TWI455988B - Resin composition - Google Patents

Resin composition Download PDF

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Publication number
TWI455988B
TWI455988B TW096138028A TW96138028A TWI455988B TW I455988 B TWI455988 B TW I455988B TW 096138028 A TW096138028 A TW 096138028A TW 96138028 A TW96138028 A TW 96138028A TW I455988 B TWI455988 B TW I455988B
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TW
Taiwan
Prior art keywords
resin
resin composition
mass
resins
content
Prior art date
Application number
TW096138028A
Other languages
Chinese (zh)
Other versions
TW200831600A (en
Inventor
Shigeo Nakamura
Original Assignee
Ajinomoto Kk
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Publication date
Application filed by Ajinomoto Kk filed Critical Ajinomoto Kk
Publication of TW200831600A publication Critical patent/TW200831600A/en
Application granted granted Critical
Publication of TWI455988B publication Critical patent/TWI455988B/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2471/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Adhesive Tapes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Claims (13)

一種樹脂組成物，其特徵為含有氰酸酯樹脂及下式(1)所示之萘酚型環氧樹脂， (n作為平均值表示1~6之數，X表示環氧丙基或碳數1~8之烴基，烴基/環氧丙基之比例為0.05~2.0)。A resin composition comprising a cyanate resin and a naphthol type epoxy resin represented by the following formula (1), (n represents an average value of 1 to 6, and X represents an epoxy group or a hydrocarbon group having 1 to 8 carbon atoms, and the ratio of the hydrocarbon group to the epoxy group is 0.05 to 2.0). 如申請專利範圍第1項之樹脂組成物，其中氰酸酯樹脂之含有量相對於樹脂組成物(不揮發份100質量%)為5~60質量%。 The resin composition of the first aspect of the invention, wherein the content of the cyanate resin is from 5 to 60% by mass based on the resin composition (100% by mass of the nonvolatile matter). 如申請專利範圍第1或2項之樹脂組成物，其中式(1)所示之萘酚型環氧樹脂之含有量相對於樹脂組成物(不揮發份100質量%)為1~50質量%。 The resin composition of the first or second aspect of the invention, wherein the content of the naphthol type epoxy resin represented by the formula (1) is 1 to 50% by mass based on the resin composition (100% by mass of the nonvolatile matter). . 如申請專利範圍第1或2項之樹脂組成物，其中更含有苯氧樹脂、聚醯亞胺樹脂、聚醯胺醯亞胺樹脂、聚醚醯亞胺樹脂、聚碸樹脂、聚醚碸樹脂、聚苯醚樹脂、聚碳酸酯樹脂、聚醚醚酮樹脂、聚酯樹脂所選出之1種以上的高分子樹脂。 The resin composition of claim 1 or 2, which further comprises a phenoxy resin, a polyamidene resin, a polyamidoximine resin, a polyether phthalimide resin, a polyfluorene resin, a polyether oxime resin. One or more polymer resins selected from polyphenylene ether resins, polycarbonate resins, polyether ether ketone resins, and polyester resins. 如申請專利範圍第4項之樹脂組成物，其中高分子樹脂之含有量相對於樹脂組成物(不揮發份100質量%)為1~60質量%。 The resin composition of the fourth aspect of the invention, wherein the content of the polymer resin is from 1 to 60% by mass based on the resin composition (100% by mass of the nonvolatile matter). 如申請專利範圍第4項之樹脂組成物，其中高分子樹脂之重量平均分子量為5000~200000。 The resin composition of claim 4, wherein the weight average molecular weight of the polymer resin is from 5,000 to 200,000. 如申請專利範圍第4項之樹脂組成物，其中高分子樹脂為苯氧樹脂。 The resin composition of claim 4, wherein the polymer resin is a phenoxy resin. 如申請專利範圍第1或2項之樹脂組成物，其中更含有無機填充材料。 The resin composition of claim 1 or 2, further comprising an inorganic filler. 如申請專利範圍第8項之樹脂組成物，其中無機填充材料之含有量相對於樹脂組成物(不揮發份100質量%)為50質量%以下。 The resin composition of the eighth aspect of the invention, wherein the content of the inorganic filler is 50% by mass or less based on the resin composition (100% by mass of the nonvolatile matter). 如申請專利範圍第8項之樹脂組成物，其中無機填充材料為二氧化矽。 The resin composition of claim 8, wherein the inorganic filler is cerium oxide. 一種黏著薄膜，其係如申請專利範圍第1至10項中任一項之樹脂組成物層形成於支持薄膜上所構成。 An adhesive film formed by forming a resin composition layer according to any one of claims 1 to 10 on a support film. 一種預浸物，其係如申請專利範圍第1至10項中任一項之樹脂組成物浸漬於由纖維所成之片狀補強基材中而成。 A prepreg obtained by immersing a resin composition according to any one of claims 1 to 10 in a sheet-like reinforcing substrate made of fibers. 一種多層印刷電路板，其係藉由申請專利範圍第1至10項中任一項之樹脂組成物之硬化物形成絕緣層而成。A multilayer printed circuit board formed by forming a heat-insulating layer of a resin composition according to any one of claims 1 to 10.
TW096138028A 2006-10-13 2007-10-11 Resin composition TWI455988B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006279739 2006-10-13

Publications (2)

Publication Number Publication Date
TW200831600A TW200831600A (en) 2008-08-01
TWI455988B true TWI455988B (en) 2014-10-11

Family

ID=39282953

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096138028A TWI455988B (en) 2006-10-13 2007-10-11 Resin composition

Country Status (4)

Country Link
JP (1) JP5298852B2 (en)
KR (1) KR101464140B1 (en)
TW (1) TWI455988B (en)
WO (1) WO2008044766A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008153208A1 (en) * 2007-06-14 2008-12-18 Ajinomoto Co., Inc. Resin composition for interlayer insulation of multilayer printed wiring board
JP5245526B2 (en) * 2008-05-09 2013-07-24 日立化成株式会社 Insulating resin composition and insulating film with support
JP5276389B2 (en) * 2008-09-05 2013-08-28 パナソニック株式会社 Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed wiring board
JP5651941B2 (en) * 2008-10-07 2015-01-14 味の素株式会社 Epoxy resin composition
TWI621638B (en) * 2008-11-28 2018-04-21 味之素股份有限公司 Resin composition
JP5636962B2 (en) * 2009-01-19 2014-12-10 味の素株式会社 Resin composition
TWI477549B (en) * 2009-02-06 2015-03-21 Ajinomoto Kk Resin composition
TWI565750B (en) 2009-02-20 2017-01-11 Ajinomoto Kk Resin composition
JP5482002B2 (en) * 2009-08-03 2014-04-23 味の素株式会社 Resin composition
TWI540170B (en) 2009-12-14 2016-07-01 Ajinomoto Kk Resin composition
CN102884131A (en) * 2010-05-07 2013-01-16 住友电木株式会社 Epoxy resin composition for circuit boards, prepreg, laminate, resin sheet, laminate for printed wiring boards, printed wiring boards, and semiconductor devices
JP2012153752A (en) * 2011-01-24 2012-08-16 Sumitomo Bakelite Co Ltd Resin composition, prepreg, laminate, resin sheet, printed wiring board and semiconductor device
ES2740952T3 (en) * 2011-10-18 2020-02-07 Guangdong Shengyi Sci Tech Co Composition of epoxy resin and high frequency electronic circuit substrate manufactured using the same
JP7357431B2 (en) * 2017-09-20 2023-10-06 横浜ゴム株式会社 Cyanate ester resin composition for fiber reinforced composite materials, prepreg and fiber reinforced composite materials
JP7484711B2 (en) * 2018-05-09 2024-05-16 株式会社レゾナック Support-attached resin film for interlayer insulating layer, multilayer printed wiring board, and method for producing multilayer printed wiring board
TWI798734B (en) * 2021-06-30 2023-04-11 南亞塑膠工業股份有限公司 Thermosetting resin material, prepreg, and metal substrate

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2003246842A (en) * 2001-12-21 2003-09-05 Sumitomo Bakelite Co Ltd Curable resin composition

Family Cites Families (5)

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JP2002050661A (en) * 2000-08-07 2002-02-15 Toray Ind Inc Adhesive sheet for semiconductor device, and semiconductor device using the same
JP2003212970A (en) * 2002-01-28 2003-07-30 Sumitomo Bakelite Co Ltd Curable resin composition
JPWO2003099952A1 (en) * 2002-05-27 2005-10-20 味の素株式会社 Adhesive film and prepreg
JP5011641B2 (en) * 2004-01-28 2012-08-29 味の素株式会社 Thermosetting resin composition, adhesive film using the same, and multilayer printed wiring board
JP4465257B2 (en) * 2004-12-07 2010-05-19 新日鐵化学株式会社 Naphthol resin, epoxy resin, production method thereof, epoxy resin composition using the same, and cured product thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003246842A (en) * 2001-12-21 2003-09-05 Sumitomo Bakelite Co Ltd Curable resin composition

Also Published As

Publication number Publication date
JP5298852B2 (en) 2013-09-25
KR20090079233A (en) 2009-07-21
JPWO2008044766A1 (en) 2010-02-18
WO2008044766A1 (en) 2008-04-17
TW200831600A (en) 2008-08-01
KR101464140B1 (en) 2014-11-21

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