CN102769443B - 压电振动片、具有压电振动片的压电装置及压电装置的制造方法 - Google Patents

压电振动片、具有压电振动片的压电装置及压电装置的制造方法 Download PDF

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Publication number
CN102769443B
CN102769443B CN201210076519.9A CN201210076519A CN102769443B CN 102769443 B CN102769443 B CN 102769443B CN 201210076519 A CN201210076519 A CN 201210076519A CN 102769443 B CN102769443 B CN 102769443B
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CN
China
Prior art keywords
vibrating
electrode
piezoelectric
thickness
outer frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210076519.9A
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English (en)
Chinese (zh)
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CN102769443A (zh
Inventor
水泽周一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
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Publication of CN102769443A publication Critical patent/CN102769443A/zh
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Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/177—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of the energy-trap type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
CN201210076519.9A 2011-05-06 2012-03-21 压电振动片、具有压电振动片的压电装置及压电装置的制造方法 Expired - Fee Related CN102769443B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-103366 2011-05-06
JP2011103366A JP5773418B2 (ja) 2011-05-06 2011-05-06 圧電振動片、圧電振動片を有する圧電デバイス及び圧電デバイスの製造方法

Publications (2)

Publication Number Publication Date
CN102769443A CN102769443A (zh) 2012-11-07
CN102769443B true CN102769443B (zh) 2015-07-01

Family

ID=47089799

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210076519.9A Expired - Fee Related CN102769443B (zh) 2011-05-06 2012-03-21 压电振动片、具有压电振动片的压电装置及压电装置的制造方法

Country Status (4)

Country Link
US (1) US8742651B2 (enExample)
JP (1) JP5773418B2 (enExample)
CN (1) CN102769443B (enExample)
TW (1) TWI443884B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013258519A (ja) * 2012-06-12 2013-12-26 Nippon Dempa Kogyo Co Ltd 圧電振動片及び圧電デバイス
JP6275526B2 (ja) * 2014-03-28 2018-02-07 京セラ株式会社 圧電振動子、圧電デバイス及び圧電振動子の製造方法
JP5991452B2 (ja) * 2014-04-24 2016-09-14 株式会社村田製作所 水晶振動装置及びその製造方法
JP6268629B2 (ja) 2015-10-08 2018-01-31 株式会社村田製作所 水晶振動素子、及びこの水晶振動素子を備える水晶振動子
JP6807046B2 (ja) 2016-09-08 2021-01-06 株式会社村田製作所 水晶振動素子及びその製造方法並びに水晶振動子及びその製造方法
JP6791766B2 (ja) * 2017-01-17 2020-11-25 日本電波工業株式会社 圧電振動片及び圧電デバイス
CN111727563B (zh) * 2018-03-13 2024-02-06 株式会社大真空 压电振动器件
WO2020170937A1 (ja) * 2019-02-22 2020-08-27 株式会社村田製作所 振動装置及びその製造方法
CN110459671B (zh) * 2019-08-21 2022-10-14 福建工程学院 一种柔性磁电耦合传感器及其制备方法
JP6747562B2 (ja) * 2019-08-29 2020-08-26 株式会社大真空 水晶ウエハ
TWI759245B (zh) * 2021-08-31 2022-03-21 國立陽明交通大學 晶體振盪器及其製作方法

Citations (1)

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Publication number Priority date Publication date Assignee Title
CN1801615A (zh) * 2004-12-17 2006-07-12 精工爱普生株式会社 表面声波器件及其制造方法、ic卡、便携用电子设备

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JPH04196910A (ja) * 1990-11-28 1992-07-16 Seiko Epson Corp 厚み辷り圧電振動子の周波数調整方法
JP3937627B2 (ja) * 1999-02-02 2007-06-27 セイコーエプソン株式会社 水晶振動子及びその製造方法
JP2002299982A (ja) 2001-03-29 2002-10-11 Kyocera Corp 水晶発振器の製造方法
JP2003152469A (ja) * 2001-11-09 2003-05-23 Matsushita Electric Ind Co Ltd 差動増幅器
JP2003198312A (ja) * 2001-12-25 2003-07-11 Seiko Epson Corp 圧電デバイスとその製造方法、及び圧電デバイスを利用した携帯電話装置ならびに圧電デバイスを利用した電子機器
JP4135631B2 (ja) * 2003-12-24 2008-08-20 株式会社村田製作所 圧電共振子の周波数調整方法および周波数調整装置
JP2006148758A (ja) * 2004-11-24 2006-06-08 Kyocera Kinseki Corp 水晶振動子パッケージ
JP4707021B2 (ja) * 2005-08-22 2011-06-22 セイコーエプソン株式会社 圧電デバイス
JP4690146B2 (ja) * 2005-08-26 2011-06-01 セイコーインスツル株式会社 水晶振動子、発振器及び電子機器
JP2007096899A (ja) * 2005-09-29 2007-04-12 Seiko Epson Corp 圧電振動片の製造方法、圧電振動片の接合構造、圧電デバイス
JP4552916B2 (ja) * 2005-12-21 2010-09-29 株式会社大真空 圧電振動デバイス
JP4635917B2 (ja) * 2006-03-09 2011-02-23 株式会社大真空 表面実装型圧電振動デバイス
JP2008160603A (ja) * 2006-12-25 2008-07-10 Epson Toyocom Corp 圧電振動子の製造方法
JP5088613B2 (ja) * 2007-08-06 2012-12-05 セイコーエプソン株式会社 振動デバイスの周波数調整方法、並びに振動デバイスおよび電子デバイス
JP4412506B2 (ja) * 2007-09-07 2010-02-10 エプソントヨコム株式会社 圧電デバイスおよびその製造方法
JP5362643B2 (ja) * 2009-06-30 2013-12-11 日本電波工業株式会社 積層型の水晶振動子

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1801615A (zh) * 2004-12-17 2006-07-12 精工爱普生株式会社 表面声波器件及其制造方法、ic卡、便携用电子设备

Also Published As

Publication number Publication date
CN102769443A (zh) 2012-11-07
TWI443884B (zh) 2014-07-01
TW201246638A (en) 2012-11-16
JP5773418B2 (ja) 2015-09-02
US20120280598A1 (en) 2012-11-08
JP2012235365A (ja) 2012-11-29
US8742651B2 (en) 2014-06-03

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