CN101448978B - 金属用表面处理剂及其用途 - Google Patents
金属用表面处理剂及其用途 Download PDFInfo
- Publication number
- CN101448978B CN101448978B CN2007800183617A CN200780018361A CN101448978B CN 101448978 B CN101448978 B CN 101448978B CN 2007800183617 A CN2007800183617 A CN 2007800183617A CN 200780018361 A CN200780018361 A CN 200780018361A CN 101448978 B CN101448978 B CN 101448978B
- Authority
- CN
- China
- Prior art keywords
- phenyl
- imidazoles
- benzoglyoxaline
- naphthyl
- treatment agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012756 surface treatment agent Substances 0.000 title claims abstract description 37
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 30
- 239000002184 metal Substances 0.000 title claims abstract description 30
- 239000000126 substance Substances 0.000 claims abstract description 46
- 229910000679 solder Inorganic materials 0.000 claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 claims abstract description 4
- 150000004693 imidazolium salts Chemical class 0.000 claims description 22
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims description 18
- 229950006191 gluconic acid Drugs 0.000 claims description 18
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 claims description 11
- -1 imidazole compound Chemical class 0.000 abstract description 47
- 238000000034 method Methods 0.000 abstract description 33
- 150000001875 compounds Chemical class 0.000 abstract description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 4
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 59
- 150000002460 imidazoles Chemical class 0.000 description 24
- 125000000217 alkyl group Chemical group 0.000 description 16
- 238000003466 welding Methods 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 125000004432 carbon atom Chemical group C* 0.000 description 14
- 238000012360 testing method Methods 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 125000005843 halogen group Chemical group 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000002253 acid Substances 0.000 description 7
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 7
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 230000005496 eutectics Effects 0.000 description 5
- 238000011010 flushing procedure Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 125000003342 alkenyl group Chemical group 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 3
- 239000005749 Copper compound Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 150000001880 copper compounds Chemical class 0.000 description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 150000002366 halogen compounds Chemical class 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- XZXYQEHISUMZAT-UHFFFAOYSA-N 2-[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenol Chemical compound CC1=CC=C(O)C(CC=2C(=CC=C(C)C=2)O)=C1 XZXYQEHISUMZAT-UHFFFAOYSA-N 0.000 description 2
- SDQCONAKTCBAMG-UHFFFAOYSA-N 2-pentadecyl-1h-imidazole Chemical class CCCCCCCCCCCCCCCC1=NC=CN1 SDQCONAKTCBAMG-UHFFFAOYSA-N 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- JOOXCMJARBKPKM-UHFFFAOYSA-N 4-oxopentanoic acid Chemical compound CC(=O)CCC(O)=O JOOXCMJARBKPKM-UHFFFAOYSA-N 0.000 description 2
- IKJYRWQCYXTMFR-UHFFFAOYSA-N 5-methyl-2-naphthalen-1-yl-4-phenyl-1h-imidazole Chemical compound CC=1NC(C=2C3=CC=CC=C3C=CC=2)=NC=1C1=CC=CC=C1 IKJYRWQCYXTMFR-UHFFFAOYSA-N 0.000 description 2
- LFNLCLNDJHARGR-UHFFFAOYSA-N 5-naphthalen-2-yl-2-phenyl-1h-imidazole Chemical class N=1C(C=2C=C3C=CC=CC3=CC=2)=CNC=1C1=CC=CC=C1 LFNLCLNDJHARGR-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-M D-gluconate Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O RGHNJXZEOKUKBD-SQOUGZDYSA-M 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- LCTONWCANYUPML-UHFFFAOYSA-N Pyruvic acid Chemical compound CC(=O)C(O)=O LCTONWCANYUPML-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229940107816 ammonium iodide Drugs 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 230000004087 circulation Effects 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- QTMDXZNDVAMKGV-UHFFFAOYSA-L copper(ii) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 description 2
- NWFNSTOSIVLCJA-UHFFFAOYSA-L copper;diacetate;hydrate Chemical compound O.[Cu+2].CC([O-])=O.CC([O-])=O NWFNSTOSIVLCJA-UHFFFAOYSA-L 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229940050410 gluconate Drugs 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 235000010755 mineral Nutrition 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- 125000002769 thiazolinyl group Chemical group 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- VNDYJBBGRKZCSX-UHFFFAOYSA-L zinc bromide Chemical compound Br[Zn]Br VNDYJBBGRKZCSX-UHFFFAOYSA-L 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- UAYWVJHJZHQCIE-UHFFFAOYSA-L zinc iodide Chemical compound I[Zn]I UAYWVJHJZHQCIE-UHFFFAOYSA-L 0.000 description 2
- ONDPHDOFVYQSGI-UHFFFAOYSA-N zinc nitrate Chemical compound [Zn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ONDPHDOFVYQSGI-UHFFFAOYSA-N 0.000 description 2
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 description 1
- DJARRRWWLTWZRT-UHFFFAOYSA-N 2-(2-bromophenyl)-5-methyl-4-phenyl-1H-imidazole Chemical compound BrC1=C(C=CC=C1)C=1NC(=C(N=1)C1=CC=CC=C1)C DJARRRWWLTWZRT-UHFFFAOYSA-N 0.000 description 1
- YOXFKAQGQSOCHH-UHFFFAOYSA-N 2-(2-bromophenyl)-5-phenyl-1H-imidazole Chemical compound BrC1=C(C=CC=C1)C=1NC=C(N=1)C1=CC=CC=C1 YOXFKAQGQSOCHH-UHFFFAOYSA-N 0.000 description 1
- LYOLIGWGWRTHCT-UHFFFAOYSA-N 2-(2-fluorophenyl)-5-methyl-4-phenyl-1H-imidazole Chemical compound FC1=C(C=CC=C1)C=1NC(=C(N=1)C1=CC=CC=C1)C LYOLIGWGWRTHCT-UHFFFAOYSA-N 0.000 description 1
- LIYVLBOGFIRDDZ-UHFFFAOYSA-N 2-(2-iodophenyl)-5-methyl-4-phenyl-1H-imidazole Chemical compound IC1=C(C=CC=C1)C=1NC(=C(N=1)C1=CC=CC=C1)C LIYVLBOGFIRDDZ-UHFFFAOYSA-N 0.000 description 1
- QUPGAQPCEFJHAV-UHFFFAOYSA-N 2-(2-iodophenyl)-5-phenyl-1H-imidazole Chemical compound IC1=C(C=CC=C1)C=1NC=C(N=1)C1=CC=CC=C1 QUPGAQPCEFJHAV-UHFFFAOYSA-N 0.000 description 1
- 125000003163 2-(2-naphthyl)ethyl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C(C([H])=C([H])C2=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- WRFWLJXNVMSJAX-UHFFFAOYSA-N 2-(3-bromo-5-octylphenyl)-5-phenyl-1H-imidazole Chemical compound BrC=1C=C(C=C(C=1)CCCCCCCC)C=1NC=C(N=1)C1=CC=CC=C1 WRFWLJXNVMSJAX-UHFFFAOYSA-N 0.000 description 1
- PREIASNNKJXBJG-UHFFFAOYSA-N 2-(3-bromophenyl)-5-methyl-4-phenyl-1H-imidazole Chemical compound BrC=1C=C(C=CC=1)C=1NC(=C(N=1)C1=CC=CC=C1)C PREIASNNKJXBJG-UHFFFAOYSA-N 0.000 description 1
- LOLMYQXBJWSZMM-UHFFFAOYSA-N 2-(3-bromophenyl)-5-phenyl-1H-imidazole Chemical compound Brc1cccc(c1)-c1nc(c[nH]1)-c1ccccc1 LOLMYQXBJWSZMM-UHFFFAOYSA-N 0.000 description 1
- NFXOFJVCPMEEHL-UHFFFAOYSA-N 2-(3-fluorophenyl)-5-methyl-4-phenyl-1H-imidazole Chemical compound FC=1C=C(C=CC=1)C=1NC(=C(N=1)C1=CC=CC=C1)C NFXOFJVCPMEEHL-UHFFFAOYSA-N 0.000 description 1
- OETLFHKNZYBADH-UHFFFAOYSA-N 2-(3-fluorophenyl)-5-phenyl-1h-imidazole Chemical compound FC1=CC=CC(C=2NC(=CN=2)C=2C=CC=CC=2)=C1 OETLFHKNZYBADH-UHFFFAOYSA-N 0.000 description 1
- SVPLJFBBVKBWIB-UHFFFAOYSA-N 2-(3-iodophenyl)-5-methyl-4-phenyl-1H-imidazole Chemical compound IC=1C=C(C=CC=1)C=1NC(=C(N=1)C1=CC=CC=C1)C SVPLJFBBVKBWIB-UHFFFAOYSA-N 0.000 description 1
- UQVXNXSSFXZVDY-UHFFFAOYSA-N 2-(3-iodophenyl)-5-phenyl-1H-imidazole Chemical compound Ic1cccc(c1)-c1nc(c[nH]1)-c1ccccc1 UQVXNXSSFXZVDY-UHFFFAOYSA-N 0.000 description 1
- KIKYZVSVRQKUDE-UHFFFAOYSA-N 2-(3-octylphenyl)-5-phenyl-1H-imidazole Chemical compound C(CCCCCCC)C=1C=C(C=CC=1)C=1NC=C(N=1)C1=CC=CC=C1 KIKYZVSVRQKUDE-UHFFFAOYSA-N 0.000 description 1
- UFAFFTPZZZSUKP-UHFFFAOYSA-N 2-(4,6-dimethylnaphthalen-1-yl)-6-ethyl-1H-benzimidazole Chemical compound CC1=CC=C(C2=CC=C(C=C12)C)C=1NC2=C(N1)C=CC(=C2)CC UFAFFTPZZZSUKP-UHFFFAOYSA-N 0.000 description 1
- WPWSWQMHRIBBTB-UHFFFAOYSA-N 2-(4-bromophenyl)-5-methyl-4-phenyl-1H-imidazole Chemical compound BrC1=CC=C(C=C1)C=1NC(=C(N=1)C1=CC=CC=C1)C WPWSWQMHRIBBTB-UHFFFAOYSA-N 0.000 description 1
- ASXXGYRRMAYECY-UHFFFAOYSA-N 2-(4-bromophenyl)-5-phenyl-1h-imidazole Chemical compound C1=CC(Br)=CC=C1C1=NC(C=2C=CC=CC=2)=CN1 ASXXGYRRMAYECY-UHFFFAOYSA-N 0.000 description 1
- XHOIMCPVMWYING-UHFFFAOYSA-N 2-(4-chlorobutyl)-1h-imidazole Chemical class ClCCCCC1=NC=CN1 XHOIMCPVMWYING-UHFFFAOYSA-N 0.000 description 1
- IOOZGAIMDGZQFZ-UHFFFAOYSA-N 2-(4-fluorophenyl)-5-methyl-4-phenyl-1h-imidazole Chemical compound CC=1NC(C=2C=CC(F)=CC=2)=NC=1C1=CC=CC=C1 IOOZGAIMDGZQFZ-UHFFFAOYSA-N 0.000 description 1
- CAJDUBMUXJAMBC-UHFFFAOYSA-N 2-(4-fluorophenyl)-5-phenyl-1H-imidazole Chemical compound FC1=CC=C(C=C1)C=1NC=C(N=1)C1=CC=CC=C1 CAJDUBMUXJAMBC-UHFFFAOYSA-N 0.000 description 1
- IDNIZYCLCDDPFL-UHFFFAOYSA-N 2-(4-iodophenyl)-5-methyl-4-phenyl-1H-imidazole Chemical compound IC1=CC=C(C=C1)C=1NC(=C(N=1)C1=CC=CC=C1)C IDNIZYCLCDDPFL-UHFFFAOYSA-N 0.000 description 1
- FNYDOGQLEQJIIR-UHFFFAOYSA-N 2-(4-iodophenyl)-5-phenyl-1H-imidazole Chemical compound IC1=CC=C(C=C1)C=1NC=C(N=1)C1=CC=CC=C1 FNYDOGQLEQJIIR-UHFFFAOYSA-N 0.000 description 1
- BQHAUJOWLSGKJL-UHFFFAOYSA-N 2-(5-chloro-2-methylnaphthalen-1-yl)-5-(4-hexylphenyl)-1H-imidazole Chemical class CC1=C(C2=CC=CC(=C2C=C1)Cl)C=1NC=C(N1)C1=CC=C(C=C1)CCCCCC BQHAUJOWLSGKJL-UHFFFAOYSA-N 0.000 description 1
- RFPNWEZMQUWPIW-UHFFFAOYSA-N 2-(cyclohexylmethyl)-6-ethyl-1h-benzimidazole Chemical compound N1C2=CC(CC)=CC=C2N=C1CC1CCCCC1 RFPNWEZMQUWPIW-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- HITWHALOZBMLHY-UHFFFAOYSA-N 2-Butyl-1H-benzimidazole Chemical group C1=CC=C2NC(CCCC)=NC2=C1 HITWHALOZBMLHY-UHFFFAOYSA-N 0.000 description 1
- MWYNOZGYGNMTBG-UHFFFAOYSA-N 2-[(4-bromophenyl)methyl]-6-ethyl-1h-benzimidazole Chemical compound N1C2=CC(CC)=CC=C2N=C1CC1=CC=C(Br)C=C1 MWYNOZGYGNMTBG-UHFFFAOYSA-N 0.000 description 1
- ZUKYCLYMFNPDCT-UHFFFAOYSA-N 2-cyclohexyl-1h-benzimidazole Chemical class C1CCCCC1C1=NC2=CC=CC=C2N1 ZUKYCLYMFNPDCT-UHFFFAOYSA-N 0.000 description 1
- LYNVLWLRSACENL-UHFFFAOYSA-N 2-decyl-1h-imidazole Chemical class CCCCCCCCCCC1=NC=CN1 LYNVLWLRSACENL-UHFFFAOYSA-N 0.000 description 1
- ILSVUUXCOJXFIJ-UHFFFAOYSA-N 2-docosyl-1H-imidazole Chemical class C(CCCCCCCCCCCCCCCCCCCCC)C=1NC=CN1 ILSVUUXCOJXFIJ-UHFFFAOYSA-N 0.000 description 1
- QGFGLYOMJKJZIC-UHFFFAOYSA-N 2-dodecyl-1h-benzimidazole Chemical class C1=CC=C2NC(CCCCCCCCCCCC)=NC2=C1 QGFGLYOMJKJZIC-UHFFFAOYSA-N 0.000 description 1
- LEHNQGSPRXHYRT-UHFFFAOYSA-N 2-dodecyl-1h-imidazole Chemical class CCCCCCCCCCCCC1=NC=CN1 LEHNQGSPRXHYRT-UHFFFAOYSA-N 0.000 description 1
- QHCCOYAKYCWDOJ-UHFFFAOYSA-N 2-ethyl-1h-benzimidazole Chemical compound C1=CC=C2NC(CC)=NC2=C1 QHCCOYAKYCWDOJ-UHFFFAOYSA-N 0.000 description 1
- PGBJAKJQOMRDGC-UHFFFAOYSA-N 2-henicosyl-1h-imidazole Chemical class CCCCCCCCCCCCCCCCCCCCCC1=NC=CN1 PGBJAKJQOMRDGC-UHFFFAOYSA-N 0.000 description 1
- SWWJTAQYZKGJIL-UHFFFAOYSA-N 2-heptadecan-8-yl-1H-imidazole Chemical class C(CCCCCC)C(CCCCCCCCC)C=1NC=CN=1 SWWJTAQYZKGJIL-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical class CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- RFWOZDRUDBNGSY-UHFFFAOYSA-N 2-heptadecyl-5-methyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC(C)=CN1 RFWOZDRUDBNGSY-UHFFFAOYSA-N 0.000 description 1
- ABLCFODXAYBNID-UHFFFAOYSA-N 2-heptyl-1h-imidazole Chemical class CCCCCCCC1=NC=CN1 ABLCFODXAYBNID-UHFFFAOYSA-N 0.000 description 1
- ASNJYDQNWYEHMD-UHFFFAOYSA-N 2-hex-5-enyl-1H-imidazole Chemical class C(CCCC=C)C=1NC=CN=1 ASNJYDQNWYEHMD-UHFFFAOYSA-N 0.000 description 1
- UANAUSCAUXQBJK-UHFFFAOYSA-N 2-hexadecyl-1h-imidazole Chemical class CCCCCCCCCCCCCCCCC1=NC=CN1 UANAUSCAUXQBJK-UHFFFAOYSA-N 0.000 description 1
- PYYKNZYLXBFXQQ-UHFFFAOYSA-N 2-hexan-2-yl-1h-imidazole Chemical class CCCCC(C)C1=NC=CN1 PYYKNZYLXBFXQQ-UHFFFAOYSA-N 0.000 description 1
- DAPXOJOQSNBLKY-UHFFFAOYSA-N 2-hexyl-1h-imidazole Chemical class CCCCCCC1=NC=CN1 DAPXOJOQSNBLKY-UHFFFAOYSA-N 0.000 description 1
- VAYWVDWGCIGJSW-UHFFFAOYSA-N 2-icosyl-1h-imidazole Chemical class CCCCCCCCCCCCCCCCCCCCC1=NC=CN1 VAYWVDWGCIGJSW-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- BQMLFRCDMWYVTQ-UHFFFAOYSA-N 2-naphthalen-1-yl-5-phenyl-1h-imidazole Chemical compound C=1NC(C=2C3=CC=CC=C3C=CC=2)=NC=1C1=CC=CC=C1 BQMLFRCDMWYVTQ-UHFFFAOYSA-N 0.000 description 1
- XVGQHMYCDALKKN-UHFFFAOYSA-N 2-naphthalen-2-yl-5-phenyl-1h-imidazole Chemical compound C=1NC(C=2C=C3C=CC=CC3=CC=2)=NC=1C1=CC=CC=C1 XVGQHMYCDALKKN-UHFFFAOYSA-N 0.000 description 1
- BJKIKGYQBXCUGV-UHFFFAOYSA-N 2-nonadecyl-1h-imidazole Chemical class CCCCCCCCCCCCCCCCCCCC1=NC=CN1 BJKIKGYQBXCUGV-UHFFFAOYSA-N 0.000 description 1
- JPZKJZJFMLNIMB-UHFFFAOYSA-N 2-nonyl-1h-imidazole Chemical class CCCCCCCCCC1=NC=CN1 JPZKJZJFMLNIMB-UHFFFAOYSA-N 0.000 description 1
- QCQBUZVEQZFGQV-UHFFFAOYSA-N 2-octadecyl-1h-imidazole Chemical class CCCCCCCCCCCCCCCCCCC1=NC=CN1 QCQBUZVEQZFGQV-UHFFFAOYSA-N 0.000 description 1
- FUFBXNVLNZEQDC-UHFFFAOYSA-N 2-pentacosyl-1H-imidazole Chemical class C(CCCCCCCCCCCCCCCCCCCCCCCC)C=1NC=CN1 FUFBXNVLNZEQDC-UHFFFAOYSA-N 0.000 description 1
- DWYHDSLIWMUSOO-UHFFFAOYSA-N 2-phenyl-1h-benzimidazole Chemical compound C1=CC=CC=C1C1=NC2=CC=CC=C2N1 DWYHDSLIWMUSOO-UHFFFAOYSA-N 0.000 description 1
- FUOZJYASZOSONT-UHFFFAOYSA-N 2-propan-2-yl-1h-imidazole Chemical compound CC(C)C1=NC=CN1 FUOZJYASZOSONT-UHFFFAOYSA-N 0.000 description 1
- MKBBSFGKFMQPPC-UHFFFAOYSA-N 2-propyl-1h-imidazole Chemical compound CCCC1=NC=CN1 MKBBSFGKFMQPPC-UHFFFAOYSA-N 0.000 description 1
- ZQWHWRQRGKZTSE-UHFFFAOYSA-N 2-tert-butyl-1h-benzimidazole Chemical class C1=CC=C2NC(C(C)(C)C)=NC2=C1 ZQWHWRQRGKZTSE-UHFFFAOYSA-N 0.000 description 1
- CTUNHIMNHSKDBN-UHFFFAOYSA-N 2-tert-butyl-1h-imidazole Chemical compound CC(C)(C)C1=NC=CN1 CTUNHIMNHSKDBN-UHFFFAOYSA-N 0.000 description 1
- YMHZVVNOKQQBGK-UHFFFAOYSA-N 2-tetracosyl-1H-imidazole Chemical class C(CCCCCCCCCCCCCCCCCCCCCCC)C=1NC=CN1 YMHZVVNOKQQBGK-UHFFFAOYSA-N 0.000 description 1
- PNIWRYYJOIOTOY-UHFFFAOYSA-N 2-tetradecyl-1h-imidazole Chemical class CCCCCCCCCCCCCCC1=NC=CN1 PNIWRYYJOIOTOY-UHFFFAOYSA-N 0.000 description 1
- OSXLFYBPEOELND-UHFFFAOYSA-N 2-tricosyl-1H-imidazole Chemical class C(CCCCCCCCCCCCCCCCCCCCCC)C=1NC=CN1 OSXLFYBPEOELND-UHFFFAOYSA-N 0.000 description 1
- OZRZZNNKEBHRGQ-UHFFFAOYSA-N 2-tridecyl-1h-benzimidazole Chemical class C1=CC=C2NC(CCCCCCCCCCCCC)=NC2=C1 OZRZZNNKEBHRGQ-UHFFFAOYSA-N 0.000 description 1
- VCWPWZZLRFHCLR-UHFFFAOYSA-N 2-tridecyl-1h-imidazole Chemical class CCCCCCCCCCCCCC1=NC=CN1 VCWPWZZLRFHCLR-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- CEOUVXSBEKBICS-UHFFFAOYSA-N 4-(2-bromophenyl)-5-methyl-2-phenyl-1H-imidazole Chemical compound C1(=CC=CC=C1)C=1NC(=C(N=1)C1=C(C=CC=C1)Br)C CEOUVXSBEKBICS-UHFFFAOYSA-N 0.000 description 1
- FUISALRLUREVKW-UHFFFAOYSA-N 4-(2-fluorophenyl)-5-methyl-2-phenyl-1H-imidazole Chemical compound C1(=CC=CC=C1)C=1NC(=C(N=1)C1=C(C=CC=C1)F)C FUISALRLUREVKW-UHFFFAOYSA-N 0.000 description 1
- VXESXYBJLFJOKN-UHFFFAOYSA-N 4-(2-hexyl-4-iodophenyl)-2-phenyl-5-propyl-1H-imidazole Chemical compound C1(=CC=CC=C1)C=1NC(=C(N=1)C1=C(C=C(C=C1)I)CCCCCC)CCC VXESXYBJLFJOKN-UHFFFAOYSA-N 0.000 description 1
- GGJIHUYVZGHZJT-UHFFFAOYSA-N 4-(2-iodophenyl)-5-methyl-2-phenyl-1H-imidazole Chemical compound C1(=CC=CC=C1)C=1NC(=C(N=1)C1=C(C=CC=C1)I)C GGJIHUYVZGHZJT-UHFFFAOYSA-N 0.000 description 1
- YTQGNHZMWRVQTP-UHFFFAOYSA-N 4-(3-bromophenyl)-5-methyl-2-phenyl-1H-imidazole Chemical compound C1(=CC=CC=C1)C=1NC(=C(N=1)C1=CC(=CC=C1)Br)C YTQGNHZMWRVQTP-UHFFFAOYSA-N 0.000 description 1
- KJYGSYQUCZMQJP-UHFFFAOYSA-N 4-(3-fluorophenyl)-5-methyl-2-phenyl-1H-imidazole Chemical compound C1(=CC=CC=C1)C=1NC(=C(N=1)C1=CC(=CC=C1)F)C KJYGSYQUCZMQJP-UHFFFAOYSA-N 0.000 description 1
- GFNIGPLHAARQBD-UHFFFAOYSA-N 4-(3-iodophenyl)-5-methyl-2-phenyl-1H-imidazole Chemical compound C1(=CC=CC=C1)C=1NC(=C(N=1)C1=CC(=CC=C1)I)C GFNIGPLHAARQBD-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- NZMPEMIPYFEPQL-UHFFFAOYSA-N 4-(4-bromophenyl)-5-methyl-2-phenyl-1H-imidazole Chemical compound CC=1NC(C=2C=CC=CC=2)=NC=1C1=CC=C(Br)C=C1 NZMPEMIPYFEPQL-UHFFFAOYSA-N 0.000 description 1
- APGYXZDRPUORJA-UHFFFAOYSA-N 4-(4-fluorophenyl)-5-methyl-2-phenyl-1H-imidazole Chemical compound C1(=CC=CC=C1)C=1NC(=C(N=1)C1=CC=C(C=C1)F)C APGYXZDRPUORJA-UHFFFAOYSA-N 0.000 description 1
- BVBIMQOXOJURAA-UHFFFAOYSA-N 4-(4-iodophenyl)-5-methyl-2-phenyl-1H-imidazole Chemical compound C1(=CC=CC=C1)C=1NC(=C(N=1)C1=CC=C(C=C1)I)C BVBIMQOXOJURAA-UHFFFAOYSA-N 0.000 description 1
- ODHNJQBSQWHBLJ-UHFFFAOYSA-N 4-bromo-5-methyl-2-undecyl-1h-imidazole Chemical class CCCCCCCCCCCC1=NC(Br)=C(C)N1 ODHNJQBSQWHBLJ-UHFFFAOYSA-N 0.000 description 1
- INHMCDLQWJUCSU-UHFFFAOYSA-N 4-chloro-2-(4-cyclohexylbutyl)-5-ethyl-1H-benzimidazole Chemical compound C1(CCCCC1)CCCCC=1NC2=C(N1)C=CC(=C2Cl)CC INHMCDLQWJUCSU-UHFFFAOYSA-N 0.000 description 1
- OECLCCYGGXDNCZ-UHFFFAOYSA-N 4-chloro-2-[(3-iodophenyl)methyl]-1H-benzimidazole Chemical compound IC=1C=C(C=CC1)CC=1NC2=C(N1)C=CC=C2Cl OECLCCYGGXDNCZ-UHFFFAOYSA-N 0.000 description 1
- OTLNPYWUJOZPPA-UHFFFAOYSA-N 4-nitrobenzoic acid Chemical compound OC(=O)C1=CC=C([N+]([O-])=O)C=C1 OTLNPYWUJOZPPA-UHFFFAOYSA-N 0.000 description 1
- JUVHKOWEYHHFIG-UHFFFAOYSA-N 5,6-dichloro-2-(1-chloronaphthalen-2-yl)-1H-benzimidazole Chemical class ClC1=C(C=CC2=CC=CC=C12)C=1NC2=C(N1)C=C(C(=C2)Cl)Cl JUVHKOWEYHHFIG-UHFFFAOYSA-N 0.000 description 1
- CEPVDZDZBLZCHX-UHFFFAOYSA-N 5-(2-bromophenyl)-2-phenyl-1H-imidazole Chemical class C1(=CC=CC=C1)C=1NC=C(N=1)C1=C(C=CC=C1)Br CEPVDZDZBLZCHX-UHFFFAOYSA-N 0.000 description 1
- BUAWZHVCXCTEAN-UHFFFAOYSA-N 5-(2-fluorophenyl)-2-phenyl-1H-imidazole Chemical class C1(=CC=CC=C1)C=1NC=C(N=1)C1=C(C=CC=C1)F BUAWZHVCXCTEAN-UHFFFAOYSA-N 0.000 description 1
- YXFBLJHHGCVNOW-UHFFFAOYSA-N 5-(2-iodophenyl)-2-phenyl-1H-imidazole Chemical class C1(=CC=CC=C1)C=1NC=C(N1)C1=C(C=CC=C1)I YXFBLJHHGCVNOW-UHFFFAOYSA-N 0.000 description 1
- DVWDHOWJBMYRJH-UHFFFAOYSA-N 5-(3-bromo-4-heptylphenyl)-2-phenyl-1H-imidazole Chemical class C1(=CC=CC=C1)C=1NC=C(N=1)C1=CC(=C(C=C1)CCCCCCC)Br DVWDHOWJBMYRJH-UHFFFAOYSA-N 0.000 description 1
- IJUIIFKBEJOXQR-UHFFFAOYSA-N 5-(3-bromophenyl)-2-phenyl-1h-imidazole Chemical class BrC1=CC=CC(C=2N=C(NC=2)C=2C=CC=CC=2)=C1 IJUIIFKBEJOXQR-UHFFFAOYSA-N 0.000 description 1
- ICBPKDJVASSGAR-UHFFFAOYSA-N 5-(3-fluorophenyl)-2-phenyl-1H-imidazole Chemical class C1(=CC=CC=C1)C=1NC=C(N=1)C1=CC(=CC=C1)F ICBPKDJVASSGAR-UHFFFAOYSA-N 0.000 description 1
- LTCCJXRPRRXTDA-UHFFFAOYSA-N 5-(3-iodophenyl)-2-phenyl-1H-imidazole Chemical class C1(=CC=CC=C1)C=1NC=C(N1)C1=CC(=CC=C1)I LTCCJXRPRRXTDA-UHFFFAOYSA-N 0.000 description 1
- FDQQAONNYLSJIG-UHFFFAOYSA-N 5-(4-bromophenyl)-2-phenyl-1h-imidazole Chemical class C1=CC(Br)=CC=C1C1=CN=C(C=2C=CC=CC=2)N1 FDQQAONNYLSJIG-UHFFFAOYSA-N 0.000 description 1
- VORGKMXYTJPTCJ-UHFFFAOYSA-N 5-(4-fluorophenyl)-2-phenyl-1h-imidazole Chemical class C1=CC(F)=CC=C1C1=CNC(C=2C=CC=CC=2)=N1 VORGKMXYTJPTCJ-UHFFFAOYSA-N 0.000 description 1
- QEHLGOAYCQCVLH-UHFFFAOYSA-N 5-(4-hexylphenyl)-2-phenyl-1H-imidazole Chemical class C1(=CC=CC=C1)C=1NC=C(N1)C1=CC=C(C=C1)CCCCCC QEHLGOAYCQCVLH-UHFFFAOYSA-N 0.000 description 1
- LVRFWQZWYVCWSH-UHFFFAOYSA-N 5-(4-iodophenyl)-2-phenyl-1H-imidazole Chemical class C1(=CC=CC=C1)C=1NC=C(N=1)C1=CC=C(C=C1)I LVRFWQZWYVCWSH-UHFFFAOYSA-N 0.000 description 1
- CJRNZMGUIYKRAF-UHFFFAOYSA-N 5-(5-butyl-2-methylphenyl)-2-phenyl-1H-imidazole Chemical class C1(=CC=CC=C1)C=1NC=C(N1)C1=C(C=CC(=C1)CCCC)C CJRNZMGUIYKRAF-UHFFFAOYSA-N 0.000 description 1
- ZVJUPQYEBOLROZ-UHFFFAOYSA-N 5-bromo-2-naphthalen-1-yl-4-phenyl-1H-imidazole Chemical class C1(=CC=CC2=CC=CC=C12)C=1NC(=C(N1)C1=CC=CC=C1)Br ZVJUPQYEBOLROZ-UHFFFAOYSA-N 0.000 description 1
- MFQSXGOTNBCOJE-UHFFFAOYSA-N 5-bromo-2-naphthalen-2-yl-4-phenyl-1H-imidazole Chemical class C1=C(C=CC2=CC=CC=C12)C=1NC(=C(N1)C1=CC=CC=C1)Br MFQSXGOTNBCOJE-UHFFFAOYSA-N 0.000 description 1
- DVBNCOOGLKRYET-UHFFFAOYSA-N 5-bromo-4-naphthalen-1-yl-2-phenyl-1H-imidazole Chemical class C1(=CC=CC=C1)C=1NC(=C(N1)C1=CC=CC2=CC=CC=C12)Br DVBNCOOGLKRYET-UHFFFAOYSA-N 0.000 description 1
- WNJHCDKLASTUEB-UHFFFAOYSA-N 5-bromo-4-naphthalen-2-yl-2-phenyl-1H-imidazole Chemical class C1(=CC=CC=C1)C=1NC(=C(N1)C1=CC2=CC=CC=C2C=C1)Br WNJHCDKLASTUEB-UHFFFAOYSA-N 0.000 description 1
- UIMIIZMSIXILQC-UHFFFAOYSA-N 5-chloro-2-(4-chloronaphthalen-2-yl)-4-(2-hexylphenyl)-1H-imidazole Chemical class ClC1=CC(=CC2=CC=CC=C12)C=1NC(=C(N1)C1=C(C=CC=C1)CCCCCC)Cl UIMIIZMSIXILQC-UHFFFAOYSA-N 0.000 description 1
- XSHXZNPFVHENRC-UHFFFAOYSA-N 5-chloro-2-naphthalen-1-yl-4-phenyl-1H-imidazole Chemical class C1(=CC=CC2=CC=CC=C12)C=1NC(=C(N=1)C1=CC=CC=C1)Cl XSHXZNPFVHENRC-UHFFFAOYSA-N 0.000 description 1
- KXSMFCSSFWPKGZ-UHFFFAOYSA-N 5-chloro-2-naphthalen-2-yl-4-phenyl-1H-imidazole Chemical class C1=C(C=CC2=CC=CC=C12)C=1NC(=C(N=1)C1=CC=CC=C1)Cl KXSMFCSSFWPKGZ-UHFFFAOYSA-N 0.000 description 1
- AKCICEHAYDBOPD-UHFFFAOYSA-N 5-chloro-4-naphthalen-1-yl-2-phenyl-1H-imidazole Chemical class C1(=CC=CC=C1)C=1NC(=C(N=1)C1=CC=CC2=CC=CC=C12)Cl AKCICEHAYDBOPD-UHFFFAOYSA-N 0.000 description 1
- SHKVAXSGLGKZLM-UHFFFAOYSA-N 5-chloro-4-naphthalen-2-yl-2-phenyl-1H-imidazole Chemical class C1(=CC=CC=C1)C=1NC(=C(N=1)C1=CC2=CC=CC=C2C=C1)Cl SHKVAXSGLGKZLM-UHFFFAOYSA-N 0.000 description 1
- XIYQKAHECLITTC-UHFFFAOYSA-N 5-decyl-4-(5,6-dimethylnaphthalen-1-yl)-2-(4-iodophenyl)-1H-imidazole Chemical class IC1=CC=C(C=C1)C=1NC(=C(N1)C1=CC=CC2=C(C(=CC=C12)C)C)CCCCCCCCCC XIYQKAHECLITTC-UHFFFAOYSA-N 0.000 description 1
- OIDGOMXZWSCUEK-UHFFFAOYSA-N 5-fluoro-2-naphthalen-1-yl-4-phenyl-1H-imidazole Chemical class C1(=CC=CC2=CC=CC=C12)C=1NC(=C(N=1)C1=CC=CC=C1)F OIDGOMXZWSCUEK-UHFFFAOYSA-N 0.000 description 1
- KPEWFCQMTIHARI-UHFFFAOYSA-N 5-fluoro-2-naphthalen-2-yl-4-phenyl-1H-imidazole Chemical class C1=C(C=CC2=CC=CC=C12)C=1NC(=C(N=1)C1=CC=CC=C1)F KPEWFCQMTIHARI-UHFFFAOYSA-N 0.000 description 1
- ZJPJVEMSWNWMSK-UHFFFAOYSA-N 5-fluoro-4-naphthalen-1-yl-2-phenyl-1H-imidazole Chemical class C1(=CC=CC=C1)C=1NC(=C(N=1)C1=CC=CC2=CC=CC=C12)F ZJPJVEMSWNWMSK-UHFFFAOYSA-N 0.000 description 1
- NJXCJXUYJCKEIX-UHFFFAOYSA-N 5-fluoro-4-naphthalen-2-yl-2-phenyl-1H-imidazole Chemical class C1(=CC=CC=C1)C=1NC(=C(N=1)C1=CC2=CC=CC=C2C=C1)F NJXCJXUYJCKEIX-UHFFFAOYSA-N 0.000 description 1
- ANJSFKLLZJKIIQ-UHFFFAOYSA-N 5-iodo-2-naphthalen-1-yl-4-phenyl-1H-imidazole Chemical class C1(=CC=CC2=CC=CC=C12)C=1NC(=C(N=1)C1=CC=CC=C1)I ANJSFKLLZJKIIQ-UHFFFAOYSA-N 0.000 description 1
- WDSIRIROMPUBJX-UHFFFAOYSA-N 5-iodo-2-naphthalen-2-yl-4-phenyl-1H-imidazole Chemical class C1=C(C=CC2=CC=CC=C12)C=1NC(=C(N=1)C1=CC=CC=C1)I WDSIRIROMPUBJX-UHFFFAOYSA-N 0.000 description 1
- PAMHCAZWJQLQHG-UHFFFAOYSA-N 5-iodo-4-naphthalen-1-yl-2-phenyl-1H-imidazole Chemical class C1(=CC=CC=C1)C=1NC(=C(N=1)C1=CC=CC2=CC=CC=C12)I PAMHCAZWJQLQHG-UHFFFAOYSA-N 0.000 description 1
- HORGIRZWMROZKH-UHFFFAOYSA-N 5-iodo-4-naphthalen-2-yl-2-phenyl-1H-imidazole Chemical class C1(=CC=CC=C1)C=1NC(=C(N=1)C1=CC2=CC=CC=C2C=C1)I HORGIRZWMROZKH-UHFFFAOYSA-N 0.000 description 1
- JQEVCCUJHLRAEY-UHFFFAOYSA-N 5-methyl-2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=C(C)N1 JQEVCCUJHLRAEY-UHFFFAOYSA-N 0.000 description 1
- INQRDWQKHMKYTQ-UHFFFAOYSA-N 5-methyl-4-naphthalen-1-yl-2-phenyl-1h-imidazole Chemical compound N=1C(C=2C3=CC=CC=C3C=CC=2)=C(C)NC=1C1=CC=CC=C1 INQRDWQKHMKYTQ-UHFFFAOYSA-N 0.000 description 1
- PVNCLKDZXOOJMO-UHFFFAOYSA-N 5-methyl-4-naphthalen-2-yl-2-phenyl-1h-imidazole Chemical compound N=1C(C=2C=C3C=CC=CC3=CC=2)=C(C)NC=1C1=CC=CC=C1 PVNCLKDZXOOJMO-UHFFFAOYSA-N 0.000 description 1
- JQJKWVIUFZWDPH-UHFFFAOYSA-N 5-naphthalen-1-yl-2-phenyl-1h-imidazole Chemical class N=1C(C=2C3=CC=CC=C3C=CC=2)=CNC=1C1=CC=CC=C1 JQJKWVIUFZWDPH-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- MIKCOIIUVHLTAU-UHFFFAOYSA-N 6-chloro-2-(2-hexylphenyl)-1H-benzimidazole Chemical compound C(CCCCC)C1=C(C=CC=C1)C=1NC2=C(N1)C=CC(=C2)Cl MIKCOIIUVHLTAU-UHFFFAOYSA-N 0.000 description 1
- UKHBTBNWIXGYOW-UHFFFAOYSA-N 6-chloro-2-cyclohexyl-1h-benzimidazole Chemical compound N1C2=CC(Cl)=CC=C2N=C1C1CCCCC1 UKHBTBNWIXGYOW-UHFFFAOYSA-N 0.000 description 1
- UGXZLJPLPJGZNP-UHFFFAOYSA-N 9-(1H-imidazol-2-yl)nonan-1-ol Chemical class OCCCCCCCCCC=1NC=CN=1 UGXZLJPLPJGZNP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910016334 Bi—In Inorganic materials 0.000 description 1
- IXWICFZRCIMHHS-UHFFFAOYSA-N CC1=CN=CN1.C1=C(C=CC=C1)C1=CC=CC=C1 Chemical compound CC1=CN=CN1.C1=C(C=CC=C1)C1=CC=CC=C1 IXWICFZRCIMHHS-UHFFFAOYSA-N 0.000 description 1
- DEKPGYPPELLMFU-UHFFFAOYSA-N CCCCC1=CC=C(C(C2=CNC(C3=CC=C(CN)C=C3)=N2)=CC=C2Cl)C2=C1 Chemical class CCCCC1=CC=C(C(C2=CNC(C3=CC=C(CN)C=C3)=N2)=CC=C2Cl)C2=C1 DEKPGYPPELLMFU-UHFFFAOYSA-N 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 229910021589 Copper(I) bromide Inorganic materials 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 229910021590 Copper(II) bromide Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- PUXNRELNVUCAAJ-UHFFFAOYSA-N FC1=C(C=CC=C1)C=1NC=C(N1)C1=CC=CC=C1 Chemical compound FC1=C(C=CC=C1)C=1NC=C(N1)C1=CC=CC=C1 PUXNRELNVUCAAJ-UHFFFAOYSA-N 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 1
- BAFDPEURBNZJCX-UHFFFAOYSA-N NCC(C=C1)=CC=C1C(N1)=NC(C(C2=CC=C3)=CC=CC2=C3Cl)=C1Cl Chemical class NCC(C=C1)=CC=C1C(N1)=NC(C(C2=CC=C3)=CC=CC2=C3Cl)=C1Cl BAFDPEURBNZJCX-UHFFFAOYSA-N 0.000 description 1
- VJMFKNXQUMONPK-UHFFFAOYSA-N NCC(C=C1)=CC=C1C(N1)=NC(C2=CC=CC=C2)=C1Cl Chemical class NCC(C=C1)=CC=C1C(N1)=NC(C2=CC=CC=C2)=C1Cl VJMFKNXQUMONPK-UHFFFAOYSA-N 0.000 description 1
- CVMIDNXMLHMLRU-UHFFFAOYSA-N NCC1=C(C=CC=C1)C=1NC=C(N1)C1=CC=CC=C1 Chemical compound NCC1=C(C=CC=C1)C=1NC=C(N1)C1=CC=CC=C1 CVMIDNXMLHMLRU-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- CANRESZKMUPMAE-UHFFFAOYSA-L Zinc lactate Chemical compound [Zn+2].CC(O)C([O-])=O.CC(O)C([O-])=O CANRESZKMUPMAE-UHFFFAOYSA-L 0.000 description 1
- DPDMMXDBJGCCQC-UHFFFAOYSA-N [Na].[Cl] Chemical compound [Na].[Cl] DPDMMXDBJGCCQC-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229920006271 aliphatic hydrocarbon resin Polymers 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- LDDQLRUQCUTJBB-UHFFFAOYSA-N ammonium fluoride Chemical compound [NH4+].[F-] LDDQLRUQCUTJBB-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- CUBCNYWQJHBXIY-UHFFFAOYSA-N benzoic acid;2-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC=C1.OC(=O)C1=CC=CC=C1O CUBCNYWQJHBXIY-UHFFFAOYSA-N 0.000 description 1
- XKGUZGHMWUIYDR-UHFFFAOYSA-N benzyl n-(3-fluoro-4-morpholin-4-ylphenyl)carbamate Chemical compound C=1C=C(N2CCOCC2)C(F)=CC=1NC(=O)OCC1=CC=CC=C1 XKGUZGHMWUIYDR-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- NKNDPYCGAZPOFS-UHFFFAOYSA-M copper(i) bromide Chemical compound Br[Cu] NKNDPYCGAZPOFS-UHFFFAOYSA-M 0.000 description 1
- GQDHEYWVLBJKBA-UHFFFAOYSA-H copper(ii) phosphate Chemical compound [Cu+2].[Cu+2].[Cu+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GQDHEYWVLBJKBA-UHFFFAOYSA-H 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 229940045803 cuprous chloride Drugs 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 235000012208 gluconic acid Nutrition 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- HHLFWLYXYJOTON-UHFFFAOYSA-N glyoxylic acid Chemical compound OC(=O)C=O HHLFWLYXYJOTON-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002500 ions Chemical group 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 229940040102 levulinic acid Drugs 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- PYLWMHQQBFSUBP-UHFFFAOYSA-N monofluorobenzene Chemical compound FC1=CC=CC=C1 PYLWMHQQBFSUBP-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 description 1
- 235000007715 potassium iodide Nutrition 0.000 description 1
- 229960004839 potassium iodide Drugs 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 229940107700 pyruvic acid Drugs 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 1
- MSXHSNHNTORCAW-GGLLEASOSA-M sodium;(2s,3s,4s,5r,6s)-3,4,5,6-tetrahydroxyoxane-2-carboxylate Chemical compound [Na+].O[C@H]1O[C@H](C([O-])=O)[C@@H](O)[C@H](O)[C@H]1O MSXHSNHNTORCAW-GGLLEASOSA-M 0.000 description 1
- 230000003381 solubilizing effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-O triethanolammonium Chemical compound OCC[NH+](CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-O 0.000 description 1
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 1
- WGIWBXUNRXCYRA-UHFFFAOYSA-H trizinc;2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O WGIWBXUNRXCYRA-UHFFFAOYSA-H 0.000 description 1
- 229960004418 trolamine Drugs 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 229940102001 zinc bromide Drugs 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011746 zinc citrate Substances 0.000 description 1
- 235000006076 zinc citrate Nutrition 0.000 description 1
- 229940068475 zinc citrate Drugs 0.000 description 1
- SRWMQSFFRFWREA-UHFFFAOYSA-M zinc formate Chemical compound [Zn+2].[O-]C=O SRWMQSFFRFWREA-UHFFFAOYSA-M 0.000 description 1
- 239000011576 zinc lactate Substances 0.000 description 1
- 235000000193 zinc lactate Nutrition 0.000 description 1
- 229940050168 zinc lactate Drugs 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
- ZPEJZWGMHAKWNL-UHFFFAOYSA-L zinc;oxalate Chemical compound [Zn+2].[O-]C(=O)C([O-])=O ZPEJZWGMHAKWNL-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Chemical Treatment Of Metals (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP140229/2006 | 2006-05-19 | ||
| JP2006140229A JP5036216B2 (ja) | 2006-05-19 | 2006-05-19 | 金属の表面処理剤およびその利用 |
| PCT/JP2007/060074 WO2007135930A1 (ja) | 2006-05-19 | 2007-05-16 | 金属の表面処理剤およびその利用 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101448978A CN101448978A (zh) | 2009-06-03 |
| CN101448978B true CN101448978B (zh) | 2012-06-13 |
Family
ID=38723243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007800183617A Expired - Fee Related CN101448978B (zh) | 2006-05-19 | 2007-05-16 | 金属用表面处理剂及其用途 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5036216B2 (ja) |
| KR (1) | KR101298386B1 (ja) |
| CN (1) | CN101448978B (ja) |
| TW (1) | TWI393804B (ja) |
| WO (1) | WO2007135930A1 (ja) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5313044B2 (ja) * | 2008-08-08 | 2013-10-09 | 四国化成工業株式会社 | 銅または銅合金の表面処理剤及びその利用 |
| JP5457814B2 (ja) | 2009-12-17 | 2014-04-02 | コーア株式会社 | 電子部品の実装構造 |
| CN102153514B (zh) * | 2011-02-23 | 2013-02-20 | 广东东硕科技有限公司 | 含氟苄基苯并咪唑化合物制造方法 |
| CN102121108B (zh) * | 2011-02-23 | 2012-11-21 | 广东东硕科技有限公司 | 无铅印制电路板用复配osp处理剂 |
| CN102775351B (zh) * | 2011-05-12 | 2015-09-30 | 比亚迪股份有限公司 | 一种二咪唑类化合物及其制备方法和一种有机助焊剂处理液 |
| JP5615227B2 (ja) | 2011-05-23 | 2014-10-29 | 四国化成工業株式会社 | 銅または銅合金の表面処理剤及びその利用 |
| JP5615233B2 (ja) * | 2011-06-20 | 2014-10-29 | 四国化成工業株式会社 | 銅または銅合金の表面処理剤及びその利用 |
| JP5985367B2 (ja) * | 2012-11-20 | 2016-09-06 | 四国化成工業株式会社 | 銅または銅合金の表面処理方法およびその利用 |
| CN103058931B (zh) * | 2012-12-31 | 2015-07-01 | 广东东硕科技有限公司 | 2-(3＇,5＇-二卤苯甲基)苯并咪唑类四个新型化合物及其制备方法 |
| JP6243792B2 (ja) * | 2014-05-12 | 2017-12-06 | 花王株式会社 | はんだが固化された回路基板の製造方法、電子部品が搭載された回路基板の製造方法、及び、フラックス用洗浄剤組成物 |
| WO2019006628A1 (zh) * | 2017-07-03 | 2019-01-10 | 深圳市盈恒科技有限公司 | 一种无铬钝化剂、铝件及其表面钝化处理方法 |
| CN110230048A (zh) * | 2019-07-18 | 2019-09-13 | 广东超华科技股份有限公司 | 一种锂离子电池用电解铜箔的无铬免水洗防氧化液及防氧化工艺 |
| US11676926B2 (en) | 2020-08-24 | 2023-06-13 | Schlumberger Technology Corporation | Solder joints on nickel surface finishes without gold plating |
| CN114134493A (zh) * | 2021-11-23 | 2022-03-04 | 沈阳加克科技有限公司 | 一种金属表面钝化液 |
| CN115011956A (zh) * | 2022-06-28 | 2022-09-06 | 南通赛可特电子有限公司 | 一种有机铜面保护剂及其制备方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1761773A (zh) * | 2003-03-19 | 2006-04-19 | 四国化成工业株式会社 | 新型咪唑化合物及其利用 |
Family Cites Families (11)
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| JPS6192778A (ja) * | 1984-10-09 | 1986-05-10 | C Uyemura & Co Ltd | 被ハンダ付け部品 |
| JP2558982B2 (ja) * | 1991-12-25 | 1996-11-27 | 日鉱金属株式会社 | 貴金属めっき材の封孔処理方法 |
| JPH1046385A (ja) * | 1996-08-02 | 1998-02-17 | Daiwa Kasei Kenkyusho:Kk | 電気・電子回路部品 |
| JP3579550B2 (ja) * | 1996-09-30 | 2004-10-20 | 株式会社大和化成研究所 | 電気・電子回路部品 |
| DE10050862C2 (de) * | 2000-10-06 | 2002-08-01 | Atotech Deutschland Gmbh | Bad und Verfahren zum stromlosen Abscheiden von Silber auf Metalloberflächen |
| JP2003328182A (ja) * | 2002-05-13 | 2003-11-19 | Yutaka Fujiwara | ラックレスめっき用スズ−銀合金めっき浴 |
| JP2004176179A (ja) * | 2002-11-15 | 2004-06-24 | Chubu Kiresuto Kk | 電子部品端子の水溶性半田濡れ性向上処理剤および処理法 |
| JP2005008975A (ja) * | 2003-06-20 | 2005-01-13 | Nippon Paint Co Ltd | 金属表面処理方法、表面処理アルミニウム系金属、及び、親水処理の前処理方法 |
| JP2005169495A (ja) * | 2003-11-18 | 2005-06-30 | Yoshihiro Miyano | プリフラックス、フラックス、ソルダーペースト及び鉛フリーはんだ付け体の製造方法 |
| JP2005179765A (ja) * | 2003-12-24 | 2005-07-07 | Nikko Materials Co Ltd | 銅及び銅合金の表面処理剤 |
| US20050217757A1 (en) * | 2004-03-30 | 2005-10-06 | Yoshihiro Miyano | Preflux, flux, solder paste and method of manufacturing lead-free soldered body |
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| Publication number | Publication date |
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| KR20090009249A (ko) | 2009-01-22 |
| WO2007135930A1 (ja) | 2007-11-29 |
| JP5036216B2 (ja) | 2012-09-26 |
| CN101448978A (zh) | 2009-06-03 |
| JP2007308776A (ja) | 2007-11-29 |
| TW200804622A (en) | 2008-01-16 |
| KR101298386B1 (ko) | 2013-08-20 |
| TWI393804B (zh) | 2013-04-21 |
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