CN109585630B - LED packaging structure, preparation method thereof and LED lamp - Google Patents
LED packaging structure, preparation method thereof and LED lamp Download PDFInfo
- Publication number
- CN109585630B CN109585630B CN201910057310.XA CN201910057310A CN109585630B CN 109585630 B CN109585630 B CN 109585630B CN 201910057310 A CN201910057310 A CN 201910057310A CN 109585630 B CN109585630 B CN 109585630B
- Authority
- CN
- China
- Prior art keywords
- visible light
- led chip
- led
- insulating visible
- reflection type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention discloses an LED packaging structure which comprises a cup-shaped support, an LED chip, an insulating visible light reflection type powder layer and packaging glue, wherein the cup-shaped support comprises a substrate and a side wall, the side wall and the substrate jointly form a cavity of the cup-shaped support, the insulating visible light reflection type powder layer and the LED chip are arranged in the cavity, the LED chip is fixed on the substrate, the insulating visible light reflection type powder layer covers the area, on the substrate, where the LED chip is not arranged, the insulating visible light reflection type powder layer comprises inorganic oxide insulating visible light reflection type powder, and the packaging glue is filled in the cavity and covers the LED chip and the insulating visible light reflection type powder layer. The invention also discloses a preparation method of the LED packaging structure and an LED lamp.
Description
Technical Field
The invention relates to the field of LED packaging, in particular to an LED packaging structure, a preparation method thereof and an LED lamp.
Background
The LED light source is very concerned with environmental protection, long life and low energy consumption, and is widely used for commercial lighting and household lighting. Common packaging methods for LED light sources include Surface Mount Device (SMD) and Chip On Board (COB). Due to the requirement for light reflection of the package substrate, the surface of the package substrate generally has a silver metal layer. However, in the use process of the LED light source, the lamp accessories, the environment and the like may contain sulfur, and halogen elements such as sulfur, chlorine, bromine and the like enter the light source and can chemically react with silver metal to generate dark substances, so that a part of light of the light source is absorbed, and further the overall brightness of the light source is reduced, namely, so-called light decay.
The common method for preventing silver halide is to package the support after evaporating or coating a protective film on the surface of the metal layer of the support, or to coat a protective film on the outer surface of the packaged finished product. No matter the protective film is coated on the outer surface of a packaged finished product, or the protective film is evaporated and coated on the metal surface layer in the bracket, new process steps need to be added, the manufacturing cost of the finished product is increased, and new potential problems are introduced.
Disclosure of Invention
Therefore, it is necessary to provide an LED package structure, a method for manufacturing the same, and an LED lamp, aiming at the problems of complicated steps and high cost of the conventional anti-halogenation method.
An LED package structure comprising a cup-shaped support, an LED chip, an insulating visible light reflective powder layer and an encapsulant, wherein the cup-shaped support comprises a substrate and a sidewall, the sidewall and the substrate together form a cavity of the cup-shaped support, the insulating visible light reflective powder layer and the LED chip are disposed in the cavity, the LED chip is fixed on the substrate, the insulating visible light reflective powder layer covers an area of the substrate where the LED chip is not disposed, the insulating visible light reflective powder layer comprises an inorganic oxide insulating visible light reflective powder, and the encapsulant is filled in the cavity and covers the LED chip and the insulating visible light reflective powder layer.
In one embodiment, the insulating visible light reflection type powder is micro-nano powder,
preferably, the insulating visible light reflection-type powder is selected from one or more of zirconium dioxide micro-nano powder, aluminum oxide micro-nano powder and zinc oxide micro-nano powder, and/or
Preferably, the encapsulation glue comprises a colloid and phosphor powder dispersed in the colloid.
In one embodiment, the insulating visible light reflective powder layer covers only a region of the substrate where the LED chip is not disposed, and an upper surface of the LED chip is not covered with the insulating visible light reflective powder.
In one embodiment, the thickness of the insulating visible light reflecting powder layer is less than the height of the LED chip.
In one embodiment, the substrate further comprises a metal layer which is arranged on the surface of the substrate and covered by the insulating visible light reflection type powder layer.
A preparation method of an LED packaging structure comprises the following steps:
providing a cup-shaped support fixed with an LED chip, wherein the cup-shaped support comprises a substrate and a side wall, the side wall and the substrate jointly form a cavity of the cup-shaped support, and the LED chip is arranged in the cavity and fixed on the substrate;
applying a first liquid glue on the substrate which is not covered by the LED chip in the cavity, wherein the first liquid glue comprises a first liquid glue body and insulating visible light reflection type powder dispersed in the first liquid glue body;
applying a second liquid glue on the upper surface of the LED chip, wherein the second liquid glue comprises a second liquid glue and does not contain the insulating visible light reflection type powder;
carrying out centrifugal rotation on the cup-shaped support fixed with the LED chip and the first and second liquid glue, so that the insulating visible light reflection type powder is deposited in an area, on the substrate, where the LED chip is not arranged, and an insulating visible light reflection type powder layer is formed; and
and solidifying the first liquid colloid and the second liquid colloid which are subjected to centrifugal rotation mixing.
In one embodiment, the density of the insulating visible light reflection type powder is greater than that of the first liquid colloid; and/or
Preferably, the second liquid glue further comprises a phosphor.
In one embodiment, the first liquid glue is not applied to the upper surface of the LED chip.
In one embodiment, the amount of the insulating visible light reflection type powder in the first liquid glue is such that the thickness of the insulating visible light reflection type powder layer formed by deposition is smaller than the height of the LED chip, and preferably, the application thickness of the first liquid glue is smaller than the height of the LED chip.
An LED lamp comprises the LED packaging structure or the LED packaging structure obtained by the preparation method.
The LED packaging structure is provided with a packaging adhesive and an insulating visible light reflection type powder layer, and the insulating visible light reflection type powder layer covers the area, on which the chip is not arranged, on the substrate. The insulating visible light reflection type powder layer formed by the inorganic oxide insulating visible light reflection type powder can replace a metal reflection layer or cover the surface of the metal layer as a blocking layer, so that the halogenation effect of halogen on the metal layer is blocked, the light attenuation caused by the halogenation of the reflection layer is avoided, and the service life of the LED lamp is prolonged. The insulating visible light reflection type powder has a good effect of reflecting light, can directly replace a metal silver reflection layer, and reduces the coverage area of silver, thereby reducing the cost. Certainly, in order to realize the functions of electric connection or heat dissipation and the like, a metal layer can be arranged between the substrate and the insulating visible light reflection type powder layer, but the metal layer can be made of a material with lower cost because the metal layer does not need to have the light reflection property. Compared with the traditional process of coating a protective film on the outer surface of a packaged finished product or packaging after evaporating or coating the protective film on the metal surface layer in the support, the preparation method of the LED packaging structure is compatible with the normal packaging process, and in the packaging process, the deposition of the insulating visible light reflection type powder on the substrate is realized by centrifuging the liquid glue containing the insulating visible light reflection type powder, so that new process steps are not required to be added, the packaging efficiency is improved, and the manufacturing cost is reduced. And the insulating visible light reflection type powder layer is formed in the packaging process, so that the damage of the packaging process, such as a metal lead welding process, to the insulating visible light reflection type powder layer is avoided, and the improvement of halogenation resistance and reflection performance is facilitated.
Drawings
Fig. 1 is a schematic structural diagram of an LED package structure according to an embodiment of the invention;
FIG. 2 is a schematic structural diagram of a comparative LED package structure according to the present invention;
fig. 3 is a schematic structural diagram of an LED package structure according to another embodiment of the invention;
FIG. 4 is a schematic structural diagram of an LED package structure according to another comparative example of the present invention;
fig. 5 is a schematic structural diagram illustrating a dispensing process of liquid glue according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the following describes in detail the LED package structure, the manufacturing method thereof and the LED lamp according to the present invention with embodiments and with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1-2, an embodiment of the present invention provides an LED package structure, including a cup-shaped support, an LED chip 20, an insulating visible light reflective powder layer, and a package adhesive 30, where the cup-shaped support includes a substrate 12 and a sidewall 14, the sidewall 14 and the substrate 12 together form a cavity of the cup-shaped support, the insulating visible light reflective powder layer and the LED chip 20 are disposed in the cavity, the LED chip 20 is fixed on the substrate 12, the insulating visible light reflective powder layer covers a region of the substrate 12 where the LED chip 20 is not disposed, the insulating visible light reflective powder layer includes an inorganic oxide insulating visible light reflective powder 40, and the package adhesive 30 is filled in the cavity and covers the LED chip 20 and the insulating visible light reflective powder layer.
The LED package structure of the embodiment of the invention is provided with a package adhesive 30 and an insulating visible light reflective powder layer, and the insulating visible light reflective powder layer covers the area on the substrate 12 where the LED chip 20 is not disposed. The insulating visible light reflection type powder layer formed by the inorganic oxide insulating visible light reflection type powder 40 can replace a metal reflection layer or be covered on the surface of a metal layer as a blocking layer, so that the halogenation effect of halogen on the metal layer is blocked, the light attenuation caused by the halogenation of the reflection layer is avoided, and the service life of the LED lamp is prolonged. The insulating visible light reflection type powder 40 has a good effect of reflecting light, can directly replace a metal silver reflection layer, and reduces the coverage area of silver, thereby reducing the cost. Certainly, in order to realize the functions of electrical connection or heat dissipation, a metal layer may be provided between the substrate 12 and the insulating visible light reflective powder layer, but since the metal layer does not need to have a light reflection property, the metal layer may be made of a material with a low cost. Compared with the traditional process of coating a protective film on the outer surface of a packaged finished product or packaging the support after evaporating or coating the protective film on the metal surface layer in the support, the LED packaging structure provided by the embodiment of the invention can be obtained by a preparation method compatible with the normal packaging process, and in the packaging process, the deposition of the insulating visible light reflection type powder 40 on the substrate 12 can be realized by centrifuging the liquid glue containing the insulating visible light reflection type powder 40, so that no new process step is required to be added, the packaging efficiency is improved, and the manufacturing cost is reduced. And the insulating visible light reflection type powder layer can be formed in the packaging process, so that the damage of the packaging process, such as a metal lead welding process, to the insulating visible light reflection type powder layer is avoided, and the improvement of halogenation resistance and reflection performance is facilitated.
Preferably, the bottom of the side wall 14 is inclined towards the inner direction of the cavity, that is, the diameter of the cavity is gradually increased from the bottom to the top, and the inclined side wall 14 is arranged to increase light reflection in the cavity and enhance the light extraction effect; meanwhile, the flow of liquid glue in the preparation process of the LED packaging structure is enhanced, so that the insulating visible light reflection type powder 40 is easier to deposit at the bottom through sedimentation to form the insulating visible light reflection type powder layer. The inclination angle may be 30 to 70 °. Alternatively, the material of the sidewall 14 may include one or more of Epoxy resin (EMC), Polyphthalamide resin (PPA), bmc (bulk Molding compounds) material, and smc (sheet Molding compounds) material. The sidewall 14 and the base 12 may be a unitary structure, the latter being two elements that are separately provided and assembled. The sidewall 14 may be coupled to the substrate 12 by an injection molding process.
In an embodiment, a metal layer is further disposed on the surface of the substrate 12, and the metal layer is covered by the insulating visible light reflection type powder layer. The metal layer is used for circuit connection or heat dissipation of the LED chip 20. In an embodiment, the metal layer may include, but is not limited to, at least one of a silver layer, an aluminum layer, a nickel layer, and a metal composite layer. The insulating visible light reflective powder layer may be used to block halogens from contacting the metal layer, avoiding halogenation of the metal layer.
The number of the LED chips 20 may be one or more. The LED chip 20 may be fixed on the substrate 12 by a die bond adhesive. The thickness of the LED chip 20 may be 80 to 150 μm. In one embodiment, the LED package structure includes metal leads electrically connecting the electrodes of the LED chip 20 and the metal layer. The metal lead comprises at least one of a gold wire, a silver wire, a copper wire and an alloy wire, preferably the gold wire, and the gold wire has higher conductivity and better heat dissipation.
Alternatively, the insulating visible light reflection type powder 40 may include a micro-nano powder. The insulating visible light reflection type powder can be white, so that the influence on the light emitting color of the LED is avoided. Preferably, the insulating visible light reflective powder 40 includes, but is not limited to, one or more of a zirconium dioxide micro-nano powder, an aluminum oxide micro-nano powder, and a zinc oxide micro-nano powder. The particle size of the insulating visible light reflection type powder 40 may be 1nm to 1000 nm. Preferably, the particle size of the insulating visible light reflective powder 40 may be 1nm to 100nm, and the smaller the particle size, the smaller the gap formed between the insulating visible light reflective powder 40, and the higher the coverage of the substrate 12 with the insulating visible light reflective powder layer. Preferably, the coverage of the surface of the substrate 12 not covered with the LED chip 20 with the insulating visible light reflective powder 40 is close to 100%.
Preferably, the insulating visible light reflective powder layer covers only the region of the substrate 12 where the LED chip 20 is not disposed, and the upper surface (i.e., the light emitting surface) of the LED chip 20 is not covered by the insulating visible light reflective powder 40, so as to ensure that the insulating visible light reflective powder 40 does not affect the light emitting effect of the LED chip 20. More preferably, the thickness of the insulating visible light reflective powder layer is smaller than the height of the LED chip 20, so as to ensure that the light extraction effect of the LED chip 20 is not affected by the insulating visible light reflective powder 40. In one embodiment, the thickness of the insulating visible light reflective powder layer may be 1 μm to 10 μm. In this thickness range, both the functions of blocking halogen and enhancing the intensity of reflected light can be achieved. The thickness of the insulating visible light reflective powder layer may be determined by a combination of factors such as the halogen concentration during the production of the LED lamp, the requirement for light reflection, and the type of the insulating visible light reflective powder 40.
Referring to fig. 3-4, the encapsulant 30 includes a gel. In an embodiment, the package adhesive 30 may further include a phosphor 34 dispersed in the adhesive, and the LED lamp emits light with different colors by using the phosphor 34 and the LED chip 20 in cooperation. The phosphor 34 may include, but is not limited to, one or more of red phosphor, yellow phosphor, and green phosphor. The phosphors 34 of different colors and the LED chip 20 cooperate to emit light of different colors. Preferably, the phosphor 34 is at least disposed in the light emitting direction of the LED chip 20, so as to ensure the cooperation between the light emitting direction of the LED chip 20 and the phosphor 34. The phosphor 34 may be disposed at the bottom of the packaging adhesive 30 and in contact with the LED chip 20 or dispersed in the gel of the packaging adhesive 30. In a specific embodiment, the LED chip 20 is a blue LED chip 20, and the phosphor 34 is a yellow phosphor, and the yellow phosphor is excited by the blue LED chip 20 to form white light. The encapsulant 30 may further include uniformly dispersed scattering particles, and the scattering particles are added to enhance the scattering effect of the light emitted from the LED chip 20.
The embodiment of the invention also provides a preparation method of the LED packaging structure, which comprises the following steps:
s10, providing a cup-shaped support fixed with the LED chip 20, wherein the cup-shaped support comprises a substrate 12 and a side wall 14, the side wall 14 and the substrate 12 together form a cavity of the cup-shaped support, and the LED chip 20 is arranged in the cavity and fixed on the substrate 12;
s20, applying a first liquid glue on the substrate 12 uncovered by the LED chip 20 in the cavity, the first liquid glue including a first liquid glue and an insulating visible light reflective powder 40 dispersed in the first liquid glue;
s30, applying a second liquid glue on the upper surface of the LED chip 20, wherein the second liquid glue comprises a second liquid glue and does not contain the insulating visible light reflective powder 40;
s40, centrifugally rotating the cup-shaped holder with the LED chip 20 fixed thereon together with the first and second liquid glues, so as to deposit the insulating visible light reflective powder 40 on the substrate 12 in an area where the LED chip 20 is not disposed, thereby forming an insulating visible light reflective powder layer; and
and S50, solidifying the first liquid colloid and the second liquid colloid after the centrifugal rotation and mixing.
In the embodiment of the invention, the first liquid glue containing the insulating visible light reflection type powder 40 is applied on the substrate 12 which is not covered by the LED chip 20, and the second liquid glue without the insulating visible light reflection type powder 40 is applied on the LED chip 20, so that the insulating visible light reflection type powder 40 is only applied in the liquid glue in the area of the substrate 12 which is not covered by the LED chip 20, then under the centrifugal rotation action, the insulating visible light reflection type powder 40 is settled under the gravity action, the first liquid glue and the second liquid glue flow and are mixed, so that the insulating visible light reflection type powder 40 is deposited at the bottom to form the insulating visible light reflection type powder layer, and the liquid glue is solidified to form the packaging glue 30. According to the embodiment of the invention, the insulating visible light reflection type powder 40 is dispersed in the liquid glue, the insulating visible light reflection type powder 40 is deposited into the insulating visible light reflection type powder layer under the action of centrifugal force, the insulating visible light reflection type powder layer has the functions of preventing the metal layer from halogenating and reflecting light, the insulating visible light reflection type powder layer is formed in the LED packaging process, no new process step is added, and the preparation cost is reduced. The liquid glue is applied in two steps, so that the deposition of the insulating visible light reflection type powder 40 on the LED chip 20 is avoided, and the influence of the insulating visible light reflection type powder 40 on the light emitting effect of the LED chip 20 is avoided.
In step S10, the LED chip 20 may be fixed on the substrate 12 by die attach adhesive. The surface of the substrate 12 may include a metal layer, and the LED chip 20 may be fixed on the metal layer. Step S10 may include soldering both ends of a metal lead to the LED chip 20 fixed on the substrate 12 and the metal layer, respectively.
In step S20, the insulating visible light reflective powder 40 may be uniformly dispersed in the first liquid colloid. After curing, the small molecules in the first liquid colloid can be crosslinked into large molecules, so that the viscosity of the first liquid colloid is reduced, and the solid encapsulation adhesive 30 is gradually formed. The first liquid colloid can comprise glue A and glue B, and the glue A and the glue B are used in a matching mode. The A glue can comprise one or more of epoxy resin, silicon glue and silicon resin, and is preferably silicon glue or silicon resin, and the silicon glue or the silicon resin has certain halogenation prevention performance. The glue B comprises a curing agent, and the curing of the first liquid colloid is accelerated after the glue A and the glue B are mixed for use. The mass ratio of the glue A to the glue B can be 1: 1-1: 3, the glue A and the glue B can be obtained through purchase, and the mass ratio can be determined according to actual types.
Preferably, the density of the insulating visible light reflection type powder 40 is greater than that of the first liquid colloid, so that the insulating visible light reflection type powder 40 can be deposited at the bottom by centrifugation. Preferably, the viscosity of the first liquid glue may be 3000cP to 10000cP, and in this viscosity range, the first liquid glue is ensured to have better fluidity in the centrifugal process, which is beneficial to the sedimentation of the insulating visible light reflection type powder 40.
Preferably, the amount of the insulating visible light reflective powder 40 in the first liquid glue is such that the thickness of the insulating visible light reflective powder layer formed by deposition is smaller than the height of the LED chip 20. The applied thickness of the first liquid glue may be smaller than the height of the LED chip 20, so as to prevent the insulating visible light reflective powder 40 in the first liquid glue from exceeding the height of the LED chip 20 and depositing on the LED chip 20 in a centrifugal process.
In step S30, the second liquid glue preferably fills the cavity or at least covers the LED chip 20, so as to ensure the sealing property of the LED chip 20. The first liquid glue is not applied to the upper surface of the LED chip 20, so as to prevent the insulating visible light reflective powder 40 from settling on the LED chip 20.
In an embodiment, the second liquid glue may include a second liquid glue. The second liquid colloid and the first liquid colloid may be the same or different in kind. The second liquid gel may also include a phosphor 34 dispersed in the second liquid gel. The density of the phosphor 34 may be greater than or equal to the density of the second liquid colloid, so that the phosphor 34 can be settled to the bottom or dispersed in the second liquid colloid by the centrifugal force.
Referring to fig. 5, in steps S20 and S30, the first liquid glue and the second liquid glue may be applied on the substrate 12 or the LED chip 20 by dispensing or coating.
Preferably, the step S20 may include a step of defoaming the first liquid glue before the step of applying the first liquid glue. The defoaming step may include adding a defoaming agent to the first liquid glue, where the defoaming agent may be a silicon-based defoaming agent. The step of defoaming may further include blowing the first liquid glue with hot air to break the bubbles. Preferably, the step S30 may include a step of defoaming the second liquid glue before the step of applying the second liquid glue. The defoaming step may be the same as the defoaming step in step S20.
In step S40, since the first and second liquid glues of the first and second liquid glues have fluidity, the density of the insulating visible light reflective powder 40 is high, and the first and second liquid glues are mixed by flowing under the centrifugal force, so that the insulating visible light reflective powder 40 is only in the first liquid glue, and the insulating visible light reflective powder 40 is only deposited on the substrate 12 region not covered by the LED chip 20. Preferably, the centrifugation speed may be 1000rpm/min to 3000 rpm/min. The centrifugal speed should not be too fast or too slow, so as to ensure the flow of the first liquid glue and ensure that the insulating visible light reflective powder 40 does not deviate onto the LED chip 20. The centrifugation time can be 1min to 5 min.
In step S50, the curing may include: and heating the first liquid colloid and the second liquid colloid which are centrifugally rotated and mixed, polymerizing small molecules in the first liquid colloid and the second liquid colloid into macromolecules by heating, and increasing the hardness to form the solid packaging adhesive 30. The curing temperature can be 120-180 ℃, and the curing time can be 2-4 hours. The curing temperature and time may be determined according to the kinds of the first and second liquid colloids.
The LED packaging structure of the embodiment can be prepared by the preparation method.
The embodiment of the invention also provides an LED lamp which comprises the LED packaging structure or the LED packaging structure obtained by the preparation method.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A preparation method of an LED packaging structure comprises the following steps:
providing a cup-shaped support fixed with an LED chip, wherein the cup-shaped support comprises a substrate and a side wall, the side wall and the substrate jointly form a cavity of the cup-shaped support, and the LED chip is arranged in the cavity and fixed on the substrate;
applying a first liquid glue on the substrate which is not covered by the LED chip in the cavity, wherein the first liquid glue is not applied to the upper surface of the LED chip, the first liquid glue comprises a first liquid glue and insulating visible light reflection type powder dispersed in the first liquid glue, the density of the insulating visible light reflection type powder is greater than that of the first liquid glue, and the amount of the insulating visible light reflection type powder in the first liquid glue enables the thickness of the deposited insulating visible light reflection type powder layer to be smaller than the height of the LED chip;
applying a second liquid glue on the upper surface of the LED chip, wherein the second liquid glue comprises a second liquid glue and does not contain the insulating visible light reflection type powder;
carrying out centrifugal rotation on the cup-shaped support fixed with the LED chip and the first and second liquid glue, so that the insulating visible light reflection type powder is deposited in an area, on the substrate, where the LED chip is not arranged, and an insulating visible light reflection type powder layer is formed; and
and solidifying the first liquid colloid and the second liquid colloid which are subjected to centrifugal rotation mixing.
2. The method for manufacturing the LED packaging structure according to claim 1, wherein the second liquid glue further comprises phosphor.
3. The method for manufacturing an LED package structure according to claim 1, wherein the first liquid glue is applied to a thickness smaller than a height of the LED chip.
4. An LED package structure prepared by the method of any one of claims 1 to 3, comprising a cup-shaped support, an LED chip, an insulating visible light reflective powder layer, and an encapsulant, the cup-shaped support comprises a base plate and a side wall, the side wall and the base plate jointly form a cavity of the cup-shaped support, the insulating visible light reflective powder layer and the LED chip are disposed in the cavity, the LED chip is fixed on the substrate, the insulating visible light reflective powder layer covers a region of the substrate where the LED chip is not disposed, the insulating visible light reflective powder layer comprises an inorganic oxide insulating visible light reflective powder, the packaging adhesive is filled in the cavity and covers the LED chip and the insulating visible light reflection type powder layer.
5. The LED package structure of claim 4, wherein the insulating visible light reflective powder is a micro-nano powder.
6. The LED packaging structure of claim 4, wherein the insulating visible light reflective powder is selected from one or more of a zirconium dioxide micro-nano powder, an aluminum oxide micro-nano powder and a zinc oxide micro-nano powder, and/or,
the packaging adhesive comprises colloid and fluorescent powder dispersed in the colloid.
7. The LED package structure of claim 4, wherein the insulating visible light reflective powder layer covers only an area of the substrate where the LED chip is not disposed, and an upper surface of the LED chip is not covered by the insulating visible light reflective powder.
8. The LED package structure of claim 4, wherein the thickness of the insulating visible light reflecting powder layer is less than the height of the LED chip.
9. The LED package structure of claim 4, further comprising a metal layer disposed on the surface of the substrate and covered by the insulating visible light reflective powder layer.
10. An LED lamp, comprising the LED packaging structure obtained by the preparation method according to any one of claims 1 to 3 or the LED packaging structure according to any one of claims 4 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910057310.XA CN109585630B (en) | 2019-01-22 | 2019-01-22 | LED packaging structure, preparation method thereof and LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910057310.XA CN109585630B (en) | 2019-01-22 | 2019-01-22 | LED packaging structure, preparation method thereof and LED lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109585630A CN109585630A (en) | 2019-04-05 |
| CN109585630B true CN109585630B (en) | 2020-08-18 |
Family
ID=65917507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910057310.XA Active CN109585630B (en) | 2019-01-22 | 2019-01-22 | LED packaging structure, preparation method thereof and LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109585630B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931625A (en) * | 2019-12-24 | 2020-03-27 | 厦门多彩光电子科技有限公司 | LED packaging method |
| CN111755582A (en) * | 2020-07-08 | 2020-10-09 | 泉州市康电光电科技有限公司 | Light source light distribution high-display fresh lighting preparation process |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2686099Y (en) * | 2004-03-09 | 2005-03-16 | 葛世潮 | White light luminous diode |
| CN102263193A (en) * | 2011-07-19 | 2011-11-30 | 四川九洲光电科技股份有限公司 | Luminous chip capable of increasing brightness of light-emitting diode and packaging method for luminous chip |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102227769B1 (en) * | 2014-11-06 | 2021-03-16 | 삼성전자주식회사 | Semiconductor light emitting diode and semiconductor light emitting diode package using the same |
-
2019
- 2019-01-22 CN CN201910057310.XA patent/CN109585630B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2686099Y (en) * | 2004-03-09 | 2005-03-16 | 葛世潮 | White light luminous diode |
| CN102263193A (en) * | 2011-07-19 | 2011-11-30 | 四川九洲光电科技股份有限公司 | Luminous chip capable of increasing brightness of light-emitting diode and packaging method for luminous chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109585630A (en) | 2019-04-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5083503B2 (en) | Light emitting device and lighting device | |
| JP3492178B2 (en) | Semiconductor light emitting device and method of manufacturing the same | |
| TWI623604B (en) | Anisotropic conductive adhesive, lighting device and method for producing anisotropic conductive adhesive | |
| US20080218072A1 (en) | Semiconductor light-emitting device and method for manufacturing semiconductor light-emitting device | |
| JP2009147343A (en) | Distribution of phosphor using centrifugal force in led lamp | |
| WO2010029872A1 (en) | Light emitting unit, light emitting module, and display device | |
| JP2006135288A (en) | White emitting diode package and its manufacturing method | |
| JP2005340813A (en) | Mold material containing fluorescent material and light-emitting device made of the same | |
| TWI789419B (en) | Semiconductor light-emitting device and method for producing the same | |
| TWI648878B (en) | Led light source, manufacturing method of led light source and direct display thereof | |
| CN109585630B (en) | LED packaging structure, preparation method thereof and LED lamp | |
| TWI832948B (en) | Light emitting device and method of manufacturing light emitting device | |
| US11791448B2 (en) | Light-emitting device and element mounting wiring board | |
| CN108767086A (en) | LED lamp bead and preparation method thereof | |
| US20220029061A1 (en) | Light-emitting device and method for manufacturing light-emitting device | |
| CN109904298B (en) | L ED packaging structure and preparation method thereof, and L ED lamp | |
| CN112166354A (en) | Wavelength conversion element and light source device | |
| CN102244179B (en) | Encapsulation structure for light-emitting diode and manufacturing method thereof | |
| KR100445666B1 (en) | Light emitting device having light emitting surface of concave lens and method for manufacturing thereof | |
| US11456402B2 (en) | Light-emitting device and method of manufacturing the light-emitting device | |
| US20140145584A1 (en) | Hemispherical remoter phosphor and methods of forming the same | |
| CN109390455B (en) | White light emitting diode and manufacturing method thereof | |
| CN218568871U (en) | High light efficiency flip-chip COB packaging structure | |
| CN101859823A (en) | Surface-mounting LED packaging structure and manufacture method thereof | |
| JP2017103492A (en) | Light-emitting device and manufacturing method therefor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |