TWI393804B - Metal surface treatment agent and its use - Google Patents

Metal surface treatment agent and its use Download PDF

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Publication number
TWI393804B
TWI393804B TW096117828A TW96117828A TWI393804B TW I393804 B TWI393804 B TW I393804B TW 096117828 A TW096117828 A TW 096117828A TW 96117828 A TW96117828 A TW 96117828A TW I393804 B TWI393804 B TW I393804B
Authority
TW
Taiwan
Prior art keywords
phenyl
imidazole
naphthyl
methylimidazole
benzimidazole
Prior art date
Application number
TW096117828A
Other languages
English (en)
Chinese (zh)
Other versions
TW200804622A (en
Inventor
Hirao Hirohiko
Kikukawa Yoshimasa
Murai Takayuki
Original Assignee
Shikoku Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shikoku Chem filed Critical Shikoku Chem
Publication of TW200804622A publication Critical patent/TW200804622A/zh
Application granted granted Critical
Publication of TWI393804B publication Critical patent/TWI393804B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
TW096117828A 2006-05-19 2007-05-18 Metal surface treatment agent and its use TWI393804B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006140229A JP5036216B2 (ja) 2006-05-19 2006-05-19 金属の表面処理剤およびその利用

Publications (2)

Publication Number Publication Date
TW200804622A TW200804622A (en) 2008-01-16
TWI393804B true TWI393804B (zh) 2013-04-21

Family

ID=38723243

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096117828A TWI393804B (zh) 2006-05-19 2007-05-18 Metal surface treatment agent and its use

Country Status (5)

Country Link
JP (1) JP5036216B2 (ja)
KR (1) KR101298386B1 (ja)
CN (1) CN101448978B (ja)
TW (1) TWI393804B (ja)
WO (1) WO2007135930A1 (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5313044B2 (ja) * 2008-08-08 2013-10-09 四国化成工業株式会社 銅または銅合金の表面処理剤及びその利用
JP5457814B2 (ja) 2009-12-17 2014-04-02 コーア株式会社 電子部品の実装構造
CN102121108B (zh) * 2011-02-23 2012-11-21 广东东硕科技有限公司 无铅印制电路板用复配osp处理剂
CN102153514B (zh) * 2011-02-23 2013-02-20 广东东硕科技有限公司 含氟苄基苯并咪唑化合物制造方法
CN102775351B (zh) * 2011-05-12 2015-09-30 比亚迪股份有限公司 一种二咪唑类化合物及其制备方法和一种有机助焊剂处理液
JP5615227B2 (ja) 2011-05-23 2014-10-29 四国化成工業株式会社 銅または銅合金の表面処理剤及びその利用
JP5615233B2 (ja) 2011-06-20 2014-10-29 四国化成工業株式会社 銅または銅合金の表面処理剤及びその利用
JP5985367B2 (ja) * 2012-11-20 2016-09-06 四国化成工業株式会社 銅または銅合金の表面処理方法およびその利用
CN103058931B (zh) * 2012-12-31 2015-07-01 广东东硕科技有限公司 2-(3＇,5＇-二卤苯甲基)苯并咪唑类四个新型化合物及其制备方法
JP6243792B2 (ja) * 2014-05-12 2017-12-06 花王株式会社 はんだが固化された回路基板の製造方法、電子部品が搭載された回路基板の製造方法、及び、フラックス用洗浄剤組成物
WO2019006628A1 (zh) * 2017-07-03 2019-01-10 深圳市盈恒科技有限公司 一种无铬钝化剂、铝件及其表面钝化处理方法
CN110230048A (zh) * 2019-07-18 2019-09-13 广东超华科技股份有限公司 一种锂离子电池用电解铜箔的无铬免水洗防氧化液及防氧化工艺
US11676926B2 (en) 2020-08-24 2023-06-13 Schlumberger Technology Corporation Solder joints on nickel surface finishes without gold plating
CN114134493A (zh) * 2021-11-23 2022-03-04 沈阳加克科技有限公司 一种金属表面钝化液
CN115011956A (zh) * 2022-06-28 2022-09-06 南通赛可特电子有限公司 一种有机铜面保护剂及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005179765A (ja) * 2003-12-24 2005-07-07 Nikko Materials Co Ltd 銅及び銅合金の表面処理剤
US20050217757A1 (en) * 2004-03-30 2005-10-06 Yoshihiro Miyano Preflux, flux, solder paste and method of manufacturing lead-free soldered body

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6192778A (ja) * 1984-10-09 1986-05-10 C Uyemura & Co Ltd 被ハンダ付け部品
JP2558982B2 (ja) * 1991-12-25 1996-11-27 日鉱金属株式会社 貴金属めっき材の封孔処理方法
JPH1046385A (ja) * 1996-08-02 1998-02-17 Daiwa Kasei Kenkyusho:Kk 電気・電子回路部品
JP3579550B2 (ja) * 1996-09-30 2004-10-20 株式会社大和化成研究所 電気・電子回路部品
DE10050862C2 (de) * 2000-10-06 2002-08-01 Atotech Deutschland Gmbh Bad und Verfahren zum stromlosen Abscheiden von Silber auf Metalloberflächen
JP2003328182A (ja) * 2002-05-13 2003-11-19 Yutaka Fujiwara ラックレスめっき用スズ−銀合金めっき浴
JP2004176179A (ja) * 2002-11-15 2004-06-24 Chubu Kiresuto Kk 電子部品端子の水溶性半田濡れ性向上処理剤および処理法
CN1761773B (zh) * 2003-03-19 2010-05-05 四国化成工业株式会社 新型咪唑化合物及其利用
JP2005008975A (ja) * 2003-06-20 2005-01-13 Nippon Paint Co Ltd 金属表面処理方法、表面処理アルミニウム系金属、及び、親水処理の前処理方法
JP2005169495A (ja) * 2003-11-18 2005-06-30 Yoshihiro Miyano プリフラックス、フラックス、ソルダーペースト及び鉛フリーはんだ付け体の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005179765A (ja) * 2003-12-24 2005-07-07 Nikko Materials Co Ltd 銅及び銅合金の表面処理剤
US20050217757A1 (en) * 2004-03-30 2005-10-06 Yoshihiro Miyano Preflux, flux, solder paste and method of manufacturing lead-free soldered body

Also Published As

Publication number Publication date
TW200804622A (en) 2008-01-16
JP2007308776A (ja) 2007-11-29
CN101448978A (zh) 2009-06-03
KR101298386B1 (ko) 2013-08-20
JP5036216B2 (ja) 2012-09-26
WO2007135930A1 (ja) 2007-11-29
CN101448978B (zh) 2012-06-13
KR20090009249A (ko) 2009-01-22

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