CN109390455B - White light emitting diode and manufacturing method thereof - Google Patents
White light emitting diode and manufacturing method thereof Download PDFInfo
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- CN109390455B CN109390455B CN201811383438.7A CN201811383438A CN109390455B CN 109390455 B CN109390455 B CN 109390455B CN 201811383438 A CN201811383438 A CN 201811383438A CN 109390455 B CN109390455 B CN 109390455B
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- 230000003247 decreasing effect Effects 0.000 claims abstract description 4
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- 229910052751 metal Inorganic materials 0.000 claims description 56
- 238000004062 sedimentation Methods 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 26
- 230000007423 decrease Effects 0.000 claims description 16
- 239000004033 plastic Substances 0.000 claims description 16
- 230000009974 thixotropic effect Effects 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 14
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 8
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- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
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- 230000001681 protective effect Effects 0.000 description 7
- 108010043121 Green Fluorescent Proteins Proteins 0.000 description 6
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
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- 229910052737 gold Inorganic materials 0.000 description 4
- 229920006375 polyphtalamide Polymers 0.000 description 4
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
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- 229910052709 silver Inorganic materials 0.000 description 2
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- 229910017109 AlON Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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Abstract
The invention discloses a white light emitting diode, comprising: the LED lamp comprises a reflecting cup, a blue light LED chip fixed on the bottom wall of the cavity of the reflecting cup and fluorescent colloid filled in the cavity of the reflecting cup; the fluorescent colloid comprises fluorescent conversion particles; the fluorescent conversion particles are formed with a fluorescent conversion particle cluster outside each blue light LED chip, each fluorescent conversion particle cluster is hemispherical or semi-hemispherical, and the concentration of the fluorescent conversion particles in the fluorescent conversion particles is decreased along a first direction, so that blue light emitted by the corresponding blue light LED chip is subjected to fluorescent colloid to obtain white light with uniform light color; the first direction is a direction from the center of the front face of the corresponding blue LED chip to the edge of the front face thereof. The invention also provides a manufacturing method of the white light emitting diode. By implementing the white light emitting diode and the manufacturing method thereof, the white light emitting diode can display white light with uniform light color, and blue light emitted by the side face of the blue light LED chip can be effectively utilized to prevent blue light leakage.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to a white light emitting diode and a manufacturing method thereof.
Background
Light emitting diodes (LIGHT EMITTING Diode, simply LED) have gradually replaced conventional incandescent lamps due to their high light efficiency, high brightness, small volume, etc. As shown in fig. 1, the conventional white light emitting diode includes a reflective cup 100, a blue LED chip 101 and a fluorescent colloid 200, wherein the blue LED chip 101 is fixed at the bottom of the reflective cup 100, the fluorescent colloid 200 is filled in the reflective cup 100, and red and green fluorescent powder 201 in the fluorescent colloid 200 uniformly covers the front surface of the blue LED chip 101 and the bottom surface of the reflective cup 100. The white light emitting diode emits blue light from the blue light LED chip 101 to excite the red and green phosphors 201 in the fluorescent colloid 200 to generate red light and green light, so that the red light, the green light and the blue light are mixed into white light. However, since the blue LED chip 101 is a point light source, and the red and green phosphors 201 in the fluorescent colloid 200 are uniformly distributed on the front surface of the blue LED chip 101, the path of the blue light reaching the surface of the red and green phosphors 201 directly above the blue LED chip 101 is shorter than the path of the blue light reaching the surface of the red and green phosphors 201 directly above the blue LED chip 101, so that the light intensity excited directly above the blue LED chip 101 is weaker than the light intensity excited by the edge of the blue LED chip 101, and the white light emitting diode is enabled to emit white light with nonuniform light color, even more serious yellow circles appear. In addition, the side surface of the blue LED chip 101 is not covered by the red-green phosphor 201, so that the blue light emitted from the side surface of the blue LED chip 101 cannot be utilized, and the existing white light emitting diode has the problem of blue light leakage.
Disclosure of Invention
Aiming at the problems, the white light emitting diode and the manufacturing method thereof can enable the white light emitting diode to present white light with uniform light color, avoid yellow circles, and effectively utilize blue light emitted by the side face of the blue light LED chip to prevent blue light leakage.
In order to solve the above technical problems, a white light emitting diode of the present invention includes: at least one blue light LED chip, a reflecting cup and fluorescent colloid; wherein,
The at least one blue light LED chip is fixed on the bottom wall of the cavity of the light reflecting cup, the fluorescent colloid is filled in the cavity of the light reflecting cup, and the fluorescent colloid comprises fluorescent conversion particles;
The fluorescent conversion particles are provided with fluorescent conversion particle clusters outside each blue light LED chip, and each fluorescent conversion particle cluster is hemispherical or semi-hemispherical and covers a partial area of the bottom wall of the reflecting cup cavity;
The concentration of fluorescent conversion particles in each fluorescent conversion particle cluster is decreased along a first direction, so that blue light emitted by a corresponding blue light LED chip passes through the fluorescent colloid to obtain white light with uniform light color; the first direction is a direction from the center of the front face of the corresponding blue light LED chip to the edge of the front face of the corresponding blue light LED chip.
As an improvement of the above-mentioned scheme, the concentration of the fluorescent conversion particles in the fluorescent conversion particle cluster decreases along a second direction, which is a radial direction from the center of the corresponding blue LED chip to the surface of the fluorescent conversion particle cluster.
As an improvement of the above-described aspect, the fluorescent conversion particles include red-green phosphor or yellow phosphor.
As an improvement of the scheme, the reflective cup comprises a metal substrate layer, two metal reflective layers and two plastic reflective blocks; wherein,
The two metal reflecting layers are laminated on the metal base material layer, and a notch is formed between the two metal reflecting layers;
The two plastic reflecting blocks are respectively arranged on the two metal reflecting layers, and form a bowl-cup-shaped cavity together with the two metal reflecting layers and the metal substrate layer;
each blue light LED chip is connected with the two metal reflecting layers through the two electric heating connecting layers respectively.
As an improvement of the above scheme, the partial areas of the two metal reflecting layers are not covered by the bottom surfaces of the two plastic reflecting blocks and are not covered by the fluorescent conversion particle clusters.
The invention also provides a manufacturing method of the white light emitting diode, which comprises the following steps:
at least one blue light LED chip is fixedly arranged on the bottom wall of the cavity of the reflecting cup;
Coating fluorescent colloid on the at least one blue light LED chip, and enabling the fluorescent colloid to be hemispherical on each blue light LED chip; wherein, fluorescent conversion particles are arranged in the fluorescent glue body;
Performing centrifugal sedimentation treatment on the fluorescent colloid by adopting a sedimentation process, so that fluorescent conversion particles form a fluorescent conversion particle cluster outside each blue light LED chip; wherein each fluorescent conversion particle cluster is in a hemispherical shape or a hemispherical shape and covers a partial area of the bottom wall of the cavity of the reflecting cup; the concentration of fluorescent conversion particles in the fluorescent conversion particle clusters decreases along a first direction, wherein the first direction is from the center of the front surface of the corresponding blue light LED chip to the edge of the front surface of the corresponding blue light LED chip;
And solidifying the fluorescent colloid subjected to centrifugal sedimentation treatment to obtain the white light emitting diode.
As an improvement of the above-mentioned scheme, the concentration of the fluorescent conversion particles in the fluorescent conversion particle cluster decreases along a second direction, and the second direction is a radial direction from the center of the corresponding blue LED chip to the surface of the fluorescent conversion particle cluster.
As an improvement of the scheme, the area of the fluorescent conversion particle clusters covering the bottom wall of the cavity of the reflecting cup is controlled by the viscosity, thixotropic index of the fluorescent colloid or centrifugal force in the sedimentation process; wherein,
The area has a negative correlation with the viscosity of the fluorescent colloid;
the area has a positive correlation with the thixotropic index of the fluorescent colloid;
the area has a positive correlation with the magnitude of the centrifugal force in the sedimentation process.
As an improvement of the above-mentioned scheme, the viscosity of the fluorescent colloid is within 500mpa·s to 20000mpa·s;
or the thixotropic index of the fluorescent colloid is within 1.0-3.0;
Or the centrifugal sedimentation rate in the sedimentation process is within 500 rpm-10000 rpm.
As an improvement of the scheme, the fluorescent colloid is one or more of silica gel, epoxy resin and acrylic resin.
The white light emitting diode and the manufacturing method thereof have the following beneficial effects: because the fluorescent conversion particle clusters are formed outside each blue light LED chip, each fluorescent conversion particle cluster is hemispherical or semi-hemispherical, the concentration of fluorescent conversion particles in each fluorescent conversion particle cluster is reduced along the first direction, the first direction is the direction from the center of the front face of the corresponding blue light LED chip to the edge of the front face of the corresponding blue light LED chip, the concentration of fluorescent conversion particles right above each blue light LED chip is higher than that of fluorescent conversion particles at the edge of the blue light LED chip, the concentration of fluorescent conversion particles at the front face of the blue light LED chip is reduced along the first direction, the intensity of light excited by the front face of the blue light LED chip is uniformly distributed, the intensity of light excited by the right above the blue light LED chip is the same as the intensity of light excited by the edge of the front face of the blue light LED chip, the white light LED is of uniform white light, the white light LED is greatly improved, and the color of the white light LED is not uniform, and the yellow circle is effectively avoided. In addition, because each fluorescent conversion particle cluster is wrapped outside the corresponding blue light LED chip and covers a partial area of the bottom wall of the reflecting cup cavity, the side surface of each blue light LED chip is wrapped by fluorescent conversion particles, so that the white light emitting diode can effectively utilize blue light emitted by the side surface of the blue light LED chip, the light emitting efficiency of the white light emitting diode is improved, and the problem of blue light leakage is avoided.
Drawings
Fig. 1 is a schematic structural diagram of a conventional white light emitting diode.
Fig. 2 is a schematic structural diagram of a white light emitting diode according to an embodiment of the present invention.
Fig. 3 is a top view of a white light emitting diode according to an embodiment of the invention.
Fig. 4 is a top view of another embodiment of a white light emitting diode of the present invention.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may be embodied in many other forms than described herein and similarly practiced by those skilled in the art without departing from the spirit or scope of the invention, which is therefore not limited to the specific embodiments disclosed below.
The present invention provides a white light emitting diode, comprising: at least one blue light LED chip, a reflecting cup and fluorescent colloid; the at least one blue light LED chip is fixed on the bottom wall of the cavity of the light reflecting cup, the fluorescent colloid is filled in the cavity of the light reflecting cup, and the fluorescent colloid comprises fluorescent conversion particles; the fluorescent conversion particles are provided with fluorescent conversion particle clusters outside each blue light LED chip, and each fluorescent conversion particle cluster is hemispherical or semi-hemispherical and covers a partial area of the bottom wall of the reflecting cup cavity; the concentration of fluorescent conversion particles in each fluorescent conversion particle cluster is decreased along a first direction, so that blue light emitted by a corresponding blue light LED chip passes through the fluorescent colloid to obtain white light with uniform light color; the first direction is a direction from the center of the front face of the corresponding blue light LED chip to the edge of the front face of the corresponding blue light LED chip.
In the white light emitting diode, as the fluorescent conversion particle clusters are formed outside each blue light LED chip, each fluorescent conversion particle cluster is hemispherical or semi-hemispherical, the concentration of fluorescent conversion particles in each fluorescent conversion particle cluster is reduced along the first direction, the first direction is the direction from the center of the front surface of the corresponding blue light LED chip to the edge of the front surface of the corresponding blue light LED chip, so that the concentration of fluorescent conversion particles right above each blue light LED chip is higher than that of the edge of the blue light LED chip, the concentration of fluorescent conversion particles on the front surface of the blue light LED chip is reduced along the first direction, the intensity of light excited by the front surface of the blue light LED chip is uniformly distributed, the intensity of light excited by the right above the blue light LED chip is the same as the intensity of light excited by the front edge of the blue light LED chip, the white light emitting diode presents white light with uniform light color, the white light emitting diode is greatly improved, and the yellow circle is effectively avoided. In addition, because each fluorescent conversion particle cluster is wrapped outside the corresponding blue light LED chip and covers a partial area of the bottom wall of the reflecting cup cavity, the side surface of each blue light LED chip is wrapped by fluorescent conversion particles, so that the white light emitting diode can effectively utilize blue light emitted by the side surface of the blue light LED chip, the light emitting efficiency of the white light emitting diode is improved, and the problem of blue light leakage is avoided.
In a specific implementation process, the white light emitting diode comprises one blue light LED chip, two blue light LED chips and a plurality of blue light LED chips. In the following, a white light emitting diode including one blue light LED chip and two blue light LED chips will be taken as an example in connection with the specific embodiments and the drawings, and the white light emitting diode will be described in detail.
Example 1
Fig. 2 is a schematic structural diagram of a white light emitting diode according to an embodiment of the invention.
As shown in fig. 2 and 3, the white light emitting diode includes: a blue light LED chip 1, a reflecting cup 2 and a fluorescent colloid 3; the blue light LED chip 1 is fixed on the bottom wall of the cavity of the light reflecting cup 2, the fluorescent colloid 3 is filled in the cavity of the light reflecting cup 2, and the fluorescent colloid 3 comprises fluorescent conversion particles 31 and polymer protective colloid 32; the fluorescent conversion particles 31 are formed with fluorescent conversion particle clusters outside the blue LED chip 1, and the fluorescent conversion particle clusters are hemispherical or semi-hemispherical and cover a partial area of the bottom wall of the cavity of the reflective cup 2; the concentration of the fluorescent conversion particles 31 in the fluorescent conversion particle cluster decreases along the first direction, so that the blue light emitted by the corresponding blue light LED chip 1 passes through the fluorescent colloid 3 to obtain white light with uniform light color; the first direction is a direction from the center of the front surface of the corresponding blue LED chip 1 to the edge of the front surface of the corresponding blue LED chip 1.
Wherein the fluorescent conversion particles 31 include red-green phosphor or yellow phosphor.
In the white light emitting diode, when the fluorescent conversion particles 31 are red-green fluorescent powder, the blue light LED chip 1 emits blue light, wherein part of the blue light excites the red-green fluorescent powder in the fluorescent conversion particle cluster to generate red light and green light, and the other part of the blue light is mixed with the red light and the green light to form white light; when the fluorescent conversion particles 31 are yellow fluorescent powder, part of blue light emitted by the blue LED chip 1 excites the yellow fluorescent powder in the fluorescent conversion particle cluster to generate yellow light, and the other part of blue light is mixed with the yellow light to form white light.
Further, in order to further improve the uniformity of the light color of the white light emitting diode, the concentration of the fluorescent conversion particles 31 in the fluorescent conversion particle cluster decreases along the second direction, and the second direction is the radial direction from the center of the blue light LED chip 1 to the surface of the fluorescent conversion particle cluster, so that the light intensity excited by the white light emitting diode decreases along the second direction, so as to mix light uniformly.
Preferably, as shown in fig. 2, the reflector cup 2 comprises a metal substrate layer 23, two metal reflector layers 22 and two plastic reflector blocks 21; wherein, two metal reflecting layers 22 are laminated on the metal substrate layer 23, a gap 221 is formed between the two metal reflecting layers 22, and the gap 221 is used for insulating and isolating the two metal reflecting layers 22; the two plastic reflecting blocks 21 are respectively arranged on the two metal reflecting layers 22, and form a bowl-cup-shaped cavity together with the two metal reflecting layers 22 and the metal substrate layer 23; the blue LED chip 1 is connected to the two metal reflective layers 22 through the two electrothermal connection layers 221, respectively.
Further, in order to increase the luminous efficiency of the white light emitting diode, the partial areas of the two metal reflecting layers 22 are not covered by the bottom surfaces of the two plastic reflecting blocks 21 and are not covered by the fluorescent conversion particle clusters, so that the partial areas of the two metal reflecting layers 22 can reflect the converted white light, thereby improving the luminous efficiency of the white light emitting diode.
Example 2
Referring to fig. 4, a top view of another embodiment of a white light emitting diode according to the present invention is shown.
The white light emitting diode is similar to the white light emitting diode in embodiment 1 in structure, except that the white light emitting diode includes two blue light LED chips 1, and each blue light LED chip 1 is respectively connected with two metal reflective layers through two electrothermal connection layers.
In the white light emitting diode of this embodiment, since two blue light LED chips 1 are disposed on the bottom wall of the cavity of the reflector cup 2, the light emission intensity of the white light emitting diode can be increased, so that the white light emitted by the white light emitting diode is not only uniform, but also has a larger light emission intensity.
When the front surface of the blue LED chip 1 is square, the clusters of fluorescent conversion particles outside each blue LED chip 1 are hemispherical; when the front surface of the blue LED chip 1 is rectangular, the clusters of fluorescent conversion particles outside each blue LED chip 1 are in a hemispherical shape, for example, the hemispherical shape may be an ellipsoid shape. It is to be understood that the shapes of the clusters of the fluorescent conversion particles 31 are merely illustrated when the front surface of the blue LED chip 1 is square and rectangular, and the front surface shape of the blue LED chip 1 and the shapes of the clusters of the fluorescent conversion particles 31 are not particularly limited.
In the above embodiment, the metal base material layer 23 includes a metal copper layer; the metal reflective layer 22 includes a gold plating layer or a silver plating layer; the plastic reflector block 21 is made of PCT (Poly 1,4-cyclohexylene DIMETHYLENE TEREPHTHALATE, 1, 4-cyclohexanedimethanol terephthalate), SMC (Sheet molding compound ), PPA (Polyphthalamid, polyphthalamide) or EMC (Epoxy Molding Compound, epoxy resin); the polymeric protective colloid 32 includes one or more of silica gel, epoxy resin, and acrylic resin.
The invention also provides a manufacturing method of the white light emitting diode, which comprises the following steps:
S1, fixedly arranging at least one blue light LED chip on the bottom wall of a cavity of a reflecting cup;
S2, coating fluorescent colloid on the at least one blue light LED chip, and enabling the fluorescent colloid to be hemispherical on each blue light LED chip; wherein the fluorescent colloid comprises a high molecular protective colloid and fluorescent conversion particles;
S3, performing centrifugal sedimentation treatment on the fluorescent colloid by adopting a sedimentation technology, so that the fluorescent conversion particles form a fluorescent conversion particle cluster outside each blue light LED chip; wherein each fluorescent conversion particle cluster is in a hemispherical shape or a hemispherical shape and covers a partial area of the bottom wall of the cavity of the reflecting cup; the concentration of fluorescent conversion particles in the fluorescent conversion particle clusters decreases along a first direction, wherein the first direction is from the center of the front surface of the corresponding blue light LED chip to the edge of the front surface of the corresponding blue light LED chip;
s4, solidifying the fluorescent colloid subjected to centrifugal sedimentation treatment to obtain the white light emitting diode.
Compared with the prior art, the manufacturing method of the white light emitting diode has the advantages that by adopting the sedimentation technology, fluorescent conversion particles in fluorescent colloid coated outside each blue light LED chip are agglomerated outside the blue light LED chips to form the hemispherical or hemispheroidal fluorescent conversion particle clusters, the concentration of the fluorescent conversion particles in the fluorescent conversion particle clusters is reduced along the first direction, the first direction is the direction from the center of the front surface of the blue light LED chip to the edge of the front surface of the blue light LED chip, so that the intensity of the front excitation light of the blue light LED chip is uniformly distributed, the intensity of the light excited right above the blue light LED chip is the same as the intensity of the light excited by the edge of the front surface of the blue light LED chip, the white light of the white light emitting diode is uniform in light color, the non-uniformity of the white light emitting diode is greatly improved, and the yellow circle is effectively avoided. In addition, because each fluorescent conversion particle cluster is wrapped outside the corresponding blue light LED chip and covers a partial area of the bottom wall of the reflecting cup cavity, the side surface of each blue light LED chip is wrapped by fluorescent conversion particles, so that the white light emitting diode can effectively utilize blue light emitted by the side surface of the blue light LED chip, the light emitting efficiency of the white light emitting diode is improved, and the problem of blue light leakage is avoided. In addition, in the manufacturing method of the white light emitting diode, when the fluorescent colloid is coated on each blue light LED chip, fluorescent conversion particles in the fluorescent colloid are uniformly distributed, and the dosage of the fluorescent colloid can be effectively controlled by coating the fluorescent colloid on the blue light LED chip and enabling the fluorescent colloid to be hemispherical on each blue light LED chip; and then the settling process is adopted to carry out centrifugal settling treatment on the fluorescent colloid, so that the distribution of fluorescent conversion particles in the fluorescent colloid can be controlled, the use amount of the fluorescent conversion particles in the fluorescent colloid can be reduced, and the cost is reduced.
Further, in order to further improve the uniformity of the light color of the white light emitting diode, in step S3, the concentration of the fluorescent conversion particles in the fluorescent conversion particle cluster decreases along a second direction, where the second direction is a radial direction from the center of the corresponding blue light LED chip to the surface of the fluorescent conversion particle cluster, so that the light intensity excited by the white light emitting diode decreases along the second direction, so as to mix light uniformly.
Further, in step S3, the area of the fluorescent conversion particle clusters covering the bottom wall of the cavity of the light reflecting cup is controlled by the viscosity, thixotropic index of the fluorescent colloid or centrifugal force in the sedimentation process, so that the area of the fluorescent conversion particle clusters covering the bottom wall of the cavity of the light reflecting cup is controlled conveniently; wherein the area has a negative correlation with the viscosity of the fluorescent colloid; the area has a positive correlation with the thixotropic index of the fluorescent colloid; the area has a positive correlation with the magnitude of the centrifugal force in the sedimentation process. For example, when the thixotropic index of the fluorescent colloid is the same and the centrifugal force in the sedimentation process is the same, in a certain viscosity range, the larger the viscosity of the fluorescent colloid, the smaller the area of the fluorescent conversion particle cluster covering the bottom wall of the cavity of the reflective cup; when the viscosity of the fluorescent colloid is the same and the centrifugal force in the sedimentation process is the same, the thixotropic index of the fluorescent colloid is larger, the fluorescent colloid is easier to deform, so that the area of the fluorescent conversion particle cluster covering the bottom wall of the cavity of the reflective cup is larger after the fluorescent colloid is centrifugally sedimented; when the viscosity of the fluorescent colloid is the same and the thixotropic index is the same, the larger the centrifugal force in the sedimentation process is, the larger the area of the fluorescent conversion particle cluster covering the bottom wall of the cavity of the reflective cup is.
Further, the viscosity of the fluorescent colloid is within 500 mPas-20000 mPas; or the thixotropic index of the fluorescent colloid is within 1.0-3.0; or the centrifugal sedimentation rate in the sedimentation process is within 500 rpm-10000 rpm.
Further, the light reflecting cup comprises a metal substrate layer, two metal light reflecting layers and two plastic light reflecting blocks; wherein, the two metal reflecting layers are laminated on the metal substrate layer, and a notch is formed between the two metal reflecting layers; the two plastic reflecting blocks are respectively arranged on the two metal reflecting layers, and form a bowl cup-shaped cavity together with the two metal reflecting layers and the metal substrate layer.
Next, the process conditions of the sedimentation process in the method for manufacturing a white light emitting diode according to the present invention will be described with reference to specific examples.
Example 3
The invention relates to a method for manufacturing a white light emitting diode, which comprises the following steps:
S11, connecting at least one blue light LED chip on the bottom wall of the cavity of the reflecting cup through an electric heating connecting layer; the metal substrate layer of the reflecting cup is a metal copper layer, the metal reflecting layer is a silver plating layer, and the plastic reflecting block is made of EMC;
S21, coating fluorescent colloid on at least one blue light LED chip, and enabling the fluorescent colloid to be hemispherical on each blue light LED chip; the fluorescent colloid comprises a fluorescent colloid, wherein the high polymer protective colloid in the fluorescent colloid is silica gel, and fluorescent conversion particles in the fluorescent colloid are nitrogen oxide green fluorescent powder and fluorine-containing red fluorescent powder; the viscosity of the fluorescent colloid is 5000 mPa.s, and the thixotropic index is 1.2;
S31, performing centrifugal sedimentation treatment on the fluorescent colloid by adopting a sedimentation technology, so that the fluorescent conversion particles form a fluorescent conversion particle cluster outside each blue light LED chip; wherein the centrifugal sedimentation rate is 500rpm; each fluorescent conversion particle cluster is hemispherical or semi-hemispherical, and covers 2/3 of the bottom wall area of the cavity of the reflecting cup; the concentration of fluorescent conversion particles in the fluorescent conversion particle clusters decreases along a first direction, wherein the first direction is from the center of the front surface of the corresponding blue light LED chip to the edge of the front surface of the corresponding blue light LED chip;
S4, solidifying the settled fluorescent colloid to obtain the white light emitting diode.
Example 4
The invention relates to a method for manufacturing a white light emitting diode, which comprises the following steps:
S12, connecting at least one blue light LED chip on the bottom wall of the cavity of the reflecting cup through an electric heating connecting layer; the metal substrate layer of the reflecting cup is a metal copper layer, the metal reflecting layer is a gold plating layer, and the plastic reflecting block is made of PCT;
S22, coating fluorescent colloid on the at least one blue light LED chip, and enabling the fluorescent colloid to be hemispherical on each blue light LED chip; wherein, the macromolecule protective colloid in the fluorescent colloid is epoxy resin, and the fluorescent conversion particles in the fluorescent colloid are YAG green fluorescent powder, luAG green fluorescent powder and nitride red fluorescent powder; the viscosity of the fluorescent colloid is 500 mPa.s, and the thixotropic index is 1.0;
S32, performing centrifugal sedimentation treatment on the fluorescent colloid by adopting a sedimentation technology, so that the fluorescent conversion particles form a fluorescent conversion particle cluster outside each blue light LED chip; wherein the centrifugal sedimentation rate is 3000rpm; each fluorescent conversion particle cluster is hemispherical or semi-hemispherical, and covers 3/4 of the bottom wall area of the cavity of the reflecting cup; the concentration of fluorescent conversion particles in the fluorescent conversion particle clusters decreases along a first direction, wherein the first direction is from the center of the front surface of the corresponding blue light LED chip to the edge of the front surface of the corresponding blue light LED chip;
S4, solidifying the settled fluorescent colloid to obtain the white light emitting diode.
Example 5
The invention relates to a method for manufacturing a white light emitting diode, which comprises the following steps:
S13, connecting at least one blue light LED chip on the bottom wall of the cavity of the reflecting cup through an electric heating connecting layer; the metal substrate layer of the reflecting cup is a metal copper layer, the metal reflecting layer is a gold plating layer, and the plastic reflecting block is made of SMC;
S23, coating fluorescent colloid on the at least one blue light LED chip, and enabling the fluorescent colloid to be hemispherical on each blue light LED chip; wherein, the macromolecule protective colloid in the fluorescent colloid is acrylic resin, and the fluorescent conversion particles in the fluorescent colloid are silicate gamma-AlON, eu 2+ green fluorescent powder and SrLiAl 3N4:Eu2+ red fluorescent powder; the viscosity of the fluorescent colloid is 20000 mPas, and the thixotropic index is 3.0;
s33, performing centrifugal sedimentation treatment on the fluorescent colloid by adopting a sedimentation technology, so that the fluorescent conversion particles form a fluorescent conversion particle cluster outside each blue light LED chip; wherein the centrifugal sedimentation rate is 10000rpm; each fluorescent conversion particle cluster is hemispherical or semi-hemispherical, and covers 1/4 of the bottom wall area of the cavity of the reflecting cup; the concentration of fluorescent conversion particles in the fluorescent conversion particle clusters decreases along a first direction, wherein the first direction is from the center of the front surface of the corresponding blue light LED chip to the edge of the front surface of the corresponding blue light LED chip;
S4, solidifying the settled fluorescent colloid to obtain the white light emitting diode.
Example 6
The invention relates to a method for manufacturing a white light emitting diode, which comprises the following steps:
s14, connecting at least one blue light LED chip on the bottom wall of the cavity of the reflecting cup through an electric heating connecting layer; the metal substrate layer of the reflecting cup is a metal copper layer, the metal reflecting layer is a gold plating layer, and the plastic reflecting block is made of PPA;
S24, coating fluorescent colloid on the at least one blue light LED chip, and enabling the fluorescent colloid to be hemispherical on each blue light LED chip; wherein, the macromolecule protective colloid in the fluorescent colloid is silica gel, and the fluorescent conversion particles in the fluorescent colloid are GaYAG green fluorescent powder and QD red fluorescent powder; the viscosity of the fluorescent colloid is 10000 mPa.s, and the thixotropic index is 1.5;
S34, performing centrifugal sedimentation treatment on the fluorescent colloid by adopting a sedimentation technology, so that the fluorescent conversion particles form a fluorescent conversion particle cluster outside each blue light LED chip; wherein the centrifugal sedimentation rate is 7000rpm; each fluorescent conversion particle cluster is hemispherical or semi-hemispherical, and covers 1/2 of the bottom wall area of the cavity of the reflecting cup; the concentration of fluorescent conversion particles in the fluorescent conversion particle clusters decreases along a first direction, wherein the first direction is from the center of the front surface of the corresponding blue light LED chip to the edge of the front surface of the corresponding blue light LED chip;
S4, solidifying the settled fluorescent colloid to obtain the white light emitting diode.
In the above embodiment of the present invention, the blue LED chip is a flip-chip type blue LED chip.
The present invention is not limited to the preferred embodiments, and any simple modification, equivalent variation and modification made to the above embodiments according to the technical substance of the present invention will still fall within the scope of the technical solution of the present invention.
Claims (10)
1. A white light emitting diode, comprising: at least one blue light LED chip, a reflecting cup and fluorescent colloid; wherein,
The at least one blue light LED chip is fixed on the bottom wall of the cavity of the light reflecting cup, the fluorescent colloid is filled in the cavity of the light reflecting cup, and the fluorescent colloid comprises fluorescent conversion particles;
The fluorescent conversion particles are provided with fluorescent conversion particle clusters outside each blue light LED chip, and each fluorescent conversion particle cluster is hemispherical or semi-hemispherical and covers a partial area of the bottom wall of the reflecting cup cavity;
The concentration of fluorescent conversion particles in each fluorescent conversion particle cluster is decreased along a first direction, so that blue light emitted by a corresponding blue light LED chip passes through the fluorescent colloid to obtain white light with uniform light color; the first direction is a direction from the center of the front face of the corresponding blue light LED chip to the edge of the front face of the corresponding blue light LED chip.
2. The white light emitting diode of claim 1, wherein the concentration of fluorescent conversion particles in the clusters of fluorescent conversion particles decreases in a second direction, the second direction being radial from the center of the corresponding blue LED chip to the surface of the clusters of fluorescent conversion particles.
3. The white light emitting diode of claim 1 or 2, wherein the phosphor conversion particles comprise red-green phosphor or yellow phosphor.
4. The white light emitting diode of claim 1, wherein the reflector cup comprises a metal substrate layer, two metal reflector layers, and two plastic reflector blocks; wherein,
The two metal reflecting layers are laminated on the metal base material layer, and a notch is formed between the two metal reflecting layers;
The two plastic reflecting blocks are respectively arranged on the two metal reflecting layers, and form a bowl-cup-shaped cavity together with the two metal reflecting layers and the metal substrate layer;
each blue light LED chip is connected with the two metal reflecting layers through the two electric heating connecting layers respectively.
5. The white light-emitting diode according to claim 4, wherein partial areas of the two metal light-reflecting layers are not covered by the bottom surfaces of the two plastic light-reflecting blocks and are not covered by the clusters of fluorescent conversion particles.
6. The method for manufacturing the white light emitting diode is characterized by comprising the following steps of:
at least one blue light LED chip is fixedly arranged on the bottom wall of the cavity of the reflecting cup;
Coating fluorescent colloid on the at least one blue light LED chip, and enabling the fluorescent colloid to be hemispherical on each blue light LED chip; wherein, fluorescent conversion particles are arranged in the fluorescent glue body;
Performing centrifugal sedimentation treatment on the fluorescent colloid by adopting a sedimentation process, so that fluorescent conversion particles form a fluorescent conversion particle cluster outside each blue light LED chip; wherein each fluorescent conversion particle cluster is in a hemispherical shape or a hemispherical shape and covers a partial area of the bottom wall of the cavity of the reflecting cup; the concentration of fluorescent conversion particles in the fluorescent conversion particle clusters decreases along a first direction, wherein the first direction is from the center of the front surface of the corresponding blue light LED chip to the edge of the front surface of the corresponding blue light LED chip;
And solidifying the fluorescent colloid subjected to centrifugal sedimentation treatment to obtain the white light emitting diode.
7. The method of claim 6, wherein the concentration of the fluorescent conversion particles in the clusters of fluorescent conversion particles decreases in a second direction, the second direction being a radial direction from the center of the corresponding blue LED chip to the surface of the clusters of fluorescent conversion particles.
8. The method of claim 6, wherein the area of the fluorescent converting particle clusters covering the bottom wall of the cavity of the reflector cup is controlled by viscosity, thixotropic index of the fluorescent colloid or centrifugal force in the sedimentation process; wherein,
The area has a negative correlation with the viscosity of the fluorescent colloid;
the area has a positive correlation with the thixotropic index of the fluorescent colloid;
the area has a positive correlation with the magnitude of the centrifugal force in the sedimentation process.
9. The method of manufacturing a white light emitting diode according to claim 8, wherein the viscosity of the fluorescent colloid is within 500 mPa-s to 20000 mPa-s;
or the thixotropic index of the fluorescent colloid is within 1.0-3.0;
Or the centrifugal sedimentation rate in the sedimentation process is within 500 rpm-10000 rpm.
10. The white light-emitting diode according to claim 1, wherein the fluorescent colloid is one or more of silica gel, epoxy resin and acrylic resin.
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100849782B1 (en) * | 2007-02-12 | 2008-07-31 | 삼성전기주식회사 | Method for manufacturing led package |
| CN101304066A (en) * | 2008-06-16 | 2008-11-12 | 罗维鸿 | Warm white LED and fluorescent powder thereof |
| CN102479785A (en) * | 2010-11-29 | 2012-05-30 | 宏齐科技股份有限公司 | Light emitting structure with deposited type fluorescence covering layer and manufacturing method thereof |
| KR20130079002A (en) * | 2012-01-02 | 2013-07-10 | 폭스세미콘 인티그리티드 테크놀로지, 인코포레이티드 | Light emitting diode |
| CN103262270A (en) * | 2010-12-13 | 2013-08-21 | 欧司朗光电半导体有限公司 | Method for generating a luminescence conversion material layer, composition therefor and component comprising such a luminescence conversion material layer |
| CN203644815U (en) * | 2013-12-18 | 2014-06-11 | 江阴长电先进封装有限公司 | LED packaging structure |
| JP2016111292A (en) * | 2014-12-10 | 2016-06-20 | 富士フイルム株式会社 | Wavelength conversion member, backlight unit, liquid crystal display device, and method for manufacturing wavelength conversion member |
| JP2017110059A (en) * | 2015-12-15 | 2017-06-22 | シャープ株式会社 | Light-emitting device or phosphor-containing sheet for light-emitting device |
| CN209389061U (en) * | 2018-11-20 | 2019-09-13 | 广东晶科电子股份有限公司 | A kind of white light emitting diode |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100887068B1 (en) * | 2006-08-04 | 2009-03-04 | 삼성전기주식회사 | Light emitting diode module and method of manufacturing the same |
| JP2013062320A (en) * | 2011-09-12 | 2013-04-04 | Olympus Corp | Light emitting device |
| JP6597657B2 (en) * | 2017-01-24 | 2019-10-30 | 日亜化学工業株式会社 | Light emitting device |
-
2018
- 2018-11-20 CN CN201811383438.7A patent/CN109390455B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100849782B1 (en) * | 2007-02-12 | 2008-07-31 | 삼성전기주식회사 | Method for manufacturing led package |
| CN101304066A (en) * | 2008-06-16 | 2008-11-12 | 罗维鸿 | Warm white LED and fluorescent powder thereof |
| CN102479785A (en) * | 2010-11-29 | 2012-05-30 | 宏齐科技股份有限公司 | Light emitting structure with deposited type fluorescence covering layer and manufacturing method thereof |
| CN103262270A (en) * | 2010-12-13 | 2013-08-21 | 欧司朗光电半导体有限公司 | Method for generating a luminescence conversion material layer, composition therefor and component comprising such a luminescence conversion material layer |
| KR20130079002A (en) * | 2012-01-02 | 2013-07-10 | 폭스세미콘 인티그리티드 테크놀로지, 인코포레이티드 | Light emitting diode |
| CN203644815U (en) * | 2013-12-18 | 2014-06-11 | 江阴长电先进封装有限公司 | LED packaging structure |
| JP2016111292A (en) * | 2014-12-10 | 2016-06-20 | 富士フイルム株式会社 | Wavelength conversion member, backlight unit, liquid crystal display device, and method for manufacturing wavelength conversion member |
| JP2017110059A (en) * | 2015-12-15 | 2017-06-22 | シャープ株式会社 | Light-emitting device or phosphor-containing sheet for light-emitting device |
| CN209389061U (en) * | 2018-11-20 | 2019-09-13 | 广东晶科电子股份有限公司 | A kind of white light emitting diode |
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|---|---|
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