TWI415144B - A resin film containing conductive particles and an electronic component electrically connected with a resin film containing conductive particles - Google Patents

A resin film containing conductive particles and an electronic component electrically connected with a resin film containing conductive particles Download PDF

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Publication number
TWI415144B
TWI415144B TW099127941A TW99127941A TWI415144B TW I415144 B TWI415144 B TW I415144B TW 099127941 A TW099127941 A TW 099127941A TW 99127941 A TW99127941 A TW 99127941A TW I415144 B TWI415144 B TW I415144B
Authority
TW
Taiwan
Prior art keywords
resin film
layer
resin
particles
film layer
Prior art date
Application number
TW099127941A
Other languages
English (en)
Chinese (zh)
Other versions
TW201101343A (en
Inventor
河野務
小林宏治
小島和良
美野真行
Original Assignee
日立化成工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成工業股份有限公司 filed Critical 日立化成工業股份有限公司
Publication of TW201101343A publication Critical patent/TW201101343A/zh
Application granted granted Critical
Publication of TWI415144B publication Critical patent/TWI415144B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H10W72/074—
    • H10W72/325—
    • H10W72/352—
    • H10W72/354—
    • H10W74/15—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW099127941A 2008-06-26 2009-06-25 A resin film containing conductive particles and an electronic component electrically connected with a resin film containing conductive particles TWI415144B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008167454 2008-06-26
JP2009148551A JP4623224B2 (ja) 2008-06-26 2009-06-23 樹脂フィルムシート及び電子部品

Publications (2)

Publication Number Publication Date
TW201101343A TW201101343A (en) 2011-01-01
TWI415144B true TWI415144B (zh) 2013-11-11

Family

ID=41495036

Family Applications (3)

Application Number Title Priority Date Filing Date
TW099127941A TWI415144B (zh) 2008-06-26 2009-06-25 A resin film containing conductive particles and an electronic component electrically connected with a resin film containing conductive particles
TW100142306A TWI396626B (zh) 2008-06-26 2009-06-25 Resin diaphragm, electronic parts and circuit connection material
TW098121389A TW201013710A (en) 2008-06-26 2009-06-25 Resin film sheet having conductive particles and electronic component electrically connected by the same

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW100142306A TWI396626B (zh) 2008-06-26 2009-06-25 Resin diaphragm, electronic parts and circuit connection material
TW098121389A TW201013710A (en) 2008-06-26 2009-06-25 Resin film sheet having conductive particles and electronic component electrically connected by the same

Country Status (4)

Country Link
JP (9) JP4623224B2 (enExample)
KR (8) KR101038614B1 (enExample)
CN (4) CN102298987A (enExample)
TW (3) TWI415144B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4623224B2 (ja) * 2008-06-26 2011-02-02 日立化成工業株式会社 樹脂フィルムシート及び電子部品
CN104170023B (zh) * 2012-03-06 2016-12-28 东洋油墨Sc控股株式会社 导电性微粒及其制造方法、导电性树脂组成物、导电性薄片、以及电磁波屏蔽薄片
JP6221285B2 (ja) * 2013-03-21 2017-11-01 日立化成株式会社 回路部材の接続方法
JP6069153B2 (ja) * 2013-09-27 2017-02-01 デクセリアルズ株式会社 アンダーフィル材、及びこれを用いた半導体装置の製造方法
JP6645730B2 (ja) * 2014-01-28 2020-02-14 デクセリアルズ株式会社 接続体及び接続体の製造方法
JP6307308B2 (ja) * 2014-03-06 2018-04-04 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料
TWI664783B (zh) 2014-03-31 2019-07-01 日商迪睿合股份有限公司 異向性導電膜、其製造方法、連接構造體、及連接構造體之製造方法
KR101737173B1 (ko) 2014-07-24 2017-05-17 삼성에스디아이 주식회사 이방 도전성 필름, 이의 제조 방법, 및 이를 포함하는 반도체 장치
WO2016076398A1 (ja) * 2014-11-12 2016-05-19 デクセリアルズ株式会社 光硬化系異方性導電接着剤、接続体の製造方法及び電子部品の接続方法
JP6661886B2 (ja) * 2015-03-11 2020-03-11 日立化成株式会社 フィルム状回路接続材料及び回路部材の接続構造体の製造方法
KR101684144B1 (ko) 2015-07-08 2016-12-07 울산대학교 산학협력단 무단변속기를 이용한 고효율 파력발전기 및 그 제어방법
JP6327630B1 (ja) * 2017-04-28 2018-05-23 リンテック株式会社 フィルム状焼成材料、支持シート付フィルム状焼成材料、フィルム状焼成材料の製造方法、及び支持シート付フィルム状焼成材料の製造方法
KR102569980B1 (ko) * 2017-09-11 2023-08-24 가부시끼가이샤 레조낙 회로 접속용 접착제 필름 및 그의 제조 방법, 회로 접속 구조체의 제조 방법, 그리고 접착제 필름 수용 세트
WO2019050006A1 (ja) * 2017-09-11 2019-03-14 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
TWI846756B (zh) * 2018-11-21 2024-07-01 日商信越化學工業股份有限公司 異向性薄膜、及異向性薄膜的製造方法
JP2020024937A (ja) * 2019-10-28 2020-02-13 日立化成株式会社 フィルム状回路接続材料及び回路部材の接続構造体の製造方法
KR20220019470A (ko) 2020-08-10 2022-02-17 현대자동차주식회사 리튬이온 이차전지 제조 시스템 및 그 제조 방법

Citations (4)

* Cited by examiner, † Cited by third party
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JPH09312176A (ja) * 1996-05-23 1997-12-02 Hitachi Chem Co Ltd 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
TW200804816A (en) * 2006-04-11 2008-01-16 Jsr Corp Anisotropic conductive connector and anisotropic conductive connector device
TW200810243A (en) * 2006-04-27 2008-02-16 Asahi Kasei Emd Corp Conducting particles placement sheet and anisotropic conductive film
TW200809879A (en) * 2006-02-27 2008-02-16 Hitachi Chemical Co Ltd Conductive particle, adhesive composition, circuit-connecting material, circuit-connecting structure, and method for connection of circuit member

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JPH03107888A (ja) * 1989-09-21 1991-05-08 Sharp Corp 回路基板の接続構造
JPH0645204A (ja) * 1992-07-21 1994-02-18 Nippon Chemicon Corp 固体電解コンデンサ
JPH0645024A (ja) * 1992-07-22 1994-02-18 Hitachi Chem Co Ltd 異方導電性接着フィルム
JPH08148213A (ja) * 1994-11-25 1996-06-07 Hitachi Chem Co Ltd 接続部材、該接続部材を用いた電極の接続構造及び接続方法
GB2296845A (en) * 1995-01-04 1996-07-10 Plessey Semiconductors Ltd Frequency shift keyed radio receivers
JP3656768B2 (ja) * 1995-02-07 2005-06-08 日立化成工業株式会社 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
TW392179B (en) * 1996-02-08 2000-06-01 Asahi Chemical Ind Anisotropic conductive composition
JPH10200243A (ja) * 1997-01-13 1998-07-31 Toshiba Chem Corp 異方性導電ペーストによる電気接続方法
JP2000182691A (ja) * 1998-12-17 2000-06-30 Hitachi Chem Co Ltd 回路の接続部材及びこれを用いた接続方法
JP4411819B2 (ja) * 2000-03-23 2010-02-10 ソニー株式会社 電気的接続材料
JP2004006417A (ja) 2003-08-22 2004-01-08 Hitachi Chem Co Ltd 接続部材及びこれを用いた電極の接続構造
JP2005146044A (ja) * 2003-11-12 2005-06-09 Sumitomo Electric Ind Ltd 異方導電性接着剤
JP4728665B2 (ja) * 2004-07-15 2011-07-20 積水化学工業株式会社 導電性微粒子、導電性微粒子の製造方法、及び異方性導電材料
JP2006233202A (ja) * 2005-01-31 2006-09-07 Asahi Kasei Electronics Co Ltd 回路接続用異方導電性接着フィルム
KR101049609B1 (ko) * 2005-11-18 2011-07-14 히다치 가세고교 가부시끼가이샤 접착제 조성물, 회로 접속 재료, 접속 구조 및 회로부재의접속방법
JP2008112732A (ja) * 2007-11-19 2008-05-15 Hitachi Chem Co Ltd 電極の接続方法
JP4623224B2 (ja) * 2008-06-26 2011-02-02 日立化成工業株式会社 樹脂フィルムシート及び電子部品

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09312176A (ja) * 1996-05-23 1997-12-02 Hitachi Chem Co Ltd 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
TW200809879A (en) * 2006-02-27 2008-02-16 Hitachi Chemical Co Ltd Conductive particle, adhesive composition, circuit-connecting material, circuit-connecting structure, and method for connection of circuit member
TW200804816A (en) * 2006-04-11 2008-01-16 Jsr Corp Anisotropic conductive connector and anisotropic conductive connector device
TW200810243A (en) * 2006-04-27 2008-02-16 Asahi Kasei Emd Corp Conducting particles placement sheet and anisotropic conductive film

Also Published As

Publication number Publication date
KR20110084491A (ko) 2011-07-25
JP2010284973A (ja) 2010-12-24
KR20110084490A (ko) 2011-07-25
CN102298988A (zh) 2011-12-28
TW201215504A (en) 2012-04-16
JP2011233530A (ja) 2011-11-17
KR101200148B1 (ko) 2012-11-12
KR20110084492A (ko) 2011-07-25
CN102298989A (zh) 2011-12-28
KR20110084488A (ko) 2011-07-25
CN101615446A (zh) 2009-12-30
KR20110084489A (ko) 2011-07-25
JP4661986B2 (ja) 2011-03-30
TW201101343A (en) 2011-01-01
KR20100102571A (ko) 2010-09-24
JP4623224B2 (ja) 2011-02-02
TW201013710A (en) 2010-04-01
JP2011198767A (ja) 2011-10-06
KR20110130376A (ko) 2011-12-05
KR20100002196A (ko) 2010-01-06
KR101038614B1 (ko) 2011-06-03
TWI396626B (zh) 2013-05-21
JP2011003544A (ja) 2011-01-06
JP4766185B2 (ja) 2011-09-07
CN102298988B (zh) 2016-09-07
JP4661985B2 (ja) 2011-03-30
KR101120277B1 (ko) 2012-03-07
KR101120253B1 (ko) 2012-03-16
JP2011233529A (ja) 2011-11-17
CN101615446B (zh) 2013-07-17
JP2010034037A (ja) 2010-02-12
CN102298987A (zh) 2011-12-28
JP2011233528A (ja) 2011-11-17
JP2010278013A (ja) 2010-12-09
JP4970574B2 (ja) 2012-07-11
JP2010267627A (ja) 2010-11-25

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