TWI403848B - 感光性樹脂組成物 - Google Patents
感光性樹脂組成物 Download PDFInfo
- Publication number
- TWI403848B TWI403848B TW095139318A TW95139318A TWI403848B TW I403848 B TWI403848 B TW I403848B TW 095139318 A TW095139318 A TW 095139318A TW 95139318 A TW95139318 A TW 95139318A TW I403848 B TWI403848 B TW I403848B
- Authority
- TW
- Taiwan
- Prior art keywords
- acrylate
- weight
- parts
- methyl
- photosensitive resin
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 44
- 150000001875 compounds Chemical class 0.000 claims abstract description 42
- 229920006243 acrylic copolymer Polymers 0.000 claims abstract description 31
- 239000002904 solvent Substances 0.000 claims abstract description 16
- 239000000203 mixture Substances 0.000 claims abstract description 15
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 11
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims abstract description 10
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims abstract description 9
- -1 glycidyl α-n-propyl acrylate Chemical compound 0.000 claims description 50
- 239000000126 substance Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 19
- 239000003822 epoxy resin Substances 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- 150000001336 alkenes Chemical class 0.000 claims description 9
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 9
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- 238000007334 copolymerization reaction Methods 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 7
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000004094 surface-active agent Substances 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 5
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 claims description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 4
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- GDUZPNKSJOOIDA-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-methylprop-2-enoate Chemical compound C1C(OC(=O)C(=C)C)CCC2OC21 GDUZPNKSJOOIDA-UHFFFAOYSA-N 0.000 claims description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- SSLASPHAKUVIRG-UHFFFAOYSA-N (2-methylcyclohexyl) prop-2-enoate Chemical compound CC1CCCCC1OC(=O)C=C SSLASPHAKUVIRG-UHFFFAOYSA-N 0.000 claims description 2
- GCIHZDWTJCGMDK-UHFFFAOYSA-N (2-methylphenyl) prop-2-enoate Chemical compound CC1=CC=CC=C1OC(=O)C=C GCIHZDWTJCGMDK-UHFFFAOYSA-N 0.000 claims description 2
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 claims description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims description 2
- PTBAHIRKWPUZAM-UHFFFAOYSA-N 2-(oxiran-2-yl)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC1CO1 PTBAHIRKWPUZAM-UHFFFAOYSA-N 0.000 claims description 2
- CBKJLMZJKHOGEQ-UHFFFAOYSA-N 2-(oxiran-2-yl)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCC1CO1 CBKJLMZJKHOGEQ-UHFFFAOYSA-N 0.000 claims description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 claims description 2
- IDDIQQGVAJRFFC-UHFFFAOYSA-N C(=C)C1=C(COCCCOCCCOCC2=C(C=CC=C2)C=C)C=CC=C1 Chemical compound C(=C)C1=C(COCCCOCCCOCC2=C(C=CC=C2)C=C)C=CC=C1 IDDIQQGVAJRFFC-UHFFFAOYSA-N 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 150000008064 anhydrides Chemical class 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 claims description 2
- 229940018557 citraconic acid Drugs 0.000 claims description 2
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 2
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 claims description 2
- FKIRSCKRJJUCNI-UHFFFAOYSA-N ethyl 7-bromo-1h-indole-2-carboxylate Chemical compound C1=CC(Br)=C2NC(C(=O)OCC)=CC2=C1 FKIRSCKRJJUCNI-UHFFFAOYSA-N 0.000 claims description 2
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 claims description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims description 2
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 claims description 2
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 claims description 2
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 claims description 2
- RSVDRWTUCMTKBV-UHFFFAOYSA-N sbb057044 Chemical compound C12CC=CC2C2CC(OCCOC(=O)C=C)C1C2 RSVDRWTUCMTKBV-UHFFFAOYSA-N 0.000 claims description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims 2
- 239000000654 additive Substances 0.000 claims 2
- 230000000996 additive effect Effects 0.000 claims 2
- HPRNPSLJNKWKCO-UHFFFAOYSA-N 1-(oxiran-2-yl)propyl prop-2-enoate Chemical compound C=CC(=O)OC(CC)C1CO1 HPRNPSLJNKWKCO-UHFFFAOYSA-N 0.000 claims 1
- UYMYEYZXJXYFSG-UHFFFAOYSA-N C(=C)C=1C=C(COCCCOCCCOCC2=CC(=CC=C2)C=C)C=CC1 Chemical compound C(=C)C=1C=C(COCCCOCCCOCC2=CC(=CC=C2)C=C)C=CC1 UYMYEYZXJXYFSG-UHFFFAOYSA-N 0.000 claims 1
- JMVVEIBHUATRPH-UHFFFAOYSA-N C(C(=C)C)(=O)OCC.C(C=C)(=O)OCC1CO1 Chemical compound C(C(=C)C)(=O)OCC.C(C=C)(=O)OCC1CO1 JMVVEIBHUATRPH-UHFFFAOYSA-N 0.000 claims 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims 1
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 claims 1
- RKGVNLUAVXQJDL-UHFFFAOYSA-N benzene;prop-2-enoic acid Chemical compound OC(=O)C=C.C1=CC=CC=C1 RKGVNLUAVXQJDL-UHFFFAOYSA-N 0.000 claims 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims 1
- BOTLEXFFFSMRLQ-UHFFFAOYSA-N cyclopentyloxycyclopentane Chemical group C1CCCC1OC1CCCC1 BOTLEXFFFSMRLQ-UHFFFAOYSA-N 0.000 claims 1
- 239000001530 fumaric acid Substances 0.000 claims 1
- 229940119545 isobornyl methacrylate Drugs 0.000 claims 1
- ZLVXBBHTMQJRSX-VMGNSXQWSA-N jdtic Chemical class C1([C@]2(C)CCN(C[C@@H]2C)C[C@H](C(C)C)NC(=O)[C@@H]2NCC3=CC(O)=CC=C3C2)=CC=CC(O)=C1 ZLVXBBHTMQJRSX-VMGNSXQWSA-N 0.000 claims 1
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 claims 1
- 125000005395 methacrylic acid group Chemical group 0.000 claims 1
- 150000004702 methyl esters Chemical class 0.000 claims 1
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 claims 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 claims 1
- 230000035945 sensitivity Effects 0.000 abstract description 13
- 238000009413 insulation Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 30
- 239000000243 solution Substances 0.000 description 18
- 239000000178 monomer Substances 0.000 description 16
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000003513 alkali Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 150000005215 alkyl ethers Chemical class 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 229960003742 phenol Drugs 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 238000001291 vacuum drying Methods 0.000 description 3
- UAJRSHJHFRVGMG-UHFFFAOYSA-N 1-ethenyl-4-methoxybenzene Chemical compound COC1=CC=C(C=C)C=C1 UAJRSHJHFRVGMG-UHFFFAOYSA-N 0.000 description 2
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 2
- APFRUMUZEFOCFO-UHFFFAOYSA-N 1-methoxybutan-1-ol Chemical compound CCCC(O)OC APFRUMUZEFOCFO-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- SDJHPPZKZZWAKF-UHFFFAOYSA-N 2,3-dimethylbuta-1,3-diene Chemical compound CC(=C)C(C)=C SDJHPPZKZZWAKF-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- WXYSZTISEJBRHW-UHFFFAOYSA-N 4-[2-[4-[1,1-bis(4-hydroxyphenyl)ethyl]phenyl]propan-2-yl]phenol Chemical compound C=1C=C(C(C)(C=2C=CC(O)=CC=2)C=2C=CC(O)=CC=2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 WXYSZTISEJBRHW-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- 230000032050 esterification Effects 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000007348 radical reaction Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
- 239000012498 ultrapure water Substances 0.000 description 2
- DIBYQTLCOMYUAP-UHFFFAOYSA-N (2-hydroxy-4-methylphenyl)-(2,3,4-trihydroxyphenyl)methanone Chemical compound OC1=CC(C)=CC=C1C(=O)C1=CC=C(O)C(O)=C1O DIBYQTLCOMYUAP-UHFFFAOYSA-N 0.000 description 1
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- FVHMFMMVURPZFE-UHFFFAOYSA-N (4-hydroxy-3-methoxyphenyl)-(2,3,4-trihydroxyphenyl)methanone Chemical compound C1=C(O)C(OC)=CC(C(=O)C=2C(=C(O)C(O)=CC=2)O)=C1 FVHMFMMVURPZFE-UHFFFAOYSA-N 0.000 description 1
- MKPHQUIFIPKXJL-UHFFFAOYSA-N 1,2-dihydroxypropyl 2-methylprop-2-enoate Chemical compound CC(O)C(O)OC(=O)C(C)=C MKPHQUIFIPKXJL-UHFFFAOYSA-N 0.000 description 1
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- NCWSYEUMCNBLPU-UHFFFAOYSA-N 1-(oxiran-2-yl)propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(CC)C1CO1 NCWSYEUMCNBLPU-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- ZIKLJUUTSQYGQI-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxypropoxy)propane Chemical compound CCOCC(C)OCC(C)OCC ZIKLJUUTSQYGQI-UHFFFAOYSA-N 0.000 description 1
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- DOVZUKKPYKRVIK-UHFFFAOYSA-N 1-methoxypropan-2-yl propanoate Chemical compound CCC(=O)OC(C)COC DOVZUKKPYKRVIK-UHFFFAOYSA-N 0.000 description 1
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 1
- DMFAHCVITRDZQB-UHFFFAOYSA-N 1-propoxypropan-2-yl acetate Chemical compound CCCOCC(C)OC(C)=O DMFAHCVITRDZQB-UHFFFAOYSA-N 0.000 description 1
- RVNBCIQRFGXLRD-UHFFFAOYSA-N 1-propoxypropan-2-yl propanoate Chemical compound CCCOCC(C)OC(=O)CC RVNBCIQRFGXLRD-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2,2'-azo-bis-isobutyronitrile Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- XCOHPXRBLQWADM-UHFFFAOYSA-N 2,2-dicyclopentyloxyethyl 2-methylprop-2-enoate Chemical compound C1CCCC1OC(COC(=O)C(=C)C)OC1CCCC1 XCOHPXRBLQWADM-UHFFFAOYSA-N 0.000 description 1
- HTQNYBBTZSBWKL-UHFFFAOYSA-N 2,3,4-trihydroxbenzophenone Chemical compound OC1=C(O)C(O)=CC=C1C(=O)C1=CC=CC=C1 HTQNYBBTZSBWKL-UHFFFAOYSA-N 0.000 description 1
- CPEXFJVZFNYXGU-UHFFFAOYSA-N 2,4,6-trihydroxybenzophenone Chemical compound OC1=CC(O)=CC(O)=C1C(=O)C1=CC=CC=C1 CPEXFJVZFNYXGU-UHFFFAOYSA-N 0.000 description 1
- COXCGWKSEPPDAA-UHFFFAOYSA-N 2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)C#N COXCGWKSEPPDAA-UHFFFAOYSA-N 0.000 description 1
- AENKTGVTNQOOCL-UHFFFAOYSA-N 2,5-dimethyl-4-(3-phenylpropyl)phenol Chemical compound C1=C(O)C(C)=CC(CCCC=2C=CC=CC=2)=C1C AENKTGVTNQOOCL-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- VAHNPAMCADTGIO-UHFFFAOYSA-N 2-methoxyethyl propanoate Chemical compound CCC(=O)OCCOC VAHNPAMCADTGIO-UHFFFAOYSA-N 0.000 description 1
- FYZUENZXIZCLAZ-UHFFFAOYSA-N 2-methylhept-2-enoic acid Chemical group CCCCC=C(C)C(O)=O FYZUENZXIZCLAZ-UHFFFAOYSA-N 0.000 description 1
- FHBWGXDQIOWTCK-UHFFFAOYSA-N 2-methylpentanenitrile Chemical compound CCCC(C)C#N FHBWGXDQIOWTCK-UHFFFAOYSA-N 0.000 description 1
- NBLFJUWXERDUEN-UHFFFAOYSA-N 4-[(2,3,4-trihydroxyphenyl)methyl]benzene-1,2,3-triol Chemical compound OC1=C(O)C(O)=CC=C1CC1=CC=C(O)C(O)=C1O NBLFJUWXERDUEN-UHFFFAOYSA-N 0.000 description 1
- FNFYXIMJKWENNK-UHFFFAOYSA-N 4-[(2,4-dihydroxyphenyl)methyl]benzene-1,3-diol Chemical compound OC1=CC(O)=CC=C1CC1=CC=C(O)C=C1O FNFYXIMJKWENNK-UHFFFAOYSA-N 0.000 description 1
- YNICUQBUXHBYCH-UHFFFAOYSA-N 4-[(4-hydroxy-2,5-dimethylphenyl)-(2-hydroxyphenyl)methyl]-2,5-dimethylphenol Chemical compound C1=C(O)C(C)=CC(C(C=2C(=CC=CC=2)O)C=2C(=CC(O)=C(C)C=2)C)=C1C YNICUQBUXHBYCH-UHFFFAOYSA-N 0.000 description 1
- NYIWTDSCYULDTJ-UHFFFAOYSA-N 4-[2-(2,3,4-trihydroxyphenyl)propan-2-yl]benzene-1,2,3-triol Chemical compound C=1C=C(O)C(O)=C(O)C=1C(C)(C)C1=CC=C(O)C(O)=C1O NYIWTDSCYULDTJ-UHFFFAOYSA-N 0.000 description 1
- GBKMMNCWHMCICJ-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)-2-[4-[2-(4-hydroxyphenyl)propan-2-yl]phenyl]ethyl]phenol Chemical compound C=1C=C(C(CC=2C=CC(O)=CC=2)C=2C=CC(O)=CC=2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 GBKMMNCWHMCICJ-UHFFFAOYSA-N 0.000 description 1
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- RTANHMOFHGSZQO-UHFFFAOYSA-N 4-methoxy-2,4-dimethylpentanenitrile Chemical compound COC(C)(C)CC(C)C#N RTANHMOFHGSZQO-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 1
- HTEYEIWLZHYUBV-UHFFFAOYSA-N C(=C)C1=CC=C(COCCCOCCCOCC2=CC=C(C=C2)C=C)C=C1 Chemical compound C(=C)C1=CC=C(COCCCOCCCOCC2=CC=C(C=C2)C=C)C=C1 HTEYEIWLZHYUBV-UHFFFAOYSA-N 0.000 description 1
- DBJFSFSBHGPDPG-UHFFFAOYSA-N C(C(=C)C)(=O)OCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound C(C(=C)C)(=O)OCCCC(C(OC)(OC)OC)CCCCCCCC DBJFSFSBHGPDPG-UHFFFAOYSA-N 0.000 description 1
- LYJYWWZORFAFHH-UHFFFAOYSA-N C(C)(=O)OC(CCCCCCCCC)(OC(C)=O)OC(C)=O.C=C Chemical compound C(C)(=O)OC(CCCCCCCCC)(OC(C)=O)OC(C)=O.C=C LYJYWWZORFAFHH-UHFFFAOYSA-N 0.000 description 1
- XRNDMACZMJPCRX-UHFFFAOYSA-N C(CC)C(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound C(CC)C(C(OCC)(OCC)OCC)CCCCCCCC XRNDMACZMJPCRX-UHFFFAOYSA-N 0.000 description 1
- VPLKXGORNUYFBO-UHFFFAOYSA-N C1(CC2C(CC1)O2)CCC(C(OC)(OC)OC)CCCCCCCC Chemical compound C1(CC2C(CC1)O2)CCC(C(OC)(OC)OC)CCCCCCCC VPLKXGORNUYFBO-UHFFFAOYSA-N 0.000 description 1
- VSCVYVRTQIRCTN-UHFFFAOYSA-N COC(CCCCCCCCC)(OC)OC.C=C Chemical compound COC(CCCCCCCCC)(OC)OC.C=C VSCVYVRTQIRCTN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- QOSMNYMQXIVWKY-UHFFFAOYSA-N Propyl levulinate Chemical compound CCCOC(=O)CCC(C)=O QOSMNYMQXIVWKY-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- NWLVDYDONYELMC-UHFFFAOYSA-N anisole;ethene Chemical group C=C.COC1=CC=CC=C1 NWLVDYDONYELMC-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- VBWIZSYFQSOUFQ-UHFFFAOYSA-N cyclohexanecarbonitrile Chemical compound N#CC1CCCCC1 VBWIZSYFQSOUFQ-UHFFFAOYSA-N 0.000 description 1
- MAWOHFOSAIXURX-UHFFFAOYSA-N cyclopentylcyclopentane Chemical group C1CCCC1C1CCCC1 MAWOHFOSAIXURX-UHFFFAOYSA-N 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- JLEDZKABTFDMAQ-UHFFFAOYSA-N dicyclopentylmethyl 2-methylprop-2-enoate Chemical compound C1CCCC1C(OC(=O)C(=C)C)C1CCCC1 JLEDZKABTFDMAQ-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000012972 dimethylethanolamine Substances 0.000 description 1
- IZDIMNIIEWWUKS-UHFFFAOYSA-N ethanol;methyl prop-2-enoate Chemical compound CCO.COC(=O)C=C IZDIMNIIEWWUKS-UHFFFAOYSA-N 0.000 description 1
- YXOGSLZKOVPUMH-UHFFFAOYSA-N ethene;phenol Chemical group C=C.OC1=CC=CC=C1 YXOGSLZKOVPUMH-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine Substances NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- DAZXVJBJRMWXJP-UHFFFAOYSA-N n,n-dimethylethylamine Chemical compound CCN(C)C DAZXVJBJRMWXJP-UHFFFAOYSA-N 0.000 description 1
- GNVRJGIVDSQCOP-UHFFFAOYSA-N n-ethyl-n-methylethanamine Chemical compound CCN(C)CC GNVRJGIVDSQCOP-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- GSGDTSDELPUTKU-UHFFFAOYSA-N nonoxybenzene Chemical compound CCCCCCCCCOC1=CC=CC=C1 GSGDTSDELPUTKU-UHFFFAOYSA-N 0.000 description 1
- ZPIRTVJRHUMMOI-UHFFFAOYSA-N octoxybenzene Chemical compound CCCCCCCCOC1=CC=CC=C1 ZPIRTVJRHUMMOI-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002924 oxiranes Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229930004725 sesquiterpene Natural products 0.000 description 1
- 150000004354 sesquiterpene derivatives Chemical class 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本發明係有關於一種感光性樹脂組成物,詳而言之,係有關於一種感光性樹脂組成物,其不僅具有優異顯像後平坦度、敏感度、析像度、耐熱性、透明性等性能,特別地,可透過實現低介電常數有機絕緣膜降低電力消耗,並可減少串擾,適用於各種顯示器製程之有機絕緣膜。
在TFT型液晶顯示元件及積體電路元件中,使用有機絕緣膜以使配置於層間之配線之間絕緣。
近來,為了降低電力消耗,並減少串擾,使用於顯示器製造過程之有機絕緣膜被要求為具低介電常數之有機絕緣膜。
以前之有機絕緣膜係由PAC、黏著劑、溶劑等成分所構成,且主要使用丙烯酸系作為前述黏著劑。但是,使用習知之丙烯酸系黏著劑時會有介電常數過高的問題,並且會造成高消耗電力及串擾等缺點。
因此,事實上極需開發用於顯示器製程之低介電常數有機絕緣膜的研究。
為了解決前述習知技術的問題,本發明之目的在於提供一種感光性樹脂組成物及使用前述感光性樹脂組成物之顯示基板的圖案形成方法,且前述感光性樹脂組成物不僅具有優異顯像後平坦度、敏感度、析像度、耐熱性、透明性等性能,特別地,可透過實現低介電常數有機絕緣膜降低電力消耗,並可減少串擾。
為了達成前述目的,本發明提供一種感光性樹脂組成物,包含:a)丙烯酸系共聚物,係使i)下述化學式1或化學式2所表示之含POSS(多面體倍半矽氧烷寡聚物Polyhedral Oligomeric Silsesquioxane)不飽和化合物;ii)不飽和羧酸、不飽和羧酸酐、或該等之混合物;iii)含環氧基不飽和化合物;及iv)烯烴系不飽和化合物共聚合後所得到者;b)1,2-二疊氮醌化合物;及c)溶劑;
且前述化學式1或化學式2中,R1表示氫原子或甲基,R2係可分別相同或相異之碳數1~10之烷基、碳數5~6之環烷基、碳數1~10之烷氧基或苯基,並且n為0~5之整數。
較佳地,本發明包含:a)丙烯酸系共聚物100重量份,係使i)前述化學式1或化學式2所表示之含POSS(多面體倍半矽氧烷寡聚物Polyhedral Oligomeric Silsesquioxane)不飽和化合物5~70重量份;ii)不飽和羧酸、不飽和羧酸酐、或該等之混合物5~40重量份;iii)含環氧基不飽和化合物10~70重量份;及iv)烯烴系不飽和化合物5~70重量份共聚合後所得到者;b)1,2-二疊氮醌化合物5~100重量份;及c)溶劑,係使感光性樹脂組成物內之固態部分含量為10~50重量%者。
另外,本發明亦提供形成顯示器之圖案的方法,係使用含前述感光性樹脂組成物之硬化體的顯示基板及前述感光性樹脂組成物者。
本發明之感光性樹脂組成物具有優異顯像後平坦度、敏感度、析像度、耐熱性、透明性等性能,特別地,可透過實現低介電常數有機絕緣膜降低電力消耗,並可減少串擾,適用於各種顯示器製程之有機絕緣膜。
以下詳細地說明本發明。
本發明之感光性樹脂組成物包含a)丙烯酸系共聚物,係i)含POSS(多面體倍半矽氧烷寡聚物Polyhedral Oligomeric Silsesquioxane)不飽和化合物;ii)不飽和羧酸、不飽和羧酸酐、或該等之混合物;iii)含環氧基不飽和化合物;及iv)烯烴系不飽和化合物共聚合後所得到者、b)1,2-二疊氮醌化合物、及c)溶劑。
本發明使用之前述a)丙烯酸系共聚物,具有顯像時不易產生浮渣且可輕易地形成預定圖案之作用。
前述a)丙烯酸系共聚物,可將i)含POSS(多面體倍半矽氧烷寡聚物Polyhedral Oligomeric Silsesquioxane)不飽和化合物;ii)不飽和羧酸、不飽和羧酸酐、或該等之混合物;iii)含環氧基不飽和化合物;及iv)烯烴系不飽和化合物作為單體,在具有溶劑及聚合引發劑的情況下進行自由基反應合成後製成,而且,較佳地,利用沉澱、過濾、及真空乾燥方式除去未反應單體。
本發明使用之前述a)i)含POSS不飽和化合物,可單獨或混合2種以上前述化學式1或化學式2之化合物後使用。
相對於100重量份製造前述丙烯酸系共聚物時使用之總單體,含有5~70重量份前述含POSS不飽和化合物較佳,又以含有10~60重量份更好。在前述含量小於5重量份時會產生介電常數過高的問題,又一旦超過70重量份則會導致
耐熱性降低。
本發明所使用之前述a)ii)不飽和羧酸、不飽和羧酸酐、或該等之混合物,可將丙烯酸、甲基丙烯酸等之不飽和單羧酸;順丁烯二酸、反丁烯二酸、檸康酸、甲康酸(methaconic acid)、伊康酸等之不飽和二羧酸;或該等之不飽和二羧酸酐等單獨或混合2種以上後使用,特別地,使用丙烯酸、甲基丙烯酸、或順丁烯二酸酐對於共聚合反應性以及對於顯像液之鹼水溶液的溶解性方面較佳。
相對於100重量份製造前述丙烯酸系共聚物時使用之總單體,含有5~40重量份前述不飽和羧酸、不飽和羧酸酐、或該等之混合物較佳,又以含有10~30重量份更好。在前述含量小於5重量份時會產生不易溶解於鹼水溶液的問題,又一旦超過40重量份則會導致對鹼水溶液之溶解性過大的情形。
本發明使用之前述a)iii)含環氧基不飽和化合物,可使用如:丙烯酸環氧丙酯、甲基丙烯酸環氧丙酯、α-乙基丙烯酸環氧丙酯、α-n-丙基丙烯酸環氧丙酯、α-n-丁基丙烯酸環氧丙酯、丙烯酸-β-甲基環氧丙酯、甲基丙烯酸-β-甲基環氧丙酯、丙烯酸-β-乙基環氧丙酯、甲基丙烯酸-β-乙基環氧丙酯、丙烯酸-3,4-環氧丁酯、甲基丙烯酸-3,4-環氧丁酯、丙烯酸-6,7-環氧庚酯、甲基丙烯酸-6,7-環氧庚酯、α-乙基丙烯酸-6,7-環氧庚酯、o-乙烯基苯甲基環氧丙基醚、m-乙烯基苯甲基環氧丙基醚、或p-乙烯基苯甲基環氧丙基醚、甲基丙烯酸3,4-環氧環己酯等,並可將前述化合物單獨或2
種以上混合後使用。
特別地,前述含環氧基不飽和化合物,使用甲基丙烯酸環氧丙酯、甲基丙烯酸-β-甲基環氧丙酯、甲基丙烯酸-6,7-環氧庚酯、o-乙烯基苯甲基環氧丙基醚、m-乙烯基苯甲基環氧丙基醚、或p-乙烯基苯甲基環氧丙基醚、甲基丙烯酸3,4-環氧環己酯時對於提昇共聚合反應性及所得到之圖案的耐熱性方面更為適合。
相對於100重量份製造前述丙烯酸系共聚物時使用之總單體,含有10~70重量份前述含環氧基不飽和化合物較佳,又以含有20~60重量份更好。若前述含量小於10重量份時會產生所得到之圖案耐熱性不良的問題,又一旦超過70重量份則會導致共聚物之保存穩定性降低。
本發明使用之前述a)iv)烯烴系不飽和化合物,可使用如:甲基丙烯酸甲酯、乙基丙烯酸甲酯、n-丁基丙烯酸甲酯、sec-丁基丙烯酸甲酯、tert-丁基丙烯酸甲酯、甲基丙烯酸酯、異丙基丙烯酸酯、環己基丙烯酸甲酯、2-甲基環己基丙烯酸甲酯、二環戊烯基丙烯酸酯、二環戊基丙烯酸酯、二環戊烯基丙烯酸甲酯、二環戊基丙烯酸甲酯、1-金剛烷丙烯酸酯、1-金剛烷丙烯酸甲酯、二環戊基氧基乙基丙烯酸甲酯、異冰片酯丙烯酸甲酯、環己基丙烯酸酯、2-甲基環己基丙烯酸酯、二環戊基氧基乙基丙烯酸酯、異冰片酯丙烯酸酯、苯基丙烯酸甲酯、苯基丙烯酸酯、苯甲基丙烯酸酯、2-羥基乙基丙烯酸甲酯、苯乙烯、σ-甲基苯乙烯、m-甲基苯乙烯、p-甲基苯乙烯、乙烯基甲苯、p-甲氧基苯
乙烯、1,3-丁二烯、異戊二烯、及2,3-二甲基1,3-丁二烯等,並可將前述化合物單獨或2種以上混合後使用。
特別地,前述烯烴系不飽和化合物,使用苯乙烯、二環戊基甲基丙烯酸甲酯、或p-甲氧基苯乙烯時對於共聚合反應性及對於顯像液之鹼水溶液的溶解性方面較佳。
相對於100重量份製造前述丙烯酸系共聚物時使用之總單體,含有10~70重量份前述烯烴系不飽和化合物較佳,又以含有20~50重量份更好。在前述含量小於10重量份時會產生丙烯酸系共聚物之保存穩定性降低的問題,又超過70重量份時丙烯酸系共聚物則不易溶解於顯像液,即,鹼水溶液中。
用以溶液聚合前述單體之溶劑,可使用如:甲醇、四氫呋喃、甲苯、二氧雜環己烷等。
用以溶液聚合前述單體之聚合引發劑可使用自由基聚合引發劑,具體而言,可使用如:2,2-偶氮二異丁腈、2,2-偶氮(2,4-二甲基戊腈)、2,2-偶氮(4-甲氧基2,4-二甲基戊腈)、1,1-偶氮(環己烷-1-碳腈)、或二甲基2,2-偶氮異丁酸等。
使前述單體在存在溶劑與聚合引發劑的情況下進行自由基反應,再透過沉澱、過濾及真空乾燥方式除去未反應單體後得到之a)丙烯酸系共聚物的聚苯乙烯換算重量平均分子量(Mw)以5,000~30,000較佳,又以5,000~20,000更好。在前述聚苯乙烯換算重量平均分子量小於5,000時,會產生有機絕緣膜之顯像性、殘膜率等降低,及圖案顯像、耐熱性等不良的問題,另外,超過30,000時則會導致絕緣膜感
度降低、圖案顯像不良。
本發明使用之前述b)1,2-二疊氮醌化合物係作為感光性化合物使用。
前述1,2-二疊氮醌化合物,可使用如:1,2-二疊氮醌4-磺酸酯、1,2-二疊氮醌5-磺酸酯、或1,2-二疊氮醌6-磺酸酯等。
又,可使二疊氮萘醌磺酸鹵化合物與酚化合物在弱鹼下進行反應後製成前述二疊氮醌化合物。
前述酚化合物,可使用如:2,3,4-三羥苯基苯基酮、2,4,6-三羥苯基苯基酮、2,2’-四羥苯基苯基酮、4,4’-四羥苯基苯基酮、2,3,4,3’-四羥苯基苯基酮、2,3,4,4’-四羥苯基苯基酮、2,3,4,2’-四羥4’-甲基二苯甲酮、2,3,4,4’-四羥3’-甲氧基二苯甲酮、2,3,4,2’-五羥苯基苯基酮、2,3,4,6’-五羥苯基苯基酮、2,4,6,3’-六羥苯基苯基酮、2,4,6,4’-六羥苯基苯基酮、2,4,6,5’-六羥苯基苯基酮、3,4,5,3’-六羥苯基苯基酮、3,4,5,4’-六羥苯基苯基酮、3,4,5,5’-六羥苯基苯基酮、雙(2,4-二羥苯基)甲烷、1,1,1-三(p-羥苯基)乙烷、雙(2,3,4-三羥苯基)甲烷、2,2-雙(2,3,4-三羥苯基)丙烷、1,1,3-參(2,5-二甲基4-羥苯基)-3-苯基丙烷、4,4’-[1-[4-[1-[4-羥苯基]-1-甲基乙基]苯基]亞乙基]雙酚、或雙(2,5-二甲基4-羥苯基)-2-羥苯基甲烷等,並可將前述化合物單獨或混合2種以上後使用。
用前述酚化合物與二疊氮萘醌磺酸鹵化合物合成二疊氮醌化合物時,酯化度以50~85%為佳。在前述酯化度小於50%時會產生殘膜率惡化的問題,又一旦超過85%時會導致
保管穩定性降低。
相對於100重量份前述a)丙烯酸系共聚物,含有5~100重量份前述1-2二疊氮醌化合物較佳,又以含有10~50重量份更好。在前述含量小於5重量份時,會有曝光部與非曝光部之溶解度差變小導致圖案不易形成的問題,又一旦超過100重量份,則在短時間照射光時,會發生未反應之1-2二疊氮醌化合物大量殘留,造成對鹼水溶液之溶解度過低而不易顯像的問題。
為了絕緣膜的平坦性與不產生塗布斑點,將本發明所使用之前述c)溶劑形成為均一的圖案輪廓。
前述溶劑可使用如:甲醇、乙醇、苯甲醇、己醇等之醇類;乙二醇甲基醚乙酸酯、乙二醇乙基醚乙酸酯等之乙二醇烷基醚乙酸酯類;乙二醇甲基醚丙酸酯、乙二醇乙基醚丙酸酯等之乙二醇烷基醚丙酸酯類;乙二醇甲基醚、乙二醇乙基醚等之乙二醇單烷基醚類;二乙二醇單甲基醚、二乙二醇單乙基醚、二乙二醇二甲基醚、二乙二醇甲基乙基醚等之二乙二醇烷基醚類;丙二醇甲基醚乙酸酯、丙二醇乙基醚乙酸酯、丙二醇丙基醚乙酸酯等之丙二醇烷基醚乙酸酯類;丙二醇甲基醚丙酸酯、丙二醇乙基醚丙酸酯、丙二醇丙基醚丙酸酯等之丙二醇烷基醚丙酸酯類;丙二醇甲基醚、丙二醇乙基醚、丙二醇丙基醚、丙二醇丁基醚等之丙二醇單烷基醚類;二丙二醇二甲基醚、二丙二醇二乙基醚等之二丙二醇烷基醚類、丁二醇單甲基醚、丁二醇單乙基醚等之丁二醇單甲基醚類;二丁二醇二甲基醚、二丁
二醇二乙基醚等之二丁二醇烷基醚類等。
前述溶劑最好使全體感光性樹脂組成物之固態部分為10~50重量%,又以15~40重量%更好。在前述全體組成物之固態部分小於10重量%時會產生塗布厚度變薄、塗布平坦性降低的問題,又,大於50重量%時會導致塗布厚度變厚,進行塗布時塗布裝備負荷過重的問題。
由前述成分所構成之本發明感光性樹脂組成物可因應需要而更含有d)環氧樹脂、e)接著劑、f)丙烯酸化合物、及g)界面活性劑。
前述d)環氧樹脂具有提昇由感光性樹脂組成物得到之圖案的耐熱性、敏感度等的作用。
前述環氧樹脂可使用如:雙酚A型環氧樹脂、酚醛型環氧樹脂、甲酚酚醛型環氧樹脂、環狀脂肪族環氧樹脂、縮水甘油酸酯型環氧樹脂、環氧丙基胺型環氧樹脂、雜環式環氧樹脂、或與a)丙烯酸系共聚物相異之已(共)聚合甲基丙烯酸環氧丙酯之樹脂等,特別地,使用雙酚A型環氧樹脂、甲酚酚醛型環氧樹脂、或縮水甘油酸酯型環氧樹脂為佳。
相對於100重量份前述a)丙烯酸系共聚物,含有0.1~30重量份前述環氧樹脂為佳,在前述含量超出前述範圍時,會產生對於丙烯酸系共聚物之相溶性不良導致無法得到充分塗布性能的問題。
又,前述e)接著劑具有提昇與基板之接著性的作用,且相對於100重量份前述a)丙烯酸系共聚物,含有0.1~20重量份為佳。
前述接著劑,可使用具有羧酸、甲基丙烯酸、異氰酸酯基、或環氧基等反應性取代基之矽烷偶合劑等。具體而言,可使用如:γ-甲基丙烯氧基丙基三甲氧基矽烷、乙烯三乙酸基矽烷、乙烯三甲氧基矽烷、γ-異氰酸酯丙基三乙氧基矽烷、γ-環氧丙氧基丙基三甲氧基矽烷、或β-(3,4-環氧環己基)乙基三甲氧基矽烷等。
又,前述f)丙烯酸化合物具有提昇由感光性樹脂組成物得到之圖案的透過率、耐熱性、及敏感度等的作用。
較佳地,前述丙烯酸化合物為下述化學式3中顯示之化合物。
在前述化學式3的式子中,
R為氫原子、碳數1~5之烷基、碳數1~5之烷氧基、或碳數1~5之烷醇基,
且1<a<6,又a+b=6。
相對於100重量份前述丙烯酸系共聚物,含有0.1~30重量份前述丙烯酸化合物為佳,又以含有0.1~15重量份更好。在該含量於前述範圍內時對於提昇圖案透過率、耐熱性、敏感度等方面較合適。
又,前述g)界面活性劑具有提昇感光性組成物之塗布性及顯像性的作用。
前述界面活性劑可使用如:聚環氧乙烷辛基苯基醚、聚環氧乙烷壬基苯基醚、F171、F172、F173(商品名:大日本化学工業株式会社)、FC430、FC431(商品名:住友株式会社)、或KP341(商品名:信越化学工業株式会社)等。
相對於100重量份前述a)丙烯酸系共聚物含有0.0001~2重量份前述界面活性劑較佳,該含量在前述範圍內時對於提昇前述感光性樹脂組成物之塗布性或顯像性方面較合適。
由前述成分構成之本發明感光性樹脂組成物的固態部分以10~50重量份為佳,另外,最好用0.1~0.2μm之微孔過濾器過濾含有前述範圍之固態部分的組成物後再使用。
又,本發明提供使用含有前述感光性樹脂組成物之硬化體的顯示基板及前述感光性樹脂組成物之形成顯示器之圖案的方法,並且,本發明形成顯示器之圖案的方法係將感光性樹脂組成物形成為有機絕緣膜,且於形成在顯示器製程中之圖案的方法中使用前述感光性樹脂組成物。
具體而言,使用前述感光性樹脂組成物形成在顯示器製程中之圖案之方法的一例如下。
首先,利用噴灑法、輥塗抹法、旋轉塗布法等將本發明之感光性樹脂組成物塗布於基板表面,並藉由預焙除去溶劑後形成塗布膜。此時,較佳地,以80~115℃的溫度進行1~15分鐘前述預焙。
接著,依據事先準備好的圖案以可見光、紫外線、遠
紫外線、電子射線、X光等照射前述已形成之塗布膜,並藉由利用顯像液顯像除去不必要的部分以形成預定圖案。
前述顯像液使用鹼水溶液較佳,具體而言,可使用如:氫氧化鈉、氫氧化鈣、碳酸鈉等無機鹼類;乙胺、n-丙基胺等1級胺類;二乙基胺、n-丙基胺等之2級胺類;三甲基胺、甲基二乙基胺、二甲基乙基胺、三乙基胺等之3級胺類;二甲基乙醇胺、甲基二乙醇胺、三乙醇胺等之醇胺類;或四甲基氫氧化銨、四乙基氫氧化銨等4級銨鹽之水溶液等。此時,將鹼性化合物以0.1~10重量%之濃度溶解後作為前述顯像液使用,並可適量添加如甲醇、乙醇等水溶性有機溶劑及界面活性劑。
又,如上所述用顯像液顯像後,用超純水洗淨30~90秒除去不必要的部分並乾燥後可形成圖案,再用紫外線等光照射前述所形成之圖案,然後利用烤爐等加熱裝置將該圖案以150~250℃的溫度加熱處理30~90分鐘,可得到最終圖案。
本發明之感光性樹脂組成物不僅具有優異顯像後平坦度、敏感度、析像度、耐熱性、透明性等性能,特別地,可利用作為實現低介電常數有機絕緣膜減少消耗電力,並可減少串擾。因此,可有效且適當地使用於在各種顯示器製程中之有機絕緣膜。
以下,雖然舉出有助於了解本發明之較佳實施例,但是下述實施例僅為舉例說明本發明者,且本發明範圍並不僅限於以下實施例。
(製造丙烯酸系共聚物)
在具有冷卻管與攪拌機的燒杯中,放入10重量份2,2'-偶氮(2,4-二甲基戊腈)、500重量份四氫矽烷、30重量份下述化學式1a所表示之含POSS不飽和化合物、25重量份甲基丙烯酸、25重量份甲基丙烯酸環氧丙酯、及20重量份苯乙烯,進行氮素取代反應後,緩慢地攪拌。將前述反應溶液升溫至62℃,一邊維持該溫度10小時,一邊製造出含有(A)丙烯酸系共聚物之聚合物溶液。
相對於10重量份n-己烷,使100重量份前述聚合物溶液沉澱以除去聚合物溶液之未反應單體。沉澱後,藉由使用篩子之過濾方式除去溶解有未反應物之不良溶劑。然後,
在小於30℃的狀態下透過真空乾燥完全除去含有經過過濾後仍殘留之未反應單體的溶劑,製成(B)丙烯酸系共聚物。
前述(B)丙烯酸系共聚物之重量平均分子量為10,000。此時,重量平均分子量為用GPC測定之聚苯乙烯換算平均分子量。
(製造1,2-二疊氮醌化合物)
使1莫耳4,4’-[1-[4-[1-[4-羥苯基]-1-甲基乙基]苯基]亞乙基]雙酚與2莫耳1,2-二疊氮萘醌-5-磺酸[氯化物]縮合反應,製成4,4’-[1-[4-[1-[4-羥苯基]-1-甲基乙基]苯基]亞乙基]雙酚1,2-二疊氮萘醌-5-磺酸酯。
(製造感光性樹脂組成物)
將100重量份前述製造之(B)丙烯酸系共聚物與25重量份前述製造之4,4’-[1-[4-[1-[4-羥苯基]-1-甲基乙基]苯基]亞乙基]雙酚1,2-二疊氮萘醌-5-磺酸酯混合。用溶劑二乙烯乙二醇二甲醚溶解前述混合物使其固態部分為20重量%,再用0.2μm之微孔過濾器過濾後製成感光性樹脂組成物。
在前述實施例1中聚合(A)丙烯酸系共聚物時,除了用下述(化學式1b)之含POSS不飽和化合物取代前述(化學式1a)含POSS不飽和化合物作為單體外,用與前述實施例1相同之方法製造感光性樹脂組成物。
(化學式1b)
在前述實施例1中聚合(A)丙烯酸系共聚物時,除了用下述(化學式1c)之含POSS不飽和化合物取代前述(化學式1a)含POSS不飽和化合物作為單體外,用與前述實施例1相同之方法製造感光性樹脂組成物。
在前述實施例1中聚合(A)丙烯酸系共聚物時,除了用下述(化學式2a)之含POSS不飽和化合物取代前述(化學式1a)含POSS不飽和化合物作為單體外,用與前述實施例1相同之方法製造感光性樹脂組成物。
在前述實施例1中聚合(A)丙烯酸系共聚物時,除了用丁基甲基丙烯酸取代前述(化學式1a)含POSS不飽和化合物作為單體外,用與前述實施例1相同之方法製造感光性樹脂組成物。
使用前述實施例1~4及比較例1製成之感光性樹脂組成物按照下述方法進行特性評價後,將該結果紀錄於下述表1。
利用旋轉塗布法將前述實施例1~4及比較例1製成之感光性樹脂組成物分別塗布於玻璃基板後,以90℃在加熱板上預焙2分鐘,形成厚度0.3μm的膜。
1)顯像後平坦度-用橢圓偏光計測量前述形成之膜的顯像後平坦度。此時,平坦度超過全體基板基準95%則以○表示,又90~95%以△表示,而小於90%以×表示。
2)敏感度-對前述1)形成的膜使用預定之圖案遮罩,用敏感度為10μmLine&Space1:1CD基準用量照射波長435nm、強度20mW/cm2之紫外線6秒鐘後,在23℃下用2.38重量%之氫氧化四甲銨水溶液顯像1分鐘,再用超純水洗淨1分鐘。
然後,對前述已顯像之圖案照射500mJ/cm2波長435nm、強度20mW/cm2之紫外線,並置於烤爐內以230℃加熱60分鐘使其硬化,可得到圖案膜。
3)析像度-測量在測量前述2)敏感度時所形成之圖案膜的最小尺寸。
4)耐熱性-測量在測量前述2)敏感度時所形成之圖案膜的上下寬度及左右寬度。此時,以本焙(mid bake)前為基準,角的變化率為0~20%時以○表示,又為20~40%時以△表示,而超過40%時以×表示。
5)透過程度-用分光光度計測量圖案膜之400nm的透過率並進行透過程度的評價。
6)介電常數-測量電容器的靜電容量後,照下述算式求出介電常數。首先,以一定的厚度塗布介電體薄膜後,利用阻抗分析儀測量靜電容量,並透過下述算式1分別計算出介電常數。
[算式1]C(靜電容量)=ε0(真空介電常數)*εr(介電體薄膜比介電常數)*A(有效面)/d(介電體薄膜厚度)
測定前述介電常數,當前述介電常數為2.5~2.8時以○
表示,又為2.9~3.3時以△表示,而為3.4以上時以×表示。
由前述表1可得知,本發明之實施例1~4所製造之感光性樹脂組成物具有優異顯像後平坦度、敏感度、析像度、耐熱性、透明性等性能,特別地,因為相較於比較例1介電常數顯著降低,所以可減少消耗電力,且由於可減少串擾,因此,可有效且適當地使用於在各種顯示器製程中之有機絕緣膜。
Claims (7)
- 一種感光性樹脂組成物,係顯示器之有機絕緣膜用感光性樹脂組成物,其包含:a)丙烯酸系共聚物100重量份,係使i)下述化學式2所表示之含POSS(多面體倍半矽氧烷寡聚物Polyhedral Oligomeric Silsesquioxane)不飽和化合物5~70重量份;ii)不飽和羧酸、不飽和羧酸酐或該等之混合物5~40重量份;iii)含環氧基不飽和化合物10~70重量份;及iv)烯烴系不飽和化合物5~70重量份;共聚合後所得到者;b)1,2-二疊氮醌化合物5~100重量份;及c)溶劑,係使感光性樹脂組成物內之固態部分含量為10~50重量%者;且前述a)丙烯酸系共聚物之聚苯乙烯換算重量平均分子量(Mw)為5,000~30,000,
- 如申請專利範圍第1項之感光性樹脂組成物,其中前述a)ii)不飽和羧酸、不飽和羧酸酐或該等之混合物係1種以上選自於由丙烯酸、甲基丙烯酸、順丁烯二酸、反丁烯二酸、檸康酸、甲康酸、伊康酸及該等之不飽和二羧酸酐所構成之群者。
- 如申請專利範圍第1項之感光性樹脂組成物,其中前述a)iii)含環氧基不飽和化合物係1種以上選自於由丙烯酸環氧丙酯、甲基丙烯酸環氧丙酯、α-乙基丙烯酸環氧丙酯、α-n-丙基丙烯酸環氧丙酯、α-n-丁基丙烯酸環氧丙酯、丙烯酸-β-甲基環氧丙酯、甲基丙烯酸-β-甲基環氧丙酯、丙烯酸-β-乙基環氧丙酯、甲基丙烯酸-β-乙基 環氧丙酯、丙烯酸-3,4-環氧丁酯、甲基丙烯酸-3,4-環氧丁酯、丙烯酸-6,7-環氧庚酯、甲基丙烯酸-6,7-環氧庚酯、α-乙基丙烯酸-6,7-環氧庚酯、o-乙烯基苯甲基環氧丙基醚、m-乙烯基苯甲基環氧丙基醚及p-乙烯基苯甲基環氧丙基醚、甲基丙烯酸3,4-環氧環己酯所構成之群者。
- 如申請專利範圍第1項之感光性樹脂組成物,其中前述a)iv)烯烴系不飽和化合物係1種以上選自於由甲基丙烯酸甲酯、乙基丙烯酸甲酯、n-丁基丙烯酸甲酯、sec-丁基丙烯酸甲酯、tert-丁基丙烯酸甲酯、甲基丙烯酸酯、異丙基丙烯酸酯、環己基丙烯酸甲酯、2-甲基環己基丙烯酸甲酯、二環戊烯基丙烯酸酯、二環戊基丙烯酸酯、二環戊烯基丙烯酸甲酯、二環戊基丙烯酸甲酯、1-金剛烷丙烯酸酯、1-金剛烷丙烯酸甲酯、二環戊基氧基乙基丙烯酸甲酯、異冰片基丙烯酸甲酯、環己基丙烯酸酯、2-甲基環己基丙烯酸酯、二環戊基氧基乙基丙烯酸酯、異冰片基丙烯酸酯、苯基丙烯酸甲酯、苯基丙烯酸酯、苯甲基丙烯酸酯、2-羥基乙基丙烯酸甲酯、苯乙烯、σ-甲基苯乙烯、m-甲基苯乙烯、p-甲基苯乙烯、乙烯基甲苯、p-甲氧基苯乙烯、1,3-丁二烯、異戊二烯、及2,3-二甲基1,3-丁二烯所構成之群者。
- 如申請專利範圍第1項之感光性樹脂組成物,其中前述b)1,2-二疊氮醌化合物之感光性化合物係1種以上選自於由1,2-二疊氮醌4-磺酸酯、1,2-二疊氮醌5-磺酸酯、及1,2-二疊氮醌6-磺酸酯所構成之群者。
- 如申請專利範圍第1項之感光性樹脂組成物,其中前述感光性樹脂組成物更含有添加劑,且相對於100重量份之前述丙烯酸系共聚物,前述添加劑係1種以上選自於由d)環氧樹脂0.1~30重量份、e)接著劑0.1~20重量份、f)丙烯酸化合物0.1~30重量份及g)界面活性劑0.0001~2重量份所構成之群者。
- 一種形成顯示器之圖案的方法,係使用如申請專利範圍第1至6項中任一項之感光性樹脂組成物者。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050101224A KR101280478B1 (ko) | 2005-10-26 | 2005-10-26 | 감광성 수지 조성물 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200727083A TW200727083A (en) | 2007-07-16 |
TWI403848B true TWI403848B (zh) | 2013-08-01 |
Family
ID=38063239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095139318A TWI403848B (zh) | 2005-10-26 | 2006-10-25 | 感光性樹脂組成物 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5062514B2 (zh) |
KR (1) | KR101280478B1 (zh) |
CN (1) | CN1955843B (zh) |
TW (1) | TWI403848B (zh) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101475780B1 (ko) * | 2008-02-13 | 2014-12-23 | 주식회사 동진쎄미켐 | 보호막으로서 유용한 유-무기 복합체 수지 조성물 |
JP5105073B2 (ja) * | 2008-03-24 | 2012-12-19 | Jsr株式会社 | 感放射線性樹脂組成物、ならびに層間絶縁膜およびマイクロレンズの製造方法 |
JP5338258B2 (ja) * | 2008-10-30 | 2013-11-13 | Jnc株式会社 | ポジ型感光性組成物、この組成物から得られる硬化膜、及びこの硬化膜を有する表示素子 |
KR101114475B1 (ko) * | 2008-12-23 | 2012-03-13 | 주식회사 삼양사 | 고내열성 네거티브 감광성 공중합체를 포함하는 감광성 수지 조성물 및 이로부터 제조되는 액정 표시소자용 절연막 |
KR100961560B1 (ko) | 2009-04-16 | 2010-06-07 | 롬엔드하스전자재료코리아유한회사 | 광가교성 가교수지 조성물, 이를 이용한 절연막 및 그 전자부품 |
JP5338532B2 (ja) * | 2009-07-13 | 2013-11-13 | Jnc株式会社 | ポジ型感光性組成物 |
CN101963757B (zh) * | 2009-07-25 | 2012-11-21 | 比亚迪股份有限公司 | 一种有机硅改性碱溶性光敏树脂及其制备方法和一种油墨组合物 |
CN102314088A (zh) * | 2010-06-29 | 2012-01-11 | 新应材股份有限公司 | 感光性树脂组成物及其所应用的面板结构 |
KR101799260B1 (ko) | 2010-08-24 | 2017-11-20 | 메르크 파텐트 게엠베하 | 포지티브형 감광성 실록산 조성물 |
KR101902164B1 (ko) | 2011-05-20 | 2018-10-01 | 메르크 파텐트 게엠베하 | 포지티브형 감광성 실록산 조성물 |
TWI477556B (zh) * | 2012-06-11 | 2015-03-21 | Chi Mei Corp | 硬化性樹脂組成物、保護膜及含彼之液晶顯示元件 |
JP6013150B2 (ja) | 2012-11-22 | 2016-10-25 | メルクパフォーマンスマテリアルズマニュファクチャリング合同会社 | ポジ型感光性シロキサン組成物の製造方法 |
CN103193914B (zh) * | 2013-03-26 | 2016-01-20 | 厦门大学 | 一种亚克力光扩散板用光扩散剂的制备方法 |
JP6190650B2 (ja) * | 2013-07-19 | 2017-08-30 | 昭和電工株式会社 | カラーフィルターのオーバーコート層用樹脂組成物、それを用いたオーバーコート層、画像表示素子、及び画像表示素子の製造方法 |
CN103755847B (zh) | 2013-12-31 | 2015-09-16 | 京东方科技集团股份有限公司 | 聚丙烯酸酯分散剂、颜料分散液、彩色光刻胶、彩膜基板和显示装置 |
CN107003607B (zh) * | 2014-12-04 | 2021-05-28 | 日产化学工业株式会社 | 正型感光性树脂组合物 |
KR101939358B1 (ko) * | 2017-02-21 | 2019-01-16 | 울산과학기술원 | 초후막 3d 나노구조체를 위한 poss 기반의 고투명성 포토레지스트 |
CN109233294B (zh) * | 2018-08-28 | 2020-04-24 | 淮阴工学院 | 有机硅介微孔超低介电薄膜及其制备方法 |
CN113087913A (zh) * | 2021-03-15 | 2021-07-09 | 北京化工大学常州先进材料研究院 | 一种双键改性笼型倍半硅氧烷及其光阻组合物 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005008765A (ja) * | 2003-06-19 | 2005-01-13 | Shin Etsu Chem Co Ltd | 高分子化合物、レジスト材料及びパターン形成方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR930010616A (ko) * | 1991-11-01 | 1993-06-22 | 오오니시미노루 | 감광성 내식막 조성물 및 에칭방법 |
JPH11349644A (ja) * | 1998-06-10 | 1999-12-21 | Chisso Corp | ポリオルガノシロキサン共重合体組成物 |
JP2003105207A (ja) * | 2001-09-28 | 2003-04-09 | Chisso Corp | 樹脂組成物及びこれを用いた表示素子 |
KR100809544B1 (ko) * | 2001-10-24 | 2008-03-04 | 주식회사 동진쎄미켐 | 퀴논디아지드 술폰산 에스테르 화합물을 포함하는 감광성수지조성물 |
GR1004403B (el) * | 2002-05-30 | 2003-12-19 | "����������", ���������� ����������������� | Υλικα λιθογραφιας με βαση πολυμερη που περιεχουν πολυεδρικες ολιγομερεις σιλεναμισοξανες |
TW200413417A (en) * | 2002-10-31 | 2004-08-01 | Arch Spec Chem Inc | Novel copolymer, photoresist compositions thereof and deep UV bilayer system thereof |
KR20040061564A (ko) * | 2002-12-31 | 2004-07-07 | 제일모직주식회사 | 아세탈기-함유 히드록시스티렌/poss-메타크릴레이트공중합체 및 이를 포함하는 포지티브형 포토레지스트 조성물 |
JP4114064B2 (ja) * | 2003-05-27 | 2008-07-09 | 信越化学工業株式会社 | 珪素含有高分子化合物、レジスト材料及びパターン形成方法 |
JP2005195758A (ja) * | 2004-01-05 | 2005-07-21 | Asahi Kasei Electronics Co Ltd | 感光性樹脂組成物及びその用途 |
JP4488174B2 (ja) * | 2004-02-05 | 2010-06-23 | 信越化学工業株式会社 | レジスト材料及びパターン形成方法 |
JP2005272506A (ja) * | 2004-03-23 | 2005-10-06 | Daikin Ind Ltd | 含フッ素シルセスキオキサン重合体 |
-
2005
- 2005-10-26 KR KR1020050101224A patent/KR101280478B1/ko active IP Right Grant
-
2006
- 2006-10-24 JP JP2006288241A patent/JP5062514B2/ja active Active
- 2006-10-25 CN CN200610137563.0A patent/CN1955843B/zh active Active
- 2006-10-25 TW TW095139318A patent/TWI403848B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005008765A (ja) * | 2003-06-19 | 2005-01-13 | Shin Etsu Chem Co Ltd | 高分子化合物、レジスト材料及びパターン形成方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1955843A (zh) | 2007-05-02 |
JP2007119777A (ja) | 2007-05-17 |
CN1955843B (zh) | 2014-06-11 |
JP5062514B2 (ja) | 2012-10-31 |
KR20070044913A (ko) | 2007-05-02 |
TW200727083A (en) | 2007-07-16 |
KR101280478B1 (ko) | 2013-07-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI403848B (zh) | 感光性樹脂組成物 | |
TWI403836B (zh) | 感光性樹脂組成物 | |
KR101068111B1 (ko) | 감광성 수지 조성물 | |
JP5016828B2 (ja) | 感光性樹脂組成物 | |
KR100809544B1 (ko) | 퀴논디아지드 술폰산 에스테르 화합물을 포함하는 감광성수지조성물 | |
KR100784672B1 (ko) | 감광성 수지 조성물 | |
JP4906356B2 (ja) | 感光性樹脂組成物、lcd基板及びそのパターン形成方法 | |
JP2007286620A (ja) | 感光性樹脂組成物 | |
JP4786360B2 (ja) | 感光性樹脂組成物、lcd基板及びその製造方法 | |
KR20090062900A (ko) | 절연막 형성용 감광성 수지 조성물 | |
TWI453539B (zh) | 感光性樹脂組成物 | |
KR100737723B1 (ko) | 감광성 수지 조성물 | |
KR101057130B1 (ko) | 감광성 수지 조성물 | |
JP7469024B2 (ja) | ポジティブ型感光性樹脂組成物 | |
KR20090062899A (ko) | 절연막 형성용 감광성 수지 조성물 | |
TWI495954B (zh) | 光敏性樹脂組成物 | |
KR20030026666A (ko) | 감광성 수지 조성물 | |
KR101030310B1 (ko) | 감광성 수지 조성물 |