KR101038614B1 - 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품 - Google Patents

도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품 Download PDF

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Publication number
KR101038614B1
KR101038614B1 KR1020090057037A KR20090057037A KR101038614B1 KR 101038614 B1 KR101038614 B1 KR 101038614B1 KR 1020090057037 A KR1020090057037 A KR 1020090057037A KR 20090057037 A KR20090057037 A KR 20090057037A KR 101038614 B1 KR101038614 B1 KR 101038614B1
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South Korea
Prior art keywords
resin film
particle
layer
resin
thickness
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Expired - Fee Related
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KR1020090057037A
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English (en)
Korean (ko)
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KR20100002196A (ko
Inventor
쯔또무 고노
고지 고바야시
가즈요시 고지마
마사유끼 미노
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히다치 가세고교 가부시끼가이샤
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Publication of KR20100002196A publication Critical patent/KR20100002196A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020090057037A 2008-06-26 2009-06-25 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품 Expired - Fee Related KR101038614B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008167454 2008-06-26
JPJP-P-2008-167454 2008-06-26
JPJP-P-2009-148551 2009-06-23
JP2009148551A JP4623224B2 (ja) 2008-06-26 2009-06-23 樹脂フィルムシート及び電子部品

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020100085249A Division KR101120277B1 (ko) 2008-06-26 2010-09-01 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품

Publications (2)

Publication Number Publication Date
KR20100002196A KR20100002196A (ko) 2010-01-06
KR101038614B1 true KR101038614B1 (ko) 2011-06-03

Family

ID=41495036

Family Applications (8)

Application Number Title Priority Date Filing Date
KR1020090057037A Expired - Fee Related KR101038614B1 (ko) 2008-06-26 2009-06-25 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020100085249A Expired - Fee Related KR101120277B1 (ko) 2008-06-26 2010-09-01 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020110067974A Withdrawn KR20110084488A (ko) 2008-06-26 2011-07-08 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020110067975A Withdrawn KR20110084489A (ko) 2008-06-26 2011-07-08 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020110067984A Expired - Fee Related KR101120253B1 (ko) 2008-06-26 2011-07-08 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020110067977A Ceased KR20110084490A (ko) 2008-06-26 2011-07-08 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020110067981A Ceased KR20110084491A (ko) 2008-06-26 2011-07-08 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020110119297A Expired - Fee Related KR101200148B1 (ko) 2008-06-26 2011-11-16 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품

Family Applications After (7)

Application Number Title Priority Date Filing Date
KR1020100085249A Expired - Fee Related KR101120277B1 (ko) 2008-06-26 2010-09-01 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020110067974A Withdrawn KR20110084488A (ko) 2008-06-26 2011-07-08 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020110067975A Withdrawn KR20110084489A (ko) 2008-06-26 2011-07-08 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020110067984A Expired - Fee Related KR101120253B1 (ko) 2008-06-26 2011-07-08 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020110067977A Ceased KR20110084490A (ko) 2008-06-26 2011-07-08 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020110067981A Ceased KR20110084491A (ko) 2008-06-26 2011-07-08 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품
KR1020110119297A Expired - Fee Related KR101200148B1 (ko) 2008-06-26 2011-11-16 도전성 입자를 내재시킨 수지 필름 시트 및 도전성 입자를 내재시킨 수지 필름 시트로 전기적으로 접속된 전자 부품

Country Status (4)

Country Link
JP (9) JP4623224B2 (enExample)
KR (8) KR101038614B1 (enExample)
CN (4) CN101615446B (enExample)
TW (3) TWI415144B (enExample)

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JP4623224B2 (ja) * 2008-06-26 2011-02-02 日立化成工業株式会社 樹脂フィルムシート及び電子部品
CN106424711B (zh) * 2012-03-06 2019-02-15 东洋油墨Sc控股株式会社 导电性微粒及其制造方法、导电性树脂组成物、导电性薄片、以及电磁波屏蔽薄片
JP6221285B2 (ja) * 2013-03-21 2017-11-01 日立化成株式会社 回路部材の接続方法
JP6069153B2 (ja) * 2013-09-27 2017-02-01 デクセリアルズ株式会社 アンダーフィル材、及びこれを用いた半導体装置の製造方法
JP6645730B2 (ja) * 2014-01-28 2020-02-14 デクセリアルズ株式会社 接続体及び接続体の製造方法
JP6307308B2 (ja) * 2014-03-06 2018-04-04 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料
KR102430609B1 (ko) * 2014-03-31 2022-08-08 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그 제조 방법
KR101737173B1 (ko) 2014-07-24 2017-05-17 삼성에스디아이 주식회사 이방 도전성 필름, 이의 제조 방법, 및 이를 포함하는 반도체 장치
TWI715542B (zh) * 2014-11-12 2021-01-11 日商迪睿合股份有限公司 光硬化系異向性導電接著劑、連接體之製造方法及電子零件之連接方法
JP6661886B2 (ja) * 2015-03-11 2020-03-11 日立化成株式会社 フィルム状回路接続材料及び回路部材の接続構造体の製造方法
KR101684144B1 (ko) 2015-07-08 2016-12-07 울산대학교 산학협력단 무단변속기를 이용한 고효율 파력발전기 및 그 제어방법
JP6327630B1 (ja) * 2017-04-28 2018-05-23 リンテック株式会社 フィルム状焼成材料、支持シート付フィルム状焼成材料、フィルム状焼成材料の製造方法、及び支持シート付フィルム状焼成材料の製造方法
KR102569980B1 (ko) * 2017-09-11 2023-08-24 가부시끼가이샤 레조낙 회로 접속용 접착제 필름 및 그의 제조 방법, 회로 접속 구조체의 제조 방법, 그리고 접착제 필름 수용 세트
WO2019050006A1 (ja) * 2017-09-11 2019-03-14 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
TWI846756B (zh) * 2018-11-21 2024-07-01 日商信越化學工業股份有限公司 異向性薄膜、及異向性薄膜的製造方法
JP2020024937A (ja) * 2019-10-28 2020-02-13 日立化成株式会社 フィルム状回路接続材料及び回路部材の接続構造体の製造方法
KR20210154293A (ko) 2020-06-11 2021-12-21 현대자동차주식회사 리튬이온 이차전지 및 그 제조방법
KR20220019470A (ko) 2020-08-10 2022-02-17 현대자동차주식회사 리튬이온 이차전지 제조 시스템 및 그 제조 방법

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JP4661985B2 (ja) 2011-03-30
CN102298988A (zh) 2011-12-28
KR101120277B1 (ko) 2012-03-07
CN102298988B (zh) 2016-09-07
TWI396626B (zh) 2013-05-21
KR101120253B1 (ko) 2012-03-16
JP4661986B2 (ja) 2011-03-30
JP2011233528A (ja) 2011-11-17
KR101200148B1 (ko) 2012-11-12
JP2011233530A (ja) 2011-11-17
CN102298987A (zh) 2011-12-28
JP4970574B2 (ja) 2012-07-11
JP2011233529A (ja) 2011-11-17
KR20110084488A (ko) 2011-07-25
JP2010278013A (ja) 2010-12-09
TWI415144B (zh) 2013-11-11
CN101615446A (zh) 2009-12-30
KR20100102571A (ko) 2010-09-24
JP4623224B2 (ja) 2011-02-02
KR20110084490A (ko) 2011-07-25
TW201215504A (en) 2012-04-16
JP2011003544A (ja) 2011-01-06
CN101615446B (zh) 2013-07-17
KR20110084491A (ko) 2011-07-25
CN102298989A (zh) 2011-12-28
JP2011198767A (ja) 2011-10-06
JP2010034037A (ja) 2010-02-12
KR20110084489A (ko) 2011-07-25
JP4766185B2 (ja) 2011-09-07
TW201101343A (en) 2011-01-01
KR20110084492A (ko) 2011-07-25
JP2010267627A (ja) 2010-11-25
JP2010284973A (ja) 2010-12-24
KR20110130376A (ko) 2011-12-05
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TW201013710A (en) 2010-04-01

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