TWI490247B - Solder resist ink composition and hardened product thereof - Google Patents

Solder resist ink composition and hardened product thereof Download PDF

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Publication number
TWI490247B
TWI490247B TW099143554A TW99143554A TWI490247B TW I490247 B TWI490247 B TW I490247B TW 099143554 A TW099143554 A TW 099143554A TW 99143554 A TW99143554 A TW 99143554A TW I490247 B TWI490247 B TW I490247B
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
printed wiring
wiring board
film
Prior art date
Application number
TW099143554A
Other languages
English (en)
Chinese (zh)
Other versions
TW201132663A (en
Inventor
Masao Arima
Nobuhito Ito
Naofumi Horiguchi
Original Assignee
Taiyo Holdings Co Ltd
Nippon Kayaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd, Nippon Kayaku Kk filed Critical Taiyo Holdings Co Ltd
Publication of TW201132663A publication Critical patent/TW201132663A/zh
Application granted granted Critical
Publication of TWI490247B publication Critical patent/TWI490247B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/06—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyurethanes
    • C08F299/065—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyurethanes from polyurethanes with side or terminal unsaturations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW099143554A 2009-12-14 2010-12-13 Solder resist ink composition and hardened product thereof TWI490247B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009282478 2009-12-14

Publications (2)

Publication Number Publication Date
TW201132663A TW201132663A (en) 2011-10-01
TWI490247B true TWI490247B (zh) 2015-07-01

Family

ID=44167225

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099143554A TWI490247B (zh) 2009-12-14 2010-12-13 Solder resist ink composition and hardened product thereof

Country Status (3)

Country Link
JP (1) JP5537566B2 (ja)
TW (1) TWI490247B (ja)
WO (1) WO2011074469A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6383764B2 (ja) * 2016-01-12 2018-08-29 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
WO2020230504A1 (ja) * 2019-05-10 2020-11-19 昭和電工株式会社 フレキシブル配線回路基板の製造方法
KR20220033490A (ko) * 2019-07-08 2022-03-16 닛폰 포리텍쿠 가부시키가이샤 경화성 조성물, 경화물, 오버코트막, 및 플렉시블 배선판 및 그 제조 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101320213A (zh) * 2007-06-04 2008-12-10 太阳油墨制造株式会社 感光性树脂组合物及使用其得到的挠性电路板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5062714B2 (ja) * 2006-01-19 2012-10-31 日本化薬株式会社 活性エネルギー線硬化型樹脂組成物、及びその用途
JP2007279489A (ja) * 2006-04-10 2007-10-25 Hitachi Chem Co Ltd 感光性樹脂組成物、レジストパターンの製造方法、フレキシブル基板及び電子部品
JP5189878B2 (ja) * 2008-04-01 2013-04-24 関西ペイント株式会社 樹脂組成物、レジスト組成物及びレジストパターン形成方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101320213A (zh) * 2007-06-04 2008-12-10 太阳油墨制造株式会社 感光性树脂组合物及使用其得到的挠性电路板

Also Published As

Publication number Publication date
WO2011074469A1 (ja) 2011-06-23
TW201132663A (en) 2011-10-01
JP5537566B2 (ja) 2014-07-02
JPWO2011074469A1 (ja) 2013-04-25

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