CN102298989A - 内含导电性粒子的树脂膜片及由其电连接的电子部件 - Google Patents

内含导电性粒子的树脂膜片及由其电连接的电子部件 Download PDF

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Publication number
CN102298989A
CN102298989A CN2011102511046A CN201110251104A CN102298989A CN 102298989 A CN102298989 A CN 102298989A CN 2011102511046 A CN2011102511046 A CN 2011102511046A CN 201110251104 A CN201110251104 A CN 201110251104A CN 102298989 A CN102298989 A CN 102298989A
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CN
China
Prior art keywords
particle
resin film
resin
layer
film layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011102511046A
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English (en)
Chinese (zh)
Inventor
河野务
小林宏治
小岛和良
美野真行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN102298989A publication Critical patent/CN102298989A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
CN2011102511046A 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件 Pending CN102298989A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008167454 2008-06-26
JP2008-167454 2008-06-26
JP2009148551A JP4623224B2 (ja) 2008-06-26 2009-06-23 樹脂フィルムシート及び電子部品
JP2009-148551 2009-06-23

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2009101503914A Division CN101615446B (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件

Publications (1)

Publication Number Publication Date
CN102298989A true CN102298989A (zh) 2011-12-28

Family

ID=41495036

Family Applications (4)

Application Number Title Priority Date Filing Date
CN2011102511046A Pending CN102298989A (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件
CN2011102510630A Pending CN102298987A (zh) 2008-06-26 2009-06-25 树脂膜片的用途
CN201110251065.XA Expired - Fee Related CN102298988B (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件
CN2009101503914A Expired - Fee Related CN101615446B (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN2011102510630A Pending CN102298987A (zh) 2008-06-26 2009-06-25 树脂膜片的用途
CN201110251065.XA Expired - Fee Related CN102298988B (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件
CN2009101503914A Expired - Fee Related CN101615446B (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件

Country Status (4)

Country Link
JP (9) JP4623224B2 (enExample)
KR (8) KR101038614B1 (enExample)
CN (4) CN102298989A (enExample)
TW (3) TWI396626B (enExample)

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JP4623224B2 (ja) * 2008-06-26 2011-02-02 日立化成工業株式会社 樹脂フィルムシート及び電子部品
KR102017121B1 (ko) * 2012-03-06 2019-09-02 토요잉크Sc홀딩스주식회사 도전성 미립자 및 그 제조 방법, 도전성 수지 조성물, 도전성 시트 및 전자파 차폐 시트
JP6221285B2 (ja) * 2013-03-21 2017-11-01 日立化成株式会社 回路部材の接続方法
JP6069153B2 (ja) * 2013-09-27 2017-02-01 デクセリアルズ株式会社 アンダーフィル材、及びこれを用いた半導体装置の製造方法
JP6645730B2 (ja) * 2014-01-28 2020-02-14 デクセリアルズ株式会社 接続体及び接続体の製造方法
JP6307308B2 (ja) * 2014-03-06 2018-04-04 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料
CN106415938B (zh) * 2014-03-31 2019-09-06 迪睿合株式会社 各向异性导电膜及其制备方法
KR101737173B1 (ko) 2014-07-24 2017-05-17 삼성에스디아이 주식회사 이방 도전성 필름, 이의 제조 방법, 및 이를 포함하는 반도체 장치
KR102031530B1 (ko) * 2014-11-12 2019-10-14 데쿠세리아루즈 가부시키가이샤 광 경화계 이방성 도전 접착제, 접속체의 제조 방법 및 전자 부품의 접속 방법
JP6661886B2 (ja) * 2015-03-11 2020-03-11 日立化成株式会社 フィルム状回路接続材料及び回路部材の接続構造体の製造方法
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JP6327630B1 (ja) 2017-04-28 2018-05-23 リンテック株式会社 フィルム状焼成材料、支持シート付フィルム状焼成材料、フィルム状焼成材料の製造方法、及び支持シート付フィルム状焼成材料の製造方法
CN111094487A (zh) * 2017-09-11 2020-05-01 日立化成株式会社 电路连接用粘接剂膜及其制造方法、电路连接结构体的制造方法、以及粘接剂膜收纳组件
JPWO2019050006A1 (ja) * 2017-09-11 2020-08-20 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
TWI846756B (zh) * 2018-11-21 2024-07-01 日商信越化學工業股份有限公司 異向性薄膜、及異向性薄膜的製造方法
JP2020024937A (ja) * 2019-10-28 2020-02-13 日立化成株式会社 フィルム状回路接続材料及び回路部材の接続構造体の製造方法
KR20210154293A (ko) 2020-06-11 2021-12-21 현대자동차주식회사 리튬이온 이차전지 및 그 제조방법
KR20220019470A (ko) 2020-08-10 2022-02-17 현대자동차주식회사 리튬이온 이차전지 제조 시스템 및 그 제조 방법

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Also Published As

Publication number Publication date
JP2011198767A (ja) 2011-10-06
JP2010284973A (ja) 2010-12-24
TW201215504A (en) 2012-04-16
JP2011233528A (ja) 2011-11-17
KR101200148B1 (ko) 2012-11-12
KR101120253B1 (ko) 2012-03-16
JP4661986B2 (ja) 2011-03-30
JP2011003544A (ja) 2011-01-06
KR20100102571A (ko) 2010-09-24
KR20110084491A (ko) 2011-07-25
JP2010278013A (ja) 2010-12-09
TWI396626B (zh) 2013-05-21
JP4766185B2 (ja) 2011-09-07
JP2010267627A (ja) 2010-11-25
TW201101343A (en) 2011-01-01
KR20110084492A (ko) 2011-07-25
KR101038614B1 (ko) 2011-06-03
JP2010034037A (ja) 2010-02-12
JP4970574B2 (ja) 2012-07-11
JP2011233529A (ja) 2011-11-17
CN102298988A (zh) 2011-12-28
JP2011233530A (ja) 2011-11-17
TW201013710A (en) 2010-04-01
CN101615446B (zh) 2013-07-17
KR20100002196A (ko) 2010-01-06
JP4623224B2 (ja) 2011-02-02
TWI415144B (zh) 2013-11-11
CN102298987A (zh) 2011-12-28
CN102298988B (zh) 2016-09-07
KR20110084488A (ko) 2011-07-25
KR20110084489A (ko) 2011-07-25
JP4661985B2 (ja) 2011-03-30
KR20110084490A (ko) 2011-07-25
KR101120277B1 (ko) 2012-03-07
KR20110130376A (ko) 2011-12-05
CN101615446A (zh) 2009-12-30

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Application publication date: 20111228