TWI738069B - 覆晶封裝基板及其製法 - Google Patents
覆晶封裝基板及其製法 Download PDFInfo
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- TWI738069B TWI738069B TW108135196A TW108135196A TWI738069B TW I738069 B TWI738069 B TW I738069B TW 108135196 A TW108135196 A TW 108135196A TW 108135196 A TW108135196 A TW 108135196A TW I738069 B TWI738069 B TW I738069B
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Abstract
一種覆晶封裝基板及其製法,係於核心層之相對兩側上分別疊設絕緣層,以形成複合式核心結構,因而增加該覆晶封裝基板之剛性強度,促使本發明的核心結構能朝薄型化設計,且其中導電結構之端面尺寸又可依需求朝微小化設計,因而能增加單位面積內電性連接點之數量,以及製作出細線路間距及高佈線密度之線路結構,進而能滿足高集積晶片/大尺寸基板之封裝需求,以及更可避免電子封裝件發生彎翹者。
Description
本發明係有關一種封裝基板,尤指一種半導體覆晶封裝製程用之覆晶封裝基板及其製法。
隨著產業應用的發展,近年來逐漸朝向5G高頻通訊、AR、VR等發展,因此更需要研發高階半導體的封裝技術,以應用於如人工智慧(AI)晶片、高階晶片、多晶片等之半導體覆晶封裝或多晶片封裝,而在此封裝需求之下,封裝尺寸勢必越來越大,疊層數也越來越高,導致線路設計更是朝高密度、細線路間距、高電性連接點數等方向設計,藉以滿足上揭晶片之封裝需求。
目前在高階晶片封裝及應用的缺點是現有的覆晶封裝基板,因為要配合高集積尺寸晶片(如AI晶片等)之封裝,為了滿足更多的電性連接點數量、大量且複雜的線路需求,以及避免板翹現象之發生,所以勢必要加厚核心結構尺寸,但也因而造成其穿孔(Through hole)之斷面尺寸變大,致使其電性連接點之間距也變大,故導致在單位面積內之電性連接點數量變少、線路密度變低、線路間距變大,而為了滿足上揭需求,只好將
覆晶封裝基板的尺寸變得更大、更厚,因而造成封裝作業變得更加的困難。
因此,現有業界是使用大尺寸的覆晶封裝基板,如45x45mm2、70x70mm2或80x80mm2等大尺寸覆晶封裝基板結構,以承載如人工智慧(AI)晶片、高階晶片或多晶片等高積集尺寸晶片來進行封裝。如第1A圖所示,該電子裝置1係包括:一電路板18、一設於該電路板18上之大尺寸版面覆晶封裝基板1a、以及一結合於該覆晶封裝基板1a上之高集積尺寸半導體晶片19。具體地,如第1B圖所示,該覆晶封裝基板1a係包括一核心結構10、設於該核心結構10上、下兩側面上之增層(Build up)結構11、及設於該增層結構11上之防焊層12,其中,該核心結構10具有導電通孔100以電性連接該增層結構11之線路層110,且該增層結構11復包含至少一包覆該線路層110之介電層111,並令該防焊層12外露出該增層結構11最外側之線路層110,俾供作為電性連接點112,以藉由焊錫材料13結合該電路板18及該半導體晶片19。
習知核心結構10之製作中,係採用玻纖配合環氧樹脂所組成之基材,如BT(Bismaleimide Triazine)或FR5等,再於其上進行導電通孔100製程,如機械鑽孔、雷射鑽孔或雙錐狀盲孔等成孔步驟,再於孔中電鍍導電層或再填入填充材。
然而,習知應用於高集積/大尺寸的覆晶封裝基板1a會產生明顯缺點,例如:該核心結構10係採用玻纖配合環氧樹脂所組成之基材,因該覆晶封裝基板1a於各層間材料之熱膨脹係數(Coefficient of thermal expansion,簡稱CTE)不一致,因而於封裝時易產生板翹,致使其與該半導體晶片19之間連接不良(如第1A圖所示之上方焊錫材料13’未接合或
斷裂)、或於焊接時,其與該電路板18之間會發生連接不良(如第1A圖所示之下方焊錫材料13”未接合或斷裂),更嚴重的是可能因為應力關係,會造成該半導體晶片19本身的破裂、或該半導體晶片19的電性失效。
因此,業界遂有將該核心結構10之厚度h加厚,如厚度h從原本0.8公厘(mm)搭配0.1mm的孔徑w,增加厚度h至1.2mm(或1.6mm)而搭配0.2mm以上的孔徑w,以增加該覆晶封裝基板1a之剛性強度,俾改善板翹問題,但卻因而產生更多的缺點,如下:
第一、加厚該核心結構10之方式,不符合朝薄型化或微小化的封裝設計之需求。
第二、單位面積內之電性連接點112的數量無法增加。具體地,加厚該核心結構10之結果,造成在傳統技術之下勢必讓該複數導電通孔100的端面尺寸變大(即該孔徑w變大),進而造成該複數導電通孔100的間距必須變大,故導致單位面積內電性連接點112的數量變少。
第三、線路間距變大及線路密度變低。具體地,加厚該核心結構10之結果,造成在傳統技術之下勢必讓該複數導電通孔100的端面尺寸變大而佔用佈線面積,導致其上方線路層110之線路佈線面積縮減,進而難以製作細線路間距或高密度線路之線路層110。
第四、該導電通孔100內更難完成電鍍及順利填入填充材。具體地,加厚該核心結構10之結果,將導致該複數導電通孔100變深,因而更難以在變深的導電通孔100內完成電鍍甚至會產生包孔現象,亦難以將填充材順利的填入變深的導電通孔100內。
第五、該導電通孔100之加工成本與難度隨著該核心結構10
加厚而變高。具體地,茲因習知核心結構10是採用含玻纖布之介電材來加厚該核心結構10以改善板翹之問題,但是於該材質上以雷射或機械鑽孔進行較深的導電通孔100加工時,不但難以製造出細小端面尺寸之導電通孔100,更因而致使製作成本居高不下。
第六、導電阻值變高,且電性變差。具體地,由於增加該核心結構10的厚度h,使該覆晶封裝基板1a之整體厚度變厚,勢必導電路徑(如該導電通孔100)變長而使電阻值變高,導致電性變差。
第七、散熱性變差。具體地,增加核心結構10的厚度,促使整個覆晶封裝基板1a變厚,勢必增加該覆晶封裝基板1a的散熱難度,導致散熱性變差而影響整體效能與壽命。
因此,如何克服習知技術中之種種問題,實已成為目前亟欲解決的課題。
鑑於上述習知技術之缺失,本發明提供一種覆晶封裝基板,係包括:核心結構,係具有相對之第一側與第二側,其中,該核心結構係包含一核心層及分別結合於該核心層相對兩側之絕緣層,且形成該核心層之材質係不同於形成該絕緣層之材質;複數導電結構,係貫通該核心層與該絕緣層,且各該導電結構係外露於該核心結構之第一側與第二側;以及線路結構,係以雙邊增層線路型式形成於該核心結構之第一側及第二側上且電性連接該導電結構。
本發明復提供一種覆晶封裝基板之製法,係包括:提供一核
心層;於該核心層之相對兩側上分別結合一絕緣層,以令該核心層與絕緣層作為核心結構,且該核心結構係具有相對之第一側與第二側,其中,形成該核心層之材質係不同於形成該絕緣層之材質;形成複數導電結構於該核心結構中,使該導電結構貫通該核心層與該絕緣層,且各該導電結構係外露於該核心結構之第一側與第二側;以及以雙邊增層線路型式形成線路結構於該核心結構之第一側及第二側上,且令該線路結構電性連接該導電結構。
前述之覆晶封裝基板及其製法中,該核心層係由含玻纖之高剛性硬度的BT(Bismaleimide Triazine)或FR-5之絕緣材所形成者。
前述之覆晶封裝基板及其製法中,該核心層之絕緣層係由環氧模壓樹脂或ABF ABF(Ajinomoto Build-up Film)之具有高剛性硬度之介電材所形成者。
前述之覆晶封裝基板及其製法中,復包括形成強化結構於該核心結構之第一側及/或第二側上之線路結構上。例如,該強化結構係包含剛性部、及將該剛性部結合於該線路結構上之絕緣部。
由上可知,本發明之覆晶封裝基板及其製法,主要藉由將該絕緣層設於該核心層之相對兩側上,以形成複合式核心結構,因而增加該覆晶封裝基板之剛性強度,所以相較於習知技術,本發明之覆晶封裝基板不僅能避免於半導體封裝製程中發生板翹,且該導電結構之端面尺寸又可依需求朝微小化設計,因而能增加單位面積內電性連接點之數量,以及製作出細線路間距及高佈線密度之線路結構,進而能滿足高集積晶片之封裝需求者。
1‧‧‧電子裝置
1a‧‧‧覆晶封裝基板
10‧‧‧核心結構
100‧‧‧導電通孔
11‧‧‧增層結構
110,261,25a,25b‧‧‧線路層
111,260‧‧‧介電層
112‧‧‧電性連接點
12‧‧‧防焊層
13,13’,13”‧‧‧焊錫材料
18‧‧‧電路板
19‧‧‧半導體晶片
2a,2b,3,4‧‧‧覆晶封裝基板
20‧‧‧核心結構
20a‧‧‧第一側
20b‧‧‧第二側
200‧‧‧通孔
21‧‧‧核心層
22,23‧‧‧絕緣層
24,24’,54a~54h‧‧‧導電結構
24a,24b‧‧‧端面
240,540‧‧‧柱體
240a‧‧‧導電材
240b‧‧‧填充材
26a,26b‧‧‧線路結構
262,263‧‧‧電性接觸墊
27‧‧‧絕緣保護層
28,29‧‧‧導電元件
3a,4a‧‧‧強化結構
33‧‧‧剛性部
330‧‧‧開孔
35‧‧‧絕緣部
350‧‧‧結合層
351‧‧‧保護層
9,9’,9”‧‧‧電子封裝件
90‧‧‧電子元件
91‧‧‧底膠
H,h,D,t‧‧‧厚度
L‧‧‧端面交界處
w‧‧‧孔徑
第1A圖係為習知電子裝置之剖視示意圖。
第1B圖係為習知覆晶封裝基板之剖視示意圖。
第2A至2E圖係為本發明之覆晶封裝基板之製法之第一實施例的剖視示意圖,其中,第2C’圖係為第2C圖之另一態樣之局部剖視圖。
第2F圖係為第2E圖之應用之剖視示意圖。
第3A圖係為本發明之覆晶封裝基板之製法之第二實施例的剖視示意圖。
第3B圖係為第3A圖之應用之剖視示意圖。
第4A圖係為本發明之覆晶封裝基板之製法之第三實施例的剖視示意圖。
第4B圖係為第4A圖之應用之剖視示意圖。
第5A至5H圖係為本發明之覆晶封裝基板之核心結構之不同態樣的剖視示意圖。
以下藉由特定的具體實施例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。
須知,本說明書所附圖式所繪示之結構、比例、大小等,均
僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如“上”、“第一”、“第二”及“一”等之用語,亦僅為便於敘述之明瞭,而非用以限定本發明可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本發明可實施之範疇。
第2A至2E圖係為本發明之覆晶封裝基板2a,2b之製法之第一實施例的剖視示意圖。
如第2A圖所示,提供一核心結構20,其具有相對之第一側20a與第二側20b。
於本實施例中,該核心結構20之製作係於一核心層21之相對兩側上分別壓合一絕緣層22,23,以令該核心層21與該絕緣層22,23作為該核心結構20,且該絕緣層22,23之表面係定義為該第一側20a與第二側20b之表面。
再者,形成該核心層21之材質係為如介電材之絕緣材,該介電材可為不包含玻纖之有機樹脂材或含有填充材(如SiO2或玻纖粉等)之有機樹脂,具體地,該有機介電材之種類更包含鑄模化合物(Molding Compound)、環氧模壓樹脂(Epoxy Molding Compound,簡稱EMC)或底層塗料(Primer);該介電材亦或可為絕緣無機材(如絕緣氧化物、氮化物、鋁化物或陶瓷類等)。較佳地,形成該核心層21之材質係為含玻纖之
高剛性硬度的BT(Bismaleimide Triazine)或FR-5。
又,該絕緣層22,23之材質可例如高剛性之陶瓷材(如Al2O3或AlN)、塑鋼、碳纖維,有機介電材或其它適當材質,且該有機介電材係例如為有機黏著材。具體地,該有機介電材之種類更包含鑄模化合物(Molding Compound)、環氧模壓樹脂(Epoxy Molding Compound,簡稱EMC)、底層塗料(Primer)或高比例充填材(SiO2-75%以上)。較佳地,形成該絕緣層22,23之材質係為EMC或ABF等具有高剛性硬度之介電材。因此,有關該絕緣層22,23之材質可依需求設計,並不限於上述。
因此,該核心層21之絕緣材可不同於該絕緣層22,23之材質,且於該絕緣層22,23之材質選擇中,該鑄模化合物或底層塗料具抗翹曲之功效。
另外,該核心層21之厚度H係為0.2~0.6mm,且該絕緣層之厚度D係為0.1~0.3mm。
如第2B圖所示,藉由圖案化製程,於該核心結構20上形成複數連通該第一側20a與第二側20b之通孔200。
於本實施例中,該通孔200之製程係採用如機械鑽孔、雷射鑽孔或其它成孔方式。
如第2C圖所示,於該複數通孔200中以電鍍、沉積或填充導電材(如錫膏、導電膠等)等方式形成複數導電結構24,且於該核心結構20之第一側20a及第二側20b上同時或分次各電鍍形成一線路層25a,25b,且該線路層25a,25b電性連接該複數導電結構24。
於本實施例中,該導電結構24係由單一柱體構成,其周身
未延伸有線路,且各該導電結構24之相對兩端面24a,24b係外露於該核心結構20之第一側20a與第二側20b,以令其端面24a,24b連接該線路層25a,25b。具體地,該導電結構24之製程係於該通孔200中電鍍填滿導電材以形成一體成形之柱體(如第2C圖所示);或者,可先將導電材240a形成於該通孔200之孔壁上,再填入絕緣填充材240b(如第5A圖所示之導電結構54a)。
再者,如第2C’圖所示,該導電結構24’亦可由複數相互接續堆疊之柱體240所組成,亦即該通孔200係由該核心層21之開孔與該絕緣層22,23之開孔所疊成,例如,各該柱體240之端面尺寸係相同。或者,各該柱體540之端面尺寸可不相同(如第5B至5D圖所示之導電結構54b,54c,54d),致使各該柱體540的端面交界處L呈凹凸狀(如第5B及5C圖所示)或呈階梯狀(如第5D圖所示),因而該導電結構的周身為非連續面。應可理解地,該柱體之接續堆疊層數或周身形式均可依需求設計,如該核心層21內可包含複數柱體,並不限於上述。
又,該導電結構的周身可依需求為連續面(如平斜面、如第2C及2C’圖所示之導電結構24,24’之平直面、如第5E及5F圖所示之導電結構54e,54f之雙錐面、或如第5G及5H圖所示之導電結構54g,54h之弧面)。因此,有關該導電結構之輪廓形狀並無特別限制。
如第2D圖所示,於該線路層25a,25b上以雙邊增層線路型式形成線路結構26a,26b於該核心結構20之第一側20a及第二側20b上,即依需求設計佈設線路之層數,且令該線路結構26a,26b電性連接該導電結構24。具體地,於該核心結構20之第一側20a及第二側20b上同時或
分次各形成增層線路型式之線路結構26a,26b,其包括至少一介電層260及結合該介電層260之線路層261。具體地,該介電層260可為環氧樹脂,如ABF(Ajinomoto Build-up Film)、預浸材或環氧模壓樹脂(EMC)。
如第2E圖所示,該線路結構26a,26b上可形成一絕緣保護層27,以令該絕緣保護層27外露出最外側線路層261,俾供作為電性接觸墊262,263。
於本實施例中,該絕緣保護層27可為防焊材,如感光型油墨、ABF或非感光型介電材(如EMC)等。
再者,於後續製程中,如第2F圖所示,可於該覆晶封裝基板2a,2b之其中一側之電性接觸墊262上藉由導電元件28接置至少一電子元件90,以形成一電子封裝件9。另一方面,於該覆晶封裝基板2b之另一側之電性接觸墊263上接置如焊球之導電元件29,俾供外接一電路板(圖略)。
所述之導電元件28係可包含焊錫材料及/或金屬凸塊(如銅凸塊)。
所述之電子元件90係為主動元件、被動元件或其二者組合,其中,該主動元件係例如半導體晶片,而該被動元件係例如電阻、電容及電感。例如,該電子元件係以覆晶方式電性連接線路部。具體地,該電子元件90藉由該複數導電元件28設於該覆晶封裝基板2a,2b上,再以底膠91包覆該複數導電元件28;或以封裝層(圖略)包覆該電子元件90,其中,該封裝層可為壓合製程用之薄膜、模壓製程用之封裝膠體或印刷製程用之膠材等,且形成該封裝層之材質係為聚醯亞胺(PI)、乾膜(dry film)、
環氧樹脂(epoxy)或封裝材,並無特別限制。
第3A至3B圖係為本發明之覆晶封裝基板3之製法之第二實施例的剖視示意圖。本實施例與第一實施例之主要差異在於增設強化結構,其它製程大致相同,故以下不再贅述相同處。
如第3A圖所示,係接續第2D圖所示之製程,將一強化結構3a設於該核心結構20之第二側20b之線路結構26b上,且於該核心結構20之第一側20a之線路結構26a上形成該絕緣保護層27。
於本實施例中,該強化結構3a係包含一剛性部33,且形成該剛性部33之材質係為高剛性片材或板材。例如,該剛性部33之材質可為如鋁、鋁合金、不鏽鋼、銅、銅合金、鎳鐵合金或其它金屬材料。或者,該剛性部33之材質可為如高剛性之陶瓷材(如Al2O3或AlN)、塑膠、碳纖或其它之絕緣材。因此,有關該剛性部33之材質可依需求設計,並不限於上述。
再者,該強化結構3a係包含一絕緣部35,其包覆該剛性部33,以令該剛性部33藉由該絕緣部35結合於該線路結構26b上。例如,該絕緣部35係包含一用以結合該線路結構26b之結合層350與一用以包覆該剛性部33之保護層351,其中,該絕緣部35(或該保護層351)之材料可為有機介電材(如防焊材)或無機介電材(如絕緣氧化物)。具體地,該有機介電材之種類更包含ABF、預浸材、鑄模化合物、環氧模壓樹脂(EMC)或底層塗料。另一方面,該結合層350之材質與該保護層351之材質可相同或不相同。
又,於該強化結構3a上形成複數開孔330,以令該複數電
性接觸墊263外露於該複數開孔330,俾供設置該導電元件29。應可理解地,有關該強化結構3a之製程之種類繁多,並無特別限制。例如,可先以該絕緣部35(或結合層350)將該剛性部33貼合於該第二側20b之線路結構26b上,再於該絕緣部25上形成複數開孔330以外露出該電性接觸墊263,之後形成該保護層351於該剛性部33上及該開孔330之孔壁中。
另外,於後續製程中,如第3B圖所示之電子封裝件9’之結構中,可於該覆晶封裝基板3之另一側之電性接觸墊262上藉由導電元件28接置至少一電子元件90,而於該強化結構3a之開孔330中之電性接觸墊263上接置如焊球之導電元件29,俾供外接一電路板(圖略)。
因此,該電子封裝件9’可藉由該絕緣部35隔絕金屬材之剛性部33與該導電元件29兩者之間的電性導通,以防止短路。
第4A至4B圖係為本發明之覆晶封裝基板4之製法之第三實施例的剖視示意圖。本實施例與第二實施例之主要差異在於強化結構之佈設,其它製程大致相同,故以下不再贅述相同處。
如第4A圖所示,係接續第2D圖所示之製程,將一強化結構3a設於該核心結構20之第二側20b之線路結構26b上,且於該核心結構20之第一側20a之線路結構26a上形成該絕緣保護層27,並於該絕緣保護層27上設置另一強化結構4a。
於本實施例中,該強化結構4a係為框體,其由高剛性材質製作,以外露該複數電性接觸墊262或該導電元件28。例如,該強化結構4a之材質可為如鋁、鋁合金、不鏽鋼、銅、銅合金、鎳鐵合金或其它金屬材料。或者,該強化結構4a之材質可為如高剛性之陶瓷材(如Al2O3或
AlN)、塑膠、碳纖或其它之絕緣材。因此,有關該強化結構4a之材質可依需求設計,並不限於上述。
另外,於後續製程中,如第4B圖所示之電子封裝件9”之結構中,可於該強化結構4a之框體內之電性接觸墊262上藉由導電元件28接置至少一電子元件90,而於該強化結構3a之開孔330中之電性接觸墊263上接置如焊球之導電元件29,俾供外接一電路板(圖略)。
因此,該強化結構4a可平衡該核心結構20之第一側20a與第二側20b之應力分佈,以防止該覆晶封裝基板4翹曲。
本發明之製法係藉由將該絕緣層22,23分別設於該核心層21之相對兩側而形成該複合強化型核心結構20,以增加該覆晶封裝基板2a,2b,3,4之剛性強度,故相較於習知技術,當本發明之覆晶封裝基板2a,2b,3,4應用於半導體之高集積/大尺寸封裝製程時,其良好的剛性特質,因而能確保本發明之薄型化且於封裝高溫製程時又不會發生板翹,進而能避免其與半導體晶片或電路板之間發生連接不良之問題。
因此,利用該複合強化型核心結構20之設計以提高該覆晶封裝基板2a,2b,3,4之剛性,因而可避免半導體封裝製程之板翹問題,故相較於習知技術,本發明之製法更利於該覆晶封裝基板2a,2b,3,4朝薄化設計。
再者,由於該覆晶封裝基板2a,2b,3,4之剛性強度夠強,因而無需增厚該核心結構20,故該導電結構24之端面24a,24b可依需求朝微小化設計,因而能增加其上方線路結構26a,26b之線路佈線面積,進而能增加該電性接觸墊262,263之數量。
本發明復提供一種覆晶封裝基板2a,2b,3,4,係包括:一核心結構20、複數導電結構24以及複數線路結構26a,26b。
所述之核心結構20係具有相對之第一側20a與第二側20b,其中,該核心結構20係包含一核心層21及分別接觸結合於該核心層21相對兩側之絕緣層22,23,且形成該核心層21之材質係不同於形成該絕緣層22,23之材質。
所述之導電結構24係貫通該核心層21與該絕緣層22,23,且各該導電結構24係外露於該核心結構20之第一側20a與第二側20b。
所述之線路結構26a,26b係以雙邊增層線路型式形成於該核心結構20之第一側20a及第二側20b上且電性連接該導電結構24。
於一實施例中,該核心層20係由絕緣材所形成者,如不包含玻纖布之有機樹脂、含有填充材(如SiO2或玻纖粉等)之有機樹脂、或絕緣之無機材(如絕緣氧化物、氮化物、鋁化物或陶瓷類等)。
於一實施例中,該導電結構24,54a,5e~5h係由單一柱體構成。
於一實施例中,該導電結構24’,54b~54d係由複數柱體240,540接續堆疊而形成,且彼此接續堆疊之該複數柱體240,540之端面尺寸係相同或不相同。
於一實施例中,所述之覆晶封裝基板3,4復包括一設於該線路結構26a,26b上之強化結構3a,4a。例如,該強化結構3a係包含剛性部33,其為導電材或絕緣材所形成者,且該強化結構更包含包覆該剛性部33之絕緣部35,其用以結合於該線路結構26b上。或者,該強化結構4a係
為框體。
綜上所述,本發明之覆晶封裝基板及其製法,係藉由複合強化型核心結構之設計,以增加該覆晶封裝基板之剛性強度,故當本發明之覆晶封裝基板應用於高集積/大尺寸半導體封裝製程時,可避免封裝件發生板翹之問題。
因此,茲將本發明上述特徵所產生之功效說明如下:
第一、因本發明之覆晶封裝基板2a,2b,3,4具有強化的高剛性核心結構20的支撐作用,促使該覆晶封裝基板2a,2b,3,4於進行電子封裝件9,9’,9”之高集積/大尺寸封裝作業時,即使是各層間材料之熱膨脹係數(Coefficient of thermal expansion,簡稱CTE)不一致,亦不會因而發生彎翹(warpage)、或與電子元件90(習知半導體晶片19)間之連接不良(如導電元件28或焊錫材料未接合)、或與電路板間之連接不良(如導電元件29或焊錫材料未接合)、或因為熱應力關係而造成該電子元件90(習知半導體晶片19)本身之破裂或電性失效者。
第二、因本發明之覆晶封裝基板2a,2b,3,4具有強化的高剛性核心結構20的支撐作用,促使該覆晶封裝基板2a,2b,3,4及藉其完成之電子封裝件9,9’,9”可以進行高集積/大尺寸之封裝作業及朝薄型化設計。
第三、因本發明之核心結構20能維持薄型化設計,故本發明之導電結構24之端面24a,24b可依需求朝微小化設計,因而達到該導電結構24細間距化之目的。
第四、因本發明之導電結構24能細間距化設計,故能降低該線路結構26a,26b之線路佈線限制,進而易於製作高密度之線路配置。
第五、因本發明之核心結構20能維持薄型化設計,故不會增加該導電結構24的高度,因而能降低導電阻值,進而提昇電性功效。
第六、因本發明之核心結構20能維持薄型化設計,故能大幅降低該核心結構20內之通孔200的加工難度與成本。
第七、因本發明之覆晶封裝基板2a,2b,3,4具有強化的高剛性核心結構20的支撐作用,促使該覆晶封裝基板2a,2b,3,4及藉其完成之電子封裝件9,9’,9”可以朝薄型化設計,所以可有效提升該電子封裝件9,9’,9”的散熱性,因而能能確保應用端的效能穩定性。
另一方面,本發明之覆晶封裝基板3,4進一步藉由將該強化結構3a設於該核心結構20之第二側20b之線路結構26b上,以增加該覆晶封裝基板3,4之剛性強度,故相較於習知技術,當該覆晶封裝基板3,4用於大封裝尺寸時,即使薄化該覆晶封裝基板3,4,該覆晶封裝基板3,4仍具有高的剛性,因而於後續封裝高溫製程時或於產品使用時,能避免該電子封裝件9,9’,9”發生彎翹,進而能避免其與電子元件90或電路板之間發生連接不良之問題。
再者,由於該覆晶封裝基板3,4用於大封裝尺寸(如55*55、70*70、80*80mm2等)時,該線路結構26a,26b之層數可依需求設計,故該線路結構26a,26b可能產生各種程度之翹曲變化,因而可藉由該強化結構3a之厚度t(如第3B圖所示)或利用該強化結構3a之及構成材質,以控制該覆晶封裝基板3,4之剛性,因而無需增加該核心結構20的厚度,甚至可降低該核心結構20之厚度,即能避免該覆晶封裝基板3,4彎翹之問題。藉此,該導電結構24之端面24a,24b可依需求朝微小化設計,因而能
降低該線路層261之線路佈線限制,進而易於製作細線路及細間距之線路層261,達到高密度封裝之功效。
又,因無需增加該核心結構20的厚度,甚至能降低該核心結構20之厚度,該導電結構24採用金屬導電柱可降低導電阻值,以提升電性,進而可提供良好之散熱。
另外,因該核心結構20得以變薄,故該導電結構24之加工難度降低,因而電子封裝件9’,9”及其覆晶封裝基板3,4之整體製作成本可大幅降低。
因此,茲將本發明因該強化結構3a特徵而產生之功效說明如下:
第一、因本發明之覆晶封裝基板3,4具有高剛性強化結構3a的支撐作用,促使該覆晶封裝基板3,4及藉其完成之電子封裝件9’,9”可以進行大尺寸之封裝作業及朝薄型化設計。
第二、因本發明之核心結構20能維持薄型化設計,故不會增加該導電結構24之直徑與該核心結構20之厚度二者間的縱深比,因而易於填塞該通孔200或電鍍該導電結構24,以有效均勻填入材質,故能大幅降低該導電結構24的加工難度與成本。
第三、因本發明之核心結構20能維持薄型化設計,故不會增加該導電結構24的高度,因而能降低導電阻值,進而提昇電性功效。
第四、因本發明之強化結構3a的厚剛性部33及薄核心結構20的特徵,可有效提升該電子封裝件9’,9”的散熱性,因而能配合封裝過程的高溫而不會翹曲變形,亦能確保應用端於運作發熱時的效能穩定性。
進一步,該強化結構3a為金屬材時,更可以提供良好的電性接地功能,降低使用中之雜訊。
上述實施例係用以例示性說明本發明之原理及其功效,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修改。因此本發明之權利保護範圍,應如後述之申請專利範圍所列。
2a‧‧‧覆晶封裝基板
20‧‧‧核心結構
20a‧‧‧第一側
20b‧‧‧第二側
21‧‧‧核心層
22,23‧‧‧絕緣層
24‧‧‧導電結構
26a,26b‧‧‧線路結構
260‧‧‧介電層
261‧‧‧線路層
262,263‧‧‧電性接觸墊
Claims (4)
- 一種覆晶封裝基板,係包括:核心結構,係具有相對之第一側與第二側,並包含一核心層及分別結合於該核心層相對兩側之絕緣層,且形成該核心層之材質係不同於形成該絕緣層之絕緣材質,其中,該核心層係由含玻纖之高剛性硬度的BT(Bismaleimide Triazine)或FR-5之絕緣材所形成者;複數導電結構,係呈實心柱體狀並貫通該核心層與該絕緣層,且各該導電結構係外露於該核心結構之第一側與第二側;線路結構,係以雙邊增層線路型式形成於該核心結構之第一側及第二側上且電性連接該導電結構;以及強化結構,係設於該核心結構之第一側及/或第二側上之線路結構上,其中,該強化結構係包含剛性部、及將該剛性部結合於該線路結構上之絕緣部。
- 如申請專利範圍第1項所述之覆晶封裝基板,其中,該核心結構之絕緣層係由環氧模壓樹脂或ABF(Ajinomoto Build-up Film)之具有高剛性硬度之介電材所形成者。
- 一種覆晶封裝基板之製法,係包括:提供一核心層,其係由含玻纖之高剛性硬度的BT(Bismaleimide Triazine)或FR-5之絕緣材所形成者;於該核心層之相對兩側上分別結合一絕緣層,以令該核心層與絕緣層作為核心結構,且該核心結構係具有相對之第一側與第二側,其中,形成該核心層之材質係不同於形成該絕緣層之材質; 形成複數呈實心柱體狀之導電結構於該核心結構中,使該導電結構貫通該核心層與該絕緣層,且各該導電結構係外露於該核心結構之第一側與第二側;以雙邊增層線路型式形成線路結構於該核心結構之第一側及第二側上,且令該線路結構電性連接該導電結構;以及形成強化結構於該核心結構之第一側及/或第二側上之線路結構上,其中,該強化結構係包含剛性部、及將該剛性部結合於該線路結構上之絕緣部。
- 如申請專利範圍第3項所述之覆晶封裝基板之製法,其中,該核心結構之絕緣層係由環氧模壓樹脂或ABF(Ajinomoto Build-up Film)之具有高剛性硬度之介電材所形成者。
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TW200620598A (en) * | 2004-12-10 | 2006-06-16 | Phoenix Prec Technology Corp | Flip-chip package structure with embedded chip in substrate |
TW201418339A (zh) * | 2012-08-01 | 2014-05-16 | Sumitomo Bakelite Co | 樹脂基板,預浸體,印刷佈線基板及半導體裝置 |
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