TWI458804B - 黏著片 - Google Patents

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Publication number
TWI458804B
TWI458804B TW100121041A TW100121041A TWI458804B TW I458804 B TWI458804 B TW I458804B TW 100121041 A TW100121041 A TW 100121041A TW 100121041 A TW100121041 A TW 100121041A TW I458804 B TWI458804 B TW I458804B
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TW
Taiwan
Prior art keywords
adhesive
adhesive layer
film
sheet
die
Prior art date
Application number
TW100121041A
Other languages
English (en)
Chinese (zh)
Other versions
TW201200576A (en
Inventor
Yuuki Nakamura
Masanobu Miyahara
Youji Katayama
Tsuyoshi Tamaki
Keiichi Hatakeyama
Takuji Ikeya
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW201200576A publication Critical patent/TW201200576A/zh
Application granted granted Critical
Publication of TWI458804B publication Critical patent/TWI458804B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • H01L2924/102—Material of the semiconductor or solid state bodies
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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
  • Adhesive Tapes (AREA)
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TW100121041A 2010-06-18 2011-06-16 黏著片 TWI458804B (zh)

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JP5947313B2 (ja) * 2011-12-02 2016-07-06 デンカ株式会社 粘着シート及び粘着シートを用いた電子部品の製造方法
JP5950838B2 (ja) * 2012-03-07 2016-07-13 古河電気工業株式会社 粘着テープ
CN103305142B (zh) * 2012-03-07 2016-01-20 古河电气工业株式会社 粘接带
KR20140142026A (ko) * 2013-06-03 2014-12-11 삼성디스플레이 주식회사 기판 합착용 하부 필름, 기판 밀봉체 및 이들을 이용한 유기 발광 표시 장치의 제조 방법
CN105452408B (zh) * 2013-09-30 2019-03-19 琳得科株式会社 树脂膜形成用复合片
CN105899631A (zh) * 2014-01-08 2016-08-24 琳得科株式会社 保护膜形成用复合片
WO2017038466A1 (ja) * 2015-09-02 2017-03-09 株式会社アルバック ワーク保持体および成膜装置
US20180085734A1 (en) * 2016-09-23 2018-03-29 Daicel Corporation Separating agent for optical isomers

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TW200530361A (en) * 2003-12-15 2005-09-16 Furukawa Electric Co Ltd Wafer-processing tape and method of producing the same
TW200627536A (en) * 2004-06-08 2006-08-01 Hitachi Chemical Co Ltd Adhesive sheet, method for producing the sheet, method for producing semiconductor device, and the semiconductor device
TW200933723A (en) * 2007-12-17 2009-08-01 Denki Kagaku Kogyo Kk Dicing sheet, manufacturing process thereof and process for manufacturing electronic element

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JP2005203749A (ja) * 2003-12-15 2005-07-28 Furukawa Electric Co Ltd:The ウェハ加工用テープおよびその製造方法
JP2010219086A (ja) * 2009-03-13 2010-09-30 Furukawa Electric Co Ltd:The ウエハ加工用フィルム及びウエハ加工用フィルムを用いて半導体装置を製造する方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200530361A (en) * 2003-12-15 2005-09-16 Furukawa Electric Co Ltd Wafer-processing tape and method of producing the same
TW200627536A (en) * 2004-06-08 2006-08-01 Hitachi Chemical Co Ltd Adhesive sheet, method for producing the sheet, method for producing semiconductor device, and the semiconductor device
TW200933723A (en) * 2007-12-17 2009-08-01 Denki Kagaku Kogyo Kk Dicing sheet, manufacturing process thereof and process for manufacturing electronic element

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