CN115011956A - 一种有机铜面保护剂及其制备方法 - Google Patents
一种有机铜面保护剂及其制备方法 Download PDFInfo
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- CN115011956A CN115011956A CN202210738790.8A CN202210738790A CN115011956A CN 115011956 A CN115011956 A CN 115011956A CN 202210738790 A CN202210738790 A CN 202210738790A CN 115011956 A CN115011956 A CN 115011956A
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- protective agent
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- 229910052802 copper Inorganic materials 0.000 title claims abstract description 49
- 239000010949 copper Substances 0.000 title claims abstract description 49
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 46
- 239000003223 protective agent Substances 0.000 title claims abstract description 38
- 238000002360 preparation method Methods 0.000 title description 6
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000006184 cosolvent Substances 0.000 claims abstract description 9
- 229910001385 heavy metal Inorganic materials 0.000 claims abstract description 9
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 27
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 claims description 19
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 18
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 12
- -1 HEDTP Chemical compound 0.000 claims description 12
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 9
- 235000011054 acetic acid Nutrition 0.000 claims description 9
- 235000019253 formic acid Nutrition 0.000 claims description 9
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 7
- 150000004820 halides Chemical class 0.000 claims description 7
- WWZKQHOCKIZLMA-UHFFFAOYSA-N Caprylic acid Natural products CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 claims description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 claims description 5
- 239000005695 Ammonium acetate Substances 0.000 claims description 5
- 235000019257 ammonium acetate Nutrition 0.000 claims description 5
- 229940043376 ammonium acetate Drugs 0.000 claims description 5
- 150000007524 organic acids Chemical group 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 4
- VZTDIZULWFCMLS-UHFFFAOYSA-N ammonium formate Chemical group [NH4+].[O-]C=O VZTDIZULWFCMLS-UHFFFAOYSA-N 0.000 claims description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 4
- VKZRWSNIWNFCIQ-WDSKDSINSA-N (2s)-2-[2-[[(1s)-1,2-dicarboxyethyl]amino]ethylamino]butanedioic acid Chemical compound OC(=O)C[C@@H](C(O)=O)NCCN[C@H](C(O)=O)CC(O)=O VKZRWSNIWNFCIQ-WDSKDSINSA-N 0.000 claims description 3
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 claims description 3
- 150000003863 ammonium salts Chemical class 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- LJDSTRZHPWMDPG-UHFFFAOYSA-N 2-(butylamino)ethanol Chemical compound CCCCNCCO LJDSTRZHPWMDPG-UHFFFAOYSA-N 0.000 claims description 2
- 229940058020 2-amino-2-methyl-1-propanol Drugs 0.000 claims description 2
- UEEJHVSXFDXPFK-UHFFFAOYSA-O N-dimethylethanolamine Chemical compound C[NH+](C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-O 0.000 claims description 2
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 claims description 2
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- CBTVGIZVANVGBH-UHFFFAOYSA-N aminomethyl propanol Chemical compound CC(C)(N)CO CBTVGIZVANVGBH-UHFFFAOYSA-N 0.000 claims description 2
- XJMWHXZUIGHOBA-UHFFFAOYSA-N azane;propanoic acid Chemical compound N.CCC(O)=O XJMWHXZUIGHOBA-UHFFFAOYSA-N 0.000 claims description 2
- GONOPSZTUGRENK-UHFFFAOYSA-N benzyl(trichloro)silane Chemical compound Cl[Si](Cl)(Cl)CC1=CC=CC=C1 GONOPSZTUGRENK-UHFFFAOYSA-N 0.000 claims description 2
- XMYQHJDBLRZMLW-UHFFFAOYSA-N methanolamine Chemical compound NCO XMYQHJDBLRZMLW-UHFFFAOYSA-N 0.000 claims description 2
- 229940087646 methanolamine Drugs 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N n-hexanoic acid Natural products CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 2
- 235000019260 propionic acid Nutrition 0.000 claims description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011814 protection agent Substances 0.000 claims 3
- 150000001298 alcohols Chemical class 0.000 claims 1
- 150000002460 imidazoles Chemical class 0.000 claims 1
- 235000005985 organic acids Nutrition 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052737 gold Inorganic materials 0.000 abstract description 9
- 239000010931 gold Substances 0.000 abstract description 9
- 230000003647 oxidation Effects 0.000 abstract description 4
- 238000007254 oxidation reaction Methods 0.000 abstract description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 2
- 229910001431 copper ion Inorganic materials 0.000 abstract description 2
- 230000014759 maintenance of location Effects 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 238000009461 vacuum packaging Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 9
- 238000005406 washing Methods 0.000 description 9
- OIHHDYNKEHASLI-UHFFFAOYSA-N 2-[(2,4-dichlorophenyl)methyl]-1h-benzimidazole Chemical compound ClC1=CC(Cl)=CC=C1CC1=NC2=CC=CC=C2N1 OIHHDYNKEHASLI-UHFFFAOYSA-N 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- XPFCXIKQEQOMMW-UHFFFAOYSA-N 2-[(3,4-dichlorophenyl)methyl]-1h-benzimidazole Chemical compound C1=C(Cl)C(Cl)=CC=C1CC1=NC2=CC=CC=C2N1 XPFCXIKQEQOMMW-UHFFFAOYSA-N 0.000 description 7
- 238000007605 air drying Methods 0.000 description 7
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 6
- 238000002791 soaking Methods 0.000 description 6
- VNDYJBBGRKZCSX-UHFFFAOYSA-L zinc bromide Chemical compound Br[Zn]Br VNDYJBBGRKZCSX-UHFFFAOYSA-L 0.000 description 6
- OYGJENONTDCXGW-UHFFFAOYSA-N 2-pentyl-1h-benzimidazole Chemical compound C1=CC=C2NC(CCCCC)=NC2=C1 OYGJENONTDCXGW-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000013022 formulation composition Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- UAYWVJHJZHQCIE-UHFFFAOYSA-L zinc iodide Chemical compound I[Zn]I UAYWVJHJZHQCIE-UHFFFAOYSA-L 0.000 description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 235000009518 sodium iodide Nutrition 0.000 description 3
- 229940102001 zinc bromide Drugs 0.000 description 3
- URDCARMUOSMFFI-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(2-hydroxyethyl)amino]acetic acid Chemical compound OCCN(CC(O)=O)CCN(CC(O)=O)CC(O)=O URDCARMUOSMFFI-UHFFFAOYSA-N 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000002516 radical scavenger Substances 0.000 description 2
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- FHHCKYIBYRNHOZ-UHFFFAOYSA-N 2,5-diphenyl-1h-imidazole Chemical compound C=1N=C(C=2C=CC=CC=2)NC=1C1=CC=CC=C1 FHHCKYIBYRNHOZ-UHFFFAOYSA-N 0.000 description 1
- OBOKIMHNZSUNKU-UHFFFAOYSA-N 2-(2,4-dichlorophenyl)-1h-imidazole Chemical compound ClC1=CC(Cl)=CC=C1C1=NC=CN1 OBOKIMHNZSUNKU-UHFFFAOYSA-N 0.000 description 1
- XKCMWWRTIUPTDP-UHFFFAOYSA-N 2-(4-chlorophenyl)-4-(2,4-dichlorophenyl)-5-methyl-1H-imidazole Chemical compound CC1=C(N=C(N1)C2=CC=C(C=C2)Cl)C3=C(C=C(C=C3)Cl)Cl XKCMWWRTIUPTDP-UHFFFAOYSA-N 0.000 description 1
- COGUOPIIFAMLES-UHFFFAOYSA-N 2-[(4-chlorophenyl)methyl]-1h-benzimidazole Chemical compound C1=CC(Cl)=CC=C1CC1=NC2=CC=CC=C2N1 COGUOPIIFAMLES-UHFFFAOYSA-N 0.000 description 1
- XHNQLMWCCPJSGQ-UHFFFAOYSA-N 2-[(4-chlorophenyl)methyl]-4-(2,4-dichlorophenyl)-5-methyl-1h-imidazole Chemical compound N=1C(C=2C(=CC(Cl)=CC=2)Cl)=C(C)NC=1CC1=CC=C(Cl)C=C1 XHNQLMWCCPJSGQ-UHFFFAOYSA-N 0.000 description 1
- RJRKURJUHLRUPD-UHFFFAOYSA-N 2-heptyl-1h-benzimidazole Chemical compound C1=CC=C2NC(CCCCCCC)=NC2=C1 RJRKURJUHLRUPD-UHFFFAOYSA-N 0.000 description 1
- IRMWQHINYNTMNS-UHFFFAOYSA-N 2-octyl-1h-benzimidazole Chemical compound C1=CC=C2NC(CCCCCCCC)=NC2=C1 IRMWQHINYNTMNS-UHFFFAOYSA-N 0.000 description 1
- NWAMRPCZWHSYJQ-UHFFFAOYSA-N 4-(2,4-dichlorophenyl)-2-[(2,4-dichlorophenyl)methyl]-5-methyl-1h-imidazole Chemical compound N=1C(C=2C(=CC(Cl)=CC=2)Cl)=C(C)NC=1CC1=CC=C(Cl)C=C1Cl NWAMRPCZWHSYJQ-UHFFFAOYSA-N 0.000 description 1
- GEAJAPSZDRSJSQ-UHFFFAOYSA-N 4-(2,4-dichlorophenyl)-5-methyl-2-phenyl-1h-imidazole Chemical compound CC=1NC(C=2C=CC=CC=2)=NC=1C1=CC=C(Cl)C=C1Cl GEAJAPSZDRSJSQ-UHFFFAOYSA-N 0.000 description 1
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- QUQFTIVBFKLPCL-UHFFFAOYSA-L copper;2-amino-3-[(2-amino-2-carboxylatoethyl)disulfanyl]propanoate Chemical compound [Cu+2].[O-]C(=O)C(N)CSSCC(N)C([O-])=O QUQFTIVBFKLPCL-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 125000004188 dichlorophenyl group Chemical group 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000003854 p-chlorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1Cl 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 229960005335 propanol Drugs 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 235000002639 sodium chloride Nutrition 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
- 238000010626 work up procedure Methods 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Abstract
本发明公开了一种化金板水性有机铜面保护剂,按质量百分比,组成为:助溶剂16‑24%,成膜剂0.1‑0.15%,护铜剂0.2‑0.26‑0.31‑0.4%,PH调整剂0.2‑0.3%,重金属捕捉剂0.05‑0.2%。本发明采用高性能的护铜成分,对化金板上的裸露铜表面进行选择性的涂覆处理,有效抑制贾凡妮效应,不会造成铜离子反粘金面,其工艺处理时间短、成膜致密、保持时间长,真空包装情况下保持6个月以上,依然有良好的可焊性。同样适用于普通全铜板的抗氧化处理。
Description
技术领域
本发明涉及一种水性化金板有机铜面保护剂,针对选择性化金的PCB板面做防氧化处理,有效抑制铜面反粘金面的贾凡尼效应。
背景技术
PCB(printed circuit board)即印制线路板,简称印制板,是电子工业的重要部件之一,是电子元器件的支撑体,是电子元器件电气相互连接的载体。几乎每种电子设备,小到电子手表、计算器,大到计算机、通信电子设备、军用武器系统,只要有集成电路等电子元件,为了使各个元件之间的电气互连,都要使用印制板。
OSP是Organic Solderability Preservatives 的简称,中译为有机保焊膜,又称护铜剂,英文亦称之Preflux,是一种对成型后的PCB表面裸露铜垫、孔环、线路等指定表面涂布上防氧化的有机薄膜即有机可焊性保护(OSP)的一种表面保护性处理工艺。通过其有效成份与铜面作用以化学的方法长出一层有机皮膜。这层膜具有防氧化,耐热冲击,耐湿性,用以保护铜表面于常态环境中不再继续生锈(氧化或硫化等);但在后续的焊接高温中,此种保护膜又必须很容易被助焊剂所迅速清除,如此方可使露出的干净铜表面得以在极短的时间内与熔融焊锡立即结合成为牢固的焊点。
特殊的对有局部化金处理的选择性化金PCB基板,普通型的防氧化剂其酸性溶液中一旦引入铜离子,因不同活动性循序的金属形成回路,引发贾凡尼效应,极易造成金面反粘铜,影响产品质量。
发明内容
本发明的目的是为了解决上述技术的不足而提供一种有机铜面保护剂及其制备方法。
本发明第一方面提供了一种有机铜面保护剂,包括如下组分:助溶剂,成膜剂,护铜剂,PH调整剂,重金属捕捉剂;所述重金属捕捉剂选自:EDTP、HEDTP、TEA或EDDS中的一种或多种。
作为优选方案之一,所述助溶剂选自有机酸或有机醇,且助溶剂为一种或多种。
作为优选方案之一,所述有机酸选自甲酸、乙酸、丙酸、己酸、辛酸、庚酸;所述有机醇选自甲醇、乙醇或丙醇。
作为更优选方案之一,所述有机酸选自甲酸、乙酸、庚酸的混合酸。
作为优选方案之一,所述成膜剂选自卤化物。
作为优选方案之一,所述成膜剂选自卤化钠、卤化钾、卤化锌、卤化铜、卤化亚铜、卤化铁、卤化亚铁中的一种或多种。
作为更优选方案之一,所述成膜剂选自氯化钠、氯化钾、氯化锌、溴化钠、溴化钾、溴化锌、碘化钾、碘化钠、碘化锌中的一种或多种。
作为优选方案之一,所述护铜剂选自咪唑类化合物。
作为优选方案之一,所述护铜剂选自2-(2,4-二氯苄基)苯并咪唑、2-戊基苯并咪唑、2-(3,4-二氯苄基)苯并咪唑、2 ,4-二苯基咪唑、2-(2 ,4-二氯苄基)-4-(2 ,4-二氯苯基)-5-甲基咪唑、2-(4-氯苄基)-4-(2 ,4-二氯苯基)-5-甲基咪唑、2-苯基-4-(2 ,4-二氯苯基)-5-甲基咪唑、2-(4-氯苯基)- 4-(2 ,4-二氯苯基)-5-甲基咪唑、2-苯基-4-(2 ,4-二氯苯基咪唑或2-(4-氯苯基)-4-(2 ,4-
二氯苯基)咪唑、2-庚基苯并咪唑、2-辛基苯并咪唑、2-(4-氯苄基)苯并咪唑、2−[(2,4−二氯苯基)甲基]−1H−苯并咪唑中的一种或多种。。
作为优选方案之一,所述PH调整剂选自有机胺或有机铵盐。
作为优选方案之一,所述PH调整剂选自甲醇胺、乙醇胺、三乙醇胺、N,N-二甲基乙醇胺、2- 氨基-2-甲基1丙醇、2-(丁基氨基)乙醇、N-甲基乙醇胺、甲酸铵、乙酸铵、丙酸铵中的一种或多种。
作为优选方案之一,本发明第一方面提供了一种有机铜面保护剂所包含的各个原料的重量百分比为:助溶剂16-24%,成膜剂0.1-0.15%,护铜剂0.2-0.4%,PH调整剂0.2-0.3%,重金属捕捉剂 0.05-0.2%。
作为优选方案之一,本发明第一方面提供了一种有机铜面保护剂,其成分中还包含水。
作为更优选方案之一,所述的水优选为蒸馏水或去离子水。
本发明第二方面提供了一种有机铜面保护剂的制备方法,其是由本发明第一方面提供的有机铜面保护剂所包含的原料混合制备而成。
本发明相对于现有技术的主要贡献有以下几点:
(1)含有特殊选择的金属捕捉剂,有效抑制贾凡尼效应,化金板和全铜板通用;
(2)生成的有机抗氧化膜,成膜速度快,烘干后膜面致密,色泽光亮;
(3)耐热性好,268℃IR炉测试,三次不变色、5次轻微变色,变色均匀;
(4)膜厚可调,在0.2-0.6um范围内均可实现保护效果,真空包装放置6个月以上,可焊性能良好。
(5)水溶体系有机物含量低,便于污水处理,减小环保压力。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚,对本公开实施例的技术方案进行清楚、完整地描述。显然,所描述的实施例是本公开的一部分实施例,而不是全部的实施例。基于所描述的本公开的实施例,本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例,都属于本公开保护的范围。
本发明的OSP工艺流程介绍:
除油40℃30-50s→水洗→微蚀30℃30s→水洗→OSP(有机铜面保护)→水洗→风干
下述实例前后处理方式一致,只描述OSP有机铜面保护剂工艺。
本发明实施例中的原料均可通过市售得到;
除非特别说明,本发明采用的试剂、方法和设备均为本技术领域常规试剂、方法和设备。
并非是本发明突出的重点。
实施例1
本实施例提供的水性有机铜面保护剂的配制组成:
组成 | 含量g/L |
乙酸 | 150 |
甲酸 | 30 |
庚酸 | 15 |
2-(2,4-二氯苄基)苯并咪唑 | 2 |
2-戊基苯并咪唑 | 1 |
2-(3,4-二氯苄基)苯并咪唑 | 2 |
碘化钠 | 0.0015 |
HEDTA羟乙基乙二胺三乙酸 | 2 |
乙酸铵 | 100 |
有机铜面保护工艺,经过40℃,60s浸泡,水洗,风干后检测膜厚0.32um,膜面光亮,致密;
268℃IR炉处理,3次,膜面无变色。说明以上配比的保护剂起到很好的成膜效果。
实施例2
本实施例提供的水性有机铜面保护剂的配制组成:
组成 | 含量g/L |
乙酸 | 180 |
甲酸 | 30 |
庚酸 | 20 |
2-(2,4-二氯苄基)苯并咪唑 | 1.8 |
2-戊基苯并咪唑 | 1 |
2-(3,4-二氯苄基)苯并咪唑 | 1.8 |
碘化锌 | 0.0018 |
乙醇胺 | 45 |
EDTP | 3 |
乙酸铵 | 70 |
有机铜面保护工艺,经过40℃,60s浸泡,水洗,风干后检测膜厚0.30um,膜面光亮,致密;
268℃IR炉处理,3次,膜面无变色。说明以上配比的保护剂起到很好的成膜效果。
实施例3
本实施例提供的水性有机铜面保护剂的配制组成:
组成 | 含量g/L |
乙酸 | 180 |
甲酸 | 30 |
庚酸 | 23 |
2-(2,4-二氯苄基)苯并咪唑 | 1.5 |
2-(3,4-二氯苄基)苯并咪唑 | 3 |
溴化锌 | 0.0015 |
乙醇胺 | 45 |
EDDS | 3.2 |
甲酸铵 | 60 |
有机铜面保护工艺,经过40℃,60s浸泡,水洗,风干后检测膜厚0.33um,膜面光亮,致密;
268℃IR炉处理,3次,膜面无变色。说明以上配比的保护剂起到很好的成膜效果。
实施例4
本实施例提供的水性有机铜面保护剂的配制组成:
组成 | 含量g/L |
乙酸 | 180 |
甲酸 | 30 |
庚酸 | 20 |
2-(2,4-二氯苄基)苯并咪唑 | 3 |
2-(3,4-二氯苄基)苯并咪唑 | 1.5 |
碘化钾 | 0.0018 |
乙醇胺 | 135 |
TEA | 1.2 |
有机铜面保护工艺,经过40℃,60s浸泡,水洗,风干后检测膜厚0.35um,膜面光亮,致密;
268℃IR炉处理,3次,膜面无变色。说明以上配比的保护剂起到很好的成膜效果。
对比例1
本对比例提供的水性有机铜面保护剂的配制组成:
组成 | 含量g/L |
乙酸 | 150 |
甲酸 | 30 |
庚酸 | 15 |
2-(2,4-二氯苄基)苯并咪唑 | 2 |
2-戊基苯并咪唑 | 1 |
2-(3,4-二氯苄基)苯并咪唑 | 2 |
碘化钠 | 0.0015 |
EDTA-2Na | 2 |
乙酸铵 | 100 |
有机铜面保护工艺,经过40℃,60s浸泡,水洗,风干后检测膜厚0.37um,膜面粗糙,致密性差;
268℃IR炉处理,3次,膜面氧化变色。说明将本发明的重金属捕捉剂替换为EDTA-2Na之后,成膜效果不佳。
对比例2
本对比例提供的水性有机铜面保护剂的配制组成:
组成 | 含量g/L |
乙酸 | 180 |
甲酸 | 30 |
庚酸 | 23 |
2-(2,4-二氯苄基)苯并咪唑 | 1.5 |
2-(3,4-二氯苄基)苯并咪唑 | 3 |
溴化锌 | 0.0015 |
乙醇胺 | 45 |
EDTA | 3.2 |
甲酸铵 | 60 |
有机铜面保护工艺,经过40℃,60s浸泡,水洗,风干后检测膜厚0.40um,膜面不均匀,致密性差;
268℃IR炉处理,3次,膜面氧化变色。说明将本发明的重金属捕捉剂替换为EDTA之后,成膜效果不佳。
最后应说明的是:显然,上述实施例仅仅是为清楚地说明本发明所作的举例,而并非对实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引申出的显而易见的变化或变动仍处于本发明的保护范围之中。
Claims (10)
1.一种有机铜面保护剂,包括如下组分:助溶剂,成膜剂,护铜剂,PH调整剂,重金属捕捉剂;所述重金属捕捉剂选自:EDTP、HEDTP、TEA(三乙胺)或EDDS中的一种或多种。
2.根据权利要求1所述的一种有机铜面保护剂,所述助溶剂选自有机酸或有机醇,且助溶剂为一种或多种。
3.根据权利要求2所述的一种有机铜面保护剂,所述有机酸选自甲酸、乙酸、丙酸、己酸、辛酸、庚酸;所述有机醇选自甲醇、乙醇或丙醇。
4.根据权利要求1所述的一种有机铜面保护剂,所述成膜剂选自卤化物。
5.根据权利要求4所述的一种有机铜面保护剂,所述卤化物选自卤化钠、卤化钾、卤化锌、卤化铜、卤化亚铜、卤化铁、卤化亚铁中的一种或多种。
6.根据权利要求1所述的一种有机铜面保护剂,所述PH调整剂选自有机胺或有机铵盐。
7.根据权利要求6所述的一种有机铜面保护剂,所述有机胺选自甲醇胺、乙醇胺、三乙醇胺、N,N-二甲基乙醇胺、2- 氨基-2-甲基1丙醇、2-(丁基氨基)乙醇、N-甲基乙醇胺;所述有机铵盐选自甲酸铵、乙酸铵、丙酸铵。
8.根据权利要求1所述的一种有机铜面保护剂,所述护铜剂选自咪唑类化合物。
9.根据权利要求1-8任一项所述的一种有机铜面保护剂,所包含的各个原料的重量百分比为:助溶剂16-24%,成膜剂0.1-0.15%,护铜剂0.2-0.4%,PH调整剂0.2-0.3%,重金属捕捉剂 0.05-0.2%。
10.一种有机铜面保护剂的制备方法,其是由权利要求1-9任一项所包含的原料混合制备而成。
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