TWI448581B - 銅或銅合金之表面處理劑及其用途 - Google Patents
銅或銅合金之表面處理劑及其用途 Download PDFInfo
- Publication number
- TWI448581B TWI448581B TW098129378A TW98129378A TWI448581B TW I448581 B TWI448581 B TW I448581B TW 098129378 A TW098129378 A TW 098129378A TW 98129378 A TW98129378 A TW 98129378A TW I448581 B TWI448581 B TW I448581B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper
- imidazole
- solder
- acid
- benzyl
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 57
- 229910052802 copper Inorganic materials 0.000 title claims description 56
- 239000010949 copper Substances 0.000 title claims description 56
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 25
- 239000003795 chemical substances by application Substances 0.000 title description 13
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 50
- 239000012756 surface treatment agent Substances 0.000 claims description 26
- -1 imidazole compound Chemical class 0.000 claims description 22
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 12
- 238000004381 surface treatment Methods 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 77
- 239000000126 substance Substances 0.000 description 24
- 238000012360 testing method Methods 0.000 description 22
- 238000005476 soldering Methods 0.000 description 20
- 230000005496 eutectics Effects 0.000 description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- 150000002460 imidazoles Chemical class 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 150000002366 halogen compounds Chemical class 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 235000002639 sodium chloride Nutrition 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- 239000005749 Copper compound Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 235000011054 acetic acid Nutrition 0.000 description 3
- 150000001880 copper compounds Chemical class 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 3
- 150000003505 terpenes Chemical class 0.000 description 3
- 235000007586 terpenes Nutrition 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 150000003752 zinc compounds Chemical class 0.000 description 3
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 2
- LMADQGMAVROGHF-UHFFFAOYSA-N 2-[(4-butylphenyl)methyl]-5-methyl-4-phenyl-1h-imidazole Chemical compound C1=CC(CCCC)=CC=C1CC1=NC(C=2C=CC=CC=2)=C(C)N1 LMADQGMAVROGHF-UHFFFAOYSA-N 0.000 description 2
- COGUOPIIFAMLES-UHFFFAOYSA-N 2-[(4-chlorophenyl)methyl]-1h-benzimidazole Chemical compound C1=CC(Cl)=CC=C1CC1=NC2=CC=CC=C2N1 COGUOPIIFAMLES-UHFFFAOYSA-N 0.000 description 2
- XBZDJYGGTQCFKT-UHFFFAOYSA-N 2-benzyl-5-(4-pentylphenyl)-1h-imidazole Chemical compound C1=CC(CCCCC)=CC=C1C(N1)=CN=C1CC1=CC=CC=C1 XBZDJYGGTQCFKT-UHFFFAOYSA-N 0.000 description 2
- VSFAOJCDBZNYFW-UHFFFAOYSA-N 2-benzyl-5-tert-butyl-4-phenyl-1h-imidazole Chemical compound N=1C(C=2C=CC=CC=2)=C(C(C)(C)C)NC=1CC1=CC=CC=C1 VSFAOJCDBZNYFW-UHFFFAOYSA-N 0.000 description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 2
- OWVMFLLVLFONOO-UHFFFAOYSA-N 3-butoxypropanoic acid Chemical compound CCCCOCCC(O)=O OWVMFLLVLFONOO-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- YZGQDNOIGFBYKF-UHFFFAOYSA-N Ethoxyacetic acid Chemical compound CCOCC(O)=O YZGQDNOIGFBYKF-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- LCTONWCANYUPML-UHFFFAOYSA-N Pyruvic acid Chemical compound CC(=O)C(O)=O LCTONWCANYUPML-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 2
- 239000004480 active ingredient Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical compound [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Natural products OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- HHLFWLYXYJOTON-UHFFFAOYSA-N glyoxylic acid Chemical compound OC(=O)C=O HHLFWLYXYJOTON-UHFFFAOYSA-N 0.000 description 2
- 239000004310 lactic acid Substances 0.000 description 2
- 235000014655 lactic acid Nutrition 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- 239000004246 zinc acetate Substances 0.000 description 2
- ONDPHDOFVYQSGI-UHFFFAOYSA-N zinc nitrate Chemical compound [Zn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ONDPHDOFVYQSGI-UHFFFAOYSA-N 0.000 description 2
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 description 1
- RMSGQZDGSZOJMU-UHFFFAOYSA-N 1-butyl-2-phenylbenzene Chemical group CCCCC1=CC=CC=C1C1=CC=CC=C1 RMSGQZDGSZOJMU-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- CLLLODNOQBVIMS-UHFFFAOYSA-N 2-(2-methoxyethoxy)acetic acid Chemical compound COCCOCC(O)=O CLLLODNOQBVIMS-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- AWVKQWIOURZHQZ-UHFFFAOYSA-N 2-[(2,4-dichlorophenyl)methyl]-4,5-diphenyl-1h-imidazole Chemical compound ClC1=CC(Cl)=CC=C1CC1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 AWVKQWIOURZHQZ-UHFFFAOYSA-N 0.000 description 1
- IDKDJCHMKXSUMY-UHFFFAOYSA-N 2-[(2-butylphenyl)methyl]-5-(2-methylphenyl)-1h-imidazole Chemical compound CCCCC1=CC=CC=C1CC1=NC=C(C=2C(=CC=CC=2)C)N1 IDKDJCHMKXSUMY-UHFFFAOYSA-N 0.000 description 1
- NDIIGFDKVPVYHG-UHFFFAOYSA-N 2-[(3-tert-butylphenyl)methyl]-5-methyl-4-(3-methylphenyl)-1h-imidazole Chemical compound N=1C(C=2C=C(C)C=CC=2)=C(C)NC=1CC1=CC=CC(C(C)(C)C)=C1 NDIIGFDKVPVYHG-UHFFFAOYSA-N 0.000 description 1
- AVURETBDNXDMID-UHFFFAOYSA-N 2-[(4-butylphenyl)methyl]-5-(4-hexylphenyl)-1h-imidazole Chemical compound C1=CC(CCCCCC)=CC=C1C(N1)=CN=C1CC1=CC=C(CCCC)C=C1 AVURETBDNXDMID-UHFFFAOYSA-N 0.000 description 1
- JGZJMSOCTGCRMG-UHFFFAOYSA-N 2-[(4-butylphenyl)methyl]-5-(4-methylphenyl)-1h-imidazole Chemical compound C1=CC(CCCC)=CC=C1CC1=NC=C(C=2C=CC(C)=CC=2)N1 JGZJMSOCTGCRMG-UHFFFAOYSA-N 0.000 description 1
- OPFSCQILYLGNCD-UHFFFAOYSA-N 2-[(4-butylphenyl)methyl]-5-hexyl-4-phenyl-1h-imidazole Chemical compound N=1C(C=2C=CC=CC=2)=C(CCCCCC)NC=1CC1=CC=C(CCCC)C=C1 OPFSCQILYLGNCD-UHFFFAOYSA-N 0.000 description 1
- NZPPARATDPGHNV-UHFFFAOYSA-N 2-[(4-butylphenyl)methyl]-5-phenyl-1H-imidazole Chemical compound C(CCC)C1=CC=C(CC=2NC=C(N=2)C2=CC=CC=C2)C=C1 NZPPARATDPGHNV-UHFFFAOYSA-N 0.000 description 1
- KOLRMWAFBJEBHR-UHFFFAOYSA-N 2-[(4-chlorophenyl)methyl]-1h-imidazole Chemical compound C1=CC(Cl)=CC=C1CC1=NC=CN1 KOLRMWAFBJEBHR-UHFFFAOYSA-N 0.000 description 1
- VCKOFPBLQMSTKR-UHFFFAOYSA-N 2-[(4-heptylphenyl)methyl]-5-phenyl-1H-imidazole Chemical compound C(CCCCCC)C1=CC=C(CC=2NC=C(N=2)C2=CC=CC=C2)C=C1 VCKOFPBLQMSTKR-UHFFFAOYSA-N 0.000 description 1
- QRCADBBDKYYUIU-UHFFFAOYSA-N 2-[(4-hexylphenyl)methyl]-5-methyl-4-(4-propan-2-ylphenyl)-1h-imidazole Chemical compound C1=CC(CCCCCC)=CC=C1CC1=NC(C=2C=CC(=CC=2)C(C)C)=C(C)N1 QRCADBBDKYYUIU-UHFFFAOYSA-N 0.000 description 1
- JEMANODGMUBCDW-UHFFFAOYSA-N 2-[(4-hexylphenyl)methyl]-5-octyl-1h-imidazole Chemical compound N1C(CCCCCCCC)=CN=C1CC1=CC=C(CCCCCC)C=C1 JEMANODGMUBCDW-UHFFFAOYSA-N 0.000 description 1
- LTPRBYUXKDCJLK-UHFFFAOYSA-N 2-[(4-octylphenyl)methyl]-5-phenyl-1H-imidazole Chemical compound C(CCCCCCC)C1=CC=C(CC=2NC=C(N=2)C2=CC=CC=C2)C=C1 LTPRBYUXKDCJLK-UHFFFAOYSA-N 0.000 description 1
- MUJWRGSQSYZUSG-UHFFFAOYSA-N 2-[(4-pentylphenyl)methyl]-5-phenyl-1H-imidazole Chemical compound C(CCCC)C1=CC=C(CC=2NC=C(N=2)C2=CC=CC=C2)C=C1 MUJWRGSQSYZUSG-UHFFFAOYSA-N 0.000 description 1
- XUIBRHPWAAHUFM-UHFFFAOYSA-N 2-[(4-tert-butylphenyl)methyl]-5-phenyl-1H-imidazole Chemical compound C(C)(C)(C)C1=CC=C(CC=2NC=C(N=2)C2=CC=CC=C2)C=C1 XUIBRHPWAAHUFM-UHFFFAOYSA-N 0.000 description 1
- XJGUMLITIZHCGE-UHFFFAOYSA-N 2-[2-[2-(2-ethoxyethoxy)ethoxy]ethoxy]acetic acid Chemical compound CCOCCOCCOCCOCC(O)=O XJGUMLITIZHCGE-UHFFFAOYSA-N 0.000 description 1
- OZIJHNOJXASLKZ-UHFFFAOYSA-N 2-[[2-(3-methylbutyl)phenyl]methyl]-4-phenyl-5-propyl-1H-imidazole Chemical compound C(CC(C)C)C1=C(CC=2NC(=C(N=2)C2=CC=CC=C2)CCC)C=CC=C1 OZIJHNOJXASLKZ-UHFFFAOYSA-N 0.000 description 1
- XFCDHMQGRQBUSN-UHFFFAOYSA-N 2-benzyl-4-(4-butylphenyl)-5-methyl-1h-imidazole Chemical compound C1=CC(CCCC)=CC=C1C1=C(C)NC(CC=2C=CC=CC=2)=N1 XFCDHMQGRQBUSN-UHFFFAOYSA-N 0.000 description 1
- RNVMMRLFWVQIND-UHFFFAOYSA-N 2-benzyl-4-(4-cyclohexylphenyl)-5-methyl-1h-imidazole Chemical compound N=1C(C=2C=CC(=CC=2)C2CCCCC2)=C(C)NC=1CC1=CC=CC=C1 RNVMMRLFWVQIND-UHFFFAOYSA-N 0.000 description 1
- KKVHVZFYSLODKD-UHFFFAOYSA-N 2-benzyl-4-(4-hexylphenyl)-5-methyl-1h-imidazole Chemical compound C1=CC(CCCCCC)=CC=C1C1=C(C)NC(CC=2C=CC=CC=2)=N1 KKVHVZFYSLODKD-UHFFFAOYSA-N 0.000 description 1
- LOGDCZSOOGXCEX-UHFFFAOYSA-N 2-benzyl-4-(4-tert-butylphenyl)-5-methyl-1h-imidazole Chemical compound N=1C(C=2C=CC(=CC=2)C(C)(C)C)=C(C)NC=1CC1=CC=CC=C1 LOGDCZSOOGXCEX-UHFFFAOYSA-N 0.000 description 1
- ATUUXYNJFVFMMP-UHFFFAOYSA-N 2-benzyl-5-(2,2-dimethylpropyl)-4-(3-methylbutyl)-1h-imidazole Chemical compound N1C(CC(C)(C)C)=C(CCC(C)C)N=C1CC1=CC=CC=C1 ATUUXYNJFVFMMP-UHFFFAOYSA-N 0.000 description 1
- XUOYYWPFKBFTRZ-UHFFFAOYSA-N 2-benzyl-5-(2,2-dimethylpropyl)-4-phenyl-1h-imidazole Chemical compound N=1C(C=2C=CC=CC=2)=C(CC(C)(C)C)NC=1CC1=CC=CC=C1 XUOYYWPFKBFTRZ-UHFFFAOYSA-N 0.000 description 1
- GQCCHLZVXWVVGY-UHFFFAOYSA-N 2-benzyl-5-(2-butylphenyl)-1H-imidazole Chemical compound C(C1=CC=CC=C1)C=1NC=C(N1)C1=C(C=CC=C1)CCCC GQCCHLZVXWVVGY-UHFFFAOYSA-N 0.000 description 1
- SYDNPIFIMOJEMD-UHFFFAOYSA-N 2-benzyl-5-(2-hexylphenyl)-1H-imidazole Chemical compound C(C1=CC=CC=C1)C=1NC=C(N1)C1=C(C=CC=C1)CCCCCC SYDNPIFIMOJEMD-UHFFFAOYSA-N 0.000 description 1
- FGEGQSSRVQUJOZ-UHFFFAOYSA-N 2-benzyl-5-(2-methylpropyl)-4-phenyl-1h-imidazole Chemical compound N=1C(C=2C=CC=CC=2)=C(CC(C)C)NC=1CC1=CC=CC=C1 FGEGQSSRVQUJOZ-UHFFFAOYSA-N 0.000 description 1
- GGJFRDMDBGZFRQ-UHFFFAOYSA-N 2-benzyl-5-(4-butylphenyl)-1h-imidazole Chemical compound C1=CC(CCCC)=CC=C1C(N1)=CN=C1CC1=CC=CC=C1 GGJFRDMDBGZFRQ-UHFFFAOYSA-N 0.000 description 1
- QTXAXNZUAUSDNY-UHFFFAOYSA-N 2-benzyl-5-(4-cyclohexylphenyl)-1H-imidazole Chemical compound C(C1=CC=CC=C1)C=1NC=C(N1)C1=CC=C(C=C1)C1CCCCC1 QTXAXNZUAUSDNY-UHFFFAOYSA-N 0.000 description 1
- CRBFYAZPKOPOSC-UHFFFAOYSA-N 2-benzyl-5-(4-heptylphenyl)-1H-imidazole Chemical compound C1=CC(CCCCCCC)=CC=C1C(N1)=CN=C1CC1=CC=CC=C1 CRBFYAZPKOPOSC-UHFFFAOYSA-N 0.000 description 1
- ZCOSNYFSUNOPTH-UHFFFAOYSA-N 2-benzyl-5-(4-hexylphenyl)-1H-imidazole Chemical compound C1=CC(CCCCCC)=CC=C1C(N1)=CN=C1CC1=CC=CC=C1 ZCOSNYFSUNOPTH-UHFFFAOYSA-N 0.000 description 1
- YIGFUEODLPYPKZ-UHFFFAOYSA-N 2-benzyl-5-(4-octylphenyl)-1h-imidazole Chemical compound C1=CC(CCCCCCCC)=CC=C1C(N1)=CN=C1CC1=CC=CC=C1 YIGFUEODLPYPKZ-UHFFFAOYSA-N 0.000 description 1
- CXUGTNHMJSAHEZ-UHFFFAOYSA-N 2-benzyl-5-(4-tert-butylphenyl)-1h-imidazole Chemical compound C1=CC(C(C)(C)C)=CC=C1C(N1)=CN=C1CC1=CC=CC=C1 CXUGTNHMJSAHEZ-UHFFFAOYSA-N 0.000 description 1
- ANIMQMGDILMQCB-UHFFFAOYSA-N 2-benzyl-5-[4-(2-methylpropyl)phenyl]-1h-imidazole Chemical compound C1=CC(CC(C)C)=CC=C1C(N1)=CN=C1CC1=CC=CC=C1 ANIMQMGDILMQCB-UHFFFAOYSA-N 0.000 description 1
- ZZQAWVJODFJOTA-UHFFFAOYSA-N 2-benzyl-5-[4-(3-methylbutyl)phenyl]-1H-imidazole Chemical compound C1=CC(CCC(C)C)=CC=C1C(N1)=CN=C1CC1=CC=CC=C1 ZZQAWVJODFJOTA-UHFFFAOYSA-N 0.000 description 1
- YTCTUUXPYXQUGY-UHFFFAOYSA-N 2-benzyl-5-butyl-4-(4-methylphenyl)-1h-imidazole Chemical compound N=1C(C=2C=CC(C)=CC=2)=C(CCCC)NC=1CC1=CC=CC=C1 YTCTUUXPYXQUGY-UHFFFAOYSA-N 0.000 description 1
- OZLVUUVRHAHKAV-UHFFFAOYSA-N 2-benzyl-5-butyl-4-phenyl-1h-imidazole Chemical compound N=1C(C=2C=CC=CC=2)=C(CCCC)NC=1CC1=CC=CC=C1 OZLVUUVRHAHKAV-UHFFFAOYSA-N 0.000 description 1
- LEURFNCGLMOGTE-UHFFFAOYSA-N 2-benzyl-5-heptyl-4-phenyl-1h-imidazole Chemical compound N=1C(C=2C=CC=CC=2)=C(CCCCCCC)NC=1CC1=CC=CC=C1 LEURFNCGLMOGTE-UHFFFAOYSA-N 0.000 description 1
- JNJFYAZNQVCCPH-UHFFFAOYSA-N 2-benzyl-5-hexyl-4-(4-propan-2-ylphenyl)-1H-imidazole Chemical compound C(C1=CC=CC=C1)C=1NC(=C(N=1)C1=CC=C(C=C1)C(C)C)CCCCCC JNJFYAZNQVCCPH-UHFFFAOYSA-N 0.000 description 1
- MWJHLOGPGWPMFT-UHFFFAOYSA-N 2-benzyl-5-hexyl-4-phenyl-1h-imidazole Chemical compound N=1C(C=2C=CC=CC=2)=C(CCCCCC)NC=1CC1=CC=CC=C1 MWJHLOGPGWPMFT-UHFFFAOYSA-N 0.000 description 1
- IATUYUAEVHNIGL-UHFFFAOYSA-N 2-benzyl-5-methyl-4-(4-octylphenyl)-1h-imidazole Chemical compound C1=CC(CCCCCCCC)=CC=C1C1=C(C)NC(CC=2C=CC=CC=2)=N1 IATUYUAEVHNIGL-UHFFFAOYSA-N 0.000 description 1
- KVTIFVPTXUZHAP-UHFFFAOYSA-N 2-benzyl-5-methyl-4-[4-(2-methylpropyl)phenyl]-1h-imidazole Chemical compound C1=CC(CC(C)C)=CC=C1C1=C(C)NC(CC=2C=CC=CC=2)=N1 KVTIFVPTXUZHAP-UHFFFAOYSA-N 0.000 description 1
- QZQAEKVHFOGABR-UHFFFAOYSA-N 2-benzyl-5-octyl-4-phenyl-1h-imidazole Chemical compound N=1C(C=2C=CC=CC=2)=C(CCCCCCCC)NC=1CC1=CC=CC=C1 QZQAEKVHFOGABR-UHFFFAOYSA-N 0.000 description 1
- URWQVSLEKJOXBM-UHFFFAOYSA-N 2-benzyl-5-pentyl-4-(4-propylphenyl)-1h-imidazole Chemical compound N=1C(C=2C=CC(CCC)=CC=2)=C(CCCCC)NC=1CC1=CC=CC=C1 URWQVSLEKJOXBM-UHFFFAOYSA-N 0.000 description 1
- AICUCQUADTUQQE-UHFFFAOYSA-N 2-benzyl-5-pentyl-4-phenyl-1h-imidazole Chemical compound N=1C(C=2C=CC=CC=2)=C(CCCCC)NC=1CC1=CC=CC=C1 AICUCQUADTUQQE-UHFFFAOYSA-N 0.000 description 1
- SGUYGLMQEOSQTH-UHFFFAOYSA-N 2-propoxyacetic acid Chemical compound CCCOCC(O)=O SGUYGLMQEOSQTH-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- JRXXEXVXTFEBIY-UHFFFAOYSA-N 3-ethoxypropanoic acid Chemical compound CCOCCC(O)=O JRXXEXVXTFEBIY-UHFFFAOYSA-N 0.000 description 1
- HTNUUDFQRYBJPH-UHFFFAOYSA-N 3-methoxypropanehydrazide Chemical compound COCCC(=O)NN HTNUUDFQRYBJPH-UHFFFAOYSA-N 0.000 description 1
- YZLDXPLNKWTMOO-UHFFFAOYSA-N 3-propoxypropanoic acid Chemical compound CCCOCCC(O)=O YZLDXPLNKWTMOO-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- JEQTYXKWBSIWMH-UHFFFAOYSA-N 4-(4-tert-butylphenyl)-2-[[4-(2,2-dimethylpropyl)phenyl]methyl]-5-octyl-1H-imidazole Chemical compound C(C)(C)(C)C1=CC=C(C=C1)C=1N=C(NC1CCCCCCCC)CC1=CC=C(C=C1)CC(C)(C)C JEQTYXKWBSIWMH-UHFFFAOYSA-N 0.000 description 1
- OTLNPYWUJOZPPA-UHFFFAOYSA-N 4-nitrobenzoic acid Chemical compound OC(=O)C1=CC=C([N+]([O-])=O)C=C1 OTLNPYWUJOZPPA-UHFFFAOYSA-N 0.000 description 1
- AWQSAIIDOMEEOD-UHFFFAOYSA-N 5,5-Dimethyl-4-(3-oxobutyl)dihydro-2(3H)-furanone Chemical compound CC(=O)CCC1CC(=O)OC1(C)C AWQSAIIDOMEEOD-UHFFFAOYSA-N 0.000 description 1
- BSLBNLJJNMWJQB-UHFFFAOYSA-N 5-(2-heptylphenyl)-2-[(2-propan-2-ylphenyl)methyl]-1h-imidazole Chemical compound CCCCCCCC1=CC=CC=C1C(N1)=CN=C1CC1=CC=CC=C1C(C)C BSLBNLJJNMWJQB-UHFFFAOYSA-N 0.000 description 1
- UKAQYQCQDLKKAJ-UHFFFAOYSA-N 5-(3-ethylphenyl)-2-[(4-hexylphenyl)methyl]-1h-imidazole Chemical compound C1=CC(CCCCCC)=CC=C1CC1=NC=C(C=2C=C(CC)C=CC=2)N1 UKAQYQCQDLKKAJ-UHFFFAOYSA-N 0.000 description 1
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- PXRKCOCTEMYUEG-UHFFFAOYSA-N 5-aminoisoindole-1,3-dione Chemical compound NC1=CC=C2C(=O)NC(=O)C2=C1 PXRKCOCTEMYUEG-UHFFFAOYSA-N 0.000 description 1
- LLHCGZOOWMXYMO-UHFFFAOYSA-N 5-ethyl-4-(4-hexylphenyl)-2-[(3-methylphenyl)methyl]-1h-imidazole Chemical compound C1=CC(CCCCCC)=CC=C1C1=C(CC)NC(CC=2C=C(C)C=CC=2)=N1 LLHCGZOOWMXYMO-UHFFFAOYSA-N 0.000 description 1
- DHDACXXDAJCWFL-UHFFFAOYSA-N 5-heptyl-2-[(4-pentylphenyl)methyl]-4-(4-propan-2-ylphenyl)-1h-imidazole Chemical compound N=1C(C=2C=CC(=CC=2)C(C)C)=C(CCCCCCC)NC=1CC1=CC=C(CCCCC)C=C1 DHDACXXDAJCWFL-UHFFFAOYSA-N 0.000 description 1
- ISBNHRTUKAPMGJ-UHFFFAOYSA-N 5-heptyl-4-(2-methylphenyl)-2-[(4-methylphenyl)methyl]-1h-imidazole Chemical compound N=1C(C=2C(=CC=CC=2)C)=C(CCCCCCC)NC=1CC1=CC=C(C)C=C1 ISBNHRTUKAPMGJ-UHFFFAOYSA-N 0.000 description 1
- QAJOCMHFNUUHPN-UHFFFAOYSA-N 5-heptyl-4-(3-hexylphenyl)-2-[[4-(2-methylpropyl)phenyl]methyl]-1h-imidazole Chemical compound N=1C(C=2C=C(CCCCCC)C=CC=2)=C(CCCCCCC)NC=1CC1=CC=C(CC(C)C)C=C1 QAJOCMHFNUUHPN-UHFFFAOYSA-N 0.000 description 1
- DTXRTBWGGQDCBD-UHFFFAOYSA-N 5-hexyl-2-[(4-methylphenyl)methyl]-4-[4-(2-methylpropyl)phenyl]-1h-imidazole Chemical compound N=1C(C=2C=CC(CC(C)C)=CC=2)=C(CCCCCC)NC=1CC1=CC=C(C)C=C1 DTXRTBWGGQDCBD-UHFFFAOYSA-N 0.000 description 1
- PTMRUUKRPOZWDR-UHFFFAOYSA-N 5-octyl-4-phenyl-2-[(3-propan-2-ylphenyl)methyl]-1h-imidazole Chemical compound N=1C(C=2C=CC=CC=2)=C(CCCCCCCC)NC=1CC1=CC=CC(C(C)C)=C1 PTMRUUKRPOZWDR-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-N Acetoacetic acid Natural products CC(=O)CC(O)=O WDJHALXBUFZDSR-UHFFFAOYSA-N 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229910016334 Bi—In Inorganic materials 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- KLWRFFVJVCTSEK-UHFFFAOYSA-N C(C)(C)(C)C1=C(CC=2NC=C(N2)C2=CC=CC=C2)C=CC=C1 Chemical compound C(C)(C)(C)C1=C(CC=2NC=C(N2)C2=CC=CC=C2)C=CC=C1 KLWRFFVJVCTSEK-UHFFFAOYSA-N 0.000 description 1
- DPZOUJLAWIDHGT-UHFFFAOYSA-N CCCCC1=CC=CC(C=2NC(CC=3C=CC=CC=3)=NC=2)=C1 Chemical compound CCCCC1=CC=CC(C=2NC(CC=3C=CC=CC=3)=NC=2)=C1 DPZOUJLAWIDHGT-UHFFFAOYSA-N 0.000 description 1
- GEQHNNZOPDETOA-UHFFFAOYSA-N CCCCCCC1=CC=CC(C=2NC(CC=3C=CC=CC=3)=NC=2)=C1 Chemical compound CCCCCCC1=CC=CC(C=2NC(CC=3C=CC=CC=3)=NC=2)=C1 GEQHNNZOPDETOA-UHFFFAOYSA-N 0.000 description 1
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- 239000005750 Copper hydroxide Substances 0.000 description 1
- 229910021589 Copper(I) bromide Inorganic materials 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 102220474387 PDZ and LIM domain protein 7_H63A_mutation Human genes 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- CANRESZKMUPMAE-UHFFFAOYSA-L Zinc lactate Chemical compound [Zn+2].CC(O)C([O-])=O.CC(O)C([O-])=O CANRESZKMUPMAE-UHFFFAOYSA-L 0.000 description 1
- RAOSIAYCXKBGFE-UHFFFAOYSA-K [Cu+3].[O-]P([O-])([O-])=O Chemical compound [Cu+3].[O-]P([O-])([O-])=O RAOSIAYCXKBGFE-UHFFFAOYSA-K 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229920006271 aliphatic hydrocarbon resin Polymers 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- ODWXUNBKCRECNW-UHFFFAOYSA-M bromocopper(1+) Chemical compound Br[Cu+] ODWXUNBKCRECNW-UHFFFAOYSA-M 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- NKNDPYCGAZPOFS-UHFFFAOYSA-M copper(i) bromide Chemical compound Br[Cu] NKNDPYCGAZPOFS-UHFFFAOYSA-M 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 229940045803 cuprous chloride Drugs 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- WOWBFOBYOAGEEA-UHFFFAOYSA-N diafenthiuron Chemical compound CC(C)C1=C(NC(=S)NC(C)(C)C)C(C(C)C)=CC(OC=2C=CC=CC=2)=C1 WOWBFOBYOAGEEA-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000026045 iodination Effects 0.000 description 1
- 238000006192 iodination reaction Methods 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- RMIODHQZRUFFFF-UHFFFAOYSA-N methoxyacetic acid Chemical compound COCC(O)=O RMIODHQZRUFFFF-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000011698 potassium fluoride Substances 0.000 description 1
- 235000003270 potassium fluoride Nutrition 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229940107700 pyruvic acid Drugs 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 235000009518 sodium iodide Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- WEZYFYMYMKUAHY-UHFFFAOYSA-N tert-butyl 2,4-dibenzylpiperazine-1-carboxylate Chemical compound C1C(CC=2C=CC=CC=2)N(C(=O)OC(C)(C)C)CCN1CC1=CC=CC=C1 WEZYFYMYMKUAHY-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- WGIWBXUNRXCYRA-UHFFFAOYSA-H trizinc;2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O WGIWBXUNRXCYRA-UHFFFAOYSA-H 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011746 zinc citrate Substances 0.000 description 1
- 235000006076 zinc citrate Nutrition 0.000 description 1
- 229940068475 zinc citrate Drugs 0.000 description 1
- SRWMQSFFRFWREA-UHFFFAOYSA-M zinc formate Chemical compound [Zn+2].[O-]C=O SRWMQSFFRFWREA-UHFFFAOYSA-M 0.000 description 1
- 239000011576 zinc lactate Substances 0.000 description 1
- 235000000193 zinc lactate Nutrition 0.000 description 1
- 229940050168 zinc lactate Drugs 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
- ZPEJZWGMHAKWNL-UHFFFAOYSA-L zinc;oxalate Chemical compound [Zn+2].[O-]C(=O)C([O-])=O ZPEJZWGMHAKWNL-UHFFFAOYSA-L 0.000 description 1
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
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- C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
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- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
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Description
本發明係關於一種在將電子零件或其類似物焊接至印刷佈線板之銅或銅合金期間使用的表面處理劑，及其用途。
近年來已廣泛地採用具高密度之表面安裝技術作為印刷佈線板之安裝方法。此種表面安裝技術尤其被分類為雙面表面安裝技術(其中晶片型零件係利用焊料糊結合)及混合安裝技術(其係使用焊料糊之晶片型零件之表面安裝技術與分散零件之通孔(through-hole)安裝技術的組合)。在任一安裝方法中，印刷佈線板接受到兩個或更多個焊接步驟，因此使其暴露至於嚴苛熱史中產生的高溫。
結果，藉由加熱構成印刷佈線板之電路部分之銅或銅合金(以下有時簡稱為銅)的表面加速氧化物膜的形成，因此電路部分的表面無法維持良好的可焊接性。
為保護印刷佈線板之銅電路部分防止空氣氧化，一般使用表面處理劑在電路部分之表面上形成一化學層。然而，需藉由防止化學層退化(即降解)，以即使在銅電路部分經過多個循環之熱史後仍繼續保護銅電路部分，而維持良好的可焊接性。
習知使用錫-鉛合金共熔焊料於將電子零件安裝至印刷佈線板等。然而，近年來，已對包含於焊料合金中之鉛對人體的不利影響產生顧慮，因此希望使用無鉛焊料。
因此，考慮各種無鉛焊料。舉例來說，已有人建議將諸如銀、鋅、鉍、銦、銻、銅等之一或多種金屬添加至錫之基底金屬的無鉛焊料。
習用之錫-鉛共熔焊料於基板(尤其係銅)之表面上的可濕性優異，因此可強固地黏著至銅，而導致高可靠性。
相對地，無鉛焊料於銅表面上之可濕性較習用之錫-鉛焊料差，因此會由於空隙及其他結合缺陷而呈現不良的可焊接性及低結合強度。
因此，當使用無鉛焊料時，需選擇具有優良可焊接性的焊料合金及適用於無鉛焊料的助焊劑。用於防止銅或銅合金之表面氧化的表面處理劑亦需具有用於改良無鉛焊料之可濕性及可焊接性的功能。
許多無鉛焊料具有高熔點，及較習用之錫-鉛共熔焊料高約20至約50℃的焊接溫度。因此，用於利用無鉛焊料進行焊接之製程中的表面處理劑應具有可形成具優異耐熱性之化學層的特性。
關於此等表面處理劑之活性成分，已提出各種咪唑化合物。舉例來說，專利文件1揭示2-烷基咪唑化合物諸如2-十一基咪唑；專利文件2揭示2-芳基咪唑化合物諸如2-苯基咪唑及2-苯基-4一甲基咪唑；專利文件3揭示2-烷基苯并咪唑化合物諸如2-壬基苯并咪唑；專利文件4揭示2-芳烷基苯并咪唑化合物諸如2-(4-氯苯基甲基)苯并咪唑；及專利文件5揭示2-芳烷基咪唑化合物諸如2-(4-氯苯基甲基)咪唑及2-(2,4-二氯苯基甲基)-4,5-二苯基咪唑。
然而，在使用包含此一咪唑化合物之表面處理劑的情況中，形成於銅表面上之化學層的耐熱性仍不令人滿意。此外，在焊接時，焊料可濕性不足，因此無法獲得良好的可焊接性。特定而言，在使用無鉛焊料替代共熔焊料進行焊接的情況中，很難實際使用前述的表面處理劑。
[PLT 1]JP-B-46-17046
[PLT 2]JP-A-4-206681
[PLT 3]JP-A-5-25407
[PLT 4]JP-A-5-186888
[PLT 5]JP-A-7-243054
鑑於前述情勢而進行本發明。本發明之一目的為提供一種表面處理劑，其在使用無鉛焊料將電子零件或其類似物安裝至印刷佈線板時，於構成印刷佈線板之電路部分之銅或銅合金的表面上形成具有優異耐熱性的化學層，且同時改良對焊料之可濕性及使得可焊接性良好；及一種表面處理方法。
此外，本發明之另一目的為提供一種經由使構成銅電路部分之銅或銅合金之表面與前述表面處理劑接觸而得的印刷佈線板，及提供一種藉由使銅或銅合金之表面與前述表面處理劑接觸，然後再使用無鉛焊料進行焊接的焊接方法。
為解決前述問題，本發明人進行廣泛且密集的研究。結果，經發現藉由用包含由化學式(I)表示之咪唑化合物之表面處理劑處理印刷佈線板，可於印刷佈線板之電路部分之銅表面上形成具有優異耐熱性(即可抵抗無鉛焊料之焊接溫度)的化學層，且同時藉由改良在利用焊料焊接時，無鉛焊料對銅或銅合金之表面的可濕性，可獲得良好的可焊接性，以致完成本發明。
換言之，本發明於其最寬廣組態中包括以下態樣：
(1)一種用於銅或銅合金之表面處理劑，其包含由化學式(I)表示之咪唑化合物：
其中R1
、R2
及R3
係相同或不同且代表氫原子或具1至8個碳原子之烷基；且選自R1
、R2
及R3
之至少一者係具4個或4個以上之碳原子的烷基。
(2)一種用於銅或銅合金之表面處理方法，其包括使銅或銅合金之表面與根據以上(1)項之表面處理劑接觸。
(3)一種印刷佈線板，其包括構成銅電路部分之銅或銅合金，其中該銅或銅合金之表面經與根據以上(1)項之表面處理劑接觸。
(4)一種焊接方法，其包括使銅或銅合金之表面與根據以上(1)項之表面處理劑接觸，然後再進行焊接。
根據本發明之表面處理劑不僅可於構成印刷佈線板之電路部分之銅或銅合金之表面上形成具有優異耐熱性的化學層，並且亦可大大地改良無鉛焊料對從屬表面的可濕性且使得可焊接性良好。
此外，由於根據本發明之焊接方法可使用不含鉛(其係有害金屬)之焊料，因而其由環境保護的觀點來看有用。
以下將詳細說明本發明。
使用於本發明之咪唑化合物係由化學式(I)所表示：
其中R1
、R2
及R3
係與上述相同。
前述化學式(I)中之R1
、R2
及R3
係氫原子或烷基，且該烷基係直鏈或分支鏈飽和脂族基團。此一烷基的實例包括甲基(1個碳原子)、乙基(2個碳原子)、丙基(3個碳原子)、異丙基(3個碳原子)、丁基(4個碳原子)、異丁基(4個碳原子)、第二丁基(4個碳原子)、第三丁基(4個碳原子)、戊基(5個碳原子)、己基(6個碳原子)、庚基(7個碳原子)及辛基(8個碳原子)。
用於進行本發明之咪唑化合物可藉由，例如，採用以下反應流程所示之合成方法合成得。
其中R1
、R2
及R3
係與上述相同且X代表氯原子、溴原子或碘原子。
關於用於進行本發明之由化學式(I)表示之咪唑化合物，其實例包括：2-(4-丁基苄基)-4-苯基咪唑，2-(4-第三丁基苄基)-4-苯基咪唑，2-(2-第二丁基苄基)-4-苯基咪唑，2-(4-戊基苄基)-4-苯基咪唑，2-(4-己基苄基)-4-苯基咪唑，2-(4-庚基苄基)-4-苯基咪唑，2-(4-辛基苄基)-4-苯基咪唑，2-苄基-4-(2-丁基苯基)咪唑，2-苄基-4-(3-丁基苯基)咪唑，2-苄基-4-(4-丁基苯基)咪唑，2-苄基-4-(4-異丁基苯基)咪唑，2-苄基-4-(4-第二丁基苯基)咪唑，2-苄基-4-(4-第三丁基苯基)咪唑，2-苄基-4-(4-戊基苯基)咪唑，2-苄基-4-(4-異戊基苯基)咪唑，2-苄基-4-(4-新戊基苯基)咪唑，2-苄基-4-(2-己基苯基)咪唑，2-苄基-4-(3-己基苯基)咪唑，2-苄基-4-(4-己基苯基)咪唑，2-苄基-4-(4-環己基苯基)咪唑，2-苄基-4-(4-庚基苯基)咪唑，2-苄基-4-(4-辛基苯基)咪唑，2-苄基-5-丁基-4-苯基咪唑，2-苄基-5-異丁基-4-苯基咪唑，2-苄基-5-第二丁基-4-苯基咪唑，2-苄基-5-第三丁基-4-苯基咪唑，2-苄基-5-戊基-4-苯基咪唑，2-苄基-5-異戊基-4-苯基咪唑，2-苄基-5-新戊基-4-苯基咪唑，2-苄基-5-己基-4-苯基咪唑，2-苄基-5-庚基-4-苯基咪唑，2-苄基-5-辛基-4-苯基咪唑，2-(2-丁基苄基)-4-(2-甲基苯基)咪唑，2-(4-丁基苄基)-4-(4-甲基苯基)咪唑，4-(3-乙基苯基)-2-(4-己基苄基)咪唑，2-(3-第三丁基苄基)-5-甲基-4-(3-甲基苯基)咪唑，2-(4-己基苄基)-4-(4-異丙基苯基)-5-甲基咪唑，2-(4-丁基苄基)-5-甲基-4-苯基咪唑，2-(2-異戊基苄基)-4-苯基-5-丙基咪唑，2-苄基-4-(4-丁基苯基)-5-甲基咪唑，2-苄基-4-(4-第三丁基苯基)-5-甲基咪唑，2-苄基-4-(4-己基苯基)-5-甲基咪唑，2-苄基-4-(4-環己基苯基)-5-甲基咪唑，2-苄基-5-甲基-4-(4-辛基苯基)咪唑，2-苄基-4-(4-異丁基苯基)-5-甲基咪唑，5-乙基-4-(4-己基苯基)-2-(3-甲基苄基)咪唑，4-(2-庚基苯基)-2-(2-異丙基苄基)咪唑，2-苄基-5-丁基-4-(4一甲基苯基)咪唑，2-苄基-5-戊基-4-(4-丙基苯基)咪唑，2-苄基-5-己基-4-(4-異丙基苯基)咪唑，5-庚基-2-(4一甲基苄基)-4-(2-甲基苯基)咪唑，2-(3-異丙基苄基)-5-辛基-4-苯基咪唑，4-(4-第三丁基苯基)-5-甲基-2-(4-戊基苄基)咪唑，2-(4-丁基苄基)-4-(4-己基苯基)咪唑，5-己基-4-(4-異丁基苯基)-2-(4-甲基苄基)咪唑，2-苄基-4-(異戊基)-5-新戊基咪唑，2-(4-丁基苄基)-5-己基-4-苯基咪唑，5-庚基-4-(4-異丙基苯基)-2-(4-戊基苄基)咪唑，2-(4-己基苄基)-5-辛基咪唑，5-庚基-4-(3-己基苯基)-2-(4-異丁基苄基)咪唑，及4-(4-第三丁基苯基)-2-(4-新戊基苄基)-5-辛基咪唑。
咪唑化合物在藉由將其溶解於水中而製備得之表面處理劑中係使用作為活性成分。咪唑化合物在表面處理劑中可以，例如，0.01至10重量%，及較佳0.1至5重量%之比例包含。當咪唑化合物之含量低於0.01重量%時，形成於銅表面上之化學層的膜厚度可能過薄，以致無法充分防止銅表面的氧化。另一方面，當其超過10重量%時，表面處理劑中之咪唑化合物可能無法完全溶解，或會有即使於咪唑化合物完全溶解後其亦會再沈澱的顧慮，因此並不佳。
附帶一提，在進行本發明時，在由化學式(I)表示之咪唑化合物中，可僅使用其之一適當種類，但亦可使用不同種咪唑化合物之組合。
在進行本發明時，在將咪唑化合物溶解於水中(形成水溶液)時，一般可使用有機酸或無機酸作為酸，但亦可同時使用少量的有機溶劑。在此情況使用之有機酸的代表性實例包括甲酸、乙酸、丙酸、丁酸、乙醛酸、丙酮酸、乙醯乙酸、4-戊酮酸、庚酸、辛酸、癸酸、月桂酸、羥乙酸、甘油酸、乳酸、丙烯酸、甲氧乙酸、乙氧乙酸、丙氧乙酸、丁氧乙酸、2-(2-甲氧基乙氧基)乙酸、2-[2-(2-乙氧基乙氧基)乙氧基]乙酸、2-{2-[2-(2-乙氧基乙氧基)乙氧基]乙氧基}乙酸、3-甲氧丙酸、3-乙氧丙酸、3-丙氧丙酸、3-丁氧丙酸、苯甲酸、對硝基苯甲酸、對甲苯磺酸、水楊酸、苦味酸、草酸、琥珀酸、順丁烯二酸、反丁烯二酸、酒石酸、及己二酸；及無機酸的實例包括鹽酸、磷酸、硫酸、及硝酸。此一酸在表面處理劑中可以0.1至50重量%，及較佳1至30重量%之比例添加。
此外，關於有機溶劑，合適者為低碳醇諸如甲醇、乙醇、及異丙醇、或丙酮、N,N-二甲基甲醯胺、乙二醇及其類似物，其可與水自由混溶。
可於本發明之表面處理劑中添加銅化合物，以加快化學層在銅或銅合金之表面上的形成速率。此外，可添加鋅化合物，以進一步增進形成化學層之耐熱性。
銅化合物的代表性實例包括乙酸銅、氯化亞銅、氯化銅、溴化亞銅、溴化銅、碘化銅、氫氧化銅、磷酸銅、硫酸銅、及硝酸銅；及鋅化合物的代表性實例包括氧化鋅、甲酸鋅、乙酸鋅、草酸鋅、乳酸鋅、檸檬酸鋅、硫酸鋅、硝酸鋅、及磷酸鋅。其兩者皆可以0.01至10重量%，及較佳0.02至5重量%之比例包含於表面處理劑中。
在使用此一銅化合物或鋅化合物之情況中，可能需要在有機酸或無機酸之外，再添加具有緩衝作用之物質，胺化合物諸如氨、單乙醇胺、二乙醇胺、或三乙醇胺，而使溶液之pH穩定化。
為進一步增進化學層之形成速率及該層之耐熱性，可將鹵素化合物(在其更一般的意義中使用「鹵素」)以0.001至1重量%，及較佳0.01至0.1重量%之比例添加至表面處理劑中。鹵素化合物的實例包括氟化鈉、氟化鉀、氟化銨、氯化鈉、氯化鉀、氯化銨、溴化鈉、溴化鉀、溴化銨、碘化鈉、碘化鉀、及碘化銨。
關於用於使用根據本發明之表面處理劑處理銅或銅合金之表面的條件，表面處理劑之液體溫度較佳可為10至70℃，及接觸時間較佳可為1秒至10分鐘。接觸方法的實例包括浸泡、噴霧、及塗布方法。
此外，於進行根據本發明之表面處理後，可藉由形成包含經塗布熱塑性樹脂之化學層的雙層結構，而進一步增進耐熱性。
換言之，於在銅或銅合金之表面上形成化學層後，可藉由將具有優異耐熱性之熱塑性樹脂(其可由松香衍生物(例如，松香或松香酯)、萜烯樹脂衍生物(例如，萜烯樹脂或萜烯酚樹脂)、烴樹脂(例如，芳族烴樹脂或脂族烴樹脂)、或其混合物所構成)溶解於溶劑(例如，甲苯、乙酸乙酯、或異丙醇)中，及使用輥塗機或其類似裝置在化學層上以(例如)1至30微米之厚度均勻塗布溶液，而形成化學層與熱塑性樹脂的雙層結構。
適用於進行本發明之無鉛焊料的實例包括諸如Sn-Ag-Cu基、Sn-Ag-Bi基、Sn-Bi基、Sn-Ag-Bi-In基、Sn-Zn基、及Sn-Cu基焊料的無鉛焊料。
本發明之焊接方法可應用於包括使印刷佈線板於焊料槽中在熔融液態焊料之上移動，以焊接電子零件與印刷佈線板之間之接點的流動焊接；或包括預先將糊膏焊料根據電路圖案印刷於印刷佈線板上，將電子零件安裝於其上，及加熱整個印刷佈線板以使焊料熔融而完成焊接的回流焊接。
以下將參照實施例及比較例明確說明本發明，但不應將本發明解釋為受其所限制。
使用於實施例中之咪唑化合物係如下。
‧2-(4-丁基苄基)-5-甲基-4-苯基咪唑(稱為「IMZ-A」)
‧2-(4-己基苄基)-4-苯基咪唑(稱為「IMZ-B」)
‧2-苄基-4-(4-丁基苯基)咪唑(稱為「IMZ-C」)
‧2-苄基-4-(4-第二丁基苯基)咪唑(稱為「IMZ-D」)
‧2-苄基-5-甲基-4-(4-辛基苯基)咪唑(稱為「IMZ-E」)
‧2-(4-丁基苄基)-5-己基-4-苯基咪唑(稱為「IMZ-F」)
使用於比較例中之咪唑化合物係如下。
‧2-(4-甲基苄基)-4-苯基咪唑(稱為「IMZ-G」)
‧2-苄基-5-甲基-4-(4-甲基苯基)咪唑(稱為「IMZ-H」)
‧2-苯基咪唑(稱為「IMZ-I」)
‧2-壬基苯并咪唑(稱為「IMZ-J」)
‧2-(4-氯苄基)苯并咪唑(稱為「IMZ-K」)
實施例中使用之咪唑化合物(IMZ-A至IMZ-F)及比較例中使用之咪唑化合物(IMZ-G至IMZ-K)的化學式顯示於下。
實施例及比較例中使用之評估試驗方法如下。
將120毫米(長度)×150毫米(寬度)×1.6毫米(厚度)之由玻璃環氧樹脂所製成且具有300個內徑0.80毫米之銅通孔的印刷佈線板使用作為試件。將此試件脫脂，進行軟蝕刻，然後用水洗滌。其後將試件於維持在指定液體溫度下的表面處理劑中浸泡指定的時間，用水洗滌，然後乾燥而於銅表面上形成具有約0.10至0.50微米厚度之化學層。
使用紅外回流烘箱(商品名：MULTI-PRO-306，Vetronix Co.,Ltd.製造)使經表面處理的試件接受兩循環的回流加熱，其中最高溫度為240℃，接著再利用流動焊接裝置(輸送器速度：1.0米/分鐘)進行焊接。
使用的焊料為具有63%錫及37%鉛(重量%)之組成的錫-鉛共熔焊料(商品名：H63A，Senju Metal Industry Co.,Ltd.製造)，且用於焊接的助焊劑為JS-64MSS(Koki Co.,Ltd.製造)。焊接溫度為240℃。
亦使用無鉛焊料以與錫-鉛共熔焊料相同的方式焊接經如以上進行表面處理的試件。使用的焊料為具有96.5%錫、3.0%銀及0.5%銅(重量%)之組成的無鉛焊料(商品名：H705「ECOSOLDER」，Senju Metal Industry Co.,Ltd.製造)，且用於焊接的助焊劑為JS-E-09(Koki Co.,Ltd.製造)。回流加熱最高溫度為245℃，且焊接溫度亦為245℃。
對經焊接的試件，計算其中焊料經填充達到銅通孔之上端之(經焊接)銅通孔的數目相對於銅通孔之總數(300個孔洞)的比例(%)。
當在銅表面上的焊料可濕性大時，熔融的焊料穿透各銅通孔之內部，藉此熔融焊料可輕易地將其填充至通孔之上端。換言之，當上端經焊接之通孔數目對通孔總數的比大時，判定焊料可濕性及對銅的可焊接性優異。
使用50毫米(長度)×50毫米(寬度)×1.2毫米(厚度)之由玻璃環氧樹脂製成的印刷佈線板作為試件。此印刷佈線板具有10個在寬度方向以1.0毫米間隔形成之具0.80毫米導體寬度及20毫米長度之銅箔電路的電路圖案。將試件脫脂，進行軟蝕刻，然後用水洗滌。其後將試件於維持在指定液體溫度下的表面處理劑中浸泡指定的時間，用水洗滌，然後乾燥而於銅表面上形成具有約0.10至0.50微米厚度之化學層。
使用紅外回流烘箱(商品名：MULTI-PRO-306，Vetronix Co.,Ltd.製造)使經表面處理的試件接受一循環的回流加熱，其中最高溫度為240℃。其後使用具有1.2毫米孔隙直徑及150微米厚度的金屬遮罩將錫-鉛焊料糊印刷於銅電路部分的中心上，及在上述條件下進行回流加熱及進行焊接。使用的錫-鉛焊料糊為由63%錫及37%鉛(重量%)所組成的共熔焊料(商品名：OZ-63-330F-40-10，Senju Metal Industry Co.,Ltd.製造)。
亦使用無鉛焊料糊以與錫-鉛焊料糊相同的方式焊接經如以上進行表面處理的試件。使用的無鉛焊料係由96.5%錫、3.0%銀及0.5%銅(重量%)所組成(商品名：M705-221BM5-42-11，Senju Metal Industry Co.,Ltd.製造)。將於焊料糊印刷前後所達到之回流加熱的最高溫度設為245℃。
測量焊料濕潤且擴展於獲得試件之銅電路部分上的長度(毫米)。
當長度較長時，判定焊料可濕性及可焊接性優異。
於將作為咪唑化合物之2-(4-丁基苄基)-5-甲基-4-苯基咪唑、作為酸之乙酸及乳酸、作為金屬鹽之乙酸銅及乙酸鋅、及作為鹵素化合物之溴化銨溶解於去離子水中而具有如表1所述之組成物後，利用氨水將pH調整至2.7，因而製備得表面處理劑。
接下來，將印刷佈線板之試件於經控制於40℃溫度下之表面處理劑中浸泡120秒，用水洗滌，然後乾燥，因而測量焊料上流速率性質及焊料擴展性。此等試驗結果示於表2。
使用如表1所述之咪唑化合物、酸、金屬鹽及鹵素化合物，以與實施例1相同之方式製備各具有如表1所述之組成物的表面處理劑，且在如表2所述之處理條件下進行表面處理。對所得的試件測量焊料上流速率性質及焊料擴展性。此等試驗結果示於表2。
使用如表1所述之咪唑化合物、酸、金屬鹽及鹵素化合物，以與實施例1相同之方式製備各具有如表1所述之組成物的表面處理劑，且在如表2所述之處理條件下進行表面處理。對所得的試件測量焊料上流速率性質及焊料擴展性。此等試驗結果示於表2。
根據如表1及表2所示之試驗結果，據認為共熔焊料或無鉛焊料對印刷佈線板之銅表面的可濕性藉由使根據本發明之表面處理劑與印刷佈線板之銅電路部分接觸，以在銅表面上形成化學層而獲得改良，且共熔焊料或無鉛焊料對銅表面之可焊接性(焊料上流速率性質、焊料擴展性)大大地改良。當然，可將根據本發明之表面處理劑使用在利用共熔焊料的焊接中，但其可適用於利用無鉛焊料的焊接中。
根據本發明之表面處理劑不僅可在構成印刷佈線板之電路部分之銅或銅合金之表面上形成具優異耐熱性之化學層，並且亦可大大地改良無鉛焊料對從屬表面的可濕性及使得可焊接性良好。
此外，由於根據本發明之焊接方法可使用不含鉛(其係有害金屬)之焊料，因而其由環境保護的觀點來看有用。
雖然本發明已經詳細說明並參照其之特定具體例，但熟悉技藝人士當明白可不脫離其範疇而於其中進行各種變化及修改。
本申請案係以2008年9月1日提出申請之日本專利申請案第2008-223663號為基礎，將其全體內容併入本文為參考資料。
Claims (4)
- 一種用於銅或銅合金之表面處理劑，其包含由化學式(I)表示之咪唑化合物：
- 一種用於銅或銅合金之表面處理方法，其包括使銅或銅合金之表面與申請專利範圍第1項之表面處理劑接觸。
- 一種印刷佈線板，其包括構成銅電路部分之銅或銅合金，其中，該銅或銅合金之表面經與申請專利範圍第1項之表面處理劑接觸。
- 一種焊接方法，其包括使銅或銅合金之表面與申請專利範圍第1項之表面處理劑接觸，然後再進行焊接。
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