TWI490649B - 正型感光性組成物、由其形成的硬化膜及具有硬化膜的元件 - Google Patents

正型感光性組成物、由其形成的硬化膜及具有硬化膜的元件 Download PDF

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Publication number
TWI490649B
TWI490649B TW100131313A TW100131313A TWI490649B TW I490649 B TWI490649 B TW I490649B TW 100131313 A TW100131313 A TW 100131313A TW 100131313 A TW100131313 A TW 100131313A TW I490649 B TWI490649 B TW I490649B
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TW
Taiwan
Prior art keywords
group
weight
compound
positive photosensitive
photosensitive composition
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TW100131313A
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English (en)
Chinese (zh)
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TW201211697A (en
Inventor
Takenori Fujiwara
Mitsuhito Suwa
Keiichi Uchida
Sho Fukuhara
Masahide Senoo
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Toray Industries
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Publication of TW201211697A publication Critical patent/TW201211697A/zh
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Publication of TWI490649B publication Critical patent/TWI490649B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C08K5/057—Metal alcoholates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nonlinear Science (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Liquid Crystal (AREA)
TW100131313A 2010-09-02 2011-08-31 正型感光性組成物、由其形成的硬化膜及具有硬化膜的元件 TWI490649B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010196348 2010-09-02

Publications (2)

Publication Number Publication Date
TW201211697A TW201211697A (en) 2012-03-16
TWI490649B true TWI490649B (zh) 2015-07-01

Family

ID=45772820

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100131313A TWI490649B (zh) 2010-09-02 2011-08-31 正型感光性組成物、由其形成的硬化膜及具有硬化膜的元件

Country Status (6)

Country Link
JP (1) JP5765235B2 (ja)
KR (1) KR101842891B1 (ja)
CN (1) CN103180784B (ja)
SG (1) SG188386A1 (ja)
TW (1) TWI490649B (ja)
WO (1) WO2012029734A1 (ja)

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KR20140058847A (ko) * 2012-11-07 2014-05-15 롬엔드하스전자재료코리아유한회사 유무기 복합 실록산계 고분자 및 이를 포함하는 포지티브형 감광성 수지 조성물
TWI484293B (zh) * 2012-11-07 2015-05-11 Chi Mei Corp 感光性樹脂組成物及其應用
JP6319082B2 (ja) * 2013-02-12 2018-05-09 東レ株式会社 感光性樹脂組成物、それを熱硬化させてなる保護膜又は絶縁膜、それを用いたタッチパネル及びその製造方法
JP6295950B2 (ja) * 2013-03-28 2018-03-20 東レ株式会社 感光性樹脂組成物、保護膜又は絶縁膜、タッチパネル及びその製造方法
KR102229661B1 (ko) * 2013-10-21 2021-03-18 닛산 가가쿠 가부시키가이샤 포지티브형 감광성 수지 조성물
JP6468853B2 (ja) * 2015-01-19 2019-02-13 東京応化工業株式会社 ポジ型感光性樹脂組成物及び硬化膜
WO2016133023A1 (ja) * 2015-02-19 2016-08-25 日本ゼオン株式会社 樹脂組成物、樹脂膜、及び電子部品
KR101881943B1 (ko) * 2015-02-26 2018-07-26 삼성에스디아이 주식회사 포지티브형 감광성 수지 조성물, 감광성 수지막 및 이를 이용한 표시 소자
CN104789041B (zh) * 2015-04-23 2017-02-01 湖北金三峡印务有限公司 锆螯合物改性的复合碱可溶乳液及其制备的高复溶性水性油墨及方法
KR20170053561A (ko) * 2015-11-06 2017-05-16 롬엔드하스전자재료코리아유한회사 감광성 수지 조성물 및 이로부터 제조된 경화막
CN105301916A (zh) * 2015-11-16 2016-02-03 北京中科紫鑫科技有限责任公司 一种光刻胶图案的形成方法
CN105301901A (zh) * 2015-11-16 2016-02-03 北京中科紫鑫科技有限责任公司 一种正性光刻胶组合物的制备方法
CN105301904B (zh) * 2015-11-16 2017-05-31 北京中科紫鑫科技有限责任公司 一种光刻胶组合物及其制备方法
CN105301903A (zh) * 2015-11-16 2016-02-03 北京中科紫鑫科技有限责任公司 一种形成光刻胶组合物
KR102399714B1 (ko) * 2016-09-30 2022-05-19 도레이 카부시키가이샤 감광성 수지 조성물, 도전성 패턴의 제조 방법, 기판, 터치 패널 및 디스플레이
JP6807226B2 (ja) * 2016-12-09 2021-01-06 東京応化工業株式会社 基材上に平坦化膜又はマイクロレンズを形成するために用いられるエネルギー感受性組成物、硬化体の製造方法、硬化体、マイクロレンズの製造方法、及びｃｍｏｓイメージセンサ
CN111837075A (zh) * 2018-03-23 2020-10-27 默克专利股份有限公司 负型超厚膜光刻胶
KR20190136248A (ko) * 2018-05-30 2019-12-10 롬엔드하스전자재료코리아유한회사 포지티브형 감광성 수지 조성물 및 이를 이용한 경화막

Citations (4)

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TW200730583A (en) * 2005-10-28 2007-08-16 Toray Industries Siloxane resin composition and the method for manufacturing the same
TW200739264A (en) * 2005-11-30 2007-10-16 Sumitomo Bakelite Co Positive photosensitive resin composition and semiconductor device and display device including the same
TW200848934A (en) * 2007-02-02 2008-12-16 Samsung Electronics Co Ltd Photoresist composition, coating method thereof, method of forming organic film pattern using the same and display device fabricated thereby
JP2009075326A (ja) * 2007-09-20 2009-04-09 Jsr Corp 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法

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JP4529616B2 (ja) * 2004-09-24 2010-08-25 Ｊｓｒ株式会社 層間絶縁膜形成用感放射線性樹脂組成物および層間絶縁膜
JP4932414B2 (ja) * 2005-11-01 2012-05-16 富士フイルム株式会社 ネガ型染料含有感放射線性硬化性組成物、カラーフィルタおよびその製造方法
JP4899844B2 (ja) * 2006-12-07 2012-03-21 住友ベークライト株式会社 ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜およびそれを用いた半導体装置、表示体装置。
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JP2010085758A (ja) * 2008-09-30 2010-04-15 Fujifilm Corp ジピロメテン系化合物及びその互変異性体、着色硬化性組成物、カラーフィルタ及びその製造方法
JP5540632B2 (ja) * 2008-12-25 2014-07-02 東レ株式会社 感光性組成物、それから形成された硬化膜、および硬化膜を有する素子

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200730583A (en) * 2005-10-28 2007-08-16 Toray Industries Siloxane resin composition and the method for manufacturing the same
TW200739264A (en) * 2005-11-30 2007-10-16 Sumitomo Bakelite Co Positive photosensitive resin composition and semiconductor device and display device including the same
TW200848934A (en) * 2007-02-02 2008-12-16 Samsung Electronics Co Ltd Photoresist composition, coating method thereof, method of forming organic film pattern using the same and display device fabricated thereby
JP2009075326A (ja) * 2007-09-20 2009-04-09 Jsr Corp 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法

Also Published As

Publication number Publication date
JPWO2012029734A1 (ja) 2013-10-28
KR101842891B1 (ko) 2018-05-14
TW201211697A (en) 2012-03-16
CN103180784B (zh) 2016-01-20
KR20130108289A (ko) 2013-10-02
SG188386A1 (en) 2013-04-30
WO2012029734A1 (ja) 2012-03-08
JP5765235B2 (ja) 2015-08-19
CN103180784A (zh) 2013-06-26

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