TWI491987B - A negative photosensitive resin composition, a hardened embossed pattern, and a semiconductor device - Google Patents

A negative photosensitive resin composition, a hardened embossed pattern, and a semiconductor device Download PDF

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Publication number
TWI491987B
TWI491987B TW102116252A TW102116252A TWI491987B TW I491987 B TWI491987 B TW I491987B TW 102116252 A TW102116252 A TW 102116252A TW 102116252 A TW102116252 A TW 102116252A TW I491987 B TWI491987 B TW I491987B
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TW
Taiwan
Prior art keywords
photosensitive resin
resin composition
mol
organic group
mass
Prior art date
Application number
TW102116252A
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English (en)
Chinese (zh)
Other versions
TW201351047A (zh
Inventor
Nobuchika Tamura
Tatsuya Hirata
Masahiko Yoshida
Original Assignee
Asahi Kasei E Materials Corp
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Application filed by Asahi Kasei E Materials Corp filed Critical Asahi Kasei E Materials Corp
Publication of TW201351047A publication Critical patent/TW201351047A/zh
Application granted granted Critical
Publication of TWI491987B publication Critical patent/TWI491987B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW102116252A 2012-05-07 2013-05-07 A negative photosensitive resin composition, a hardened embossed pattern, and a semiconductor device TWI491987B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012106000 2012-05-07

Publications (2)

Publication Number Publication Date
TW201351047A TW201351047A (zh) 2013-12-16
TWI491987B true TWI491987B (zh) 2015-07-11

Family

ID=49550713

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102116252A TWI491987B (zh) 2012-05-07 2013-05-07 A negative photosensitive resin composition, a hardened embossed pattern, and a semiconductor device

Country Status (5)

Country Link
JP (1) JP6190805B2 (ko)
KR (1) KR101719045B1 (ko)
CN (1) CN104285184B (ko)
TW (1) TWI491987B (ko)
WO (1) WO2013168675A1 (ko)

Cited By (1)

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TWI791791B (zh) * 2018-03-30 2023-02-11 日商太陽油墨製造股份有限公司 硬化性樹脂組成物、乾膜、硬化物及印刷配線板

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KR102235156B1 (ko) * 2013-12-09 2021-04-05 롬엔드하스전자재료코리아유한회사 네거티브형 감광성 수지 조성물
CN106104381B (zh) * 2014-03-17 2019-12-13 旭化成株式会社 感光性树脂组合物、固化浮雕图案的制造方法、以及半导体装置
TWI647532B (zh) * 2014-07-01 2019-01-11 南韓商東友精細化工有限公司 光敏樹脂組成物
WO2016147490A1 (ja) * 2015-03-16 2016-09-22 太陽ホールディングス株式会社 ポジ型感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
WO2016194769A1 (ja) 2015-05-29 2016-12-08 富士フイルム株式会社 ポリイミド前駆体組成物、感光性樹脂組成物、硬化膜、硬化膜の製造方法、半導体デバイスおよびポリイミド前駆体組成物の製造方法
JP6481032B2 (ja) * 2015-06-30 2019-03-13 富士フイルム株式会社 ネガ型感光性樹脂組成物、硬化膜、硬化膜の製造方法および半導体デバイス
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TWI625232B (zh) 2016-02-26 2018-06-01 Fujifilm Corp 積層體、積層體的製造方法、半導體元件以及半導體元件的製造方法
CN108780275B (zh) * 2016-03-28 2022-11-08 东丽株式会社 感光性膜
JP6487875B2 (ja) 2016-04-19 2019-03-20 信越化学工業株式会社 テトラカルボン酸ジエステル化合物、ポリイミド前駆体の重合体及びその製造方法、ネガ型感光性樹脂組成物、ポジ型感光性樹脂組成物、パターン形成方法、及び硬化被膜形成方法
JP6663320B2 (ja) 2016-07-25 2020-03-11 信越化学工業株式会社 テトラカルボン酸ジエステル化合物、ポリイミド前駆体の重合体及びその製造方法、ネガ型感光性樹脂組成物、パターン形成方法、及び硬化被膜形成方法
KR20180055875A (ko) * 2016-08-22 2018-05-25 아사히 가세이 가부시키가이샤 감광성 수지 조성물 및 경화 릴리프 패턴의 제조 방법
WO2018043467A1 (ja) * 2016-08-31 2018-03-08 富士フイルム株式会社 樹脂組成物およびその応用
JP6909093B2 (ja) * 2016-09-13 2021-07-28 東京応化工業株式会社 感光性樹脂組成物、ポリアミド樹脂、ポリアミド樹脂の製造方法、化合物、化合物の製造方法、硬化膜の製造方法、及び硬化膜
KR102472822B1 (ko) * 2016-09-13 2022-12-02 도쿄 오카 고교 가부시키가이샤 감광성 수지 조성물, 폴리아미드 수지, 폴리아미드 수지의 제조 방법, 화합물, 화합물의 제조 방법, 경화막의 제조 방법 및 경화막
JP6637871B2 (ja) 2016-10-27 2020-01-29 信越化学工業株式会社 テトラカルボン酸ジエステル化合物、ポリイミド前駆体の重合体及びその製造方法、ネガ型感光性樹脂組成物、パターン形成方法、及び硬化被膜形成方法
KR102680126B1 (ko) * 2016-11-29 2024-07-03 (주)덕산테코피아 네거티브 감광성 수지 조성물, 필름 및 전자장치
JP6663380B2 (ja) 2017-03-22 2020-03-11 信越化学工業株式会社 ポリイミド前駆体の重合体、ポジ型感光性樹脂組成物、ネガ型感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品
KR20200087876A (ko) * 2017-08-28 2020-07-21 스미또모 베이크라이트 가부시키가이샤 네거티브형 감광성 수지 조성물, 반도체 장치 및 전자기기
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JP2018082184A (ja) * 2017-12-06 2018-05-24 味の素株式会社 樹脂シート
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WO2020111178A1 (ja) * 2018-11-29 2020-06-04 日産化学株式会社 アルコール化合物
WO2020150918A1 (zh) * 2019-01-23 2020-07-30 律胜科技股份有限公司 感光性树脂组合物及其应用
KR20230069646A (ko) 2021-11-12 2023-05-19 주식회사 파이솔루션테크놀로지 폴리이미드 중합체, 이를 포함한 수지, 상기 중합체의 제조방법 및 이를 포함한 네가티브형 감광성 수지 조성물
TW202419533A (zh) * 2022-08-31 2024-05-16 日商富士軟片股份有限公司 樹脂組成物、硬化物、積層體、硬化物的製造方法、積層體的製造方法、半導體元件的製造方法及半導體元件
WO2024090486A1 (ja) * 2022-10-28 2024-05-02 旭化成株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置

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Publication number Priority date Publication date Assignee Title
TWI791791B (zh) * 2018-03-30 2023-02-11 日商太陽油墨製造股份有限公司 硬化性樹脂組成物、乾膜、硬化物及印刷配線板

Also Published As

Publication number Publication date
KR20140148451A (ko) 2014-12-31
WO2013168675A1 (ja) 2013-11-14
TW201351047A (zh) 2013-12-16
KR101719045B1 (ko) 2017-03-22
CN104285184B (zh) 2018-09-25
JPWO2013168675A1 (ja) 2016-01-07
JP6190805B2 (ja) 2017-08-30
CN104285184A (zh) 2015-01-14

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