TWI455988B - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
TWI455988B
TWI455988B TW096138028A TW96138028A TWI455988B TW I455988 B TWI455988 B TW I455988B TW 096138028 A TW096138028 A TW 096138028A TW 96138028 A TW96138028 A TW 96138028A TW I455988 B TWI455988 B TW I455988B
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TW
Taiwan
Prior art keywords
resin
resin composition
mass
resins
content
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TW096138028A
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English (en)
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TW200831600A (en
Inventor
Shigeo Nakamura
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Ajinomoto Kk
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Publication of TW200831600A publication Critical patent/TW200831600A/zh
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Publication of TWI455988B publication Critical patent/TWI455988B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2471/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Reinforced Plastic Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Claims (13)

  1. 一種樹脂組成物，其特徵為含有氰酸酯樹脂及下式(1)所示之萘酚型環氧樹脂， (n作為平均值表示1~6之數，X表示環氧丙基或碳數1~8之烴基，烴基/環氧丙基之比例為0.05~2.0)。
  2. 如申請專利範圍第1項之樹脂組成物，其中氰酸酯樹脂之含有量相對於樹脂組成物(不揮發份100質量%)為5~60質量%。
  3. 如申請專利範圍第1或2項之樹脂組成物，其中式(1)所示之萘酚型環氧樹脂之含有量相對於樹脂組成物(不揮發份100質量%)為1~50質量%。
  4. 如申請專利範圍第1或2項之樹脂組成物，其中更含有苯氧樹脂、聚醯亞胺樹脂、聚醯胺醯亞胺樹脂、聚醚醯亞胺樹脂、聚碸樹脂、聚醚碸樹脂、聚苯醚樹脂、聚碳酸酯樹脂、聚醚醚酮樹脂、聚酯樹脂所選出之1種以上的高分子樹脂。
  5. 如申請專利範圍第4項之樹脂組成物，其中高分子樹脂之含有量相對於樹脂組成物(不揮發份100質量%)為1~60質量%。
  6. 如申請專利範圍第4項之樹脂組成物，其中高分子樹脂之重量平均分子量為5000~200000。
  7. 如申請專利範圍第4項之樹脂組成物，其中高分子樹脂為苯氧樹脂。
  8. 如申請專利範圍第1或2項之樹脂組成物，其中更含有無機填充材料。
  9. 如申請專利範圍第8項之樹脂組成物，其中無機填充材料之含有量相對於樹脂組成物(不揮發份100質量%)為50質量%以下。
  10. 如申請專利範圍第8項之樹脂組成物，其中無機填充材料為二氧化矽。
  11. 一種黏著薄膜，其係如申請專利範圍第1至10項中任一項之樹脂組成物層形成於支持薄膜上所構成。
  12. 一種預浸物，其係如申請專利範圍第1至10項中任一項之樹脂組成物浸漬於由纖維所成之片狀補強基材中而成。
  13. 一種多層印刷電路板，其係藉由申請專利範圍第1至10項中任一項之樹脂組成物之硬化物形成絕緣層而成。
TW096138028A 2006-10-13 2007-10-11 樹脂組成物 TWI455988B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006279739 2006-10-13

Publications (2)

Publication Number Publication Date
TW200831600A TW200831600A (en) 2008-08-01
TWI455988B true TWI455988B (zh) 2014-10-11

Family

ID=39282953

Family Applications (1)

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TW096138028A TWI455988B (zh) 2006-10-13 2007-10-11 樹脂組成物

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JP (1) JP5298852B2 (zh)
KR (1) KR101464140B1 (zh)
TW (1) TWI455988B (zh)
WO (1) WO2008044766A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008153208A1 (ja) * 2007-06-14 2008-12-18 Ajinomoto Co., Inc. 多層プリント配線板の層間絶縁用樹脂組成物
JP5245526B2 (ja) * 2008-05-09 2013-07-24 日立化成株式会社 絶縁樹脂組成物、及び支持体付絶縁フィルム
JP5276389B2 (ja) * 2008-09-05 2013-08-28 パナソニック株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板
JP5651941B2 (ja) * 2008-10-07 2015-01-14 味の素株式会社 エポキシ樹脂組成物
TWI486372B (zh) * 2008-11-28 2015-06-01 Ajinomoto Kk Resin composition
WO2010082658A1 (ja) * 2009-01-19 2010-07-22 味の素株式会社 樹脂組成物
TWI477549B (zh) * 2009-02-06 2015-03-21 Ajinomoto Kk Resin composition
TWI565750B (zh) 2009-02-20 2017-01-11 Ajinomoto Kk Resin composition
JP5482002B2 (ja) * 2009-08-03 2014-04-23 味の素株式会社 樹脂組成物
TWI540170B (zh) 2009-12-14 2016-07-01 Ajinomoto Kk Resin composition
KR101763975B1 (ko) * 2010-05-07 2017-08-01 스미토모 베이클리트 컴퍼니 리미티드 회로 기판용 에폭시 수지 조성물, 프리프레그, 적층판, 수지 시트, 프린트 배선판용 적층기재, 프린트 배선판, 및 반도체 장치
JP2012153752A (ja) * 2011-01-24 2012-08-16 Sumitomo Bakelite Co Ltd 樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置
DK2770005T3 (da) * 2011-10-18 2019-08-05 Guangdong Shengyi Sci Tech Co Epoxyharpikssammensætning og substrat af et elektronisk højfrekvenskredsløb fremstillet ved anvendelse heraf
JP7357431B2 (ja) * 2017-09-20 2023-10-06 横浜ゴム株式会社 繊維強化複合材料用シアネートエステル樹脂組成物、プリプレグおよび繊維強化複合材料
WO2019216247A1 (ja) * 2018-05-09 2019-11-14 日立化成株式会社 支持体付き層間絶縁層用樹脂フィルム、多層プリント配線板及び多層プリント配線板の製造方法
TWI798734B (zh) * 2021-06-30 2023-04-11 南亞塑膠工業股份有限公司 熱固性樹脂材料、預浸片及金屬基板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003246842A (ja) * 2001-12-21 2003-09-05 Sumitomo Bakelite Co Ltd 硬化樹脂組成物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002050661A (ja) * 2000-08-07 2002-02-15 Toray Ind Inc 半導体装置用接着剤シート及びそれを用いた半導体装置
JP2003212970A (ja) * 2002-01-28 2003-07-30 Sumitomo Bakelite Co Ltd 硬化樹脂組成物
AU2003241778A1 (en) * 2002-05-27 2003-12-12 Ajinomoto Co., Inc. Adhesive film and prepreg
JP5011641B2 (ja) * 2004-01-28 2012-08-29 味の素株式会社 熱硬化性樹脂組成物、それを用いた接着フィルム及び多層プリント配線板
JP4465257B2 (ja) * 2004-12-07 2010-05-19 新日鐵化学株式会社 ナフトール樹脂、エポキシ樹脂、それらの製造法、それらを用いたエポキシ樹脂組成物及びその硬化物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003246842A (ja) * 2001-12-21 2003-09-05 Sumitomo Bakelite Co Ltd 硬化樹脂組成物

Also Published As

Publication number Publication date
KR20090079233A (ko) 2009-07-21
JP5298852B2 (ja) 2013-09-25
WO2008044766A1 (fr) 2008-04-17
TW200831600A (en) 2008-08-01
KR101464140B1 (ko) 2014-11-21
JPWO2008044766A1 (ja) 2010-02-18

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