TWI396626B - Resin diaphragm, electronic parts and circuit connection material - Google Patents

Resin diaphragm, electronic parts and circuit connection material Download PDF

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Publication number
TWI396626B
TWI396626B TW100142306A TW100142306A TWI396626B TW I396626 B TWI396626 B TW I396626B TW 100142306 A TW100142306 A TW 100142306A TW 100142306 A TW100142306 A TW 100142306A TW I396626 B TWI396626 B TW I396626B
Authority
TW
Taiwan
Prior art keywords
resin film
thickness
layer
resin
particles
Prior art date
Application number
TW100142306A
Other languages
English (en)
Chinese (zh)
Other versions
TW201215504A (en
Inventor
河野務
小林宏治
小島和良
美野真行
Original Assignee
日立化成工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成工業股份有限公司 filed Critical 日立化成工業股份有限公司
Publication of TW201215504A publication Critical patent/TW201215504A/zh
Application granted granted Critical
Publication of TWI396626B publication Critical patent/TWI396626B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
TW100142306A 2008-06-26 2009-06-25 Resin diaphragm, electronic parts and circuit connection material TWI396626B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008167454 2008-06-26
JP2009148551A JP4623224B2 (ja) 2008-06-26 2009-06-23 樹脂フィルムシート及び電子部品

Publications (2)

Publication Number Publication Date
TW201215504A TW201215504A (en) 2012-04-16
TWI396626B true TWI396626B (zh) 2013-05-21

Family

ID=41495036

Family Applications (3)

Application Number Title Priority Date Filing Date
TW100142306A TWI396626B (zh) 2008-06-26 2009-06-25 Resin diaphragm, electronic parts and circuit connection material
TW099127941A TWI415144B (zh) 2008-06-26 2009-06-25 A resin film containing conductive particles and an electronic component electrically connected with a resin film containing conductive particles
TW098121389A TW201013710A (en) 2008-06-26 2009-06-25 Resin film sheet having conductive particles and electronic component electrically connected by the same

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW099127941A TWI415144B (zh) 2008-06-26 2009-06-25 A resin film containing conductive particles and an electronic component electrically connected with a resin film containing conductive particles
TW098121389A TW201013710A (en) 2008-06-26 2009-06-25 Resin film sheet having conductive particles and electronic component electrically connected by the same

Country Status (4)

Country Link
JP (9) JP4623224B2 (enExample)
KR (8) KR101038614B1 (enExample)
CN (4) CN101615446B (enExample)
TW (3) TWI396626B (enExample)

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* Cited by examiner, † Cited by third party
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JP4623224B2 (ja) * 2008-06-26 2011-02-02 日立化成工業株式会社 樹脂フィルムシート及び電子部品
CN106424711B (zh) * 2012-03-06 2019-02-15 东洋油墨Sc控股株式会社 导电性微粒及其制造方法、导电性树脂组成物、导电性薄片、以及电磁波屏蔽薄片
JP6221285B2 (ja) * 2013-03-21 2017-11-01 日立化成株式会社 回路部材の接続方法
JP6069153B2 (ja) * 2013-09-27 2017-02-01 デクセリアルズ株式会社 アンダーフィル材、及びこれを用いた半導体装置の製造方法
JP6645730B2 (ja) * 2014-01-28 2020-02-14 デクセリアルズ株式会社 接続体及び接続体の製造方法
JP6307308B2 (ja) * 2014-03-06 2018-04-04 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料
CN106415938B (zh) * 2014-03-31 2019-09-06 迪睿合株式会社 各向异性导电膜及其制备方法
KR101737173B1 (ko) 2014-07-24 2017-05-17 삼성에스디아이 주식회사 이방 도전성 필름, 이의 제조 방법, 및 이를 포함하는 반도체 장치
CN107001865B (zh) * 2014-11-12 2020-08-21 迪睿合株式会社 光固化类各向异性导电粘接剂、连接体的制造方法及电子部件的连接方法
JP6661886B2 (ja) * 2015-03-11 2020-03-11 日立化成株式会社 フィルム状回路接続材料及び回路部材の接続構造体の製造方法
KR101684144B1 (ko) 2015-07-08 2016-12-07 울산대학교 산학협력단 무단변속기를 이용한 고효율 파력발전기 및 그 제어방법
JP6327630B1 (ja) * 2017-04-28 2018-05-23 リンテック株式会社 フィルム状焼成材料、支持シート付フィルム状焼成材料、フィルム状焼成材料の製造方法、及び支持シート付フィルム状焼成材料の製造方法
KR102631317B1 (ko) * 2017-09-11 2024-02-01 가부시끼가이샤 레조낙 회로 접속용 접착제 필름 및 그의 제조 방법, 회로 접속 구조체의 제조 방법, 그리고 접착제 필름 수용 세트
KR102794873B1 (ko) * 2017-09-11 2025-04-11 가부시끼가이샤 레조낙 회로 접속용 접착제 필름 및 그의 제조 방법, 회로 접속 구조체의 제조 방법, 그리고 접착제 필름 수용 세트
TWI846756B (zh) 2018-11-21 2024-07-01 日商信越化學工業股份有限公司 異向性薄膜、及異向性薄膜的製造方法
JP2020024937A (ja) * 2019-10-28 2020-02-13 日立化成株式会社 フィルム状回路接続材料及び回路部材の接続構造体の製造方法
KR102914642B1 (ko) 2020-06-11 2026-01-19 현대자동차주식회사 리튬이온 이차전지 및 그 제조방법
KR20220019470A (ko) 2020-08-10 2022-02-17 현대자동차주식회사 리튬이온 이차전지 제조 시스템 및 그 제조 방법

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JPH09312176A (ja) * 1996-05-23 1997-12-02 Hitachi Chem Co Ltd 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
JP2008112732A (ja) * 2007-11-19 2008-05-15 Hitachi Chem Co Ltd 電極の接続方法

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Publication number Priority date Publication date Assignee Title
JPH09312176A (ja) * 1996-05-23 1997-12-02 Hitachi Chem Co Ltd 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
JP2008112732A (ja) * 2007-11-19 2008-05-15 Hitachi Chem Co Ltd 電極の接続方法

Also Published As

Publication number Publication date
KR20110130376A (ko) 2011-12-05
CN101615446A (zh) 2009-12-30
TWI415144B (zh) 2013-11-11
JP2011003544A (ja) 2011-01-06
JP2010267627A (ja) 2010-11-25
JP4766185B2 (ja) 2011-09-07
JP4661986B2 (ja) 2011-03-30
JP4970574B2 (ja) 2012-07-11
KR101120277B1 (ko) 2012-03-07
CN102298988A (zh) 2011-12-28
KR101200148B1 (ko) 2012-11-12
CN101615446B (zh) 2013-07-17
KR20100002196A (ko) 2010-01-06
TW201101343A (en) 2011-01-01
JP2011233529A (ja) 2011-11-17
KR20110084488A (ko) 2011-07-25
CN102298988B (zh) 2016-09-07
KR20110084492A (ko) 2011-07-25
KR20110084489A (ko) 2011-07-25
JP2011233528A (ja) 2011-11-17
KR20110084491A (ko) 2011-07-25
JP2011233530A (ja) 2011-11-17
KR20110084490A (ko) 2011-07-25
JP2010284973A (ja) 2010-12-24
CN102298987A (zh) 2011-12-28
JP2010278013A (ja) 2010-12-09
TW201215504A (en) 2012-04-16
KR101120253B1 (ko) 2012-03-16
JP2011198767A (ja) 2011-10-06
KR101038614B1 (ko) 2011-06-03
CN102298989A (zh) 2011-12-28
KR20100102571A (ko) 2010-09-24
JP2010034037A (ja) 2010-02-12
JP4623224B2 (ja) 2011-02-02
JP4661985B2 (ja) 2011-03-30
TW201013710A (en) 2010-04-01

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MM4A Annulment or lapse of patent due to non-payment of fees