TWI443884B - 壓電振動片、具有壓電振動片的壓電裝置及壓電裝置的製造方法 - Google Patents
壓電振動片、具有壓電振動片的壓電裝置及壓電裝置的製造方法 Download PDFInfo
- Publication number
- TWI443884B TWI443884B TW101112584A TW101112584A TWI443884B TW I443884 B TWI443884 B TW I443884B TW 101112584 A TW101112584 A TW 101112584A TW 101112584 A TW101112584 A TW 101112584A TW I443884 B TWI443884 B TW I443884B
- Authority
- TW
- Taiwan
- Prior art keywords
- electrode
- vibrating
- piezoelectric
- thickness
- outer frame
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 238000000034 method Methods 0.000 title claims description 6
- 230000005284 excitation Effects 0.000 claims description 68
- 238000005530 etching Methods 0.000 claims description 9
- 238000010884 ion-beam technique Methods 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 239000013078 crystal Substances 0.000 description 87
- 239000011521 glass Substances 0.000 description 23
- 238000002844 melting Methods 0.000 description 16
- 239000010931 gold Substances 0.000 description 10
- 238000005520 cutting process Methods 0.000 description 9
- 239000011651 chromium Substances 0.000 description 8
- 230000006866 deterioration Effects 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 6
- 229910052804 chromium Inorganic materials 0.000 description 6
- 235000014676 Phragmites communis Nutrition 0.000 description 5
- 229910052720 vanadium Inorganic materials 0.000 description 4
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 4
- 244000273256 Phragmites communis Species 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/177—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of the energy-trap type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011103366A JP5773418B2 (ja) | 2011-05-06 | 2011-05-06 | 圧電振動片、圧電振動片を有する圧電デバイス及び圧電デバイスの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201246638A TW201246638A (en) | 2012-11-16 |
| TWI443884B true TWI443884B (zh) | 2014-07-01 |
Family
ID=47089799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101112584A TWI443884B (zh) | 2011-05-06 | 2012-04-10 | 壓電振動片、具有壓電振動片的壓電裝置及壓電裝置的製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8742651B2 (enExample) |
| JP (1) | JP5773418B2 (enExample) |
| CN (1) | CN102769443B (enExample) |
| TW (1) | TWI443884B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI679844B (zh) * | 2018-03-13 | 2019-12-11 | 日商大真空股份有限公司 | 壓電振動器件 |
| TWI759245B (zh) * | 2021-08-31 | 2022-03-21 | 國立陽明交通大學 | 晶體振盪器及其製作方法 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013258519A (ja) * | 2012-06-12 | 2013-12-26 | Nippon Dempa Kogyo Co Ltd | 圧電振動片及び圧電デバイス |
| JP6275526B2 (ja) * | 2014-03-28 | 2018-02-07 | 京セラ株式会社 | 圧電振動子、圧電デバイス及び圧電振動子の製造方法 |
| JP5991452B2 (ja) * | 2014-04-24 | 2016-09-14 | 株式会社村田製作所 | 水晶振動装置及びその製造方法 |
| JP6268629B2 (ja) | 2015-10-08 | 2018-01-31 | 株式会社村田製作所 | 水晶振動素子、及びこの水晶振動素子を備える水晶振動子 |
| JP6807046B2 (ja) | 2016-09-08 | 2021-01-06 | 株式会社村田製作所 | 水晶振動素子及びその製造方法並びに水晶振動子及びその製造方法 |
| JP6791766B2 (ja) * | 2017-01-17 | 2020-11-25 | 日本電波工業株式会社 | 圧電振動片及び圧電デバイス |
| WO2020170937A1 (ja) * | 2019-02-22 | 2020-08-27 | 株式会社村田製作所 | 振動装置及びその製造方法 |
| CN110459671B (zh) * | 2019-08-21 | 2022-10-14 | 福建工程学院 | 一种柔性磁电耦合传感器及其制备方法 |
| JP6747562B2 (ja) * | 2019-08-29 | 2020-08-26 | 株式会社大真空 | 水晶ウエハ |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04196910A (ja) * | 1990-11-28 | 1992-07-16 | Seiko Epson Corp | 厚み辷り圧電振動子の周波数調整方法 |
| JP3937627B2 (ja) * | 1999-02-02 | 2007-06-27 | セイコーエプソン株式会社 | 水晶振動子及びその製造方法 |
| JP2002299982A (ja) | 2001-03-29 | 2002-10-11 | Kyocera Corp | 水晶発振器の製造方法 |
| JP2003152469A (ja) * | 2001-11-09 | 2003-05-23 | Matsushita Electric Ind Co Ltd | 差動増幅器 |
| JP2003198312A (ja) * | 2001-12-25 | 2003-07-11 | Seiko Epson Corp | 圧電デバイスとその製造方法、及び圧電デバイスを利用した携帯電話装置ならびに圧電デバイスを利用した電子機器 |
| JP4135631B2 (ja) * | 2003-12-24 | 2008-08-20 | 株式会社村田製作所 | 圧電共振子の周波数調整方法および周波数調整装置 |
| JP2006148758A (ja) * | 2004-11-24 | 2006-06-08 | Kyocera Kinseki Corp | 水晶振動子パッケージ |
| CN100474768C (zh) * | 2004-12-17 | 2009-04-01 | 精工爱普生株式会社 | 表面声波器件及其制造方法、ic卡、便携用电子设备 |
| JP4707021B2 (ja) * | 2005-08-22 | 2011-06-22 | セイコーエプソン株式会社 | 圧電デバイス |
| JP4690146B2 (ja) * | 2005-08-26 | 2011-06-01 | セイコーインスツル株式会社 | 水晶振動子、発振器及び電子機器 |
| JP2007096899A (ja) * | 2005-09-29 | 2007-04-12 | Seiko Epson Corp | 圧電振動片の製造方法、圧電振動片の接合構造、圧電デバイス |
| JP4552916B2 (ja) * | 2005-12-21 | 2010-09-29 | 株式会社大真空 | 圧電振動デバイス |
| JP4635917B2 (ja) * | 2006-03-09 | 2011-02-23 | 株式会社大真空 | 表面実装型圧電振動デバイス |
| JP2008160603A (ja) * | 2006-12-25 | 2008-07-10 | Epson Toyocom Corp | 圧電振動子の製造方法 |
| JP5088613B2 (ja) * | 2007-08-06 | 2012-12-05 | セイコーエプソン株式会社 | 振動デバイスの周波数調整方法、並びに振動デバイスおよび電子デバイス |
| JP4412506B2 (ja) * | 2007-09-07 | 2010-02-10 | エプソントヨコム株式会社 | 圧電デバイスおよびその製造方法 |
| JP5362643B2 (ja) * | 2009-06-30 | 2013-12-11 | 日本電波工業株式会社 | 積層型の水晶振動子 |
-
2011
- 2011-05-06 JP JP2011103366A patent/JP5773418B2/ja active Active
-
2012
- 2012-03-21 CN CN201210076519.9A patent/CN102769443B/zh not_active Expired - Fee Related
- 2012-04-10 TW TW101112584A patent/TWI443884B/zh not_active IP Right Cessation
- 2012-04-24 US US13/454,645 patent/US8742651B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI679844B (zh) * | 2018-03-13 | 2019-12-11 | 日商大真空股份有限公司 | 壓電振動器件 |
| TWI759245B (zh) * | 2021-08-31 | 2022-03-21 | 國立陽明交通大學 | 晶體振盪器及其製作方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102769443A (zh) | 2012-11-07 |
| TW201246638A (en) | 2012-11-16 |
| JP5773418B2 (ja) | 2015-09-02 |
| US20120280598A1 (en) | 2012-11-08 |
| JP2012235365A (ja) | 2012-11-29 |
| CN102769443B (zh) | 2015-07-01 |
| US8742651B2 (en) | 2014-06-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |