TW202346639A - 銅或銅合金之表面處理劑 - Google Patents
銅或銅合金之表面處理劑 Download PDFInfo
- Publication number
- TW202346639A TW202346639A TW112111907A TW112111907A TW202346639A TW 202346639 A TW202346639 A TW 202346639A TW 112111907 A TW112111907 A TW 112111907A TW 112111907 A TW112111907 A TW 112111907A TW 202346639 A TW202346639 A TW 202346639A
- Authority
- TW
- Taiwan
- Prior art keywords
- imidazole
- group
- dichlorophenyl
- phenyl
- copper
- Prior art date
Links
- 239000012756 surface treatment agent Substances 0.000 title claims abstract description 84
- 239000010949 copper Substances 0.000 title claims abstract description 61
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 60
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 60
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 22
- -1 imidazole compound Chemical class 0.000 claims abstract description 249
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 126
- 239000000126 substance Substances 0.000 claims abstract description 72
- 125000001424 substituent group Chemical group 0.000 claims description 69
- 125000000217 alkyl group Chemical group 0.000 claims description 50
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 46
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 46
- 125000004432 carbon atom Chemical group C* 0.000 claims description 43
- 125000001624 naphthyl group Chemical group 0.000 claims description 27
- 150000001556 benzimidazoles Chemical class 0.000 claims description 23
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 20
- 125000005843 halogen group Chemical group 0.000 claims description 15
- 125000001544 thienyl group Chemical group 0.000 claims description 13
- 125000004076 pyridyl group Chemical group 0.000 claims description 12
- 125000002541 furyl group Chemical group 0.000 claims description 10
- 125000003277 amino group Chemical group 0.000 claims description 8
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 8
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 5
- 125000004923 naphthylmethyl group Chemical group C1(=CC=CC2=CC=CC=C12)C* 0.000 claims description 5
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 4
- 125000005301 thienylmethyl group Chemical group [H]C1=C([H])C([H])=C(S1)C([H])([H])* 0.000 claims description 4
- 238000005476 soldering Methods 0.000 abstract description 11
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 54
- 230000000052 comparative effect Effects 0.000 description 36
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 31
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 28
- 230000015572 biosynthetic process Effects 0.000 description 27
- 238000000034 method Methods 0.000 description 24
- 238000012360 testing method Methods 0.000 description 23
- 238000003786 synthesis reaction Methods 0.000 description 22
- 239000000203 mixture Substances 0.000 description 20
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 16
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 15
- 239000002253 acid Substances 0.000 description 15
- 239000002585 base Substances 0.000 description 15
- 238000011156 evaluation Methods 0.000 description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 12
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 12
- 150000002460 imidazoles Chemical class 0.000 description 12
- 230000000630 rising effect Effects 0.000 description 11
- WNEPQGXFDUUWRF-UHFFFAOYSA-N 2-(3-amino-1,2,4-triazol-1-yl)acetic acid Chemical compound NC=1N=CN(CC(O)=O)N=1 WNEPQGXFDUUWRF-UHFFFAOYSA-N 0.000 description 10
- TXUQJAOFDMFKDK-UHFFFAOYSA-N 2-(naphthalen-2-ylmethyl)-1h-benzimidazole Chemical compound C1=CC=CC2=CC(CC=3NC4=CC=CC=C4N=3)=CC=C21 TXUQJAOFDMFKDK-UHFFFAOYSA-N 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 235000002639 sodium chloride Nutrition 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- AGOWGGKOXAEXKJ-UHFFFAOYSA-N 2-[(3-chlorophenyl)methyl]-5-naphthalen-1-yl-1h-imidazole Chemical compound ClC1=CC=CC(CC=2NC(=CN=2)C=2C3=CC=CC=C3C=CC=2)=C1 AGOWGGKOXAEXKJ-UHFFFAOYSA-N 0.000 description 6
- YECSLYXTXWSKBO-UHFFFAOYSA-N 2-nonyl-1h-benzimidazole Chemical compound C1=CC=C2NC(CCCCCCCCC)=NC2=C1 YECSLYXTXWSKBO-UHFFFAOYSA-N 0.000 description 6
- INQRDWQKHMKYTQ-UHFFFAOYSA-N 5-methyl-4-naphthalen-1-yl-2-phenyl-1h-imidazole Chemical compound N=1C(C=2C3=CC=CC=C3C=CC=2)=C(C)NC=1C1=CC=CC=C1 INQRDWQKHMKYTQ-UHFFFAOYSA-N 0.000 description 6
- LMMVLKWKBWKSDI-UHFFFAOYSA-N 5-methyl-4-phenyl-2-thiophen-2-yl-1h-imidazole Chemical compound CC=1NC(C=2SC=CC=2)=NC=1C1=CC=CC=C1 LMMVLKWKBWKSDI-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000460 chlorine Substances 0.000 description 6
- 238000010992 reflux Methods 0.000 description 6
- 239000011780 sodium chloride Substances 0.000 description 6
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- UYWWLYCGNNCLKE-UHFFFAOYSA-N 2-pyridin-4-yl-1h-benzimidazole Chemical class N=1C2=CC=CC=C2NC=1C1=CC=NC=C1 UYWWLYCGNNCLKE-UHFFFAOYSA-N 0.000 description 5
- VELJKZCOFOESAQ-UHFFFAOYSA-N 5-benzyl-3-phenyl-1h-1,2,4-triazole Chemical compound C=1C=CC=CC=1CC(NN=1)=NC=1C1=CC=CC=C1 VELJKZCOFOESAQ-UHFFFAOYSA-N 0.000 description 5
- LKSKYTPSWHNROI-UHFFFAOYSA-N 5-methyl-3-octyl-1h-1,2,4-triazole Chemical compound CCCCCCCCC1=NNC(C)=N1 LKSKYTPSWHNROI-UHFFFAOYSA-N 0.000 description 5
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical compound NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 description 5
- 235000011054 acetic acid Nutrition 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 235000019441 ethanol Nutrition 0.000 description 5
- 230000005496 eutectics Effects 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 4
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- 239000005749 Copper compound Substances 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 229910020816 Sn Pb Inorganic materials 0.000 description 4
- 229910020922 Sn-Pb Inorganic materials 0.000 description 4
- 229910008783 Sn—Pb Inorganic materials 0.000 description 4
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 150000001880 copper compounds Chemical class 0.000 description 4
- 239000000706 filtrate Substances 0.000 description 4
- 235000019253 formic acid Nutrition 0.000 description 4
- 150000002366 halogen compounds Chemical class 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- KAESVJOAVNADME-UHFFFAOYSA-N 1H-pyrrole Natural products C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 3
- MBNDVRNZPXEYHL-UHFFFAOYSA-N 5-[(3-amino-1h-1,2,4-triazol-5-yl)methyl]-1h-1,2,4-triazol-3-amine Chemical compound NC1=NNC(CC=2NN=C(N)N=2)=N1 MBNDVRNZPXEYHL-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 125000001309 chloro group Chemical group Cl* 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229910001431 copper ion Inorganic materials 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- ZDGGJQMSELMHLK-UHFFFAOYSA-N m-Trifluoromethylhippuric acid Chemical compound OC(=O)CNC(=O)C1=CC=CC(C(F)(F)F)=C1 ZDGGJQMSELMHLK-UHFFFAOYSA-N 0.000 description 3
- 150000007522 mineralic acids Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 150000003752 zinc compounds Chemical class 0.000 description 3
- CLUAAGKBBZBESA-UHFFFAOYSA-N 2-(2,4-dichlorophenyl)-5-methyl-4-phenyl-1h-imidazole Chemical compound CC=1NC(C=2C(=CC(Cl)=CC=2)Cl)=NC=1C1=CC=CC=C1 CLUAAGKBBZBESA-UHFFFAOYSA-N 0.000 description 2
- OWVMFLLVLFONOO-UHFFFAOYSA-N 3-butoxypropanoic acid Chemical compound CCCCOCCC(O)=O OWVMFLLVLFONOO-UHFFFAOYSA-N 0.000 description 2
- WHBMMWSBFZVSSR-UHFFFAOYSA-N 3-hydroxybutyric acid Chemical compound CC(O)CC(O)=O WHBMMWSBFZVSSR-UHFFFAOYSA-N 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 2
- YZGQDNOIGFBYKF-UHFFFAOYSA-N Ethoxyacetic acid Chemical compound CCOCC(O)=O YZGQDNOIGFBYKF-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- LCTONWCANYUPML-UHFFFAOYSA-N Pyruvic acid Chemical compound CC(=O)C(O)=O LCTONWCANYUPML-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000004480 active ingredient Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical compound [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 239000012752 auxiliary agent Substances 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000001869 cobalt compounds Chemical class 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- QTMDXZNDVAMKGV-UHFFFAOYSA-L copper(ii) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- JXTHNDFMNIQAHM-UHFFFAOYSA-N dichloroacetic acid Chemical compound OC(=O)C(Cl)Cl JXTHNDFMNIQAHM-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- BYEVBITUADOIGY-UHFFFAOYSA-N ethyl nonanoate Chemical compound CCCCCCCCC(=O)OCC BYEVBITUADOIGY-UHFFFAOYSA-N 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- HHLFWLYXYJOTON-UHFFFAOYSA-N glyoxylic acid Chemical compound OC(=O)C=O HHLFWLYXYJOTON-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine hydrate Chemical compound O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 2
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 150000002697 manganese compounds Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- 150000002816 nickel compounds Chemical class 0.000 description 2
- FBUKVWPVBMHYJY-UHFFFAOYSA-N nonanoic acid Chemical compound CCCCCCCCC(O)=O FBUKVWPVBMHYJY-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 239000008213 purified water Substances 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- 235000009518 sodium iodide Nutrition 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
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- QAHREYKOYSIQPH-UHFFFAOYSA-L cobalt(II) acetate Chemical compound [Co+2].CC([O-])=O.CC([O-])=O QAHREYKOYSIQPH-UHFFFAOYSA-L 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- NKNDPYCGAZPOFS-UHFFFAOYSA-M copper(i) bromide Chemical compound Br[Cu] NKNDPYCGAZPOFS-UHFFFAOYSA-M 0.000 description 1
- LSXDOTMGLUJQCM-UHFFFAOYSA-M copper(i) iodide Chemical compound I[Cu] LSXDOTMGLUJQCM-UHFFFAOYSA-M 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- HFDWIMBEIXDNQS-UHFFFAOYSA-L copper;diformate Chemical compound [Cu+2].[O-]C=O.[O-]C=O HFDWIMBEIXDNQS-UHFFFAOYSA-L 0.000 description 1
- QYCVHILLJSYYBD-UHFFFAOYSA-L copper;oxalate Chemical compound [Cu+2].[O-]C(=O)C([O-])=O QYCVHILLJSYYBD-UHFFFAOYSA-L 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 150000003983 crown ethers Chemical class 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 229940045803 cuprous chloride Drugs 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- WOWBFOBYOAGEEA-UHFFFAOYSA-N diafenthiuron Chemical compound CC(C)C1=C(NC(=S)NC(C)(C)C)C(C(C)C)=CC(OC=2C=CC=CC=2)=C1 WOWBFOBYOAGEEA-UHFFFAOYSA-N 0.000 description 1
- 229960005215 dichloroacetic acid Drugs 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- ZZGUZQXLSHSYMH-UHFFFAOYSA-N ethane-1,2-diamine;propanoic acid Chemical compound NCCN.CCC(O)=O.CCC(O)=O ZZGUZQXLSHSYMH-UHFFFAOYSA-N 0.000 description 1
- WCQOBLXWLRDEQA-UHFFFAOYSA-N ethanimidamide;hydrochloride Chemical compound Cl.CC(N)=N WCQOBLXWLRDEQA-UHFFFAOYSA-N 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N ethyl formate Chemical compound CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- DEFVIWRASFVYLL-UHFFFAOYSA-N ethylene glycol bis(2-aminoethyl)tetraacetic acid Chemical compound OC(=O)CN(CC(O)=O)CCOCCOCCN(CC(O)=O)CC(O)=O DEFVIWRASFVYLL-UHFFFAOYSA-N 0.000 description 1
- IFQUWYZCAGRUJN-UHFFFAOYSA-N ethylenediaminediacetic acid Chemical compound OC(=O)CNCCNCC(O)=O IFQUWYZCAGRUJN-UHFFFAOYSA-N 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 235000012208 gluconic acid Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- PKWIYNIDEDLDCJ-UHFFFAOYSA-N guanazole Chemical compound NC1=NNC(N)=N1 PKWIYNIDEDLDCJ-UHFFFAOYSA-N 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- GPUJTUQMITZQEV-UHFFFAOYSA-N hydrazine;2-phenylacetic acid Chemical compound NN.OC(=O)CC1=CC=CC=C1 GPUJTUQMITZQEV-UHFFFAOYSA-N 0.000 description 1
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- JDNTWHVOXJZDSN-UHFFFAOYSA-N iodoacetic acid Chemical compound OC(=O)CI JDNTWHVOXJZDSN-UHFFFAOYSA-N 0.000 description 1
- 150000002506 iron compounds Chemical class 0.000 description 1
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011656 manganese carbonate Substances 0.000 description 1
- 235000006748 manganese carbonate Nutrition 0.000 description 1
- 229940093474 manganese carbonate Drugs 0.000 description 1
- 239000011565 manganese chloride Substances 0.000 description 1
- 235000002867 manganese chloride Nutrition 0.000 description 1
- 229940099607 manganese chloride Drugs 0.000 description 1
- 229940099596 manganese sulfate Drugs 0.000 description 1
- 239000011702 manganese sulphate Substances 0.000 description 1
- 235000007079 manganese sulphate Nutrition 0.000 description 1
- BHVPEUGTPDJECS-UHFFFAOYSA-L manganese(2+);diformate Chemical compound [Mn+2].[O-]C=O.[O-]C=O BHVPEUGTPDJECS-UHFFFAOYSA-L 0.000 description 1
- RGVLTEMOWXGQOS-UHFFFAOYSA-L manganese(2+);oxalate Chemical compound [Mn+2].[O-]C(=O)C([O-])=O RGVLTEMOWXGQOS-UHFFFAOYSA-L 0.000 description 1
- 229910000016 manganese(II) carbonate Inorganic materials 0.000 description 1
- SQQMAOCOWKFBNP-UHFFFAOYSA-L manganese(II) sulfate Chemical compound [Mn+2].[O-]S([O-])(=O)=O SQQMAOCOWKFBNP-UHFFFAOYSA-L 0.000 description 1
- XMWCXZJXESXBBY-UHFFFAOYSA-L manganese(ii) carbonate Chemical compound [Mn+2].[O-]C([O-])=O XMWCXZJXESXBBY-UHFFFAOYSA-L 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- RMIODHQZRUFFFF-UHFFFAOYSA-N methoxyacetic acid Chemical compound COCC(O)=O RMIODHQZRUFFFF-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000008 nickel(II) carbonate Inorganic materials 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- ZULUUIKRFGGGTL-UHFFFAOYSA-L nickel(ii) carbonate Chemical compound [Ni+2].[O-]C([O-])=O ZULUUIKRFGGGTL-UHFFFAOYSA-L 0.000 description 1
- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 125000003854 p-chlorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1Cl 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 150000004032 porphyrins Chemical class 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000011698 potassium fluoride Substances 0.000 description 1
- 235000003270 potassium fluoride Nutrition 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 229940107700 pyruvic acid Drugs 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- FDRCDNZGSXJAFP-UHFFFAOYSA-M sodium chloroacetate Chemical compound [Na+].[O-]C(=O)CCl FDRCDNZGSXJAFP-UHFFFAOYSA-M 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- WEZYFYMYMKUAHY-UHFFFAOYSA-N tert-butyl 2,4-dibenzylpiperazine-1-carboxylate Chemical compound C1C(CC=2C=CC=CC=2)N(C(=O)OC(C)(C)C)CCN1CC1=CC=CC=C1 WEZYFYMYMKUAHY-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
- WGIWBXUNRXCYRA-UHFFFAOYSA-H trizinc;2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O WGIWBXUNRXCYRA-UHFFFAOYSA-H 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229940102001 zinc bromide Drugs 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011746 zinc citrate Substances 0.000 description 1
- 235000006076 zinc citrate Nutrition 0.000 description 1
- 229940068475 zinc citrate Drugs 0.000 description 1
- SRWMQSFFRFWREA-UHFFFAOYSA-M zinc formate Chemical compound [Zn+2].[O-]C=O SRWMQSFFRFWREA-UHFFFAOYSA-M 0.000 description 1
- 239000011576 zinc lactate Substances 0.000 description 1
- 235000000193 zinc lactate Nutrition 0.000 description 1
- 229940050168 zinc lactate Drugs 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
- ZPEJZWGMHAKWNL-UHFFFAOYSA-L zinc;oxalate Chemical compound [Zn+2].[O-]C(=O)C([O-])=O ZPEJZWGMHAKWNL-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/58—Treatment of other metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Chemical Treatment Of Metals (AREA)
- Paints Or Removers (AREA)
Abstract
本發明之課題在於提供一種表面處理劑,係形成於銅表面之化成皮膜的耐熱性優越,進行焊接時可獲得良好焊接性。本發明之銅或銅合金之表面處理劑係含有:化學式(I)所示咪唑化合物或化學式(II)所示苯并咪唑化合物;與化學式(III)所示三唑化合物。化學式(I)~(III)中之各取代基的定義係與說明書中之定義相同。
Description
本發明係關於印刷佈線板之銅或銅合金所使用的表面處理劑。
作為最近之印刷佈線板的安裝方法,廣泛採用提升安裝密度之表面安裝。此種表面安裝方法區分為:將晶片零件藉由銲錫膏進行接合的兩面表面安裝;組合了晶片零件之藉由銲錫膏進行之表面安裝與分散式零件之導通孔安裝的混載安裝等。任一安裝方法中,由於印刷佈線板進行複數次之焊接,故曝露於高溫而承受嚴苛之熱履歷。
其結果,構成印刷佈線板之電路部的銅或銅合金(以下有時簡稱為銅)的表面因被加熱而促進氧化皮膜形成,故無法良好保持該電路部表面的焊接性。
為了保護此種印刷佈線板之銅電路部免於空氣或熱所造成的氧化,已廣泛進行使用表面處理劑(預焊劑)於銅電路部表面形成化成皮膜的處理。對於藉由表面處理劑所形成之OSP(Organic Solderability Preservative,有機保焊膜)膜之化成皮膜,係要求即使銅電路部受到複數次熱履歷,化成皮膜仍不變性(劣化)而保護銅電路部,藉此使焊接性保持良好。
另一方面,習知以來在將電子零件接合至印刷佈線板等時,廣泛使用錫-鉛合金之共晶銲錫,但近年來考慮到此銲錫合金中所含鉛(Pb)對人體之有害性,而要求使用不含鉛之銲錫。
因此已研討了各種無鉛銲錫,例如提案有以錫(Sn)為基底金屬,並添加銀(Ag)、鋅(Zn)、鉍(Bi)、銦(In)、銻(Sb)、鈷(Co)、錳(Mn)、鎳(Ni)或銅(Cu)等金屬的無鉛銲錫。
然而,習知之Sn-Pb系共晶銲錫由於對接合母材所使用之金屬、尤其對銅表面之潤濕性優越且對銅牢固地接合,故在銅構件間之接合性方面可獲得高可靠性。
相對於此,相較於習知之Sn-Pb系共晶銲錫,無鉛銲錫由於對銅表面之潤濕性劣化,故產生焊接性差、出現空隙等接合不良,接合強度亦低。
因此,於使用無鉛銲錫時,要求選定焊接性更良好之銲錫合金及適合於無鉛銲錫的助焊劑,但對於用於防止銅表面氧化之表面處理劑,亦要求改善無鉛銲錫之潤濕性、使其成為焊接性良好的機能。
又,無鉛銲錫大多融點較高,相較於習知之Sn-Pb系共晶銲錫,其焊接溫度高出20~50℃左右,故對於該表面處理劑尚期望可形成具有優越耐熱性的化成皮膜。
於此種表面處理劑中係使用咪唑化合物作為有效成分,並進行各種研討。例如專利文獻1、2提案有含有具特定取代基之咪唑化合物的銅或銅合金之表面處理劑。
[先前技術文獻]
[專利文獻]
[專利文獻1] 日本專利特開2012-241251號公報
[專利文獻2] 日本專利特開2013-1977號公報
(發明所欲解決之問題)
為了提升電子機器之性能,而要求維持電子零件對印刷佈線板之良好焊接性,尤其於使用無鉛銲錫的情況,為了防止銅表面氧化,而要求表面處理劑之進一步改善。
因此,本發明之課題在於提供一種表面處理劑,係形成於銅表面之化成皮膜的耐熱性優越,進行焊接時可獲得良好焊接性。
(解決問題之技術手段)
本案發明人等為了解決上述課題而潛心研究,結果發現,藉由使用特定構造之咪唑化合物或苯并咪唑化合物,並進一步含有特定構造之三唑化合物作為助劑的表面處理劑,對具有銅電路部之印刷佈線板進行處理,則可解決上述課題,遂完成本發明。
亦即,本發明係如以下[1]~[6]。
[1]一種銅或銅合金之表面處理劑,係含有:下述化學式(I)所示咪唑化合物或下述化學式(II)所示苯并咪唑化合物;與下述化學式(III)所示三唑化合物;
[化1]
(式(I)中,
R
1表示氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、環烷基、亦可具有取代基之苯基、亦可具有取代基之萘基、亦可具有取代基之苄基、萘甲基、-CH-(Ph)
2、-(CH
2)
k-Ph、噻吩基、噻吩甲基、呋喃基或吡啶基;其中,Ph表示亦可具有取代基之苯基,k表示2~5之整數;
R
2可為相同或相異,表示氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、環烷基、亦可具有取代基之苯基、亦可具有取代基之萘基、噻吩基或呋喃基;其中,排除R
2同時為氫原子的情況);
[化2]
(式(II)中,
R
3表示碳數1~18之直鏈狀或分支鏈狀之烷基、-(CH
2)
m-Ph、-(CH
2)
m-Np或下式(1)所示之基,Ph表示亦可具有取代基之苯基,Np表示亦可具有取代基之萘基,m表示1~5之整數;
[化3]
(式(1)中,m表示1~5之整數);
R
4可為相同或相異,表示氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、硝基或鹵原子);
[化4]
(式(III)中,
R
5及R
6可為相同或相異,表示氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、胺基、亦可具有取代基之苯基、亦可具有取代基之苄基、萘基、吡啶基或下式(2)所示之基;其中,排除R
5及R
6同時為下式(2)所示之基的情況;
[化5]
(式(2)中,t表示0~12之整數);
R
7表示氫原子、苄基或-(CH
2)
n-COOH,n表示1~5之整數)。
[2]如[1]之銅或銅合金之表面處理劑,其中,進一步含有鹵化物離子。
[3]如[2]之銅或銅合金之表面處理劑,其中,上述鹵化物離子為氯化物離子。
[4]如[1]~[3]中任一項之銅或銅合金之表面處理劑,其中,進一步含有鋅離子。
[5]如[1]~[4]中任一項之銅或銅合金之表面處理劑,其中,上述化學式(III)所示三唑化合物係相對於上述化學式(I)所示咪唑化合物或上述化學式(II)所示苯并咪唑化合物,依0.005~3.0之莫耳比含有。
[6]如[1]~[5]中任一項之銅或銅合金之表面處理劑,其中,pH為2~5。
(對照先前技術之功效)
本發明之銅或銅合金之表面處理劑係於構成印刷佈線板之電路部等的銅或銅合金的表面,可形成耐熱性優越的化成皮膜,同時使銲錫對該表面之潤濕性飛躍性地提升,使焊接性良好。
以下詳細說明本發明。又,本發明並不限定於以下說明之實施形態。
本發明之銅或銅合金之表面處理劑係含有式(I)所示咪唑化合物或式(II)所示苯并咪唑化合物作為有效成分,並含有式(III)所示三唑化合物作為助劑的表面處理劑(水溶性預焊劑)。
當本發明之表面處理劑附著於銅或銅合金時,由銅表面溶出之銅離子與式(I)所示咪唑化合物或式(II)所示苯并咪唑化合物進行反應,形成銅-咪唑錯合物。此銅-咪唑錯合物係對表面處理劑呈不溶,故沉澱於銅或銅表面而形成化成皮膜(OSP膜)。藉由於表面處理劑中含有式(III)所示三唑化合物,其作用雖尚未闡明,但可推測由於三唑化合物被攝取至化成皮膜中,結果使化成皮膜之耐熱性提升。
(式(I)所示咪唑化合物)
式(I)所示咪唑化合物(以下亦稱為咪唑化合物(I))係具有以下構造。
[化6]
(式(I)中,
R
1表示氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、環烷基、亦可具有取代基之苯基、亦可具有取代基之萘基、亦可具有取代基之苄基、萘甲基、-CH-(Ph)
2、-(CH
2)
k-Ph、噻吩基、噻吩甲基、呋喃基或吡啶基;其中,Ph表示亦可具有取代基之苯基,k表示2~5之整數。
R
2可為相同或相異,表示氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、環烷基、亦可具有取代基之苯基、亦可具有取代基之萘基、噻吩基或呋喃基;其中,排除R
2同時為氫原子的情況。)
式(I)中,R
1表示氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、環烷基、亦可具有取代基之苯基、亦可具有取代基之萘基、亦可具有取代基之苄基、萘甲基、-CH-(Ph)
2(Ph為亦可具有取代基之苯基)、-(CH
2)
k-Ph(Ph為亦可具有取代基之苯基,k為2~5之整數)、噻吩基、噻吩甲基、呋喃基或吡啶基。
作為碳數1~18之直鏈狀之烷基,具體可舉例如甲基、乙基、正丙基、正丁基、正戊基、正己基、正庚基、正辛基、正壬基、正癸基、正十一基、正十二基、正十三基、正十四基、正十五基、正十六基、正十七基、正十八基、等。作為碳數1~18之分支鏈狀之烷基,為碳數3~18之分支鏈狀烷基,具體可舉例如異丙基、異丁基、第二丁基、第三丁基、異戊基、第二戊基、第三戊基、異己基、第二己基、第三己基、異庚基、第二庚基、第三庚基、異辛基、第二辛基、第三辛基等。
作為於苯基、萘基及苄基之氫基所取代的取代基,可舉例如碳數1~18之直鏈狀或分支鏈狀之烷基、苯基、甲氧基、乙氧基、鹵原子等。
作為於苯基、萘基及苄基之氫基所取代的鹵原子,可舉例如氟(F)、氯原子(Cl)、溴原子(Br)、碘原子(I)等。作為經鹵原子取代的苯基,具體可舉例如2-氟苯基、3-氟苯基、4-氟苯基、2-氯苯基、3-氯苯基、4-氯苯基、2-溴苯基、3-溴苯基、4-溴苯基、2-碘苯基、3-碘苯基、4-碘苯基、2,3-二氯苯基、2,4-二氯苯基、2,5-二氯苯基、2,6-二氯苯基、3,4-二氯苯基、3,5-二氯苯基、2,4,5-三氯苯基、3,4,5-三氯苯基等。作為經鹵原子取代之苄 ,具體可舉例如2-氟苄基、3-氟苄基、4-氟苄基、2-氯苄基、3-氯苄基、4-氯苄基、2-溴苄基、3-溴苄基、4-溴苄基、2-碘苄基、3-碘苄基、4-碘苄基、2,3-二氯苄基、2,4-二氯苄基、2,5-二氯苄基、2,6-二氯苄基、3,4-二氯苄基、3,5-二氯苄基、2,4,5-三氯苄基、3,4,5-三氯苄基等。
作為噻吩基,可舉例如2-噻吩基與3-噻吩基;作為呋喃基,可舉例如2-呋喃基與3-呋喃基。
由化成皮膜之耐熱性的觀點而言,R
1較佳係碳數1~18之直鏈狀或分支鏈狀之烷基、亦可具有取代基之苯基、亦可具有取代基之萘基、亦可具有取代基之苄基、萘甲基、噻吩基。
R
2為表示氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、環烷基、亦可具有取代基之苯基、亦可具有取代基之萘基、噻吩基或呋喃基。此等之取代基係與上述R
1所記載者相同。2個R
2可為相同或相異,但R
2不同時為氫原子。
由化成皮膜之耐熱性的觀點而言,R
2較佳為氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、亦可具有取代基之苯基、亦可具有取代基之萘基、噻吩基、呋喃基。其中,排除R
2同時為氫原子的情況。
作為式(I)所示咪唑化合物(咪唑化合物(I)),較佳為式(I-1)~式(I-6)所示咪唑化合物。
[化7]
(式(I-1)中,R
112表示碳數1~18之直鏈狀或分支鏈狀之烷基;R
214表示碳數1~18之直鏈狀或分支鏈狀之烷基或亦可具有取代基之苯基,R
215表示氫原子或碳數1~18之直鏈狀或分支鏈狀之烷基。
式(I-2)中,R
224表示亦可具有取代基之苯基、亦可具有取代基之萘基、噻吩基或呋喃基,R
225表示氫原子或碳數1~18之直鏈狀或分支鏈狀之烷基,R
226可為相同或相異,表示碳數1~18之直鏈狀或分支鏈狀之烷基、甲氧基、乙氧基或鹵原子,p表示0~3之整數。
式(I-3)中,R
234表示亦可具有取代基之苯基,R
235表示氫原子或碳數1~18之直鏈狀或分支鏈狀之烷基。
式(I-4)中,R
224表示亦可具有取代基之苯基、萘基或噻吩基,R
245表示氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基或亦可具有取代基之苯基,R
246可為相同或相異,表示碳數1~18之直鏈狀或分支鏈狀之烷基、鹵原子,p表示0~3之整數。
式(I-5)中,R
254表示亦可具有取代基之苯基,R
255表示氫原子或碳數1~18之直鏈狀或分支鏈狀之烷基。
式(I-6)中,R
264表示亦可具有取代基之苯基或萘基,R
265表示氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基或亦可具有取代基之苯基。)
作為咪唑化合物(I)之具體例,式(I-1)所示咪唑化合物可舉例如
2-乙基-4-甲基咪唑、
2-十一基-4-甲基咪唑、
2,4,5-三甲基咪唑、
4,5-二甲基-2-辛基咪唑、
4-(3,4-二氯苯基)-5-甲基-2-壬基咪唑、
4-(2,4-二氯苯基)-5- 甲基-2-十一基咪唑等。
作為式(I-2)所示咪唑化合物,可舉例如
2,4-二苯基咪唑、
2,4-二苯基-5-甲基咪唑、
2,4-二苯基-5-己基咪唑、
2-苯基-4-(2-氯苯基)咪唑、
2-苯基-4-(3-氯苯基)咪唑、
2-苯基-4-(4-氯苯基)咪唑、
2-苯基-4-(4-氟苯基)咪唑、
2-苯基-4-(4-溴苯基)咪唑、
2-苯基-4-(4-碘苯基)咪唑、
2-苯基-4-(2,3-二氯苯基)咪唑、
2-苯基-4-(2,4-二氯苯基)咪唑、
2-苯基-4-(2,5-二氯苯基)咪唑、
2-苯基-4-(2,6-二氯苯基)咪唑、
2-苯基-4-(3,4-二氯苯基)咪唑、
2-苯基-4-(3,5-二氯苯基)咪唑、
2-苯基-4-(2-丙基-3-氯苯基)咪唑、
2-苯基-4-(2-氯苯基)-5-甲基咪唑、
2-苯基-4-(3-氯苯基)-5-甲基咪唑、
2-苯基-4-(4-氯苯基)-5-甲基咪唑、
2-苯基-4-(2,3-二氯苯基)-5-甲基咪唑、
2-苯基-4-(2,4-二氯苯基)-5-甲基咪唑、
2-苯基-4-(2,5-二氯苯基)-5-甲基咪唑、
2-苯基-4-(2,6-二氯苯基)-5-甲基咪唑、
2-苯基-4-(3,4-二氯苯基)-5-甲基咪唑、
2-苯基-4-(3,5-二氯苯基)-5-甲基咪唑、
2-苯基-4-(2,3-二氯苯基)-5-丙基咪唑、
2-苯基-4-(2,4-二氯苯基)-5-十一基咪唑、
2-苯基-4-(1-萘基)咪唑、
2-苯基-4-(2-萘基)咪唑、
2-苯基-4-(1-萘基)-5-甲基咪唑、
2-苯基-4-(2-萘基)-5-甲基咪唑、
2-苯基-4-(2-噻吩基)咪唑、
2-苯基-4-(3-噻吩基)咪唑、
5-甲基-2-苯基-4-(2-噻吩基)咪唑、
5-甲基-2-苯基-4-(3-噻吩基)咪唑、
4-(2-呋喃基)-2-苯基咪唑、
2-(2-甲基苯基)-4-苯基咪唑、
2-(3-辛基苯基)-4-苯基咪唑、
2-(4-甲基苯基)-4-苯基咪唑、
2-(4-異丙基苯基)-4-苯基咪唑、
2-(4-甲基苯基)-4-苯基-5-甲基咪唑、
2-(4-異丙基苯基)-4-苯基-5-甲基咪唑、
2-(4-聯苯基)-4-苯基-5-甲基咪唑、
2-(2,4-二甲基苯基)-4-苯基咪唑、
2-(2-氯苯基)-4-苯基咪唑、
2-(3-氯苯基)-4-苯基咪唑、
2-(4-氯苯基)-4-苯基咪唑、
2-(4-氟苯基)-4-苯基咪唑、
2-(4-溴苯基)-4-苯基咪唑、
2-(4-碘苯基)-4-苯基咪唑、
2-(2,3-二氯苯基)-4-苯基咪唑、
2-(2,4-二氯苯基)-4-苯基咪唑、
2-(2,5-二氯苯基)-4-苯基咪唑、
2-(2,6-二氯苯基)-4-苯基咪唑、
2-(3,4-二氯苯基)-4-苯基咪唑、
2-(3,5-二氯苯基)-4-苯基咪唑、
2-(2,4-二溴苯基)-4-苯基咪唑、
2-(2-甲基-4-氯苯基)-4-苯基咪唑、
2-(4-氯苯基)-4-苯基-5-甲基咪唑、
4-(2,4-二氯苯基)-2-(4-甲氧苯基)-5-甲基咪唑、
2-(2,3-二氯苯基)-4-苯基-5-甲基咪唑、
2-(2,4-二氯苯基)-4-苯基-5-甲基咪唑、
2-(2,5-二氯苯基)-4-苯基-5-甲基咪唑、
2-(2,6-二氯苯基)-4-苯基-5-甲基咪唑、
2-(3,4二氯苯基)-4-苯基-5-甲基咪唑、
2-(3,5-二氯苯基)-4-苯基-5-甲基咪唑、
2-(2,4-二氯苯基)-4-苯基-5-乙基咪唑、
2-(2,3-二氯苯基)-4-苯基-5-癸基咪唑、
2-(3,4-二氯苯基)-4-苯基-5-十七基咪唑、
2-(2-庚基-4-氯苯基)-4-苯基-5-異丁基咪唑、
2,4-雙(4-氯苯基)咪唑、
2-(2,4-二氯苯基)-4-(3,4-二氯苯基)-5-甲基咪唑、
4-(2,4-二氯苯基)-2-(3,4-二甲氧基苯基)-5-甲基咪唑、
4-(3,4-二氯苯基)-2-(3,4-二甲氧基苯基)-5-甲基咪唑、
2-(4-甲基苯基)-4-(2-萘基)咪唑、
2-(4-異丙基苯基)-4-(1-萘基)咪唑、
2-(3,4-二甲氧基苯基)-4-(1-萘基)咪唑、
2-(4-甲基苯基)-4-(4-氯-6-丁基-1-萘基)咪唑等。
式(I-3)所示咪唑化合物可舉例如
2-(1-萘基)-4-苯基咪唑、
2-(2-萘基)-4-苯基咪唑、
2-(1-萘基)-4-苯基-5-甲基咪唑、
2-(2-萘基)-4-苯基-5-甲基咪唑等
式(I-4)所示咪唑化合物可舉例如
2-苄基-4-苯基咪唑、
2-苄基-4-(4-己基苯基)咪唑、
2-苄基-4-(2-氯苯基)咪唑、
2-苄基-4-(3-氯苯基)咪唑、
2-苄基-4-(4-氯苯基)咪唑、
2-苄基-4-(4-溴苯基)咪唑、
2-苄基-4-(2,3-二氯苯基)咪唑、
2-苄基-4-(2,4-二氯苯基)咪唑、
2-苄基-4-(2,5-二氯苯基)咪唑、
2-苄基-4-(2,6-二氯苯基)咪唑、
2-苄基-4-(3,4-二氯苯基)咪唑、
2-苄基-4-(3,5-二氯苯基)咪唑、
2-苄基-4-(2,4,5-三氯苯基)咪唑、
2-苄基-4-(3,4,5-三氯苯基)咪唑、
2-苄基-5-甲基-4-苯基咪唑、
2-苄基-5-丁基-4-苯基咪唑、
2-苄基-5-庚基-4-苯基咪唑、
2-苄基-5-己基-4-苯基咪唑、
2-苄基-5-辛基-4-苯基咪唑、
2-苄基-4-(2-氯苯基)-5-甲基咪唑、
2-苄基-4-(3-氯苯基)-5-甲基咪唑、
2-苄基-4-(4-氯苯基)-5-甲基咪唑、
2-苄基-4-(2,4-二氯苯基)-5-甲基咪唑、
2-苄基-4-(3,4-二氯苯基)-5-甲基咪唑、
2-苄基-5-甲基-4-(2,4,5-三氯苯基)咪唑、
2-苄基-4,5-二苯基咪唑、
2-苄基-4-(1-萘基)咪唑、
2-苄基-4-(2-萘基)咪唑、
2-(2-氯苄基)-4-苯基咪唑、
2-(3-氯苄基)-4-苯基咪唑、
2-(4-氯苄基)-4-苯基咪唑、
2-(4-溴苄基)-4-苯基咪唑、
2-(4-氯苄基)-4-(4-氯苯基)咪唑、
4-(4-溴苯基)-2-(4-氯苄基)咪唑、
2-(4-溴苄基)-4-(4-氯苯基)咪唑、
2-(4-溴苄基)-4-(4-氟苯基)咪唑、
2-(2-溴苄基)-4-(4-溴苯基)咪唑、
2-(4-溴苄基)-4-(3-溴苯基)咪唑、
4-(4-丁基苯基)-2-(2-氯苄基)咪唑、
2-(2-氯苄基)-4-(4-己基苯基)咪唑、
2-(2-氯苄基)-4-(2,4-二氯苯基)咪唑、
2-(2-氯苄基)-4-(3,4-二氯苯基)咪唑、
2-(3-氯苄基)-4-(2,4-二氯苯基)咪唑、
2-(3-氯苄基)-4-(3,4-二氯苯基)咪唑、
2-(4-氯苄基)-4-(2,4-二氯苯基)咪唑、
2-(4-氯苄基)-4-(3,4-二氯苯基)咪唑、
2-(4-氯苄基)-4-(2,4-二溴苯基)咪唑、
4-(2,4-二氯苯基)-2-(4-甲基苄基)-5-甲基咪唑、
2-(2,3-二氯苄基)-4-苯基咪唑、
2-(2,4-二氯苄基)-4-苯基咪唑、
2-(2,5-二氯苄基)-4-苯基咪唑、
2-(2,6-二氯苄基)-4-苯基咪唑、
2-(3,4-二氯苄基)-4-苯基咪唑、
2-(3,5-二氯苄基)-4-苯基咪唑、
4-(2-氯苯基)-2-(2,4-二氯苄基)咪唑、
4-(2-氯苯基)-2-(3,4-二氯苄基)咪唑、
4-(3-氯苯基)-2-(2,4-二氯苄基)咪唑、
4-(3-氯苯基)-2-(3,4-二氯苄基)咪唑、
4-(4-氯苯基)-2-(2,4-二氯苄基)咪唑、
4-(4-氯苯基)-2-(3,4-二氯苄基)咪唑、
4-(4-溴苯基)-2-(2,4-二氯苄基)咪唑、
4-(4-聯苯基)-2-(2,4-二氯苄基)咪唑、
4-(2,3-二氯苄基)-4-(2,4-二氯苯基)咪唑、
4-(2,4-二氯苄基)-4-(2,4-二氯苯基)咪唑、
4-(2,5-二氯苄基)-4-(2,4-二氯苯基)咪唑、
4-(2,6-二氯苄基)-4-(2,4-二氯苯基)咪唑、
4-(3,4-二氯苄基)-4-(2,4-二氯苯基)咪唑、
4-(3,5-二氯苄基)-4-(2,4-二氯苯基)咪唑、
4-(2,3-二氯苄基)-4-(3,4-二氯苯基)咪唑、
4-(2,4-二氯苄基)-4-(3,4-二氯苯基)咪唑、
4-(2,5-二氯苄基)-4-(3,4-二氯苯基)咪唑、
4-(2,6-二氯苄基)-4-(3,4-二氯苯基)咪唑、
4-(3,4-二氯苄基)-4-(3,4-二氯苯基)咪唑、
4-(3,5-二氯苄基)-4-(3,4-二氯苯基)咪唑、
4-苯基-2-(3,4,5-三氯苄基)咪唑、
2-(4-氯苄基)-5-甲基-4-苯基咪唑、
2-(4-氯苄基)-4-(4-氯苯基)-5-甲基咪唑、
2-(4-溴苄基)-4-(4-溴苯基)-5-甲基咪唑、
2-(2-氯苄基)-4-(2,4-二氯苯基)-5-甲基咪唑、
2-(2-氯苄基)-4-(3,4-二氯苯基)-5-甲基咪唑、
2-(3-氯苄基)-4-(2,4-二氯苯基)-5-甲基咪唑、
2-(3-氯苄基)-4-(3,4-二氯苯基)-5-甲基咪唑、
2-(4-氯苄基)-4-(2,4-二氯苯基)-5-甲基咪唑、
2-(4-氯苄基)-4-(3,4-二氯苯基)-5-甲基咪唑、
2-(4-氯苄基)-4-(2,4-二溴苯基)-5-甲基咪唑、
4-(2,4-二氯苯基)-2-(4-氟苄基)-5-甲基咪唑、
4-(3,4-二氯苯基)-2-(4-氟苄基)-5-甲基咪唑、
2-(4-溴苄基)-4-(2,4-二氯苄基)-5-甲基咪唑、
2-(4-溴苄基)-4-(3,4-二氯苄基)-5-甲基咪唑、
2-(2,4-二氯苯基)-5-甲基-4-苯基咪唑、
2-(3,4-二氯苄基)-5-甲基-4-苯基咪唑、
4-(2-氯苯基)-2-(2,4-二氯苄基)-5-甲基咪唑、
4-(2-氯苯基)-2-(3,4-二氯苄基)-5-甲基咪唑、
4-(3-氯苯基)-2-(2,4-二氯苄基)-5-甲基咪唑、
4-(3-氯苯基)-2-(3,4-二氯苄基)-5-甲基咪唑、
4-(4-氯苯基)-2-(2,4-二氯苄基)-5-甲基咪唑、
4-(4-氯苯基)-2-(3,4-二氯苄基)-5-甲基咪唑、
2-(2,4-二氯苄基)-5-甲基-4-(4-甲基苯基)咪唑、
2-(2,4-二氯苄基)-4-(4-甲氧基苯基)-5-甲基咪唑、
2-(2,3-二氯苄基)-4-(2,4-二氯苯基)-5-甲基咪唑、
2-(2,4-二氯苄基)-4-(2,4-二氯苯基)-5-甲基咪唑、
2-(2,6-二氯苄基)-4-(2,4-二氯苯基)-5-甲基咪唑、
2-(3,4-二氯苄基)-4-(2,4-二氯苯基)-5-甲基咪唑、
2-(2,4-二氯苄基)-4-(3,4-二氯苯基)-5-甲基咪唑、
2-(3,4-二氯苄基)-4-(3,4-二氯苯基)-5-甲基咪唑、
2-(2,4-二溴苄基)-4-(3,4-二溴苯基)-5-甲基咪唑、
4-(2,4-二氯苯基)-2-(3,4-二甲氧基苄基)-5-甲基咪唑、
4-(3-氯-4-甲基苯基)-2-(2,4-二氯苄基)-5-甲基咪唑、
2-(2-氯苄基)-4,5-二苯基咪唑、
2-(3-氯苄基)-4,5-二苯基咪唑、
2-(4-氯苄基)-4,5-二苯基咪唑、
2-(2,4-二氯苄基)-4,5二苯基咪唑、
2-(2,4-二氯苄基)-5-己基-4-苯基咪唑、
2-(2-氯苄基)-4-(1-萘基)咪唑、
2-(2-氯苄基)-4-(2-萘基)咪唑、
2-(3-氯苄基)-4-(1-萘基)咪唑、
2-(3-氯苄基)-4-(2-萘基)咪唑、
2-(4-氯苄基)-4-(1-萘基)咪唑、
2-(4-氯苄基)-4-(2-萘基)咪唑、
2-(2,3-二氯苄基)-4-(1-萘基)咪唑、
2-(2,3-二氯苄基)-4-(2-萘基)咪唑、
2-(2,4-二氯苄基)-4-(1-萘基)咪唑、
2-(2,4-二氯苄基)-4-(2-萘基)咪唑、
2-(2,5-二氯苄基)-4-(1-萘基)咪唑、
2-(2,5-二氯苄基)-4-(2-萘基)咪唑、
2-(2,6-二氯苄基)-4-(1-萘基)咪唑、
2-(2,6-二氯苄基)-4-(2-萘基)咪唑、
2-(3,4-二氯苄基)-4-(1-萘基)咪唑、
2-(3,4-二氯苄基)-4-(2-萘基)咪唑、
2-(3,5-二氯苄基)-4-(1-萘基)咪唑、
2-(3,5-二氯苄基)-4-(2-萘基)咪唑等。
式(I-5)所示咪唑化合物可舉例如
2-(1-萘甲基)-4-苯基咪唑、
2-(2-萘甲基)-4-苯基咪唑、
4-(2-氯苯基)-2-(1-萘甲基)咪唑、
4-(2-氯苯基)-2-(2-萘甲基)咪唑、
4-(3-氯苯基)-2-(1-萘甲基)咪唑、
4-(3-氯苯基)-2-(2-萘甲基)咪唑、
4-(4-氯苯基)-2-(1-萘甲基)咪唑、
4-(4-氯苯基)-2-(2-萘甲基)咪唑、
4-(2,3-二氯苯基)-2-(1-萘甲基)咪唑、
4-(2,3-二氯苯基)-2-(2-萘甲基)咪唑、
4-(2,4-二氯苯基)-2-(1-萘甲基)咪唑、
4-(2,4-二氯苯基)-2-(2-萘甲基)咪唑、
4-(2,5-二氯苯基)-2-(1-萘甲基)咪唑、
4-(2,5-二氯苯基)-2-(2-萘甲基)咪唑、
4-(2,6-二氯苯基)-2-(1-萘甲基)咪唑、
4-(2,6-二氯苯基)-2-(2-萘甲基)咪唑、
4-(3,4-二氯苯基)-2-(1-萘甲基)咪唑、
4-(3,4-二氯苯基)-2-(2-萘甲基)咪唑、
4-(3,5-二氯苯基)-2-(1-萘甲基)咪唑、
4-(3,5-二氯苯基)-2-(2-萘甲基)咪唑、
5-甲基-2-(1-萘甲基)-4-苯基咪唑、
5-甲基-2-(2-萘甲基)-4-苯基咪唑、
4-(2-氯苯基)-5-甲基-2-(1-萘甲基)咪唑、
4-(2-氯苯基)-5-甲基-2-(2-萘甲基)咪唑、
4-(3-氯苯基)-5-甲基-2-(1-萘甲基)咪唑、
4-(3-氯苯基)-5-甲基-2-(2-萘甲基)咪唑、
4-(4-氯苯基)-5-甲基-2-(1-萘甲基)咪唑、
4-(4-氯苯基)-5-甲基-2-(2-萘甲基)咪唑、
4-(2,3-二氯苯基)-5-甲基-2-(1-萘甲基)咪唑、
4-(2,3-二氯苯基)-5-甲基-2-(2-萘甲基)咪唑、
4-(2,4-二氯苯基)-5-甲基-2-(1-萘甲基)咪唑、
4-(2,4-二氯苯基)-5-甲基-2-(2-萘甲基)咪唑、
4-(2,5-二氯苯基)-5-甲基-2-(1-萘甲基)咪唑、
4-(2,5-二氯苯基)-5-甲基-2-(2-萘甲基)咪唑、
4-(2,6-二氯苯基)-5-甲基-2-(1-萘甲基)咪唑、
4-(2,6-二氯苯基)-5-甲基-2-(2-萘甲基)咪唑、
4-(3,4-二氯苯基)-5-甲基-2-(1-萘甲基)咪唑、
4-(3,4-二氯苯基)-5-甲基-2-(2-萘甲基)咪唑、
4-(3,5-二氯苯基)-5-甲基-2-(1-萘甲基)咪唑、
4-(3,5-二氯苯基)-5-甲基-2-(2-萘甲基)咪唑等。
式(I-6)所示咪唑化合物可舉例如
4-苯基-2-(2-噻吩基)咪唑、
4-苯基-2-(3-噻吩基)咪唑、
4-(2-氯苯基)-2-(2-噻吩基)咪唑、
4-(2-氯苯基)-2-(3-噻吩基)咪唑、
4-(3-氯苯基)-2-(2-噻吩基)咪唑、
4-(3-氯苯基)-2-(3-噻吩基)咪唑、
4-(4-氯苯基)-2-(2-噻吩基)咪唑、
4-(4-氯苯基)-2-(3-噻吩基)咪唑、
4-(2,3-二氯苯基)-2-(2-噻吩基)咪唑、
4-(2,3-二氯苯基)-2-(3-噻吩基)咪唑、
4-(2,4-二氯苯基)-2-(2-噻吩基)咪唑、
4-(2,4-二氯苯基)-2-(3-噻吩基)咪唑、
4-(2,5-二氯苯基)-2-(2-噻吩基)咪唑、
4-(2,5-二氯苯基)-2-(3-噻吩基)咪唑、
4-(2,6-二氯苯基)-2-(2-噻吩基)咪唑、
4-(2,6-二氯苯基)-2-(3-噻吩基)咪唑、
4-(3,4-二氯苯基)-2-(2-噻吩基)咪唑、
4-(3,4-二氯苯基)-2-(3-噻吩基)咪唑、
4-(3,5-二氯苯基)-2-(2-噻吩基)咪唑、
4-(3,5-二氯苯基)-2-(3-噻吩基)咪唑、
4-(1-萘基)-2-(2-噻吩基)咪唑、
4-(1-萘基)-2-(3-噻吩基)咪唑、
4-(2-萘基)-2-(2-噻吩基)咪唑、
4-(2-萘基)-2-(3-噻吩基)咪唑、
5-甲基-4-苯基-2-(2-噻吩基)咪唑、
5-甲基-4-苯基-2-(3-噻吩基)咪唑、
4-(2-氯苯基)-5-甲基-2-(2-噻吩基)咪唑、
4-(2-氯苯基)-5-甲基-2-(3-噻吩基)咪唑、
4-(3-氯苯基)-5-甲基-2-(2-噻吩基)咪唑、
4-(3-氯苯基)-5-甲基-2-(3-噻吩基)咪唑、
4-(4-氯苯基)-5-甲基-2-(2-噻吩基)咪唑、
4-(4-氯苯基)-5-甲基-2-(3-噻吩基)咪唑、
4-(2,3-二氯苯基)-5-甲基-2-(2-噻吩基)咪唑、
4-(2,3-二氯苯基)-5-甲基-2-(3-噻吩基)咪唑、
4-(2,4-二氯苯基)-5-甲基-2-(2-噻吩基)咪唑、
4-(2,4-二氯苯基)-5-甲基-2-(3-噻吩基)咪唑、
4-(2,5-二氯苯基)-5-甲基-2-(2-噻吩基)咪唑、
4-(2,5-二氯苯基)-5-甲基-2-(3-噻吩基)咪唑、
4-(2,6-二氯苯基)-5-甲基-2-(2-噻吩基)咪唑、
4-(2,6-二氯苯基)-5-甲基-2-(3-噻吩基)咪唑、
4-(3,4-二氯苯基)-5-甲基-2-(2-噻吩基)咪唑、
4-(3,4-二氯苯基)-5-甲基-2-(3-噻吩基)咪唑、
4-(3,5-二氯苯基)-5-甲基-2-(2-噻吩基)咪唑、
4-(3,5-二氯苯基)-5-甲基-2-(3-噻吩基)咪唑、
5-甲基-4-(1-萘基)-2-(2-噻吩基)咪唑、
5-甲基-4-(1-萘基)-2-(3-噻吩基)咪唑、
5-甲基-4-(2-萘基)-2-(2-噻吩基)咪唑、
5-甲基-4-(2-萘基)-2-(3-噻吩基)咪唑、
4,5-二苯基-2-(2-噻吩基)咪唑、
4,5-二苯基-2-(3-噻吩基)咪唑、
4-(2-氯苯基)-5-苯基-2-(2-噻吩基)咪唑、
4-(2-氯苯基)-5-苯基-2-(3-噻吩基)咪唑、
4-(3-氯苯基)-5-苯基-2-(2-噻吩基)咪唑、
4-(3-氯苯基)-5-苯基-2-(3-噻吩基)咪唑、
4-(4-氯苯基)-5-苯基-2-(2-噻吩基)咪唑、
4-(4-氯苯基)-5-苯基-2-(3-噻吩基)咪唑、
4-(2,3-二氯苯基)-5-苯基-2-(2-噻吩基)咪唑、
4-(2,3-二氯苯基)-5-苯基-2-(3-噻吩基)咪唑、
4-(2,4-二氯苯基)-5-苯基-2-(2-噻吩基)咪唑、
4-(2,4-二氯苯基)-5-苯基-2-(3-噻吩基)咪唑、
4-(2,5-二氯苯基)-5-苯基-2-(2-噻吩基)咪唑、
4-(2,5-二氯苯基)-5-苯基-2-(3-噻吩基)咪唑、
4-(2,6-二氯苯基)-5-苯基-2-(2-噻吩基)咪唑、
4-(2,6-二氯苯基)-5-苯基-2-(3-噻吩基)咪唑、
4-(3,4-二氯苯基)-5-苯基-2-(2-噻吩基)咪唑、
4-(3,4-二氯苯基)-5-苯基-2-(3-噻吩基)咪唑、
4-(3,5-二氯苯基)-5-苯基-2-(2-噻吩基)咪唑、
4-(3,5-二氯苯基)-5-苯基-2-(3-噻吩基)咪唑、
4-(1-萘基)-5-苯基-2-(2-噻吩基)咪唑、
4-(1-萘基)-5-苯基-2-(3-噻吩基)咪唑、
4-(2-萘基)-5-苯基-2-(2-噻吩基)咪唑、
4-(2-萘基)-5-苯基-2-(3-噻吩基)咪唑等。
其他,作為式(I)所示咪唑化合物的具體例,可舉例如
5-環己基-2,4-二苯基咪唑、
5-環己基-2-(2,4-二氯苄基)-4-苯基咪唑、
2-(3,6-二氯-2-萘基)-4-(2-異丙基-5-氟苯基)-5-癸基咪唑、
4-苯基-2-(2-噻吩基甲基)咪唑、
4-苯基-2-(3-噻吩基甲基)咪唑、
4-(2-氯苯基)-2-(2-噻吩基甲基)咪唑、
4-(2-氯苯基)-2-(3-噻吩基甲基)咪唑、
4-(3-氯苯基)-2-(2-噻吩基甲基)咪唑、
4-(3-氯苯基)-2-(3-噻吩基甲基)咪唑、
4-(4-氯苯基)-2-(2-噻吩基甲基)咪唑、
4-(4-氯苯基)-2-(3-噻吩基甲基)咪唑、
4-(2,3-二氯苯基)-2-(2-噻吩基甲基)咪唑、
4-(2,3-二氯苯基)-2-(3-噻吩基甲基)咪唑、
4-(2,4-二氯苯基)-2-(2-噻吩基甲基)咪唑、
4-(2,4-二氯苯基)-2-(3-噻吩基甲基)咪唑、
4-(2,5-二氯苯基)-2-(2-噻吩基甲基)咪唑、
4-(2,5-二氯苯基)-2-(3-噻吩基甲基)咪唑、
4-(2,6-二氯苯基)-2-(2-噻吩基甲基)咪唑、
4-(2,6-二氯苯基)-2-(3-噻吩基甲基)咪唑、
4-(3,4-二氯苯基)-2-(2-噻吩基甲基)咪唑、
4-(3,4-二氯苯基)-2-(3-噻吩基甲基)咪唑、
4-(3,5-二氯苯基)-2-(2-噻吩基甲基)咪唑、
4-(3,5-二氯苯基)-2-(3-噻吩基甲基)咪唑、
4-(1-萘基)-2-(2-噻吩基甲基)咪唑、
4-(1-萘基)-2-(3-噻吩基甲基)咪唑、
4-(2-萘基)-2-(2-噻吩基甲基)咪唑、
4-(2-萘基)-2-(3-噻吩基甲基)咪唑、
5-甲基-4-苯基-2-(2-噻吩基甲基)咪唑、
5-甲基-4-苯基-2-(3-噻吩基甲基)咪唑、
4-(2-氯苯基)-5-甲基-2-(2-噻吩基甲基)咪唑、
4-(2-氯苯基)-5-甲基-2-(3-噻吩基甲基)咪唑、
4-(3-氯苯基)-5-甲基-2-(2-噻吩基甲基)咪唑、
4-(3-氯苯基)-5-甲基-2-(3-噻吩基甲基)咪唑、
4-(4-氯苯基)-5-甲基-2-(2-噻吩基甲基)咪唑、
4-(4-氯苯基)-5-甲基-2-(3-噻吩基甲基)咪唑、
4-(2,3-二氯苯基)-5-甲基-2-(2-噻吩基甲基)咪唑、
4-(2,3-二氯苯基)-5-甲基-2-(3-噻吩基甲基)咪唑、
4-(2,4-二氯苯基)-5-甲基-2-(2-噻吩基甲基)咪唑、
4-(2,4-二氯苯基)-5-甲基-2-(3-噻吩基甲基)咪唑、
4-(2,5-二氯苯基)-5-甲基-2-(2-噻吩基甲基)咪唑、
4-(2,5-二氯苯基)-5-甲基-2-(3-噻吩基甲基)咪唑、
4-(2,6-二氯苯基)-5-甲基-2-(2-噻吩基甲基)咪唑、
4-(2,6-二氯苯基)-5-甲基-2-(3-噻吩基甲基)咪唑、
4-(3,4-二氯苯基)-5-甲基-2-(2-噻吩基甲基)咪唑、
4-(3,4-二氯苯基)-5-甲基-2-(3-噻吩基甲基)咪唑、
4-(3,5-二氯苯基)-5-甲基-2-(2-噻吩基甲基)咪唑、
4-(3,5-二氯苯基)-5-甲基-2-(3-噻吩基甲基)咪唑、
5-甲基-4-(1-萘基)-2-(2-噻吩基甲基)咪唑、
5-甲基-4-(1-萘基)-2-(3-噻吩基甲基)咪唑、
5-甲基-4-(2-萘基)-2-(2-噻吩基甲基)咪唑、
5-甲基-4-(2-萘基)-2-(3-噻吩基甲基)咪唑、
4,5-二苯基-2-(2-噻吩基甲基)咪唑、
4,5-二苯基-2-(3-噻吩基甲基)咪唑、
4-(2-氯苯基)-5-苯基-2-(2-噻吩基甲基)咪唑、
4-(2-氯苯基)-5-苯基-2-(3-噻吩基甲基)咪唑、
4-(3-氯苯基)-5-苯基-2-(2-噻吩基甲基)咪唑、
4-(3-氯苯基)-5-苯基-2-(3-噻吩基甲基)咪唑、
4-(4-氯苯基)-5-苯基-2-(2-噻吩基甲基)咪唑、
4-(4-氯苯基)-5-苯基-2-(3-噻吩基甲基)咪唑、
4-(2,3-二氯苯基)-5-苯基-2-(2-噻吩基甲基)咪唑、
4-(2,3-二氯苯基)-5-苯基-2-(3-噻吩基甲基)咪唑、
4-(2,4-二氯苯基)-5-苯基-2-(2-噻吩基甲基)咪唑、
4-(2,4-二氯苯基)-5-苯基-2-(3-噻吩基甲基)咪唑、
4-(2,5-二氯苯基)-5-苯基-2-(2-噻吩基甲基)咪唑、
4-(2,5-二氯苯基)-5-苯基-2-(3-噻吩基甲基)咪唑、
4-(2,6-二氯苯基)-5-苯基-2-(2-噻吩基甲基)咪唑、
4-(2,6-二氯苯基)-5-苯基-2-(3-噻吩基甲基)咪唑、
4-(3,4-二氯苯基)-5-苯基-2-(2-噻吩基甲基)咪唑、
4-(3,4-二氯苯基)-5-苯基-2-(3-噻吩基甲基)咪唑、
4-(3,5-二氯苯基)-5-苯基-2-(2-噻吩基甲基)咪唑、
4-(3,5-二氯苯基)-5-苯基-2-(3-噻吩基甲基)咪唑、
4-(1-萘基)-5-苯基-2-(2-噻吩基甲基)咪唑、
4-(1-萘基)-5-苯基-2-(3-噻吩基甲基)咪唑、
4-(2-萘基)-5-苯基-2-(2-噻吩基甲基)咪唑、
4-(2-萘基)-5-苯基-2-(3-噻吩基甲基)咪唑等。
(式(II)所示苯并咪唑化合物)
式(II)所示苯并咪唑化合物(以下亦稱為苯并咪唑化合物(II))係具有以下構造。
[化8]
(式(II)中,
R
3表示碳數1~18之直鏈狀或分支鏈狀之烷基、-(CH
2)
m-Ph、-(CH
2)
m-Np或下式(1)所示之基,Ph表示亦可具有取代基之苯基,Np表示亦可具有取代基之萘基,m表示1~5之整數;
[化9]
(式(1)中,m表示1~5之整數。)
R
4可為相同或相異,表示氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、硝基或鹵原子。)
式(II)中,R
3為碳數1~18之直鏈狀或分支鏈狀之烷基、-(CH
2)
m-Ph(Ph為亦可具有取代基之苯基,m為1~5之整數)、-(CH
2)
m-Np(Np為亦可具有取代基之萘基,m為1~5之整數)或上式(1)所示之基。
碳數1~18之直鏈狀之烷基及分支鏈狀之烷基係與上述咪唑化合物(I)所記載者相同。
又,於苯基、萘基之氫所取代的取代基,亦與上述咪唑化合物(I)所記載者相同。
R
4為氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、硝基或鹵原子。此碳數1~18之直鏈狀或分支鏈狀之烷基係與上述咪唑化合物(I)所記載者相同。作為鹵原子,可舉例如氟原子(F)、氯原子(Cl)、溴原子(Br)、碘原子(I)等。4個R
4可為相同或相異。
由化成皮膜之耐熱性的觀點而言,R
4較佳為氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基或鹵原子,更佳為氫原子、甲基或氯原子(Cl)。
作為式(II)所示苯并咪唑化合物(苯并咪唑化合物(II)),較佳為式(II-1)~式(II~4)所示苯并咪唑化合物。
[化10]
(式(II-1)中,R
312表示碳數1~18之直鏈狀或分支鏈狀之烷基;R
415可為相同或相異,表示碳數1~18之直鏈狀或分支鏈狀之烷基、鹵原子;q表示0~3之整數。
式(II-2)中,X可為相同或相異,表示鹵原子;m表示1~5之整數,q表示0~3之整數。
式(II-3)中,X可為相同或相異,表示鹵原子;m表示1~5之整數,q表示0~3之整數,r表示0~3之整數。
式(II-4)中,X可為相同或相異,表示鹵原子;m表示1~5之整數,q表示0~3之整數。)
作為苯并咪唑化合物(II)之具體例,式(II-1)所示苯并咪唑化合物可舉例如
2-甲基苯并咪唑、
2-乙基苯并咪唑、
2-丙基苯并咪唑、
2-丁基苯并咪唑、
2-第三丁基苯并咪唑、
2-戊基苯并咪唑、
2-己基苯并咪唑、
2-庚基苯并咪唑、
2-辛基苯并咪唑、
2-壬基苯并咪唑、
2-癸基苯并咪唑、
2-十一基苯并咪唑、
2-十二基苯并咪唑、
2-十三基苯并咪唑、
2-十四基苯并咪唑、
2-十五基苯并咪唑、
2-十六基苯并咪唑、
2-十七基苯并咪唑、
2-庚基-5,6-二甲基苯并咪唑、
2-辛基-5-氯苯并咪唑、
2-戊基-5,6-二氯苯并咪唑等。
式(II-2)所示苯并咪唑化合物可舉例如
2-(2-噻吩基甲基)苯并咪唑、
2-(3-噻吩基甲基)苯并咪唑等。
式(II-3)所示苯并咪唑化合物可舉例如
2-(苯基甲基)苯并咪唑、
2-(4-氯苯基甲基)苯并咪唑、
2-(2,4-二氯苯基甲基)苯并咪唑、
2-(3,4-二氯苯基甲基)苯并咪唑、
6-氯-2-(3,4-二氯苯基甲基)苯并咪唑、
2-(2-苯基乙基)苯并咪唑、
2-[2-(4-氯苯基)乙基]苯并咪唑、
2-(3-苯基丙基)苯并咪唑、
2-[3-(2-氯苯基)丙基]苯并咪唑、
2-(4苯基丁基)苯并咪唑、
2-[4-(4-氯苯基)丁基]苯并咪唑、
2-(5-苯基戊基)苯并咪唑、
2-[4-(2,4-二氯苯基)丁基]-4,7-二氯苯并咪唑等。
式(II-4)所示苯并咪唑化合物可舉例如
2-(1-萘基甲基)苯并咪唑、
2-(2-萘基甲基)苯并咪唑、
2-[2-(1-萘基)乙基]苯并咪唑、
2-[2-(2-萘基)乙基]苯并咪唑、
2-[3-(1-萘基)丙基]苯并咪唑、
2-[3-(2-萘基)丙基]苯并咪唑、
2-[4-(1-萘基)丁基]苯并咪唑、
2-[4-(2-萘基)丁基]苯并咪唑、
2-[5-(1-萘基)戊基]苯并咪唑、
2-[5-(2-萘基)戊基]苯并咪唑等。
相對於表面處理劑總量,咪唑化合物(I)或苯并咪唑化合物(II)較佳係依0.01~10重量%之比例含有,更佳係依0.05~5重量%之比例含有,又更佳係依0.05~1重量%之比例含有。若咪唑化合物(I)或苯并咪唑化合物(II)之含量為0.01重量%以上,可於銅表面依能夠防止氧化之膜厚形成化成皮膜。又,若咪唑化合物(I)或苯并咪唑化合物(II)為10重量%以下,則咪唑化合物容易溶解於表面處理劑,且可提升銅表面之焊接性。
尚且,本發明實施中,可將選自由上述咪唑化合物(I)及苯并咪唑化合物(II)所構成群之咪唑化合物單獨使用1種,或組合2種以上使用。
又,咪唑化合物(I)及苯并咪唑化合物(II)可依與適當酸形成鹽的狀態使用。作為該酸,可舉例如HCl(鹽酸)、HBr(氫溴酸)等,可作為HCl鹽、HBr鹽使用。
又,本發明之表面處理劑中,可與此等咪唑化合物(I)及苯并咪唑化合物(II)一起合併使用與本發明相同技術領域中公知之咪唑化合物。
(式(III)所示三唑化合物)
式(III)所示三唑化合物(以下亦稱為三唑化合物(III))係具有以下構造。
[化11]
(式(III)中,
R
5及R
6可為相同或相異,表示氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、胺基、亦可具有取代基之苯基、亦可具有取代基之苄基、萘基、吡啶基或下式(2)所示之基;其中,排除R
5及R
6同時為下式(2)所示之基的情況;
[化12]
(式(2)中,t表示0~12之整數。)
R
7表示氫原子、苄基或-(CH
2)
n-COOH,n表示1~5之整數。)
式(III)中,R
5及R
6為氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、胺基、亦可具有取代基之苯基、亦可具有取代基之苄基、萘基、吡啶基或上式(2)所示之基。R
5及R
6為相同或相異,但不同時為上式(2)所示之基。
碳數1~18之直鏈狀之烷基及分支鏈狀之烷基係與上述咪唑化合物(I)所記載者相同。
又,於苯基、萘基之氫所取代的取代基,亦與上述咪唑化合物(I)所記載者相同。
由化成皮膜之耐熱性的觀點而言,R
5及R
6較佳為氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、胺基、亦可具有取代基之苯基、具有取代基之苄基、萘基、吡啶基或式(2)所示之基。又,式(2)中,t較佳為0~10之整數、更佳為0~8之整數、又更佳為0~6。
R
7表示氫原子、苄基或-(CH
2)
n-COOH(n為1~5之整數)。
由化成皮膜之耐熱性的觀點而言,R
7較佳為氫原子、-(CH
2)
n-COOH(n為1~3之整數)。
作為式(III)所示三唑化合物(三唑化合物(III)),較佳為式(III-1)~式(III-5)所示三唑化合物。
[化13]
(式(III-1)中,R
513表示氫原子、胺基或亦可具有取代基之苯基,R
515表示氫原子、胺基或亦可具有取代基之苯基,s表示1~3之整數。
式(III-2)中,R
523表示碳數1~18之直鏈狀或分支鏈狀之烷基、吡啶基,R
525表示氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、亦可具有取代基之苯基、亦可具有取代基之苄基或吡啶基。
式(III-3)中,R
531表示氫原子或亦可具有取代基之苄基,R
535表示氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、亦可具有取代基之苯基、萘基或胺基。
式(III-4)中,R
545表示氫原子、亦可具有取代基之苯基或亦可具有取代基之苄基。
式(III-5)中,t表示0~6之整數。)
作為三唑化合物(III)之具體例,式(III-1)所示三唑化合物可舉例如
1,2,4-三唑-1-乙酸、
1,2,4-三唑-1-丙酸、
1,2,4-三唑-1-酪酸、
3-胺基-1,2,4-三唑-1-乙酸、
3-胺基-5-苯基-1,2,4-三唑-1-乙酸等。
式(III-2)所示三唑化合物可舉例如
3-甲基-1,2,4-三唑、
3-乙基-1,2,4-三唑、
3-丙基-1,2,4-三唑、
3-異丙基-1,2,4-三唑、
3-丁基-1,2,4-三唑、
3-戊基-1,2,4-三唑、
3-己基-1,2,4-三唑、
3-辛基-1,2,4-三唑、
3-十一基-1,2,4-三唑、
3,5-二甲基-1,2,4-三唑、
3-乙基-5-甲基-1,2,4-三唑、
3-甲基-5-丙基-1,2,4-三唑、
3-異丙基-5-甲基-1,2,4-三唑、
3-丁基-5-甲基-1,2,4-三唑、
3-甲基-5-戊基-1,2,4-三唑、
5-庚基-3-甲基-1,2,4-三唑、
5-甲基-3-辛基-1,2,4-三唑、
3-甲基-5-十一基-1,2,4-三唑、
3,5-二乙基-1,2,4-三唑、
3,5-二丙基-1,2,4-三唑、
3,5-二異丙基-1,2,4-三唑、
3,5-二丁基-1,2,4-三唑、
3,5-二戊基-1,2,4-三唑、
3,5-二庚基-1,2,4-三唑、
3,5-二辛基-1,2,4-三唑、
3,5-二(十一基)-1,2,4-三唑、
3-甲基-5-苯基-1,2,4-三唑、
3-乙基-5-苯基-1,2,4-三唑、
5-苯基-3-丙基-1,2,4-三唑、
3-丁基-5-苯基-1,2,4-三唑、
3-戊基-5-苯基-1,2,4-三唑、
3-甲基-5-(苯基甲基)-1,2,4-三唑、
3-乙基-5-(苯基甲基)-1,2,4-三唑、
5-(苯基甲基)-3-丙基-1,2,4-三唑、
3-甲基-5-(4-吡啶基)-1,2,4-三唑、
3,5-雙(4-吡啶基)-1,2,4-三唑等。
式(III-3)所示三唑化合物可舉例如
3-胺基-1,2,4-三唑、
3,5-二胺基-1,2,4-三唑、
3-胺基-5-甲基-1,2,4-三唑、
3-胺基-5-乙基-1,2,4-三唑、
3-胺基-5-丙基-1,2,4-三唑、
3-胺基-5-異丙基-1,2,4-三唑、
3-胺基-5-丁基-1,2,4-三唑、
3-胺基-5-戊基-1,2,4-三唑、
3-胺基-5-苯基-1,2,4-三唑、
3-胺基-5-(1-萘基)-1,2,4-三唑、
3-胺基-5-(2-萘基)-1,2,4-三唑、
1-苄基-3,5-二胺基-1,2,4-三唑等。
式(III-4)所示三唑化合物可舉例如
3-苯基-1,2,4-三唑、
3-苄基-5-苯基-1,2,4-三唑、
3,5-二苯基-1,2,4-三唑等。
式(III-5)所示三唑化合物可舉例如
3,3’-雙(5-胺基-1,2,4-三唑)、
3,3’-亞甲基雙(5-胺基-1,2,4-三唑)、
3,3’-伸乙基雙(5-胺基-1,2,4-三唑)、
3,3’-三亞甲基雙(5-胺基-1,2,4-三唑)、
3,3’-四亞甲基雙(5-胺基-1,2,4-三唑)、
3,3’-五亞甲基雙(5-胺基-1,2,4-三唑)、
3,3’-六亞甲基雙(5-胺基-1,2,4-三唑)等。
相對於表面處理劑總量,三唑化合物(III)較佳係依0.005~1重量%之比例含有、更佳為0.01~0.5重量%、又更佳為0.01~0.3重量%。
尚且,本發明之實施中,可使用選自上述三唑化合物(III)之1種、或組合2種以上使用,此三唑化合物亦可合併使用與本發明相同技術領域中公知之三唑化合物。
本發明中,相對於咪唑化合物(I)或苯并咪唑化合物(II),三唑化合物(III)較佳係依0.005~3.0之莫耳比含有,更佳係依0.01~2.7之莫耳比含有,又更佳係依0.05~2.5之莫耳比含有。藉由使三唑化合物(III)、與咪唑化合物(I)或苯并咪唑化合物(II)之比例為上述範圍,可形成高耐熱性的化成皮膜。
本發明之表面處理劑係藉由將咪唑化合物(I)或苯并咪唑化合物(II)、與三唑化合物(III)溶解於水而調製。藉此,可得到水溶性之預焊劑。
水並無特別限定,可舉例如自來水、離子交換水、精製水、純水等。
本發明之表面處理劑中,為了使咪唑化合物(I)或苯并咪唑化合物(II)與三唑化合物(III)容易溶解於水(水溶液化),較佳係含有可溶化劑。作為可溶化劑,較佳係使用例如有機酸或無機酸(有時將此等稱為酸)。
作為代表性之有機酸,可舉例如甲酸、乙酸、丙酸、酪酸、纈草酸、己酸、庚酸、辛酸、壬酸、癸酸、月桂酸、異酪酸、2-乙基酪酸、油酸、乙醇酸、乳酸、2-羥基酪酸、3-羥基酪酸、葡萄糖酸、甘油酸、酒石酸、蘋果酸、檸檬酸、氯乙酸、二氯乙酸、三氯乙酸、溴乙酸、碘乙酸、甲氧基乙酸、乙氧基乙酸、丙氧基乙酸、丁氧基乙酸、2-(2-甲氧基乙氧基)乙酸、2-[2-(2-乙氧基乙氧基)乙氧基]乙酸、2-{2-[2-(2-乙氧基乙氧基)乙氧基]乙氧基}乙酸、3-甲氧基丙酸、3-乙氧基丙酸、3-丙氧基丙酸、3-丁氧基丙酸、乙醯丙酸、乙醛酸、丙酮酸、乙醯乙酸、丙烯酸、丁烯酸、草酸、丙二酸、琥珀酸、戊二酸、己二酸、順丁烯二酸、反丁烯二酸、苯甲酸、對硝基苯甲酸、苦味酸、水楊酸、對甲苯磺酸、甲磺酸、胺磺酸等;作為無機酸,可舉例如鹽酸、磷酸、硫酸、硝酸等。
此等酸可使用1種或組合2種以上。
相對於表面處理劑總量,可溶化劑較佳係依0.1~50重量%之比例含有,更佳係依0.1~40重量%之比例含有。藉由可溶化劑之比例為上述範圍,使咪唑化合物(I)或苯并咪唑化合物(II)與三唑化合物(III)容易溶解於水,且容易形成化成皮膜。
本發明實施中,可與上述可溶化劑合併使用有機溶劑。
作為此有機溶劑,較佳可使用甲醇、乙醇、正丙醇、異丙醇、正丁醇、乙二醇、四氫糠醇等醇類,乙二醇單甲醚、乙二醇單乙醚、乙二醇單丁醚等賽珞蘇,或丙酮、N,N-二甲基甲醯胺、乙醯丙酮等之與水自由混合者。
此等有機溶劑可使用1種或組合2種以上。
相對於表面處理劑總量,有機溶劑較佳係依0.1~50重量%之比例含有、更佳為1~40重量%。
本發明之表面處理劑中,為了進一步提升化成皮膜之形成速度(造膜性)及該皮膜之耐熱性,較佳係含有鹵化物離子。作為鹵化物離子,可舉例如氟化物離子、氯化物離子、溴化物離子、碘化物離子等,可單獨含有1種,亦可含有2種以上。其中,由化成皮膜之耐熱性提升的觀點而言,表面處理劑中更佳係含有氯化物離子。
相對於表面處理劑總量,鹵化物離子較佳係依0.005~1重量%之比例含有,更佳為0.01~0.1重量%。
鹵化物離子可藉由於表面處理劑中添加鹵化合物而使其含有。作為鹵化合物,可舉例如氟化鈉、氟化鉀、氟化銨、氯化鈉、氯化鉀、氯化銨、氯丙酸、溴化鈉、溴化鉀、溴化銨、溴丙酸、碘化鈉、碘化鉀、碘化銨、碘丙酸等,可單獨使用1種,亦可組合使用2種以上。
本發明之表面處理劑中,為了更加提高所形成之化成皮膜的耐熱性,較佳係含有鋅離子。
鋅離子較佳係依0.05~2重量%之比例含有,更佳為0.1~1重量%。
鋅離子可藉由於表面處理劑中添加鋅化合物作為助劑而含有。作為此鋅化合物,可舉例如氧化鋅、甲酸鋅、乙酸鋅、草酸鋅、乳酸鋅、檸檬酸鋅、硫酸鋅、硝酸鋅、磷酸鋅、氯化鋅、溴化鋅、碘化鋅等,可單獨使用1種,亦可組合使用2種以上。
本發明之表面處理劑中,為了提高銅表面之化成皮膜的形成速度(造膜性),較佳係含有銅離子。
相對於表面處理劑總量,銅離子較佳係依0.005~1重量%之比例含有,更佳為0.01~0.1重量%。
鋅離子可藉由於表面處理劑中添加銅化合物作為助劑而含有。作為此銅化合物,可舉例如甲酸銅、乙酸銅、草酸銅、氯化亞銅、氯化銅、溴化亞銅、溴化銅、碘化亞銅、氫氧化銅、磷酸銅、硫酸銅、硝酸銅等,可單獨使用1種,亦可組合使用2種以上。
本發明之表面處理劑中,除了上述鹵化合物、鋅化合物、銅化合物以外,亦可以化成皮膜之造膜性提升或化成皮膜之物性改良為目的,添加錳化合物、鈷化合物、鎳化合物等金屬化合物或冠醚、聯吡啶、卟啉、啡啉等配位化合物作為助劑。
尚且,作為錳化合物,可舉例如甲酸錳、氯化錳、草酸錳、硫酸錳、碳酸錳等;作為鈷化合物,可舉例如乙酸鈷、硫酸鈷、硝酸鈷等;作為鎳化合物,可舉例如氯化鎳、乙酸鎳、硝酸鎳、碳酸鎳、硫酸鎳等。
關於此等金屬化合物,可使用1種或組合使用2種以上,相對於表面處理劑總量,較佳係依0.05~2重量%之比例含有,更佳為0.1~1重量%。又,關於配位化合物亦同,可使用1種或組合使用2種以上,相對於表面處理劑總量,較佳係依0.05~2重量%之比例含有,更佳為0.1~1重量%。
本發明之表面處理劑中,為了抑制化成皮膜對金(Au)表面的形成、同時提升化成皮膜對銅表面之造膜性,可含有鉗合劑及/或鐵化合物作為助劑(參照日本專利特開平9-291372號公報,藉由引用而涵括於本說明書中)。
作為上述鉗合劑,可舉例如亞胺二乙酸、氮三乙酸、乙二胺四乙酸、二乙三胺五乙酸、三乙四胺六乙酸、1,2-二胺基環己烷四乙酸、乙二醇雙氨乙基醚四乙酸、N,N-雙(2-羥基苄基)乙二胺二乙酸、乙二胺二丙酸、乙二胺二乙酸、二胺基丙醇四乙酸、六亞甲基二胺四乙酸、羥乙基亞胺二乙酸、二胺基丙烷四乙酸、氮三丙酸、乙二胺-N,N’-二琥珀酸、乙二胺肆亞甲基亞磷酸、氮參亞甲基亞磷酸、2-膦醯基丁烷-1,2,4-三甲酸等與此等之鹽類。
鉗合劑較佳係依0.01~0.4重量%之比例含有。
由化成皮膜之造膜性(形成速度)的觀點而言,本發明之表面處理劑較佳係pH為2.0~5.0、更佳為2.2~4.8、又更佳為2.5~4.5。
尚且,在降低表面處理劑之pH的情況,可使用上述有機酸或無機酸;在提高pH的情況,可使用鹼。作為鹼,除了氫氧化鈉或氫氧化鉀之外,可舉例如氨或單乙醇胺、二乙醇胺、三乙醇胺、三異丙醇胺等之胺類等。作為鹼,較佳可使用胺類等具有緩衝作用的物質。
藉由使本發明之表面處理劑接觸至銅表面,可於銅表面形成化成皮膜。
作為使用本發明之表面處理劑對銅表面進行處理時的條件,較佳係將表面處理劑之液溫設定為10~70℃之範圍,將接觸時間設定為1秒~10分鐘之範圍。作為用於對銅表面進行處理之銅與表面處理劑的接觸方法,可舉例如浸漬、噴霧、塗佈等手段。
在使表面處理劑接觸至銅表面後,較佳係視需要進行水洗,其後使銅表面乾燥。乾燥較佳係依室溫(例如20℃)~150℃之溫度、較佳為60~120℃之溫度,並設為1秒~10分鐘、較佳為10秒~3分鐘左右的時間。又,作為水洗所使用之水,較佳為離子交換水、蒸餾水、精製水等之純水。水洗之方法或時間並無特別限制,可為由噴霧法、浸漬法等方法進行適當時間。
在使表面處理劑接觸銅表面前,亦可使含有唑化合物之預浸液接觸至上述銅表面。此預浸液係具有提高形成於銅表面之化成皮膜之造膜性的機能。
作為唑化合物並無特別限定,可舉例如市售之咪唑化合物、三唑化合物、四唑化合物等。
於預浸液中,除了唑化合物之外,尚含有水與添加劑。作為添加劑,亦可含有例如上述有機溶劑、胺類、銅化合物、鹵化合物或其他添加劑(例如硫酸銨、甲酸銨、乙酸銨、氯化銨、碳酸銨、硝酸銨等銨鹽)。
藉由本發明之表面處理劑所形成的化成皮膜(OSP膜)的膜厚較佳為0.10~0.50μm。皮膜之膜厚若為0.10μm以上,則可賦予充分耐熱性,故可得到本發明所需效果。又,皮膜之膜厚若為0.50μm以下,可維持良好之焊接性。
本發明之實施中所使用的銲錫,除了習知之Sn-Pb系之共晶銲錫之外,尚可舉例如Sn-Ag-Cu系、Sn-Ag-Bi系、Sn-Bi系、Sn-Ag-Bi-In系、Sn-Zn系、Sn-Cu系等無鉛銲錫。
又,本發明之焊接方法,可應用於:將安裝了電子零件之印刷佈線板一邊接觸至銲錫槽內之熔融銲錫之液面並一邊移動,而將電子零件與印刷佈線板之接合部焊接的流焊法;或事先將膏狀之銲錫膏配合電路圖案印刷於印刷佈線板,對其安裝電子零件,將印刷佈線板加熱使銲錫熔融而進行焊接的回焊法等。
[實施例]
以下藉由實施例及比較例更具體說明本發明,但本發明並不限定於此等。
[咪唑化合物]
實施例所使用之咪唑化合物係如以下。
(合成例1)
<4-(3,4-二氯苯基)-5-甲基-2-壬基咪唑(A-1)之合成>
根據日本專利特開2010-77071號公報記載之方法,合成咪唑化合物「4-(3,4-二氯苯基)-5-甲基-2-壬基咪唑」(有時簡稱為「A-1」)。
(合成例2)
<2-苯基-4-(1-萘基)-5-甲基咪唑(A-2)之合成>
根據日本專利特開2006-36683號公報記載之方法,合成咪唑化合物「2-苯基-4-(1-萘基)-5-甲基咪唑(A-2)」(有時簡稱為「A-2」)。
(合成例3)
<5-甲基-4-苯基-2-(2-噻吩基)咪唑(A-3)之合成>
根據日本專利特開2014-37370號公報記載之方法,合成咪唑化合物「5-甲基-4-苯基-2-(2-噻吩基)咪唑」(有時簡稱為「A-3」)。
(合成例4)
<2-(3-氯苄基)-4-(1-萘基)咪唑(A-4)之合成>
根據日本專利特開2010-90105號公報記載之方法,合成咪唑化合物「2-(3-氯苄基)-4-(1-萘基)咪唑」(有時簡稱為「A-4」)。
A-1~A-4之咪唑化合物的化學式如以下所示。
[化14]
[苯并咪唑化合物]
實施例所使用之苯并咪唑化合物係如以下。
(合成例5)
<2-壬基苯并咪唑(B-1)之合成>
根據日本專利特開平5-107814號公報記載之方法,合成苯并咪唑化合物「2-壬基苯并咪唑」(有時簡稱為「B-1」)。
(合成例6)
<6-氯-2-(3,4-二氯苯基甲基)苯并咪唑(B-2)之合成>
藉由以下方法,合成苯并咪唑化合物「6-氯-2-(3,4-二氯苯基甲基)苯并咪唑」(有時簡稱為「B-2」)。
將3,4-二氯苄甲腈133.0g(0.715mol)與脫水二氯甲烷190g混合,再添加脫水乙醇36.4g(0.790mol)。一邊於冰冷下攪拌,一邊將氯化氫氣體29.6g(0.812mol)逐次少量吹入後,於5℃以下攪拌一晚。將所得生成物減壓濃縮,得到白色粉末狀之2-(3,4-二氯苯基)乙烷亞胺酸乙基鹽酸鹽192.1g(0.715mol,產率100%)。
將4-氯-1,2-苯二胺25.4g(0.178mol)與脫水甲醇200mL混合後,添加2-(3,4-二氯苯基)乙烷亞胺酸乙基鹽酸鹽48.0g(0.179mol)。於回流下攪拌2小時後,進而添加25%氨水23.6g。其後,進行減壓濃縮得到黑褐色焦油狀之生成物76.4g。於熱水中攪拌此生成物,將所得固體進行熱過濾後,以研缽進行粉碎,加入水400mL並加熱後,冷卻並進行晶析、過濾而得到黑紫色結晶。加入甲醇與活性碳並進行加熱攪拌、過濾,將所得濾液減壓濃縮,對所得生成物以乙腈進行再結晶,得到乳白色粉末之6-氯-2-(3,4-二氯苯基甲基)苯并咪唑化合物33.7g(0.108mol,產率60.9%)。
(合成例7)
<2-(2-萘基甲基)苯并咪唑(B-3)之合成>
藉由以下方法,合成苯并咪唑化合物「2-(2-萘基甲基)苯并咪唑」(有時簡稱為「B-3」)。
將2-萘基乙酸50.9g(0.273mol)與鄰苯二胺29.5g(0.273mol)混合,加熱至不再流出水而得到紫色固體。將所得固體以研缽作成粉狀後,加入水1L與碳酸鈉88g並於回流下攪拌30分鐘。進行熱過濾後,對所得固體再進行一次相同操作。於其中加入甲醇與活性碳並進行加熱攪拌、過濾,對所得濾液逐次少量添加水作為貧溶媒而進行晶析,將所得結晶以甲醇及水洗淨後,進行乾燥而得到淡黃色結晶之2-(2-萘基甲基)苯并咪唑39.4g(0.153mol,產率55.8%)。
B-1~B-3之苯并咪唑化合物的化學式如以下所示。
[化15]
[三唑化合物]
實施例所使用之三唑化合物係如以下。
(合成例8)
<3-胺基-1,2,4-三唑-1-乙酸(C-1)之合成>
藉由以下方法,合成三唑化合物「3-胺基-1,2,4-三唑-1-乙酸」(有時簡稱為「C-1」)。
將3-胺基-1,2,4-三唑30.1g(0.357mol)與甲醇200mL混合,於其中將事先混合了氫氧化鈉14.5g(0.363mol)與水80.0g的氫氧化鈉水溶液逐次少量添加。其後,添加單氯乙酸鈉41.6g(0.357mol)並加熱,於一晚回流下進行攪拌。將所得生成物減壓濃縮後,添加水100mL,一邊冷卻、一邊逐次少量添加36%鹽酸36.1g。過濾析出物後,以水洗淨並乾燥,得到白色粉末之3-胺基-1,2,4-三唑-1-乙酸24.3g(0.171mol,產率47.8%)。
(合成例9)
<5-甲基-3-辛基-1,2,4-三唑(C-2)之合成>
藉由以下方法,合成三唑化合物「5-甲基-3-辛基-1,2,4-三唑」(有時簡稱為「C-2」)。
將壬酸乙酯37.26g(0.200mol)與甲醇100g混合,於室溫進一步添加肼一水合物20.02g(0.400mol)並攪拌1小時後,加熱並於一晚回流下攪拌。將藉由冷卻所析出之結晶過濾,以少量甲醇洗淨後,進行乾燥得到白色鱗片狀結晶之壬酸肼28.26g(0.164mol,產率82.0%)。
將乙脒鹽酸鹽15.60g(0.165mol)與甲醇100g混合後,添加28%甲氧化鈉/甲醇溶液34.72g(0.180mol),再添加壬酸肼25.84g(0.150mol)。於回流下攪拌一晚後,進行冷卻、過濾而去除NaCl後,將濾液減壓濃縮。對所得濃縮物添加甲苯80g與水80g,使生成物溶解於甲苯,將有機層分離後,進行減壓濃縮至總量成為40g為止。將此濃縮液冷卻晶析後,進行過濾、乾燥而得到白色粉末之5-甲基-3-辛基-1,2,4-三唑20.51g(0.105mol,產率70.0%)。
(合成例10)
<3-苄基-5-苯基-1,2,4-三唑(C-3)之合成>
藉由以下方法,合成三唑化合物「3-苄基-5-苯基-1,2,4-三唑」(有時簡稱為「C-3」)。
將苯甲脒鹽酸鹽31.3g(0.200mol)與乙醇300mL混合後,添加事先將乙醇240mL與甲氧化鈉14.0g(0.259mol)混合的溶液。過濾去除析出之NaCl後,於所得濾液中添加苯乙酸醯肼3.00g(0.200mol)。於回流下攪拌1小時後,將反應液減壓濃縮而得到焦油狀之生成物55.1g。加水並攪拌,過濾所得固體,經乾燥後再藉由二乙醚進行再結晶,進行乾燥而得到白色粉末之3-苄基-5-苯基-1,2,4-三唑14.4g(0.061mol,產率30.6%)。
(合成例11)
<3,3’-亞甲基雙(5-胺基-1,2,4-三唑)(C-4)之合成>
根據Russ. J. Applied Chem., 82(2), 276(2009)記載之方法,合成三唑化合物「3,3’-亞甲基雙(5-胺基-1,2,4-三唑」(有時簡稱為「C-4」)。
C-1~C-4之三唑化合物的化學式如以下所示。
[化16]
實施例及比較例中所採用之評價試驗方法係如以下。
[銲錫上升率之評價試驗]
使用具有內徑0.60、0.80、1.00mm之銅導通孔各300孔的120mm(縱)×150mm(橫)×1.6mm(厚)之玻璃環氧樹脂製之印刷佈線板作為試驗片。將此試驗片藉由下述條件進行軟蝕刻、水洗及乾燥後,浸漬於保持為既定液溫之預浸液中既定時間,進行水洗、乾燥後,浸漬於保持為既定液溫之表面處理劑中,接著進行水洗、乾燥,藉此進行表面處理,而於銅表面上形成厚約0.2μm之化成皮膜。
對此經表面處理之試驗片,使用紅外線兼溫風迴焊裝置(製品名:SNR-725GT-MH,千住金屬工業公司製),依表1~6記載之條件進行迴焊加熱,接著,使用迴焊焊接裝置(輸送速度:1.0m/分鐘)進行焊接。
又,所使用之銲錫為千住金屬工業公司製「ECO SOLDER M705」(商品名,Sn-3.0Ag-0.5Cu之無鉛銲錫),焊接時所使用之助焊劑為千住金屬工業公司製「ES-1062V-1」(商品名)。又,銲錫溫度設為250℃。
針對進行了焊接之試驗片,計測銅導通孔中銲錫上升至上部連接盤(經焊接)的導通孔數,算出相對於總導通孔數(900孔)之比例(%,上升率)。
銲錫對銅表面之潤濕性越大,則經熔融之銲錫越容易滲透至銅導通孔內並上升至該導通孔之上部連接盤部分。亦即,銲錫上升至上部連接盤部分之導通孔數相對於總導通孔數的比例越大,則判定為對銅之銲錫潤濕性越優越、焊接性越良好。
[試驗片之表面處理]
依以下步驟i~iii進行試驗片之處理。
i. 酸清潔/1分鐘(室溫)、水洗、乾燥/1分鐘(100℃)
ii. 預浸液(四國化成工業公司製「PT20」)中浸漬/30秒(30℃)、水洗、乾燥/1分鐘(100℃)
iii. 於表面處理液中浸漬/1分鐘(40℃)、水洗、乾燥/1分鐘(100℃)
(實施例1)
使2-(3-氯苄基)-4-(1-萘基)咪唑(A-4)、3-胺基-1,2,4-三唑-1-乙酸(C-1)、乙酸及庚酸溶解於離子交換水後,以氨水調整為pH3.20,調製表1記載之組成的表面處理劑。
使用所得表面處理劑進行上述銲錫上升率之評價試驗,測定銲錫上升率(%)。迴焊條件係如表1記載,波峰溫度設為260℃,加熱次數進行2次。
試驗結果如表1所示。
(實施例2~16、比較例1~4)
與實施例1同樣進行,如表1~2記載之組成調製表面處理劑,使用所得表面處理劑,依表1~2記載之處理條件進行銲錫上升率之評價試驗,測定銲錫上升率(%)。
此等之試驗結果如表1~2所示。
[表1]
A-4:2-(3-氯苄基)-4-(1-萘基)咪唑
B-1:2-壬基苯并咪唑
C-1:3-胺基-1,2,4-三唑-1-乙酸
C-2:5-甲基-3-辛基-1,2,4-三唑
C-3:3-苄基-5-苯基-1,2,4-三唑
C-4:3,3’-亞甲基雙(5-胺基-1,2,4-三唑)
實施例 | 比較例 | 實施例 | 比較例 | |||||||||
1 | 2 | 3 | 4 | 1 | 5 | 6 | 7 | 8 | 2 | |||
表面處理劑組成(重量%) | 咪唑化合物 | A-4 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | |||||
苯并咪唑化合物 | B-1 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | ||||||
三唑化合物 | C-1 | 0.1 | 0.1 | |||||||||
C-2 | 0.075 | 0.05 | ||||||||||
C-3 | 0.025 | 0.025 | ||||||||||
C-4 | 0.01 | 0.1 | ||||||||||
酸 | 乙酸 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | |
庚酸 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | |||||||
三唑化合物相對於咪唑化合物或苯并咪唑化合物的比(莫耳比) | 1.12 | 0.61 | 0.17 | 0.09 | ‒ | 0.86 | 0.31 | 0.13 | 0.68 | ‒ | ||
pH | 3.20 | 3.20 | 3.20 | 3.25 | 3.20 | 3.60 | 3.60 | 3.60 | 3.65 | 3.50 | ||
化成皮膜之膜厚(μm) | 0.22 | 0.19 | 0.22 | 0.21 | 0.17 | 0.20 | 0.21 | 0.23 | 0.22 | 0.18 | ||
評價試驗 | 迴焊條件 | 波峰溫度(℃) | 260 | 250 | ||||||||
加熱次數(次) | 2 | 3 | ||||||||||
銲錫上升率(%) | 98 | 97 | 99 | 67 | 56 | 52 | 26 | 72 | 38 | 10 |
[表2]
A-4:2-(3-氯苄基)-4-(1-萘基)咪唑
B-1:2-壬基苯并咪唑
C-1:3-胺基-1,2,4-三唑-1-乙酸
C-2:5-甲基-3-辛基-1,2,4-三唑
C-3:3-苄基-5-苯基-1,2,4-三唑
C-4:3,3’-亞甲基雙(5-胺基-1,2,4-三唑)
實施例 | 比較例 | 實施例 | 比較例 | |||||||||
9 | 10 | 11 | 12 | 3 | 13 | 14 | 15 | 16 | 4 | |||
表 面 處 理 劑 組 成 (重 量 %) | 咪唑化合物 | A-4 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | |||||
苯并咪唑化合物 | B-1 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | ||||||
三唑化合物 | C-1 | 0.1 | 0.1 | |||||||||
C-2 | 0.075 | 0.05 | ||||||||||
C-3 | 0.025 | 0.025 | ||||||||||
C-4 | 0.01 | 0.1 | ||||||||||
鹵化物離子 | Cl -(氯化鈉) | 0.09 (0.15) | 0.09 (0.15) | 0.09 (0.15) | 0.09 (0.15) | 0.09 (0.15) | 0.09 (0.15) | 0.09 (0.15) | 0.09 (0.15) | 0.09 (0.15) | 0.09 (0.15) | |
酸 | 乙酸 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | |
庚酸 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | |||||||
三唑化合物相對於咪唑化合物或苯 并咪唑化合物的比(莫耳比) | 1.12 | 0.61 | 0.17 | 0.09 | ‒ | 0.86 | 0.31 | 0.13 | 0.68 | ‒ | ||
pH | 3.20 | 3.20 | 3.20 | 3.25 | 3.20 | 3.60 | 3.60 | 3.60 | 3.60 | 3.50 | ||
化成皮膜之膜厚(μm) | 0.20 | 0.20 | 0.21 | 0.18 | 0.21 | 0.20 | 0.22 | 0.21 | 0.17 | 0.23 | ||
評價試驗 | 迴焊條件 | 波峰溫度(℃) | 260 | 250 | ||||||||
加熱次數(次) | 3 | 3 | ||||||||||
銲錫上升率(%) | 35 | 43 | 59 | 34 | 15 | 93 | 99 | 91 | 90 | 83 |
由實施例1~4與比較例1、實施例5~8與比較例2、實施例9~12與比較例3、實施例13~16與比較例4之比對可知,藉由於表面處理劑中與咪唑化合物(I)或苯并咪唑化合物(II)一起含有三唑化合物(III),則銲錫上升率提升。由此可知,實施例1~16之表面處理劑係所得化成皮膜之耐熱性優越。
(實施例17~20、比較例5~8)
與實施例1同樣進行,如表3記載之組成調製表面處理劑,使用所得表面處理劑,依表3記載之處理條件進行銲錫上升率之評價試驗,測定銲錫上升率(%)。
此等之試驗結果如表3所示。
[表3]
A-4:2-(3-氯苄基)-4-(1-萘基)咪唑
B-1:2-壬基苯并咪唑
C-1:3-胺基-1,2,4-三唑-1-乙酸
實施例 | 比較例 | 實施例 | 比較例 | 實施例 | 比較例 | 實施例 | 比較例 | |||
17 | 5 | 18 | 6 | 19 | 7 | 20 | 8 | |||
表面處理劑組成(重量%) | 咪唑化合物 | A-4 | 0.2 | 0.2 | 0.2 | 0.2 | ||||
苯并咪唑化合物 | B-1 | 0.2 | 0.2 | 0.2 | 0.2 | |||||
三唑化合物 | C-1 | 0.1 | 0.1 | 0.1 | 0.1 | |||||
鹵化物離子 | Br -(溴化銨) | 0.09 (0.20) | 0.09 (0.20) | 0.09 (0.20) | 0.09 (0.20) | |||||
I -(碘化鈉) | 0.01 (0.013) | 0.01 (0.013) | 0.01 (0.013) | 0.01 (0.013) | ||||||
酸 | 乙酸 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | |
庚酸 | 0.2 | 0.2 | 0.2 | 0.2 | ||||||
三唑化合物相對於咪唑化合物或苯并咪唑化合物的比(莫耳比) | 1.12 | ‒ | 1.12 | ‒ | 0.86 | ‒ | 0.86 | ‒ | ||
pH | 3.40 | 3.30 | 3.40 | 3.30 | 3.60 | 3.60 | 3.60 | 3.60 | ||
化成皮膜之膜厚(μm) | 0.21 | 0.22 | 0.19 | 0.20 | 0.21 | 0.23 | 0.22 | 0.18 | ||
評價試驗 | 迴焊條件 | 波峰溫度(℃) | 260 | 250 | 240 | 240 | ||||
加熱次數(次) | 2 | 3 | 3 | 3 | ||||||
銲錫上升率(%) | 42 | 1 | 68 | 46 | 89 | 43 | 94 | 89 |
由實施例17與比較例5、實施例18與比較例6、實施例19與比較例7、實施例20與比較例8之比對可知,藉由於含有溴化物離子、碘化物離子作為鹵化物離子的系統中,於表面處理劑中與咪唑化合物(I)或苯并咪唑化合物(II)一起含有三唑化合物(III),則銲錫上升率提升。
(實施例21~30、比較例9~18)
與實施例1同樣進行,如表4~5記載之組成調製表面處理劑,使用所得表面處理劑,依表4~5記載之處理條件進行銲錫上升率之評價試驗,測定銲錫上升率(%)。
此等之試驗結果如表4~5所示。
[表4]
A-1: 4-(3,4-二氯苯基)-5-甲基-2-壬基咪唑
A-2:2-苯基-4-(1-萘基)-5-甲基咪唑
A-3:5-甲基-4-苯基-2-(2-噻吩基)咪唑
B-2:6-氯-2-(3,4-二氯苯基甲基)苯并咪唑
B-3:2-(2-萘基甲基)苯并咪唑
C-1:3-胺基-1,2,4-三唑-1-乙酸
實施例 | 比較例 | 實施例 | 比較例 | 實施例 | 比較例 | 實施例 | 比較例 | 實施例 | 比較例 | |||
21 | 9 | 22 | 10 | 23 | 11 | 24 | 12 | 25 | 13 | |||
表面處理劑組成(重量%) | 咪唑化合物 | A-1 | 0.2 | 0.2 | ||||||||
A-2 | 0.2 | 0.2 | ||||||||||
A-3 | 0.2 | 0.2 | ||||||||||
苯并咪唑化合物 | B-2 | 0.2 | 0.2 | |||||||||
B-3 | 0.2 | 0.2 | ||||||||||
三唑化合物 | C-1 | 0.2 | 0.1 | 0.1 | 0.1 | 0.05 | ||||||
鹵化物離子 | Cl -(氯化鈉) | 0.09 (0.15) | 0.09 (0.15) | 0.09 (0.15) | 0.09 (0.15) | 0.09 (0.15) | 0.09 (0.15) | 0.09 (0.15) | 0.09 (0.15) | 0.09 (0.15) | 0.09 (0.15) | |
酸 | 甲酸 | 2 | 2 | |||||||||
乙酸 | 40 | 40 | 20 | 20 | 15 | 15 | 20 | 20 | 15 | 15 | ||
庚酸 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | ||||
三唑化合物相對於咪唑化合物或苯并咪唑化合物的比(莫耳比) | 2.49 | ‒ | 1.00 | ‒ | 0.85 | ‒ | 1.10 | ‒ | 0.45 | ‒ | ||
pH | 3.10 | 3.10 | 3.10 | 3.10 | 4.20 | 4.20 | 2.65 | 2.65 | 3.50 | 3.50 | ||
化成皮膜之膜厚(μm) | 0.20 | 0.21 | 0.22 | 0.21 | 0.19 | 0.20 | 0.22 | 0.20 | 0.19 | 0.20 | ||
評價試驗 | 迴焊條件(波峰溫度/次數) | 波峰溫度(℃) | 250 | 240 | 240 | 260 | 250 | |||||
加熱次數(次) | 3 | 2 | 3 | 3 | 3 | |||||||
銲錫上升率(%) | 70 | 60 | 93 | 36 | 78 | 63 | 80 | 31 | 87 | 46 |
[表5]
A-1: 4-(3,4-二氯苯基)-5-甲基-2-壬基咪唑
A-2:2-苯基-4-(1-萘基)-5-甲基咪唑
A-3:5-甲基-4-苯基-2-(2-噻吩基)咪唑
B-2:6-氯-2-(3,4-二氯苯基甲基)苯并咪唑
B-3:2-(2-萘基甲基)苯并咪唑
C-1:3-胺基-1,2,4-三唑-1-乙酸
實施例 | 比較例 | 實施例 | 比較例 | 實施例 | 比較例 | 實施例 | 比較例 | 實施例 | 比較例 | |||
26 | 14 | 27 | 15 | 28 | 16 | 29 | 17 | 30 | 18 | |||
表面處理劑組成(重量%) | 咪唑化合物 | A-1 | 0.2 | 0.2 | ||||||||
A-2 | 0.2 | 0.2 | ||||||||||
A-3 | 0.2 | 0.2 | ||||||||||
苯并咪唑化合物 | B-2 | 0.2 | 0.2 | |||||||||
B-3 | 0.2 | 0.2 | ||||||||||
三唑化合物 | C-1 | 0.2 | 0.1 | 0.1 | 0.1 | 0.05 | ||||||
酸 | 甲酸 | 2 | 2 | |||||||||
乙酸 | 40 | 40 | 20 | 20 | 15 | 15 | 20 | 20 | 15 | 15 | ||
庚酸 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | ||||
三唑化合物相對於咪唑化合物或苯并咪唑化合物的比(莫耳比) | 2.49 | ‒ | 1.00 | ‒ | 0.85 | ‒ | 1.10 | ‒ | 0.45 | ‒ | ||
pH | 3.10 | 3.10 | 3.10 | 3.10 | 4.20 | 4.20 | 2.65 | 2.65 | 3.50 | 3.50 | ||
化成皮膜之膜厚(μm) | 0.19 | 0.20 | 0.2 | 0.21 | 0.19 | 0.20 | 0.22 | 0.21 | 0.21 | 0.20 | ||
評價試驗 | 迴焊條件 | 波峰溫度(℃) | 250 | 250 | 250 | 260 | 260 | |||||
加熱次數(次) | 3 | 3 | 2 | 3 | 3 | |||||||
銲錫上升率(%) | 68 | 47 | 52 | 8 | 100 | 89 | 97 | 82 | 12 | 1 |
於添加作為咪唑化合物(I)之4-(3,4-二氯苯基)-5-甲基-2-壬基咪唑(A-1)、2-苯基-4-(1-萘基)-5-甲基咪唑(A-2)及5-甲基-4-苯基-2-(2-噻吩基)咪唑(A-3),並使用6-氯-2-(3,4-二氯苯基甲基)苯并咪唑(B-2)及2-(2-萘基甲基)苯并咪唑(B-3)作為苯并咪唑化合物(II)時,亦藉由於表面處理劑中與咪唑化合物(I)或苯并咪唑化合物(II)一起含有三唑化合物(III),而銲錫上升率提升。
(實施例31~32、比較例19~20)
與實施例1同樣進行,如表6記載之組成調製表面處理劑,使用所得表面處理劑,依表6記載之處理條件進行銲錫上升率之評價試驗,測定銲錫上升率(%)。
此等之試驗結果如表6所示。
[表6]
A-2:2-苯基-4-(1-萘基)-5-甲基咪唑
A-3:5-甲基-4-苯基-2-(2-噻吩基)咪唑
C-1:3-胺基-1,2,4-三唑-1-乙酸
實施例 | 比較例 | 實施例 | 比較例 | |||
31 | 19 | 32 | 20 | |||
表 面 處 理 劑 組 成 (重 量 %) | 咪唑化合物 | A-2 | 0.2 | 0.2 | ||
A-3 | 0.2 | 0.2 | ||||
三唑化合物 | C-1 | 0.1 | 0.1 | |||
鹵化物離子 | Cl -(氯化鈉) | 0.09 (0.15) | 0.09 (0.15) | 0.09 (0.15) | 0.09 (0.15) | |
酸 | 甲酸 | 2 | 2 | |||
乙酸 | 20 | 20 | 15 | 15 | ||
庚酸 | 0.1 | 0.1 | 0.1 | 0.1 | ||
金屬離子 | Zn 2+(乙酸鋅) | 0.3 (1.0) | 0.3 (1.0) | 0.3 (1.0) | 0.3 (1.0) | |
鉗合劑 | 鉗合劑(GEDTA) | 0.06 | 0.06 | 0.06 | 0.06 | |
三唑化合物相對於咪唑化合物 或苯并咪唑化合物的比(莫耳比) | 1.00 | ‒ | 0.85 | ‒ | ||
pH | 3.10 | 3.10 | 4.20 | 4.20 | ||
化成皮膜之膜厚(μm) | 0.20 | 0.19 | 0.19 | 0.21 | ||
評價 試驗 | 迴焊條件 | 波峰溫度(℃) | 240 | 240 | ||
加熱次數(次) | 2 | 2 | ||||
銲錫上升率(%) | 94 | 89 | 100 | 87 |
由實施例31與比較例19、實施例32與比較例20之比對可知,藉由於含有金屬離子的系統中,於表面處理劑中與咪唑化合物(I)一起含有三唑化合物(III),則銲錫上升率提升。
以上參照詳細且特定之實施態樣說明了本發明,但對於本領域中具有通常知識者而言,當明白在不脫離本發明之精神與範圍之下可進行各種變更或修正。本申請案係根據2022年3月29日提出之日本專利申請案(特願2022-054331),將其內容引用於此作為參照。
(產業上之可利用性)
根據本發明,在使用銲錫將電子零件等接合至印刷佈線板時,於印刷佈線板之構成電路部等之銅或銅合金的表面,形成耐熱性及與銲錫之潤濕性優越的化成皮膜,藉此可提供焊接性良好的表面處理劑、表面處理方法。
Claims (6)
- 一種銅或銅合金之表面處理劑,係含有:下述化學式(I)所示咪唑化合物或下述化學式(II)所示苯并咪唑化合物;與下述化學式(III)所示三唑化合物; [化1] (式(I)中, R 1表示氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、環烷基、亦可具有取代基之苯基、亦可具有取代基之萘基、亦可具有取代基之苄基、萘甲基、-CH-(Ph) 2、-(CH 2) k-Ph、噻吩基、噻吩甲基、呋喃基或吡啶基;其中,Ph表示亦可具有取代基之苯基,k表示2~5之整數; R 2可為相同或相異,表示氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、環烷基、亦可具有取代基之苯基、亦可具有取代基之萘基、噻吩基或呋喃基;其中,排除R 2同時為氫原子的情況); [化2] (式(II)中, R 3表示碳數1~18之直鏈狀或分支鏈狀之烷基、-(CH 2) m-Ph、-(CH 2) m-Np或下式(1)所示之基,Ph表示亦可具有取代基之苯基,Np表示亦可具有取代基之萘基,m表示1~5之整數; [化3] (式(1)中,m表示1~5之整數); R 4可為相同或相異,表示氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、硝基或鹵原子); [化4] (式(III)中, R 5及R 6可為相同或相異,表示氫原子、碳數1~18之直鏈狀或分支鏈狀之烷基、胺基、亦可具有取代基之苯基、亦可具有取代基之苄基、萘基、吡啶基或下式(2)所示之基;其中,排除R 5及R 6同時為下式(2)所示之基的情況; [化5] (式(2)中,t表示0~12之整數); R 7表示氫原子、苄基或-(CH 2) n-COOH,n表示1~5之整數)。
- 如請求項1之銅或銅合金之表面處理劑,其中,進一步含有鹵化物離子。
- 如請求項2之銅或銅合金之表面處理劑,其中,上述鹵化物離子為氯化物離子。
- 如請求項1至3中任一項之銅或銅合金之表面處理劑,其中,進一步含有鋅離子。
- 如請求項1至4中任一項之銅或銅合金之表面處理劑,其中,上述化學式(III)所示三唑化合物係相對於上述化學式(I)所示咪唑化合物或上述化學式(II)所示苯并咪唑化合物,依0.005~3.0之莫耳比含有。
- 如請求項1至5中任一項之銅或銅合金之表面處理劑,其中,pH為2~5。
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