KR101072162B1 - 형광체 제조방법 및 상기 형광체를 포함하는 발광장치 - Google Patents

형광체 제조방법 및 상기 형광체를 포함하는 발광장치 Download PDF

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Publication number
KR101072162B1
KR101072162B1 KR1020090120181A KR20090120181A KR101072162B1 KR 101072162 B1 KR101072162 B1 KR 101072162B1 KR 1020090120181 A KR1020090120181 A KR 1020090120181A KR 20090120181 A KR20090120181 A KR 20090120181A KR 101072162 B1 KR101072162 B1 KR 101072162B1
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KR
South Korea
Prior art keywords
phosphor
nano
solution
light emitting
stirring
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Expired - Fee Related
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KR1020090120181A
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English (en)
Korean (ko)
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KR20110063221A (ko
Inventor
송윤수
이상혁
Original Assignee
엘지이노텍 주식회사
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Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020090120181A priority Critical patent/KR101072162B1/ko
Priority to US12/949,879 priority patent/US8465798B2/en
Priority to JP2010264854A priority patent/JP5903212B2/ja
Priority to EP10193699.5A priority patent/EP2330172B1/en
Priority to TW099142300A priority patent/TWI496871B/zh
Priority to CN201010625147.1A priority patent/CN102154002B/zh
Publication of KR20110063221A publication Critical patent/KR20110063221A/ko
Application granted granted Critical
Publication of KR101072162B1 publication Critical patent/KR101072162B1/ko
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77342—Silicates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
KR1020090120181A 2009-12-04 2009-12-04 형광체 제조방법 및 상기 형광체를 포함하는 발광장치 Expired - Fee Related KR101072162B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020090120181A KR101072162B1 (ko) 2009-12-04 2009-12-04 형광체 제조방법 및 상기 형광체를 포함하는 발광장치
US12/949,879 US8465798B2 (en) 2009-12-04 2010-11-19 Method for manufacturing phosphor and light emitting device comprising the phosphor
JP2010264854A JP5903212B2 (ja) 2009-12-04 2010-11-29 蛍光体の製造方法及び蛍光体を含む発光装置
EP10193699.5A EP2330172B1 (en) 2009-12-04 2010-12-03 Method for manufacturing phosphor and light emitting device comprising the phosphor
TW099142300A TWI496871B (zh) 2009-12-04 2010-12-06 製造螢光體的方法及包含此螢光體的發光裝置
CN201010625147.1A CN102154002B (zh) 2009-12-04 2010-12-06 荧光体的制备方法及包括该荧光体的发光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090120181A KR101072162B1 (ko) 2009-12-04 2009-12-04 형광체 제조방법 및 상기 형광체를 포함하는 발광장치

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020110064092A Division KR20110081798A (ko) 2011-06-29 2011-06-29 발광 장치

Publications (2)

Publication Number Publication Date
KR20110063221A KR20110063221A (ko) 2011-06-10
KR101072162B1 true KR101072162B1 (ko) 2011-10-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090120181A Expired - Fee Related KR101072162B1 (ko) 2009-12-04 2009-12-04 형광체 제조방법 및 상기 형광체를 포함하는 발광장치

Country Status (6)

Country Link
US (1) US8465798B2 (enExample)
EP (1) EP2330172B1 (enExample)
JP (1) JP5903212B2 (enExample)
KR (1) KR101072162B1 (enExample)
CN (1) CN102154002B (enExample)
TW (1) TWI496871B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101400343B1 (ko) * 2012-02-10 2014-05-30 한국광기술원 상온 선택적 전극 보호 수용성 수지가 적용된 전극 노출형 침전 및 증발형 용제가 포함된 형광체 제조방법과 형광체 코팅층이 형성된 ｌｅｄ 제조방법
KR101945808B1 (ko) * 2012-08-06 2019-02-08 엘지이노텍 주식회사 발광 소자 및 발광 소자 패키지
TWI484664B (zh) * 2012-09-11 2015-05-11 Brightek Optoelectronic Co Ltd 螢光粉粒子之塗佈方法
TWI484669B (zh) * 2012-09-11 2015-05-11 Brightek Optoelectronic Co Ltd 發光元件之封裝方法
CN108689712B (zh) * 2018-06-26 2020-10-09 镭米光学科技（宁波）有限公司 一体式复合陶瓷荧光体及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100717936B1 (ko) 2005-02-01 2007-05-11 주식회사 엘지화학 Ｂｌｕ 용 램프의 상하 색편차 개선을 위한 흐름성이우수한 신규 청색 형광체의 제조방법 및 그로부터 제조된청색 형광체

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US4208448A (en) * 1978-10-27 1980-06-17 Westinghouse Electric Corp. Method for improving the performance of low pressure fluorescent discharge lamp which utilizes zinc silicate as a phosphor blend constituent
JP2514423B2 (ja) * 1989-03-15 1996-07-10 日亜化学工業株式会社 二酸化ケイ素でコ―ティングされた蛍光体の製造方法
JP3189626B2 (ja) 1994-09-09 2001-07-16 双葉電子工業株式会社 表示装置
JPH09255951A (ja) * 1996-03-25 1997-09-30 Kasei Optonix Co Ltd 青色発光蛍光体
JPH11256149A (ja) * 1998-03-16 1999-09-21 Matsushita Electric Ind Co Ltd 赤色蛍光体とこれを用いた蛍光ランプ
US6313578B1 (en) 1998-09-28 2001-11-06 Osram Sylvania Inc. Phosphor coating for gas discharge lamps and lamp containing same
KR100791564B1 (ko) * 1999-12-21 2008-01-03 삼성에스디아이 주식회사 희토류 산화물이 코팅된 형광체 및 그의 제조방법
US6531074B2 (en) * 2000-01-14 2003-03-11 Osram Sylvania Inc. Luminescent nanophase binder systems for UV and VUV applications
JP2002038150A (ja) * 2000-07-26 2002-02-06 Toshiba Corp 真空紫外線励起蛍光体およびそれを用いた発光装置
JP2002038148A (ja) * 2000-07-26 2002-02-06 Toshiba Corp 緑色蛍光体とその製造方法、およびそれを用いた発光装置
KR100768177B1 (ko) 2001-03-13 2007-10-17 삼성에스디아이 주식회사 나노크기의 형광체가 부착된 형광체, 그의 제조방법 및이를 이용하여 제조된 음극선관
JP4880887B2 (ja) * 2004-09-02 2012-02-22 株式会社東芝 半導体発光装置
US20060222757A1 (en) * 2005-03-31 2006-10-05 General Electric Company Method for making phosphors
DE102005047609A1 (de) 2005-10-05 2007-04-12 Giesecke & Devrient Gmbh Echtheitssicherung von Wertdokumenten mittels Merkmalsstoffen
KR100803620B1 (ko) 2006-12-28 2008-02-19 중앙대학교 산학협력단 유ㆍ무기 나노 복합체가 코팅된 ｐｄｐ 및 ｌｅｄ용 형광체 및 그의 제조방법
US20080230750A1 (en) 2007-03-20 2008-09-25 Evident Technologies, Inc. Powdered quantum dots
DE102007016228A1 (de) 2007-04-04 2008-10-09 Litec Lll Gmbh Verfahren zur Herstellung von Leuchtstoffen basierend auf Orthosilikaten für pcLEDs

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KR100717936B1 (ko) 2005-02-01 2007-05-11 주식회사 엘지화학 Ｂｌｕ 용 램프의 상하 색편차 개선을 위한 흐름성이우수한 신규 청색 형광체의 제조방법 및 그로부터 제조된청색 형광체

Also Published As

Publication number Publication date
TWI496871B (zh) 2015-08-21
US20110133630A1 (en) 2011-06-09
KR20110063221A (ko) 2011-06-10
US8465798B2 (en) 2013-06-18
EP2330172A1 (en) 2011-06-08
CN102154002A (zh) 2011-08-17
EP2330172B1 (en) 2017-06-28
TW201137087A (en) 2011-11-01
CN102154002B (zh) 2015-12-16
JP5903212B2 (ja) 2016-04-13
JP2011116985A (ja) 2011-06-16

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