide a white light emitting device by forming a phosphor layer by simple ejection on the entire light emitting surface of the light emitting diode.

Another object of the present invention is to provide a method of manufacturing the light emitting device.

In order to achieve the above object, a wavelength conversion type light emitting diode package using the phosphor of the present invention includes a light emitting diode emitting light; A phosphor layer converting and emitting wavelengths of light emitted from the light emitting diodes; A coating part for preventing the spread of the phosphor layer; And an electrode unit for providing a power source of the light emitting diode.

In the present invention, the phosphor layer is preferably mixed with the encapsulant.

In the present invention, the light emitting diodes preferably generate ultraviolet light or blue light.

In the present invention, the fluorescent layer is preferably made of a material for converting the light emitted from the light emitting diode into white light.

In the present invention, the coating part is preferably made of a material different in polarity from the material constituting the fluorescent layer.

In the present invention, a material having a different polarity from the material constituting the fluorescent layer is preferably Teflon.

In the present invention, the coating portion is preferably made of a protrusion form or irregularities.

In the present invention, the phosphor layer is preferably formed by a dispensing method.

In the present invention, the light emitting diode preferably has a general or flip chip structure.

In the present invention, the phosphor layer is preferably formed to pass all the light emitted from the light emitting diode.

In the present invention, it is preferable to further include a cup including the light emitting diode therein.

In the present invention, the portion in which the light emitting diode is bonded in the cup is preferably contained in the other bottom surface of the cup.

A wavelength conversion light emitting diode package manufacturing method using the phosphor of the present invention comprises the steps of coating a material having a different polarity from the material mixing the phosphor on the bottom surface of the cup around the light emitting diode; Discharging and coating the phosphor; Crosslinking the coated phosphor mixture and final packaging into an encapsulant.

In the present invention, the coating method preferably uses at least one method selected from sputtering and spraying methods using a mask.

In order to achieve the above technical problem, the present invention, there is a light-emitting diode that can be wire-bonded to the bottom of the cup and a material that is different in polarity from the material mixing the phosphor at the bottom of the cup around the light emitting diode (Teflon, etc.) A light emitting device having a package structure which is slightly convex or concave or flat coated, and which has a phosphor layer which converts the wavelength of light generated from the light emitting diode by causing the phosphor to be coated in a dome shape inside the coated material. To provide.

Preferably, the light emitting diodes generate ultraviolet light or blue light, and the phosphor layer may be a material for converting white light into light generated from the light emitting diodes.

Phosphor layer employed in the present invention can be formed more easily than physical vapor deposition, spin coating or stencil method, preferably coated with a dispenser.

Furthermore, the present invention can be easily applied to both a general light emitting diode (a type in which two wires are bonded to an upper surface or a type in which one wire is bonded to an upper surface) or a chip having a flip chip bonding structure and to manufacture a wavelength conversion light emitting device. It may provide a method. The method includes a technique of coating a light emitting diode in a dome shape, and coating the phosphor with a material having a very different polarity from a material (epoxy, silicon, etc.) mixed with a phosphor on the bottom surface of the cup around the light emitting diode. Discharging and coating, crosslinking the coated phosphor mixture, and final packaging into an encapsulant.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. In the following description, specific details such as specific components are shown, which are provided to help a more general understanding of the present invention, and it is understood that these specific details may be changed or changed within the scope of the present invention. It is self-evident to those of ordinary knowledge in Esau.

4A and 4B are bottom and cross-sectional views of a wavelength conversion light emitting diode package using phosphors according to an embodiment of the present invention.

In the above embodiment, the wavelength conversion type light emitting diode package using the phosphor is the light emitting diode 100, the coating portion 101, the fluorescent layer 102, the encapsulant 103, the electrode wire 104, the electrode portion 105 , And cup 106.

This embodiment schematically illustrates how the fluorescent layer 102 is formed in a diode package.

4A and 4B, a wavelength conversion light emitting diode using the above-described phosphor is illustrated. The light emitting diodes 100 illustrated in FIGS. 4A and 4B are preferably light emitting diodes for obtaining white light. The light emitting diodes 100 may include a general light emitting diode or flip chip type.

The structure of the light emitting diode device is a light emitting diode (100) emitting blue or ultraviolet light is bonded to the bottom of the cup 106, the coating portion 101 is made of a material different in polarity from the material mixed with the phosphor around the die Is formed.

The encapsulant 102 mixed with the phosphor may be discharged from the top, and the discharged phosphor flows down as shown in FIG. 4 and stops in contact with a coating material having a different polarity and emits circularly due to surface tension. It is coated in the form of wrapping the diode. In this case, the coating portion surrounding the light emitting diode may protrude slightly or may enter into an uneven shape.

The white light emitting diode emits blue or ultraviolet light, but through the phosphor layer 102 a large portion of the blue or ultraviolet light is converted to long wavelengths, combined with some unconverted light or light converted to a different degree, and finally Desired white light can be obtained.

It includes a phosphor layer 102 formed on the light emitting surface of the light emitting diode 100 relatively uniform as a whole. The phosphor layer is made of a fluorescent material for forming white light by converting ultraviolet light or blue light.

The phosphor layer 102 may be formed on the upper and side surfaces of the light emitting diode 100, which is a substantially light emitting surface, and may be configured such that almost no light does not pass through the phosphor layer 102, thereby improving white light conversion efficiency. In addition, in order to prevent non-uniform distribution and precipitation of the phosphor particles generated in the dispensing process of curing after mixing and spraying the conventional phosphor powder and epoxy resin, uniformity can be increased by coating with high density. In addition, the problem of coating thicker than necessary in the conventional dispensing method can also be solved.

As illustrated, the phosphor layer should be coated with a material having a different polarity from the phosphor mixed material around the light emitting diode to sufficiently cover the light emitting surface of the light emitting diode 102, and if not coated, the light emitting diode as shown in FIG. In the case of discharging the phosphor from above, it is initially clustered in a circle, but when a predetermined amount or more is discharged, it flows sideways and spreads widely along the bottom surface of the cup. Then, the phosphor is very thinly coated on the upper surface of the light emitting diode, and as a result, white light cannot be realized.

The wavelength conversion light emitting device is mainly used as a light emitting device for white light emission. In this case, the light emitting diode may be a light emitting diode that generates ultraviolet light or blue light, which is a short wavelength series, and the phosphor layer may be selected and used as a suitable fluorescent material to obtain white light by converting the short wavelength light. The coating method of the material surrounding the light emitting diode shown in FIG. 1 may be manufactured by a sputtering or spraying method using a mask when making a cup on which the light emitting diode is mounted.

As described above, the light emitting device according to the present invention has a high density coating of the entire light emitting surface of the light emitting diode, and has the advantage that both general chip flip chips can be coated using a dispenser.

As described above, although described with reference to the preferred embodiment of the present invention, those skilled in the art will be variously modified and modified within the scope of the present invention without departing from the spirit and scope of the present invention described in the claims below. It will be appreciated that it can be changed.

As described above, according to the present invention, the light emitting diode is bonded to the bottom surface of the cup, coated with a material having a different polarity from the material coated with the phosphor around the light emitting diode, and the phosphor is coated on the inside of the entire light emitting diode. The uniform coating provides a light emitting device in which a phosphor layer is coated on the entire light emitting surface, thereby improving light wavelength conversion efficiency.

In addition, by forming the phosphor layer by using an ejection process, it is possible to solve the problem of non-uniform phosphor particles generated in the method of discharging the whole cup by a dispensing method.

Claims (14)

Light emitting diodes emitting light; A phosphor layer converting and emitting wavelengths of light emitted from the light emitting diodes; A coating part for preventing the spread of the phosphor layer; And wavelength conversion type light emitting diode package using a phosphor comprising an electrode for providing a power source of the light emitting diode. The wavelength conversion type light emitting diode package using a phosphor according to claim 1, wherein the phosphor layer is mixed with an encapsulant. The light emitting diode package of claim 1, wherein the light emitting diodes generate ultraviolet light or blue light. The wavelength conversion type light emitting diode package using a phosphor according to claim 3, wherein the fluorescent layer is made of a material converting light emitted from the light emitting diode into white light. The wavelength conversion type light emitting diode package using a phosphor according to claim 1, wherein the coating part is made of a material having a different polarity from the material constituting the fluorescent layer. [6] The wavelength conversion type light emitting diode package of claim 5, wherein the material constituting the fluorescent layer is different in polarity from that of Teflon. The method of claim 1, wherein the coating portion wavelength conversion type light emitting diode package using a phosphor, characterized in that formed in the form of protrusions or irregularities. The wavelength conversion type light emitting diode package using a phosphor according to claim 1, wherein the phosphor layer is formed by any one method selected from the group consisting of physical vapor deposition, spin coating, stenciling, and dispenser coating. The wavelength conversion type light emitting diode package using a phosphor according to claim 1, wherein the light emitting diode has a general and flip chip structure. The wavelength conversion type light emitting diode package using a phosphor according to claim 1, wherein the phosphor layer is formed so that all light emitted from the light emitting diode passes. The wavelength conversion type light emitting diode package using a phosphor according to claim 1, further comprising a cup including the light emitting diode therein. 12. The wavelength conversion type light emitting diode package using a phosphor according to claim 11, wherein a portion in which the light emitting diodes are bonded is contained in the cup than another bottom surface of the cup. Coating the bottom surface of the cup with a material different in polarity from the material mixing the phosphor around the light emitting diode; Discharging and coating the phosphor; Crosslinking the coated phosphor mixture and A wavelength conversion type light emitting diode package manufacturing method using a phosphor comprising the final packaging step of encapsulating material. The method of claim 13, wherein the coating method comprises any one selected from the group consisting of a sputtering and a spraying method using a mask.

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