TWI469287B - 佈線板及其製造方法 - Google Patents

佈線板及其製造方法 Download PDF

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Publication number
TWI469287B
TWI469287B TW97138058A TW97138058A TWI469287B TW I469287 B TWI469287 B TW I469287B TW 97138058 A TW97138058 A TW 97138058A TW 97138058 A TW97138058 A TW 97138058A TW I469287 B TWI469287 B TW I469287B
Authority
TW
Taiwan
Prior art keywords
wiring
wiring board
reinforcing member
reinforcing
forming
Prior art date
Application number
TW97138058A
Other languages
English (en)
Chinese (zh)
Other versions
TW200919671A (en
Inventor
松下德孝
大島一宏
堀內章夫
Original Assignee
新光電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新光電氣工業股份有限公司 filed Critical 新光電氣工業股份有限公司
Publication of TW200919671A publication Critical patent/TW200919671A/zh
Application granted granted Critical
Publication of TWI469287B publication Critical patent/TWI469287B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09136—Means for correcting warpage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7424—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self-supporting substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW97138058A 2007-10-05 2008-10-03 佈線板及其製造方法 TWI469287B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007261850A JP5394625B2 (ja) 2007-10-05 2007-10-05 配線基板及びその製造方法

Publications (2)

Publication Number Publication Date
TW200919671A TW200919671A (en) 2009-05-01
TWI469287B true TWI469287B (zh) 2015-01-11

Family

ID=40533077

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97138058A TWI469287B (zh) 2007-10-05 2008-10-03 佈線板及其製造方法

Country Status (4)

Country Link
US (1) US8410375B2 (https=)
JP (1) JP5394625B2 (https=)
KR (1) KR20090035452A (https=)
TW (1) TWI469287B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4841609B2 (ja) * 2008-12-01 2011-12-21 第一精工株式会社 配線基板製造用金型およびこれを用いた配線基板の製造方法
JP5313047B2 (ja) * 2009-05-28 2013-10-09 Ｔｏｗａ株式会社 電子部品の樹脂封止用の成形型及び樹脂封止方法
US8742603B2 (en) 2010-05-20 2014-06-03 Qualcomm Incorporated Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC)
US8964403B2 (en) * 2010-11-17 2015-02-24 Ngk Spark Plug Co., Ltd. Wiring board having a reinforcing member with capacitors incorporated therein
US8461676B2 (en) 2011-09-09 2013-06-11 Qualcomm Incorporated Soldering relief method and semiconductor device employing same
WO2013065287A1 (ja) * 2011-11-01 2013-05-10 住友ベークライト株式会社 半導体パッケージの製造方法
KR20130097481A (ko) * 2012-02-24 2013-09-03 삼성전자주식회사 인쇄회로기판(ｐｃｂ) 및 그 ｐｃｂ를 포함한 메모리 모듈
US8890284B2 (en) * 2013-02-22 2014-11-18 Infineon Technologies Ag Semiconductor device
US9263329B2 (en) * 2014-03-19 2016-02-16 Intel Corporation Methods of connecting a first electronic package to a second electronic package
US9899238B2 (en) 2014-12-18 2018-02-20 Intel Corporation Low cost package warpage solution
KR102419893B1 (ko) 2018-01-15 2022-07-12 삼성전자주식회사 보호 부재를 가지는 인쇄 회로 기판 및 이를 포함하는 반도체 패키지 제조 방법
JP7202785B2 (ja) * 2018-04-27 2023-01-12 新光電気工業株式会社 配線基板及び配線基板の製造方法
KR102534733B1 (ko) * 2018-07-31 2023-05-19 삼성전자 주식회사 재배선 구조물을 가지는 팬 아웃 반도체 패키지
JP2020031089A (ja) * 2018-08-21 2020-02-27 イビデン株式会社 プリント配線板
JP7362280B2 (ja) 2019-03-22 2023-10-17 キヤノン株式会社 パッケージユニットの製造方法、パッケージユニット、電子モジュール、および機器
CN111599700B (zh) * 2019-06-20 2022-08-26 矽磐微电子(重庆)有限公司 半导体封装方法及半导体封装结构
TWI690040B (zh) * 2019-07-11 2020-04-01 晶化科技股份有限公司 保護膜片
KR102798695B1 (ko) 2019-08-13 2025-04-24 삼성전자주식회사 반도체 패키지 및 그의 제조 방법
US11224132B2 (en) * 2019-09-06 2022-01-11 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same
TWI738069B (zh) * 2019-09-27 2021-09-01 恆勁科技股份有限公司 覆晶封裝基板及其製法
US12488997B2 (en) 2021-06-08 2025-12-02 Samsung Electronics Co., Ltd. Method of manufacturing a semiconductor package including a PCB substrate
KR102901072B1 (ko) * 2023-08-07 2025-12-16 삼성전기주식회사 회로 기판

Citations (3)

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JP2000243867A (ja) * 1999-02-24 2000-09-08 Hitachi Ltd 半導体装置及びその製造方法並びに半導体装置の積層構造並びに半導体装置の実装構造
JP2000323613A (ja) * 1999-03-11 2000-11-24 Shinko Electric Ind Co Ltd 半導体装置用多層基板及びその製造方法
US20060243478A1 (en) * 2004-02-04 2006-11-02 Ibiden Co., Ltd Multilayer printed wiring board

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JPH11261228A (ja) 1998-03-13 1999-09-24 Ibiden Co Ltd 多層プリント配線板
JP2000058736A (ja) * 1998-08-07 2000-02-25 Sumitomo Kinzoku Electro Device:Kk 樹脂基板へのピン接続方法
JP2000208903A (ja) 1999-01-19 2000-07-28 Ibiden Co Ltd プリント配線板およびその製造方法
EP1744609B1 (en) * 1999-06-02 2012-12-12 Ibiden Co., Ltd. Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
JP2001223295A (ja) 2000-02-08 2001-08-17 Hitachi Chem Co Ltd 半導体素子支持基板及びその製造方法並びにそれを用いた半導体装置
JP4427874B2 (ja) 2000-07-06 2010-03-10 住友ベークライト株式会社 多層配線板の製造方法および多層配線板
JP2002151853A (ja) 2000-11-08 2002-05-24 Matsushita Electric Ind Co Ltd 多層配線基板とその製造方法
JP2006332321A (ja) 2005-05-26 2006-12-07 Fujitsu Ltd 半導体装置及びその製造方法
JP4509972B2 (ja) * 2005-09-01 2010-07-21 日本特殊陶業株式会社 配線基板、埋め込み用セラミックチップ
JP4802666B2 (ja) 2005-11-08 2011-10-26 住友金属鉱山株式会社 エポキシ樹脂接着組成物及びそれを用いた光半導体用接着剤
JP2007081437A (ja) 2006-12-21 2007-03-29 Nec Toppan Circuit Solutions Inc 印刷配線板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000243867A (ja) * 1999-02-24 2000-09-08 Hitachi Ltd 半導体装置及びその製造方法並びに半導体装置の積層構造並びに半導体装置の実装構造
JP2000323613A (ja) * 1999-03-11 2000-11-24 Shinko Electric Ind Co Ltd 半導体装置用多層基板及びその製造方法
US20060243478A1 (en) * 2004-02-04 2006-11-02 Ibiden Co., Ltd Multilayer printed wiring board

Also Published As

Publication number Publication date
US8410375B2 (en) 2013-04-02
JP5394625B2 (ja) 2014-01-22
JP2009094195A (ja) 2009-04-30
US20090095518A1 (en) 2009-04-16
KR20090035452A (ko) 2009-04-09
TW200919671A (en) 2009-05-01

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