CN107971655B - 一种高抗热性有机保焊剂及其应用 - Google Patents
一种高抗热性有机保焊剂及其应用 Download PDFInfo
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- CN107971655B CN107971655B CN201810064949.6A CN201810064949A CN107971655B CN 107971655 B CN107971655 B CN 107971655B CN 201810064949 A CN201810064949 A CN 201810064949A CN 107971655 B CN107971655 B CN 107971655B
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- methylimidazole
- organic solder
- zinc
- resistant organic
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 61
- 230000004907 flux Effects 0.000 title claims abstract description 15
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 95
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims abstract description 57
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims abstract description 49
- 150000002460 imidazoles Chemical class 0.000 claims abstract description 45
- 150000002736 metal compounds Chemical class 0.000 claims abstract description 39
- JESNJGKGWNVYRF-UHFFFAOYSA-N imidazo[1,2]pyrido[4,5-c]pyrazin-2-one Chemical compound N1=CC=NC2=NC3=NC(=O)N=C3C=C21 JESNJGKGWNVYRF-UHFFFAOYSA-N 0.000 claims abstract description 36
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 35
- 125000003118 aryl group Chemical group 0.000 claims abstract description 31
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims abstract description 28
- 235000019253 formic acid Nutrition 0.000 claims abstract description 28
- CLLLODNOQBVIMS-UHFFFAOYSA-N 2-(2-methoxyethoxy)acetic acid Chemical compound COCCOCC(O)=O CLLLODNOQBVIMS-UHFFFAOYSA-N 0.000 claims abstract description 24
- 235000019260 propionic acid Nutrition 0.000 claims abstract description 24
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims abstract description 24
- 239000008367 deionised water Substances 0.000 claims abstract description 17
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims description 33
- 238000003756 stirring Methods 0.000 claims description 32
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 25
- 239000001301 oxygen Substances 0.000 claims description 25
- 229910052760 oxygen Inorganic materials 0.000 claims description 25
- CADXMSNVVKAOKU-UHFFFAOYSA-N 2,4,8,10-tetrazatricyclo[7.4.0.02,6]trideca-1(9),5,7,10,12-pentaen-3-one Chemical compound O=C1NC=C2N1C1=C(N=C2)N=CC=C1 CADXMSNVVKAOKU-UHFFFAOYSA-N 0.000 claims description 24
- WELZFURMIFFATQ-UHFFFAOYSA-N 5-methyl-2,4-diphenyl-1h-imidazole Chemical compound CC=1NC(C=2C=CC=CC=2)=NC=1C1=CC=CC=C1 WELZFURMIFFATQ-UHFFFAOYSA-N 0.000 claims description 15
- 229910021591 Copper(I) chloride Inorganic materials 0.000 claims description 12
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 claims description 12
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims description 12
- 229940045803 cuprous chloride Drugs 0.000 claims description 12
- VFDVEIYSLYPKEI-UHFFFAOYSA-N 3,6-dihydroxynaphthalene-2,7-dicarboxylic acid Chemical compound OC(=O)C1=C(O)C=C2C=C(O)C(C(=O)O)=CC2=C1 VFDVEIYSLYPKEI-UHFFFAOYSA-N 0.000 claims description 11
- XESRTVJAPGRIRS-UHFFFAOYSA-N 3lambda4-thia-1,7,10-triazatricyclo[7.3.0.02,6]dodeca-2(6),4,7,9,11-pentaene 3-oxide Chemical compound S1(C=CC=2N=CC=3N(C=21)C=CN=3)=O XESRTVJAPGRIRS-UHFFFAOYSA-N 0.000 claims description 11
- VTUOCDJOZKEHHB-UHFFFAOYSA-N 7-imidazol-1-ylnaphthalene-2-carboxylic acid Chemical compound C=1C2=CC(C(=O)O)=CC=C2C=CC=1N1C=CN=C1 VTUOCDJOZKEHHB-UHFFFAOYSA-N 0.000 claims description 10
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 9
- FHHCKYIBYRNHOZ-UHFFFAOYSA-N 2,5-diphenyl-1h-imidazole Chemical compound C=1N=C(C=2C=CC=CC=2)NC=1C1=CC=CC=C1 FHHCKYIBYRNHOZ-UHFFFAOYSA-N 0.000 claims description 8
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 claims description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 8
- ONDPHDOFVYQSGI-UHFFFAOYSA-N zinc nitrate Chemical compound [Zn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ONDPHDOFVYQSGI-UHFFFAOYSA-N 0.000 claims description 8
- 239000005749 Copper compound Substances 0.000 claims description 6
- 150000001880 copper compounds Chemical class 0.000 claims description 6
- 150000003752 zinc compounds Chemical class 0.000 claims description 6
- QMWOUSYSNFCKAZ-UHFFFAOYSA-N 3,7-dihydroxynaphthalene-2-carboxylic acid Chemical compound OC1=CC=C2C=C(O)C(C(=O)O)=CC2=C1 QMWOUSYSNFCKAZ-UHFFFAOYSA-N 0.000 claims description 5
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 claims description 5
- INQRDWQKHMKYTQ-UHFFFAOYSA-N 5-methyl-4-naphthalen-1-yl-2-phenyl-1h-imidazole Chemical compound N=1C(C=2C3=CC=CC=C3C=CC=2)=C(C)NC=1C1=CC=CC=C1 INQRDWQKHMKYTQ-UHFFFAOYSA-N 0.000 claims description 5
- NSWNXQGJAPQOID-UHFFFAOYSA-N 2-(2-chlorophenyl)-4,5-diphenyl-1h-imidazole Chemical compound ClC1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 NSWNXQGJAPQOID-UHFFFAOYSA-N 0.000 claims description 4
- MGCJSIPFFQFYBB-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-methyl-4-phenyl-1H-imidazole Chemical compound COC=1C=C(C=CC1OC)C=1NC(=C(N1)C1=CC=CC=C1)C MGCJSIPFFQFYBB-UHFFFAOYSA-N 0.000 claims description 4
- AWVKQWIOURZHQZ-UHFFFAOYSA-N 2-[(2,4-dichlorophenyl)methyl]-4,5-diphenyl-1h-imidazole Chemical compound ClC1=CC(Cl)=CC=C1CC1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 AWVKQWIOURZHQZ-UHFFFAOYSA-N 0.000 claims description 4
- IQJMWFVIAPBMBL-UHFFFAOYSA-N 2-[(3-chlorophenyl)methyl]-1h-benzimidazole Chemical compound ClC1=CC=CC(CC=2NC3=CC=CC=C3N=2)=C1 IQJMWFVIAPBMBL-UHFFFAOYSA-N 0.000 claims description 4
- NAPDOWNULRULLI-UHFFFAOYSA-N 2-benzyl-1h-imidazole Chemical compound C=1C=CC=CC=1CC1=NC=CN1 NAPDOWNULRULLI-UHFFFAOYSA-N 0.000 claims description 4
- IKCMEDJGOKBRFC-UHFFFAOYSA-N 2-benzyl-4-(2,4-dichlorophenyl)-5-methyl-1h-imidazole Chemical compound N=1C(C=2C(=CC(Cl)=CC=2)Cl)=C(C)NC=1CC1=CC=CC=C1 IKCMEDJGOKBRFC-UHFFFAOYSA-N 0.000 claims description 4
- RGJVGSQPHPDGQG-UHFFFAOYSA-N 2-benzyl-4-(3,4-dichlorophenyl)-5-methyl-1h-imidazole Chemical compound N=1C(C=2C=C(Cl)C(Cl)=CC=2)=C(C)NC=1CC1=CC=CC=C1 RGJVGSQPHPDGQG-UHFFFAOYSA-N 0.000 claims description 4
- GOXBDVDMFJVVNM-UHFFFAOYSA-N 2-benzyl-6-chloro-1h-benzimidazole Chemical compound N1C2=CC(Cl)=CC=C2N=C1CC1=CC=CC=C1 GOXBDVDMFJVVNM-UHFFFAOYSA-N 0.000 claims description 4
- BQMLFRCDMWYVTQ-UHFFFAOYSA-N 2-naphthalen-1-yl-5-phenyl-1h-imidazole Chemical compound C=1NC(C=2C3=CC=CC=C3C=CC=2)=NC=1C1=CC=CC=C1 BQMLFRCDMWYVTQ-UHFFFAOYSA-N 0.000 claims description 4
- XVGQHMYCDALKKN-UHFFFAOYSA-N 2-naphthalen-2-yl-5-phenyl-1h-imidazole Chemical compound C=1NC(C=2C=C3C=CC=CC3=CC=2)=NC=1C1=CC=CC=C1 XVGQHMYCDALKKN-UHFFFAOYSA-N 0.000 claims description 4
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 4
- AAYASKAHPGVADW-UHFFFAOYSA-N 4,5-dimethyl-2-naphthalen-1-yl-1h-imidazole Chemical compound N1C(C)=C(C)N=C1C1=CC=CC2=CC=CC=C12 AAYASKAHPGVADW-UHFFFAOYSA-N 0.000 claims description 4
- YATKABCHSRLDGQ-UHFFFAOYSA-N 5-benzyl-2-phenyl-1h-imidazole Chemical compound C=1C=CC=CC=1CC(N=1)=CNC=1C1=CC=CC=C1 YATKABCHSRLDGQ-UHFFFAOYSA-N 0.000 claims description 4
- IKJYRWQCYXTMFR-UHFFFAOYSA-N 5-methyl-2-naphthalen-1-yl-4-phenyl-1h-imidazole Chemical compound CC=1NC(C=2C3=CC=CC=C3C=CC=2)=NC=1C1=CC=CC=C1 IKJYRWQCYXTMFR-UHFFFAOYSA-N 0.000 claims description 4
- PVNCLKDZXOOJMO-UHFFFAOYSA-N 5-methyl-4-naphthalen-2-yl-2-phenyl-1h-imidazole Chemical compound N=1C(C=2C=C3C=CC=CC3=CC=2)=C(C)NC=1C1=CC=CC=C1 PVNCLKDZXOOJMO-UHFFFAOYSA-N 0.000 claims description 4
- 229910021589 Copper(I) bromide Inorganic materials 0.000 claims description 4
- CANRESZKMUPMAE-UHFFFAOYSA-L Zinc lactate Chemical compound [Zn+2].CC(O)C([O-])=O.CC(O)C([O-])=O CANRESZKMUPMAE-UHFFFAOYSA-L 0.000 claims description 4
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 claims description 4
- 150000001553 barium compounds Chemical class 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 4
- 229910000366 copper(II) sulfate Inorganic materials 0.000 claims description 4
- NKNDPYCGAZPOFS-UHFFFAOYSA-M copper(i) bromide Chemical compound Br[Cu] NKNDPYCGAZPOFS-UHFFFAOYSA-M 0.000 claims description 4
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 claims description 4
- GQDHEYWVLBJKBA-UHFFFAOYSA-H copper(ii) phosphate Chemical compound [Cu+2].[Cu+2].[Cu+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GQDHEYWVLBJKBA-UHFFFAOYSA-H 0.000 claims description 4
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 claims description 4
- 229960003280 cupric chloride Drugs 0.000 claims description 4
- 150000002506 iron compounds Chemical class 0.000 claims description 4
- 150000002611 lead compounds Chemical class 0.000 claims description 4
- 150000002697 manganese compounds Chemical class 0.000 claims description 4
- 150000002816 nickel compounds Chemical class 0.000 claims description 4
- 150000002941 palladium compounds Chemical class 0.000 claims description 4
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 4
- 229960004889 salicylic acid Drugs 0.000 claims description 4
- 150000003606 tin compounds Chemical class 0.000 claims description 4
- WGIWBXUNRXCYRA-UHFFFAOYSA-H trizinc;2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O WGIWBXUNRXCYRA-UHFFFAOYSA-H 0.000 claims description 4
- 239000004246 zinc acetate Substances 0.000 claims description 4
- 239000011746 zinc citrate Substances 0.000 claims description 4
- 235000006076 zinc citrate Nutrition 0.000 claims description 4
- 229940068475 zinc citrate Drugs 0.000 claims description 4
- SRWMQSFFRFWREA-UHFFFAOYSA-M zinc formate Chemical compound [Zn+2].[O-]C=O SRWMQSFFRFWREA-UHFFFAOYSA-M 0.000 claims description 4
- 239000011576 zinc lactate Substances 0.000 claims description 4
- 229940050168 zinc lactate Drugs 0.000 claims description 4
- 235000000193 zinc lactate Nutrition 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 claims description 4
- 229910000165 zinc phosphate Inorganic materials 0.000 claims description 4
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 claims description 4
- 229960001763 zinc sulfate Drugs 0.000 claims description 4
- 229910000368 zinc sulfate Inorganic materials 0.000 claims description 4
- ZPEJZWGMHAKWNL-UHFFFAOYSA-L zinc;oxalate Chemical compound [Zn+2].[O-]C(=O)C([O-])=O ZPEJZWGMHAKWNL-UHFFFAOYSA-L 0.000 claims description 4
- PALVXRUKMAHOPW-UHFFFAOYSA-N 2-(4-chlorophenyl)-5-methyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=C(Cl)C=C1 PALVXRUKMAHOPW-UHFFFAOYSA-N 0.000 claims description 3
- 239000006096 absorbing agent Substances 0.000 claims 2
- 229960002311 dithranol Drugs 0.000 claims 2
- YDWRSMMYMIMMKL-UHFFFAOYSA-N 2-benzyl-2-phenylimidazole Chemical compound N1=CC=NC1(C=1C=CC=CC=1)CC1=CC=CC=C1 YDWRSMMYMIMMKL-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 49
- 229910052802 copper Inorganic materials 0.000 description 48
- 239000010949 copper Substances 0.000 description 48
- 239000003755 preservative agent Substances 0.000 description 22
- 230000002335 preservative effect Effects 0.000 description 21
- 230000008569 process Effects 0.000 description 21
- 239000000126 substance Substances 0.000 description 19
- 239000002250 absorbent Substances 0.000 description 16
- 230000002745 absorbent Effects 0.000 description 16
- -1 azole compound Chemical class 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 15
- 238000007254 oxidation reaction Methods 0.000 description 13
- 230000003647 oxidation Effects 0.000 description 12
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 10
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 10
- 150000007524 organic acids Chemical class 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 8
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 7
- PFKFTWBEEFSNDU-UHFFFAOYSA-N carbonyldiimidazole Chemical compound C1=CN=CN1C(=O)N1C=CN=C1 PFKFTWBEEFSNDU-UHFFFAOYSA-N 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- IJVFHCSUEBAAOZ-UHFFFAOYSA-N 3-fluoro-2-nitropyridine Chemical compound [O-][N+](=O)C1=NC=CC=C1F IJVFHCSUEBAAOZ-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 150000007980 azole derivatives Chemical class 0.000 description 6
- 150000001556 benzimidazoles Chemical class 0.000 description 6
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- 238000002360 preparation method Methods 0.000 description 5
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- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 4
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- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
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- XEGJWGYVNFWAHG-UHFFFAOYSA-N 4,5-dibutyl-1h-imidazole Chemical compound CCCCC=1N=CNC=1CCCC XEGJWGYVNFWAHG-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
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- KOLRMWAFBJEBHR-UHFFFAOYSA-N 2-[(4-chlorophenyl)methyl]-1h-imidazole Chemical compound C1=CC(Cl)=CC=C1CC1=NC=CN1 KOLRMWAFBJEBHR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 229930184510 Mallotus Natural products 0.000 description 1
- 241001060384 Mallotus <angiosperm> Species 0.000 description 1
- 206010027439 Metal poisoning Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000861 blow drying Methods 0.000 description 1
- 210000000748 cardiovascular system Anatomy 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005237 degreasing agent Methods 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000029087 digestion Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 210000000750 endocrine system Anatomy 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000011132 hemopoiesis Effects 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 235000011167 hydrochloric acid Nutrition 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 210000003734 kidney Anatomy 0.000 description 1
- 208000008127 lead poisoning Diseases 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 210000005036 nerve Anatomy 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000003381 solubilizing effect Effects 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (10)
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CN109759692B (zh) * | 2019-01-21 | 2020-11-17 | 武汉大学 | 一种寒冷环境下室外焊接铝母线的方法 |
CN111922553A (zh) * | 2020-08-08 | 2020-11-13 | 深圳市创智成功科技有限公司 | 用于晶圆先进封装领域的铜面保护剂及其制备方法 |
CN114574074A (zh) * | 2022-04-22 | 2022-06-03 | 三棵树(上海)新材料研究有限公司 | 原位合成片层磷酸锌配位防腐填料的防腐涂料及制备方法 |
CN115043779B (zh) * | 2022-06-14 | 2024-06-25 | 广东金柏化学有限公司 | 一种2,4-二苯基咪唑化合物及其制备方法与应用 |
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CN101697662A (zh) * | 2009-10-29 | 2010-04-21 | 深圳市唯特偶化工开发实业有限公司 | 一种高抗热性有机保焊剂 |
CN102121108A (zh) * | 2011-02-23 | 2011-07-13 | 广东东硕科技有限公司 | 无铅印制电路板用复配osp处理剂 |
CN103882417A (zh) * | 2012-12-20 | 2014-06-25 | 罗门哈斯电子材料有限公司 | 有机可焊性防腐剂和方法 |
CN106903455A (zh) * | 2016-12-26 | 2017-06-30 | 长沙理工大学 | 一种耐高温有机保焊剂及应用用法 |
CN106929839A (zh) * | 2015-12-29 | 2017-07-07 | 罗门哈斯电子材料有限责任公司 | 用于在铜表面上形成有机涂层的方法 |
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CN101697662A (zh) * | 2009-10-29 | 2010-04-21 | 深圳市唯特偶化工开发实业有限公司 | 一种高抗热性有机保焊剂 |
CN102121108A (zh) * | 2011-02-23 | 2011-07-13 | 广东东硕科技有限公司 | 无铅印制电路板用复配osp处理剂 |
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CN106929839A (zh) * | 2015-12-29 | 2017-07-07 | 罗门哈斯电子材料有限责任公司 | 用于在铜表面上形成有机涂层的方法 |
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